CN115573019A - Electroplating cabinet for lead frame - Google Patents

Electroplating cabinet for lead frame Download PDF

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Publication number
CN115573019A
CN115573019A CN202211575708.0A CN202211575708A CN115573019A CN 115573019 A CN115573019 A CN 115573019A CN 202211575708 A CN202211575708 A CN 202211575708A CN 115573019 A CN115573019 A CN 115573019A
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CN
China
Prior art keywords
plate
fixedly connected
plates
lead frame
cavity
Prior art date
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Granted
Application number
CN202211575708.0A
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Chinese (zh)
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CN115573019B (en
Inventor
刘国滔
冯军民
周光明
周怡
李勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Dezhou Precision Electronic Co ltd
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Ningbo Dezhou Precision Electronic Co ltd
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Priority to CN202211575708.0A priority Critical patent/CN115573019B/en
Publication of CN115573019A publication Critical patent/CN115573019A/en
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Publication of CN115573019B publication Critical patent/CN115573019B/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a lead frame electroplating cabinet, which comprises a bottom box and an installation cavity fixedly communicated with the upper end of the bottom box, wherein a fixed plate is fixedly connected in the installation cavity, a placing plate is connected in the installation cavity in a sliding manner, a clamping part is arranged on the placing plate, the clamping part comprises sliding rods, square plates, clamping plates, transverse plates, L-shaped plates and inclined rods, the transverse plates are respectively arranged on the placing plate in an equidistant array mode, the two sliding rods are respectively and fixedly connected to the two ends of the transverse plates, the sliding rods are connected to the placing plate in a sliding manner, the square plates are fixedly connected to the transverse plates, and the two L-shaped plates are both fixedly connected to the square plates.

Description

Electroplating cabinet for lead frame
Technical Field
The invention relates to the technical field of lead frame electroplating, in particular to a lead frame electroplating cabinet.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a lead-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
When the existing lead frame is electroplated, the lead frame is placed in liquid for electroplating treatment in most of time, and when the lead frame is taken out from the liquid, the surface of the lead frame is always required to wait for the excessive liquid to automatically fall into electroplating liquid to take away the lead frame, so that more time is delayed, and the subsequent rapid processing of the lead frame is not facilitated.
Disclosure of Invention
The invention aims to solve the following defects in the prior art that the electroplating cabinet for the lead frame is provided, because more redundant liquid is adhered to the surface of the lead frame, the redundant liquid is required to automatically fall into electroplating liquid to take away the lead frame, so that more time is delayed, and the subsequent rapid processing of the lead frame is not facilitated.
In order to achieve the purpose, the invention adopts the following technical scheme:
a lead frame electroplating cabinet comprises a bottom case and an installation cavity fixedly communicated with the upper end of the bottom case, wherein a fixing plate is fixedly connected in the installation cavity;
the mounting cavity is internally and slidably connected with a placing plate, a clamping part is arranged on the placing plate and comprises sliding rods, square plates, clamping plates, transverse plates, L-shaped plates and inclined rods, the transverse plates are respectively arrayed on the placing plate in an equidistant mode, the two sliding rods are respectively and fixedly connected to two ends of each transverse plate, the sliding rods are slidably connected to the placing plate, the square plates are fixedly connected to the transverse plates, the two L-shaped plates are both fixedly connected to the square plates, the two clamping plates are both slidably connected to the square plates, and the inclined rods are hinged between the clamping plates and the placing plate;
the fixed plate is provided with a pressing part, the pressing part comprises a sealing cavity, a piston plate, a pressing plate and a pushing plate, the sealing cavity is fixedly connected onto the fixed plate, one end of the piston plate is slidably connected into the sealing cavity, one end of the fixed plate is provided with a groove, one end of each of the pressing plates is hinged into the groove, and the pushing plate is fixedly connected onto the other end of the piston plate.
Preferably, the clamping component comprises first springs, and the first springs are fixedly connected between the transverse plate and the placing plate respectively.
Preferably, the pressing element further includes a rotating rod and a torsion spring, the rotating rod is fixedly connected between the two pressing plates, and the two torsion springs are respectively and fixedly connected between the rotating rod and the fixing plate.
Preferably, the T-shaped plates are fixedly connected to two opposite side walls of the installation cavity respectively, the T-shaped plates are provided with driving parts respectively, each driving part comprises a triangular plate, an arc-shaped plate and a rotating wheel, the triangular plate is fixedly connected to the T-shaped plates, the arc-shaped plates are rotatably connected to the triangular plates, and the rotating wheels are rotatably connected to one ends of the arc-shaped plates.
Preferably, the driving part further comprises a rotating shaft and a closed cavity, the rotating shaft is connected to the rotating wheel in a sliding mode, the closed cavity is connected to the side wall of the mounting cavity in a sliding mode, and one end, far away from the rotating shaft, of the rotating wheel is connected to the side wall of the closed cavity in a threaded mode.
Preferably, the two ends of the bottom box are respectively fixedly connected with a telescopic cavity, the upper end of the telescopic cavity is fixedly connected with a connecting rod, the bottom box is slidably connected with a storage cavity, the storage cavity is fixedly connected between the two connecting rods, and the closed cavity is fixedly communicated with the telescopic cavity through a gas pipe.
Preferably, fixedly connected with backup pad on the set-square, fixedly connected with drum in the backup pad, sliding connection has the stripper bar in the backup pad, stripper bar upper end sliding connection be in the drum, stripper bar lower extreme sliding connection be in the arc other end, the arc with fixedly connected with second spring between the backup pad, the drum with fixed intercommunication has the intake pipe between the sealed chamber.
Compared with the prior art, the invention has the beneficial effects that:
1. drive arc one end all the time and have ascending trend under the pulling force of second spring to the runner can tightly be extruded on placing the board, has fixed effect to placing the board, reaches the stable electroplating process of lead frame.
2. When the transverse plate moves downwards, the transverse plate is extruded by the inclined rod and pushes the clamping plate to move, and the lead frame can be extruded onto the L-shaped plate in the moving process of the clamping plate, so that the clamping and fixing effects on the lead frame are achieved.
3. Can toward sealing the intracavity when the pivot is rotatory and remove to carry the gas that will seal the intracavity to flexible intracavity through the gas-supply pipe, and flexible intracavity is because of the gas increase extension, thereby can promote the connecting rod to shift up, and the storage chamber shifts up along with two connecting rods, and the cooperation lead frame moves down, thereby the lead frame can remove to electroplate in the storage intracavity, makes in the entering plating solution that the lead frame can be stable.
4. Move to when the maximum position on the diaphragm, can produce vibrations, and lead frame to on the L template has the vibrations effect, can just break away from the lead frame fast with the attached plating solution of lead frame surface and avoid waiting, can move the back on the lead frame, go fast and take away the district, the plating solution that breaks away from the lead frame simultaneously can fall into the storage intracavity, the effect of sparingly electroplating material has, through shifting up along with the diaphragm, thereby splint keep away from the L template and do not have the effect of centre gripping to the lead frame, be convenient for take away the lead frame after electroplating.
Drawings
FIG. 1 is a schematic front view of a lead frame electroplating cabinet according to the present invention;
FIG. 2 is a schematic diagram of an L-shaped board structure of a lead frame electroplating cabinet according to the present invention;
FIG. 3 is a schematic view of a pressing plate structure of a lead frame electroplating cabinet according to the present invention;
fig. 4 is a schematic view of a cylinder structure of a lead frame electroplating cabinet according to the present invention.
In the figure: the device comprises an installation cavity 1, a fixing plate 2, a sealing cavity 3, a material storage cavity 4, a bottom box 5, a telescopic cavity 6, a connecting rod 7, an air delivery pipe 8, a closed cavity 9, a first spring 10, a transverse plate 11, a placing plate 12, a convex block 13, a cylinder 14, an air inlet pipe 15, a triangular plate 16, an arc plate 17, a rotating shaft 18, an inclined rod 19, a square plate 20, a clamping plate 21, a sliding rod 22, a 23L-shaped plate 24, a pressing plate 24, a rotating rod 25, a torsion spring 26, a pushing plate 27, a piston plate 28, a rotating wheel 29, a supporting plate 30, a second spring 31, a squeezing rod 32 and a shaped plate 33T.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a lead frame electroplating cabinet comprises a bottom case 5 and an installation cavity 1 fixedly communicated with the upper end of the bottom case 5, wherein a fixed plate 2 is fixedly connected in the installation cavity 1, and the fixed plate 2 is used for pressing a transverse plate 11;
sliding connection places board 12 in installation cavity 1, place board 12 and be the horizontal slip in installation cavity 1, place and install clamping part on board 12, clamping part includes slide bar 22, square board 20, splint 21, diaphragm 11, L template 23, down tube 19, a plurality of diaphragms 11 are the equidistance array respectively on placing board 12, two slide bars 22 are fixed connection respectively at diaphragm 11 both ends, diaphragm 11 is with sliding bar 22 through both ends fixed connection from top to bottom on placing board 12, slide bar 22 sliding connection is on placing board 12, square board 20 fixed connection is on diaphragm 11, two equal fixed connection of L template 23 are on square board 20, the lead frame can be placed to L template 23 lower extreme, when splint 21 is compared in the square removal of L template 23, can carry out the centre gripping to the lead frame upper end, reach the fixed effect to the lead frame, two equal sliding connection of splint 21 are on square board 20, down tube 19 articulates between splint 21 and placing board 12, when board 11 and square board 20 compare in placing board 12 and move down, splint 21 can receive the spacing of down tube 19, thereby promote the direction removal of splint 21 to L23.
The fixing plate 2 is provided with a pressing part, the pressing part comprises a sealing cavity 3, a piston plate 28, a pressing plate 24 and a push plate 27, the sealing cavity 3 is fixedly connected on the fixing plate 2, one end of the piston plate 28 is slidably connected in the sealing cavity 3, one end of the fixing plate 2 is provided with a groove, one end of each of the two pressing plates 24 is hinged in the groove, the push plate 27 is fixedly connected at the other end of the piston plate 28, the sealing cavity 3 increases gas and pushes the piston plate 28 to move, the piston plate 28 can push the pressing plate 24 to be changed from an inclined state to a horizontal state with the push plate 27 in various countries, the transverse plate 11 moving downwards can be extruded in the process that the pressing plate 24 is changed from the inclined state to the horizontal state, meanwhile, along with the movement of the placing plate 12, the transverse plate enters the lower side of the fixing plate 2, when the transverse plate 11 is pressed to the lower side of the fixing plate 2 once, the lead frame can be quickly fixed, and along with the upward movement of the storage cavity 4, the lead frame can slowly enter the storage cavity 4 for electroplating, the rotating rod 25 and the rotating spring 26 is fixedly connected between the rotating rod 24, and the pressing plate 24 is not reset state when the pressing plate 24 is changed into the horizontal pressing plate 24.
Fixed T template 33 that comes to be connected with respectively on two relative lateral walls of installation cavity 1, driver part is installed respectively to two T templates 33, driver part includes set-square 16, arc 17, runner 29, set-square 16 fixed connection is on T template 33, arc 17 rotates to be connected on set-square 16, runner 29 rotates to be connected in arc 17 wherein one end, driver part still includes pivot 18, closed chamber 9, pivot 18 sliding connection is on runner 29, closed chamber 9 sliding connection is on the 1 lateral wall of installation cavity, the one end threaded connection that runner 29 was kept away from in pivot 18 is on closed chamber 9 lateral wall, when runner 29 is rotatory, can be to the inside removal in closed chamber 9, and extrude the gas in the closed chamber 9.
5 both ends of under casing 5 fixedly connected with flexible chamber 6 respectively, flexible chamber 6 upper end fixedly connected with connecting rod 7, 5 sliding connection of under casing have storage chamber 4, and the splendid attire plating solution of storage chamber 4, 4 fixed connection of storage chamber between two connecting rods 7, and fixed intercommunication has gas-supply pipe 8 between closed chamber 9 and the flexible chamber 6, and the gas in the closed chamber 9 passes through gas-supply pipe 8 and transmits to flexible chamber 6 in, and flexible chamber 6 extends and promotes storage chamber 4 and moves upward.
Fixedly connected with backup pad 30 on the set-square 16, fixedly connected with drum 14 on the backup pad 30, sliding connection has the stripper bar 32 on the backup pad 30, stripper bar 32 upper end sliding connection is in drum 14, stripper bar 32 lower extreme sliding connection is at the arc 17 other end, fixedly connected with second spring 31 between arc 17 and the backup pad 30, it has intake pipe 15 to be fixed the intercommunication between drum 14 and the sealed chamber 3, second spring 31 has ascending pulling force to the one end of arc 17 all the time.
In the invention, when the electroplating device is used, the placing plate 12 is pulled firstly, so that the placing plate 12 slides towards the direction far away from the installation cavity 1, a plurality of lead frames are placed on the L-shaped plates 23 respectively, then the placing plate 12 is pushed to move towards the direction close to the installation cavity 1, the rotating wheel 29 is pushed to move upwards along with the movement of the placing plate 12, so that the placing plate 12 is positioned at the lower side of the rotating wheel 29, the arc-shaped plate 17 rotates due to the upward movement of the rotating wheel 29, the other one moves downwards, the extrusion rod 32 is pulled to move downwards in the cylinder 14, the second spring 31 is stretched, one end of the arc-shaped plate 17 is driven to have an upward trend under the pulling force of the second spring 31, and therefore, the rotating wheel 29 can be tightly extruded on the placing plate 12, the placing plate 12 has a fixing effect, and stable electroplating processing of the lead frames is achieved.
Meanwhile, along with the movement of the placing plate 12, the rotating wheel 29 is limited by the protruding block 13, so that the arc-shaped plate 17 swings back and forth, and the extrusion rod 32 can be pushed to slide up and down on the cylinder 14, when the extrusion rod 32 slides up on the cylinder 14, gas in the cylinder 14 can be pushed to be conveyed into the sealed cavity 3 through the air inlet pipe 15, and the piston plate 28 and the push plate 27 are pushed to move, so that the push plate 27 extrudes the two press plates 24, so that the press plates 24 have an inclined state and press to a horizontal state, and simultaneously the rotating rod 25 is driven to rotate and the torsion spring 26 is driven to twist, so that the transverse plates 11 which move forward can be extruded to move down in the rotating process of the press plates 24, and the first spring 10 is extruded, and the transverse plates 11 can push the L-shaped plate 23 and the lead frame to move down, and along with the reciprocating up and down movement of the arc-shaped plate 17, so that the press plates 24 can swing back and forth and pressurize the transverse plates 11, so that the transverse plates 11 can be sequentially pressed to the lower sides of the fixing plate 2 and slide on the lower surface of the fixing plate 2, and when the transverse plates 11 move down, the clamping plate 19 can clamp the lead frame 23, and the lead frame can be clamped.
Simultaneously can drive pivot 18 when runner 29 is rotatory, pivot 18 and one of them lateral wall threaded connection of closed chamber 9, consequently can move in closed chamber 9 when pivot 18 is rotatory, and carry the gas in the closed chamber 9 to flexible chamber 6 in through the gas-supply pipe 8, and extend because of gaseous increase in the flexible chamber 6, thereby can promote connecting rod 7 to move up, and storage chamber 4 moves up along with two connecting rods 7, and the cooperation lead frame moves down, thereby the lead frame can move and electroplate in the storage chamber 4, make in the stable entering plating solution of lead frame.
When needs take out lead frame, place the square removal that board 12 kept away from installation cavity 1 at this pulling, and make diaphragm 11 keep away from fixed plate 2 in proper order, when fixed plate 2 was kept away from to diaphragm 11, diaphragm 11 shifts up fast under the elasticity of first spring 10, when moving to the maximum position on diaphragm 11, can produce vibrations, and have the vibrations effect to the lead frame on the L template 23, can just break away from the lead frame fast with lead frame surface attached plating solution and avoid waiting, can move the back on the lead frame, remove fast and take away, the plating solution that breaks away from the lead frame simultaneously can fall into storage cavity 4, the effect of electroplating material sparingly has, through shifting up along with diaphragm 11, thereby splint 21 keeps away from L template 23 and does not have the effect of centre gripping to the lead frame, be convenient for take away the lead frame after electroplating.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (7)

1. A lead frame electroplating cabinet comprises a bottom case (5) and a mounting cavity (1) fixedly communicated with the upper end of the bottom case (5), and is characterized in that a fixing plate (2) is fixedly connected in the mounting cavity (1);
the mounting structure is characterized in that a placing plate (12) is connected in the mounting cavity (1) in a sliding manner, a clamping part is mounted on the placing plate (12), the clamping part comprises sliding rods (22), square plates (20), clamping plates (21), transverse plates (11), L-shaped plates (23) and inclined rods (19), the transverse plates (11) are arranged on the placing plate (12) in an equidistant array mode respectively, the two sliding rods (22) are fixedly connected to two ends of the transverse plates (11) respectively, the sliding rods (22) are connected to the placing plate (12) in a sliding manner, the square plates (20) are fixedly connected to the transverse plates (11), the two L-shaped plates (23) are fixedly connected to the square plates (20), the two clamping plates (21) are connected to the square plates (20) in a sliding manner, and the inclined rods (19) are hinged between the clamping plates (21) and the placing plate (12);
install the pressing part on fixed plate (2), the pressing part includes sealed chamber (3), piston board (28), presses pressing plate (24), push pedal (27), sealed chamber (3) fixed connection in fixed plate (2) are last, wherein one end sliding connection of piston board (28) is in sealed chamber (3), fixed plate (2) wherein one end is seted up flutedly, two press pressing plate (24) wherein one end articulate respectively in the recess, push pedal (27) fixed connection be in the piston board (28) other end.
2. Lead frame plating cabinet according to claim 1, characterized in that said clamping means comprise first springs (10), a plurality of said first springs (10) being fixedly connected between said horizontal plate (11) and said placing plate (12), respectively.
3. The lead frame electroplating cabinet according to claim 1, wherein the pressing element further comprises a rotating rod (25) and a torsion spring (26), the rotating rod (25) is fixedly connected between the two pressing plates (24), and the two torsion springs (26) are respectively and fixedly connected between the rotating rod (25) and the fixing plate (2).
4. Lead frame electroplating cabinet according to claim 1, characterized in that two opposite side walls of the mounting cavity (1) are fixedly connected with T-shaped plates (33), two T-shaped plates (33) are respectively provided with a driving part, the driving part comprises a triangular plate (16), an arc-shaped plate (17) and a rotating wheel (29), the triangular plate (16) is fixedly connected on the T-shaped plates (33), the arc-shaped plate (17) is rotatably connected on the triangular plate (16), and the rotating wheel (29) is rotatably connected at one end of the arc-shaped plate (17).
5. Lead frame electroplating cabinet according to claim 4, characterized in that the driving part further comprises a rotating shaft (18) and a closed cavity (9), the rotating shaft (18) is slidably connected to the rotating wheel (29), the closed cavity (9) is slidably connected to the side wall of the mounting cavity (1), and one end of the rotating shaft (18) far away from the rotating wheel (29) is screwed to the side wall of the closed cavity (9).
6. The lead frame electroplating cabinet according to claim 5, characterized in that two ends of the bottom box (5) are respectively and fixedly connected with a telescopic cavity (6), the upper end of the telescopic cavity (6) is fixedly connected with a connecting rod (7), the bottom box (5) is slidably connected with a storage cavity (4), the storage cavity (4) is fixedly connected between the two connecting rods (7), and a gas pipe (8) is fixedly communicated between the closed cavity (9) and the telescopic cavity (6).
7. The lead frame electroplating cabinet according to claim 4, characterized in that a supporting plate (30) is fixedly connected to the triangular plate (16), a cylinder (14) is fixedly connected to the supporting plate (30), an extrusion rod (32) is slidably connected to the supporting plate (30), the upper end of the extrusion rod (32) is slidably connected to the inside of the cylinder (14), the lower end of the extrusion rod (32) is slidably connected to the other end of the arc-shaped plate (17), a second spring (31) is fixedly connected between the arc-shaped plate (17) and the supporting plate (30), and an air inlet pipe (15) is fixedly communicated between the cylinder (14) and the sealed cavity (3).
CN202211575708.0A 2022-12-09 2022-12-09 Electroplating cabinet for lead frame Active CN115573019B (en)

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CN202211575708.0A CN115573019B (en) 2022-12-09 2022-12-09 Electroplating cabinet for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211575708.0A CN115573019B (en) 2022-12-09 2022-12-09 Electroplating cabinet for lead frame

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CN115573019A true CN115573019A (en) 2023-01-06
CN115573019B CN115573019B (en) 2023-02-17

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Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322863A (en) * 2000-03-27 2001-11-21 三洋电机株式会社 Electroplating apparatus
JP2006237269A (en) * 2005-02-24 2006-09-07 Sumitomo Metal Electronics Devices Inc Printed wiring board and printed wiring board holding tool for holding the same
WO2008081490A1 (en) * 2007-01-03 2008-07-10 Occleppo S.R.L. Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated
US20100170801A1 (en) * 1999-06-30 2010-07-08 Chema Technology, Inc. Electroplating apparatus
WO2010103749A1 (en) * 2009-03-12 2010-09-16 住友ベークライト株式会社 Jig for plating
JP2012087367A (en) * 2010-10-20 2012-05-10 Mitomo Semicon Engineering Kk Continuous partial-plating device, and continuous partial-plating method using the same
US20150042026A1 (en) * 2013-08-08 2015-02-12 C. Uyemura & Co., Ltd. Clamper and holding jig including same
CN208250445U (en) * 2018-04-26 2018-12-18 袁海香 A kind of efficient circuit board electroplating device
CN211726628U (en) * 2020-01-11 2020-10-23 瑞茂(天津)金属表面处理有限公司 Electroplating hanger surface plating solution cleaning device
CN112663123A (en) * 2020-12-24 2021-04-16 铜陵蓝盾丰山微电子有限公司 Sheet type electroplating clamp for lead frame and clamping method thereof
CN214572290U (en) * 2021-01-27 2021-11-02 新恒汇电子股份有限公司 Selective electroplating die for lead frame
CN114059134A (en) * 2021-11-15 2022-02-18 东莞奥美特科技有限公司 High-density multi-row frame electroplating device
CN217733319U (en) * 2022-05-31 2022-11-04 东莞奥美特科技有限公司 Double-side hanging plating device for integrated circuit lead frame

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100170801A1 (en) * 1999-06-30 2010-07-08 Chema Technology, Inc. Electroplating apparatus
CN1322863A (en) * 2000-03-27 2001-11-21 三洋电机株式会社 Electroplating apparatus
JP2006237269A (en) * 2005-02-24 2006-09-07 Sumitomo Metal Electronics Devices Inc Printed wiring board and printed wiring board holding tool for holding the same
WO2008081490A1 (en) * 2007-01-03 2008-07-10 Occleppo S.R.L. Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated
WO2010103749A1 (en) * 2009-03-12 2010-09-16 住友ベークライト株式会社 Jig for plating
JP2012087367A (en) * 2010-10-20 2012-05-10 Mitomo Semicon Engineering Kk Continuous partial-plating device, and continuous partial-plating method using the same
US20150042026A1 (en) * 2013-08-08 2015-02-12 C. Uyemura & Co., Ltd. Clamper and holding jig including same
CN208250445U (en) * 2018-04-26 2018-12-18 袁海香 A kind of efficient circuit board electroplating device
CN211726628U (en) * 2020-01-11 2020-10-23 瑞茂(天津)金属表面处理有限公司 Electroplating hanger surface plating solution cleaning device
CN112663123A (en) * 2020-12-24 2021-04-16 铜陵蓝盾丰山微电子有限公司 Sheet type electroplating clamp for lead frame and clamping method thereof
CN214572290U (en) * 2021-01-27 2021-11-02 新恒汇电子股份有限公司 Selective electroplating die for lead frame
CN114059134A (en) * 2021-11-15 2022-02-18 东莞奥美特科技有限公司 High-density multi-row frame electroplating device
CN217733319U (en) * 2022-05-31 2022-11-04 东莞奥美特科技有限公司 Double-side hanging plating device for integrated circuit lead frame

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Denomination of invention: A lead frame electroplating cabinet

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