CN217733319U - Double-side hanging plating device for integrated circuit lead frame - Google Patents
Double-side hanging plating device for integrated circuit lead frame Download PDFInfo
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- CN217733319U CN217733319U CN202221339336.7U CN202221339336U CN217733319U CN 217733319 U CN217733319 U CN 217733319U CN 202221339336 U CN202221339336 U CN 202221339336U CN 217733319 U CN217733319 U CN 217733319U
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- hanging plate
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- bushing
- template
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- 238000007747 plating Methods 0.000 title claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000000741 silica gel Substances 0.000 claims abstract description 44
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 44
- 238000009713 electroplating Methods 0.000 claims abstract description 37
- 230000006978 adaptation Effects 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 37
- 229910000831 Steel Inorganic materials 0.000 claims description 31
- 239000010959 steel Substances 0.000 claims description 31
- 210000003781 tooth socket Anatomy 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a two-sided hanging of integrated circuit lead frame plates device, it is including being used for hanging the link plate of plating and being used for wrapping up the silica gel of integrated circuit lead frame, the link plate is including relative first link plate and the second link plate that sets up, first link plate all is equipped with the electroplating through-hole with the second link plate, be provided with on the silica gel with the electroplating hole of electroplating through-hole looks adaptation, first link plate and second link plate pressfitting in the outside of silica gel, first link plate is equipped with the electrically conductive connective bar, just be located on the first link plate and be equipped with the conducting block with one side that the second link plate is relative, the electrically conductive connective bar is connected with the conducting block. The utility model discloses a hang the mode of plating and realize the two-sided electroplating simultaneously of integrated circuit lead frame, improve and electroplate efficiency and electroplate the quality, reduce electroplating process time, electroplate effectually, the practicality is strong.
Description
Technical Field
The utility model relates to an electroplate technical field, concretely relates to integrated circuit lead frame's two-sided hanging plate device.
Background
With the continuous development of society and the continuous progress of scientific level, electroplating becomes a common processing technology in the current metal processing field, the electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing an electrolysis effect so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing attractiveness and the like.
In the process of processing the integrated circuit lead frame in a hanging plating mode, the existing integrated circuit lead frame hanging plating device still has the problem that double-sided electroplating cannot be carried out on the integrated circuit lead frame simultaneously, two sides of the electroplating device need to be electroplated respectively, and the processing mode is low in working efficiency, long in electroplating time, poor in fixing effect of the integrated circuit lead frame, inconvenient for people to use and poor in practicability.
Disclosure of Invention
There is above-mentioned technical problem to prior art, the utility model provides an accessible is hung the mode of plating and is realized the two-sided electroplating simultaneously of integrated circuit lead frame, improves electroplating efficiency and electroplates the quality, reduces electroplating process time, electroplates effectual integrated circuit lead frame's two-sided hanging plating device.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a two-sided hanging of integrated circuit lead frame plates device, it is including the silica gel that is used for hanging the link plate of plating and is used for wrapping up the integrated circuit lead frame, the link plate is including relative first link plate and the second link plate that sets up, first link plate all is equipped with the electroplating through-hole with the second link plate, be provided with on the silica gel with the electroplating hole of electroplating through-hole looks adaptation, first link plate and second link plate pressfitting in the outside of silica gel, first link plate is equipped with electrically conductive connective bar, just be located on the first link plate and be equipped with the conducting block with the relative one side of second link plate, electrically conductive connective bar is connected with the conducting block.
As a further elaboration of the above technical solution:
in the above technical scheme, still including being used for the fashioned template of silica gel, the template includes the first template that uses with the cooperation of first link plate and the second template that uses with the cooperation of second link plate, first template is equipped with first die cavity, form first silica gel in the first die cavity, the second template is equipped with the second die cavity, the second die cavity forms second silica gel, first silica gel wraps up in the outside of integrated circuit lead frame with second silica gel.
In the technical scheme, the upper end of the first hanging plate is provided with a conductive connecting rod fixing hole, a sealing ring is arranged between the conductive connecting rod fixing hole and the conductive connecting rod, and the conductive connecting rod is arranged at the upper end of the first hanging plate through the conductive connecting rod fixing hole.
In the technical scheme, the first hanging plate is provided with the conductive block fixing hole on one side opposite to the second hanging plate, the conductive block is mounted on the first hanging plate through the conductive block fixing hole, the conductive block fixing hole is communicated with the conductive connecting rod fixing hole, and the conductive block is connected with the conductive connecting rod through a screw.
In the technical scheme, an embedded tooth socket fixing hole is formed in the first hanging plate in a penetrating mode, an embedded tooth socket is arranged in the embedded tooth socket fixing hole, a tooth socket plug block is arranged at the end portion of the embedded tooth socket, and a bolt fixing hole is formed in the second hanging plate in a penetrating mode; when the first hanging plate is attached to the second hanging plate, the bolt penetrates through the bolt fixing hole to be screwed and fixed with the embedded tooth socket.
In the technical scheme, a positioning steel needle fixing hole is formed in one side, opposite to the second hanging plate, of the first hanging plate, a positioning steel needle is arranged in the positioning steel needle fixing hole, the needle end of the positioning steel needle is exposed out of the positioning steel needle fixing hole, and a steel needle positioning hole matched with the positioning steel needle is formed in the first template; when the first hanging plate is attached to the first template, the positioning steel needle is inserted into the steel needle positioning hole.
In the above technical solution, a first bushing positioning pin fixing hole is formed in the first hanging plate and on a side opposite to the second hanging plate, a first bushing positioning pin is arranged in the first bushing positioning pin fixing hole, an end of the first bushing positioning pin is exposed outside the first bushing positioning pin fixing hole, and the first template is provided with a first bushing positioning hole adapted to the first bushing positioning pin; when the first hanging plate is attached to the first template, the first bushing positioning pin is inserted into the first bushing pin positioning hole.
In the above technical solution, a second bushing pin positioning hole is provided on the second hanging plate and on a side opposite to the first hanging plate, the second template is provided with a second bushing positioning pin, an aperture of the second bushing pin positioning hole is the same as an aperture of the first bushing pin positioning hole, and a diameter of the second bushing positioning pin is the same as a diameter of the first bushing positioning pin; when the second hanging plate is attached to the second template, the second bushing positioning pin is inserted into the second bushing pin positioning hole; when the first hanging plate is attached to the second hanging plate, the first bushing positioning pin is inserted into the second bushing pin positioning hole.
In the technical scheme, a glue pouring positioning pin fixing hole is formed in one side, opposite to the second hanging plate, of the first hanging plate, a glue pouring positioning pin is arranged in the glue pouring positioning pin fixing hole, the end portion of the glue pouring positioning pin is exposed outside the glue pouring positioning pin fixing hole, and glue pouring pin positioning holes matched with the glue pouring positioning pin are formed in the second hanging plate and the first template; when the first hanging plate is attached to the second hanging plate, the inverted glue positioning pin is inserted into the inverted glue pin positioning hole of the second hanging plate; when the first hanging plate is attached to the first template, the glue pouring positioning pin is inserted into the glue pouring pin positioning hole of the first template.
In the above technical scheme, the first hanging plate is provided with a denting structure at one side opposite to the second hanging plate, and the denting structure comprises a pair of denting supports which are oppositely arranged.
The utility model has the advantages that:
the utility model relates to a rationally, novel structure, through the structural design who adopts link plate and template, specifically be through template shaping play silica gel, rethread silica gel seals the cladding to the integrated circuit lead frame, the part of not needing to electroplate that makes the integrated circuit lead frame keeps apart with electrolyte, electrolyte contacts through electroplating through-hole and the electroplating zone of treating of integrated circuit lead frame, the rethread is electrically conductive to make electrolyte and to treat that the electroplating zone is electroplated, thereby realize the two-sided electroplating of integrated circuit lead frame with hanging the plating mode, electroplating efficiency and electroplating quality have been improved, reduce electroplating process time, electroplating effect is good, therefore, the clothes hanger is strong in practicability.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the first hanging plate;
FIG. 3 is a schematic view of the first hanging plate and the first mold plate;
FIG. 4 is a schematic structural view of a second hanging plate and a second mold plate;
fig. 5 is a schematic structural view of the first hanging plate and the second hanging plate.
Reference numerals: the first hanging plate 1, the conductive connecting rod 11, the conductive block 12, the embedded tooth socket 13, the tooth socket plug block 14, the positioning steel needle 15, the first bushing positioning pin 16, the inverted glue positioning pin 17, the recessing bracket 18, the second hanging plate 2, the bolt fixing hole 21, the second bushing positioning pin hole 22, the electroplating through hole 3, the first template 4, the first cavity 41, the steel needle positioning hole 42, the first bushing pin positioning hole 43, the second template 5, the second cavity 51, the second bushing positioning pin 52 and the inverted glue pin positioning hole 6.
Detailed Description
The present invention will be described in detail with reference to the following embodiments and accompanying drawings.
The two-sided hanging of integrated circuit lead frame of this embodiment plates device, as shown in fig. 1 to 5, it need not electroplate regional silica gel (not shown in the figure) including being used for hanging the link plate of plating and being used for wrapping up the integrated circuit lead frame, the link plate is including relative first link plate 1 and the second link plate 2 that sets up, first link plate 1 all is equipped with electroplating through-hole 3 with second link plate 2, be equipped with the electroplating hole that communicates with electroplating through-hole 3 alignment on the silica gel, first link plate 1 is equipped with electrically conductive connective bar 11, just be located on the first link plate 1 and be equipped with conducting block 12 with second link plate 2 relative one side, electrically conductive connective bar 11 is connected with conducting block 12.
As a further improvement of the utility model, this two-sided hanging plate device is still including being used for the fashioned template of silica gel, the template includes first template 4 of using with the cooperation of first link plate 1 and the second template 5 of using with the cooperation of second link plate 2, first template 4 is equipped with first die cavity 41, first die cavity 41 forms first silica gel in this die cavity, second template 5 is equipped with second die cavity 51, second die cavity 51 forms second silica gel in this die cavity, first silica gel and second silica gel cladding are in the outside of integrated circuit lead frame.
Preferably, because the stickness of aluminium system template and silica gel is worse for the stickness of glass fiber board, consequently the first link plate 1 of this embodiment and second link plate 2 adopt glass fiber material to prepare, and first template 4 and second template 5 adopt the aluminium template to prepare, and during the silica gel drawing of patterns, silica gel can depend on first link plate 1 and second link plate 2, breaks away from first template 4 and second template 5 department. And after the silica gel is formed, the template is pulled out.
In this embodiment, the first hanging plate 1 is attached to the first template 4, liquid silica gel is injected into the first cavity 41 of the first template 4 and cooled to form first silica gel, the second hanging plate 2 is attached to the second template 5, liquid silica gel is injected into the second cavity 51 of the second template 5 and cooled to form second silica gel, the first hanging plate 1 and the first template 4 are separated from the second hanging plate 2 and the second template 5 respectively, the formed first silica gel and the formed second silica gel are taken out, the first template 4 and the second template 5 are taken away, the integrated circuit lead frame is coated inside through the first silica gel and the second silica gel and the area to be electroplated is exposed through the electroplating holes, finally the first silica gel, the second silica gel and the integrated circuit lead frame are clamped in an electroplating solution through the first hanging plate 1 and the second hanging plate 2, and the electroplating solution is used for conducting electroplating on the integrated circuit lead frame at the electroplating through hole 3 and the electroplating hole.
As a further improvement, the upper end of the first hanging plate 1 is provided with a conductive connecting rod fixing hole, a sealing ring is arranged between the conductive connecting rod fixing hole and the conductive connecting rod 11, and the conductive connecting rod 11 is arranged at the upper end of the first hanging plate 1 through the conductive connecting rod fixing hole.
As a further improvement, the first link plate 1 is gone up and is located the one side relative with second link plate 2 and is equipped with the conducting block fixed orifices, conducting block 12 passes through the conducting block fixed orifices and installs on first link plate 1, the conducting block fixed orifices communicates with electrically conductive connective bar fixed orifices, conducting block 12 passes through the screw and is connected with electrically conductive connective bar 11.
In the present embodiment, the conductive connection rod 11 and the conductive block 12 are used for conducting electricity, so that the area to be plated of the lead frame of the integrated circuit at the position of the plated through hole 3 in the electrolyte is plated.
As a further improvement of the present invention, an embedded facing fixing hole is provided on the first hanging plate 1, an embedded facing 13 is provided in the embedded facing fixing hole, a facing plug 14 is provided at the end of the embedded facing 13, and a bolt fixing hole 21 is provided on the second hanging plate 2; when the first hanging plate 1 is attached to the second hanging plate 2, the bolt passes through the bolt fixing hole 21 and is screwed and fixed with the embedded tooth socket 13.
In this embodiment, the first hanging plate 1 and the second hanging plate 2 are screwed and fixed to the embedded mouthpiece 13 by bolts, and the mouthpiece plug 14 prevents the plating solution from entering the first silica gel and the second silica gel from the embedded mouthpiece 13.
As a further improvement of the present invention, a positioning steel needle fixing hole is formed in the first hanging plate 1 and located at a side opposite to the second hanging plate 2, a positioning steel needle 15 is arranged in the positioning steel needle 15 fixing hole, a needle end of the positioning steel needle 15 is exposed outside the positioning steel needle fixing hole, and the first template 4 is provided with a steel needle positioning hole 42 adapted to the positioning steel needle 15; when the first hanging plate 1 is attached to the first template 4, the positioning steel needle 15 is inserted into the steel needle positioning hole 42.
In this embodiment, when the first hanging plate 1 is attached to the first mold plate 4, the positioning steel needle 15 is inserted into the steel needle positioning hole 42 to perform positioning and limiting, so that the attaching precision is improved.
As a further improvement of the present invention, a first bushing positioning pin fixing hole is formed in the first hanging plate 1 and located on the side opposite to the second hanging plate 2, a first bushing positioning pin 16 is arranged in the first bushing positioning pin fixing hole, the end of the first bushing positioning pin 16 is exposed outside the first bushing positioning pin fixing hole, and the first mold plate 4 is provided with a first bushing positioning hole 43 adapted to the first bushing positioning pin 16; when the first hanging plate 1 is attached to the first mold plate 4, the first bushing positioning pin 16 is inserted into the first bushing pin positioning hole 43.
As a further improvement of the present invention, a second bush pin positioning hole 22 is provided on the second hanging plate 2 and on the side opposite to the first hanging plate 1, the second template 5 is provided with a second bush positioning pin 52, the aperture of the second bush pin positioning hole 22 is the same as the aperture of the first bush pin positioning hole 43, and the diameter of the second bush positioning pin 52 is the same as the diameter of the first bush positioning pin 16; when the second hanging plate 2 is attached to the second template 5, the second bushing positioning pin 52 is inserted into the second bushing pin positioning hole 22; when the first hanging plate 1 is attached to the second hanging plate 2, the first bush positioning pin 16 is inserted into the second bush positioning hole 22.
In this embodiment, the sealing performance of the present invention is improved by adopting the structural design of the first bushing positioning pin 16, the first bushing positioning hole 43, the second bushing positioning pin 52, and the second bushing positioning hole 22.
As a further improvement of the present invention, a glue pouring positioning pin fixing hole is formed in the first hanging plate 1 and located at the side opposite to the second hanging plate 2, a glue pouring positioning pin 17 is arranged in the glue pouring positioning pin fixing hole, the end of the glue pouring positioning pin 17 is exposed outside the glue pouring positioning pin fixing hole, and both the second hanging plate 2 and the first template 4 are provided with a glue pouring pin positioning hole 6 matched with the glue pouring positioning pin 17; when the first hanging plate 1 is attached to the second hanging plate 2, the inverted glue positioning pin 17 is inserted into the inverted glue pin positioning hole 6 of the second hanging plate 2; when the first hanging plate 1 is attached to the first template 4, the glue pouring positioning pin 17 is inserted into the glue pouring pin positioning hole 6 of the first template 4.
In this embodiment, when the first hanging plate 1 is respectively attached to the second hanging plate 2 and the first template 4, the attaching precision is further improved by positioning and limiting the first hanging plate by using the glue pouring positioning pin 17 and the glue pouring pin positioning hole 6.
As a further improvement of the utility model, one side of the first hanging plate 1 opposite to the second hanging plate 2 is provided with a concave structure, and the concave structure comprises a pair of concave brackets 18 which are oppositely arranged.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the description with the record of drawing of description, and the concrete connection mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, and machinery, part and equipment all adopt prior art, and conventional model, including circuit connection adopts conventional connection mode among the prior art, does not detailed here again.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. Integrated circuit lead frame's two-sided hanging plate device of plating, its characterized in that, it is including the silica gel that is used for hanging the link plate of plating and is used for wrapping up integrated circuit lead frame, the link plate is including relative first link plate and the second link plate that sets up, first link plate all is equipped with the electroplating through-hole with the second link plate, be provided with on the silica gel with the electroplating hole of electroplating through-hole looks adaptation, first link plate and second link plate pressfitting in the outside of silica gel, first link plate is equipped with electrically conductive connective bar, just be located on the first link plate and be equipped with the conducting block with the relative one side of second link plate, electrically conductive connective bar is connected with the conducting block.
2. The double-sided rack plating device of the integrated circuit lead frame according to claim 1, further comprising a template for forming silica gel, wherein the template comprises a first template used in cooperation with the first hanging plate and a second template used in cooperation with the second hanging plate, the first template is provided with a first cavity, the first silica gel is formed in the first cavity, the second template is provided with a second cavity, the second cavity is formed by the second silica gel, and the first silica gel and the second silica gel are wrapped outside the integrated circuit lead frame.
3. The device of claim 1, wherein the first hanging plate has a conductive connecting rod fixing hole at the upper end, a sealing ring is disposed between the conductive connecting rod fixing hole and the conductive connecting rod, and the conductive connecting rod is mounted at the upper end of the first hanging plate through the conductive connecting rod fixing hole.
4. The device of claim 3, wherein the first hanging plate is provided with a conductive block fixing hole at a side opposite to the second hanging plate, the conductive block is mounted on the first hanging plate through the conductive block fixing hole, the conductive block fixing hole is communicated with the conductive connecting rod fixing hole, and the conductive block is connected with the conductive connecting rod through a screw.
5. The double-sided rack plating device of the lead frame of the integrated circuit according to claim 1, characterized in that the first hanging plate is provided with an embedded tooth socket fixing hole in a penetrating way, an embedded tooth socket is arranged in the embedded tooth socket fixing hole, a tooth socket plug block is arranged at the end part of the embedded tooth socket, and a bolt fixing hole is arranged in a penetrating way on the second hanging plate; when the first hanging plate is attached to the second hanging plate, the bolt penetrates through the bolt fixing hole and is screwed and fixed with the embedded tooth socket.
6. The double-sided rack plating device of the lead frame of the integrated circuit according to claim 2, wherein the first hanging plate is provided with a positioning steel needle fixing hole at a side opposite to the second hanging plate, a positioning steel needle is arranged in the positioning steel needle fixing hole, a needle end of the positioning steel needle is exposed outside the positioning steel needle fixing hole, and the first template is provided with a steel needle positioning hole matched with the positioning steel needle; when the first hanging plate is attached to the first template, the positioning steel needle is inserted into the steel needle positioning hole.
7. The double-sided rack plating device of the integrated circuit lead frame according to claim 2, wherein a first bushing positioning pin fixing hole is formed in the first hanging plate and on the side opposite to the second hanging plate, a first bushing positioning pin is arranged in the first bushing positioning pin fixing hole, the end of the first bushing positioning pin is exposed outside the first bushing positioning pin fixing hole, and a first bushing positioning hole matched with the first bushing positioning pin is formed in the first template; when the first hanging plate is attached to the first template, the first bushing positioning pin is inserted into the first bushing pin positioning hole.
8. The double-sided suspension plating device of the integrated circuit lead frame according to claim 7, wherein a second bushing pin positioning hole is provided on the second hanging plate at a side opposite to the first hanging plate, the second template is provided with a second bushing positioning pin, the diameter of the second bushing pin positioning hole is the same as the diameter of the first bushing pin positioning hole, and the diameter of the second bushing positioning pin is the same as the diameter of the first bushing positioning pin; when the second hanging plate is attached to the second template, the second bushing positioning pin is inserted into the second bushing pin positioning hole; when the first hanging plate is attached to the second hanging plate, the first bushing positioning pin is inserted into the second bushing pin positioning hole.
9. The double-sided rack plating device of the integrated circuit lead frame according to claim 2, wherein a glue pouring positioning pin fixing hole is formed in the first hanging plate and on the side opposite to the second hanging plate, a glue pouring positioning pin is arranged in the glue pouring positioning pin fixing hole, the end part of the glue pouring positioning pin is exposed outside the glue pouring positioning pin fixing hole, and glue pouring pin positioning holes matched with the glue pouring positioning pin are formed in the second hanging plate and the first template; when the first hanging plate is attached to the second hanging plate, the inverted glue positioning pin is inserted into the inverted glue pin positioning hole of the second hanging plate; when the first hanging plate is attached to the first template, the glue pouring positioning pin is inserted into the glue pouring pin positioning hole of the first template.
10. The apparatus of claim 1, wherein the first strap is provided with a dimple arrangement on a side thereof opposite the second strap, the dimple arrangement comprising a pair of oppositely disposed dimple brackets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221339336.7U CN217733319U (en) | 2022-05-31 | 2022-05-31 | Double-side hanging plating device for integrated circuit lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221339336.7U CN217733319U (en) | 2022-05-31 | 2022-05-31 | Double-side hanging plating device for integrated circuit lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217733319U true CN217733319U (en) | 2022-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221339336.7U Active CN217733319U (en) | 2022-05-31 | 2022-05-31 | Double-side hanging plating device for integrated circuit lead frame |
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| CN (1) | CN217733319U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115573019A (en) * | 2022-12-09 | 2023-01-06 | 宁波德洲精密电子有限公司 | Electroplating cabinet for lead frame |
-
2022
- 2022-05-31 CN CN202221339336.7U patent/CN217733319U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115573019A (en) * | 2022-12-09 | 2023-01-06 | 宁波德洲精密电子有限公司 | Electroplating cabinet for lead frame |
| CN115573019B (en) * | 2022-12-09 | 2023-02-17 | 宁波德洲精密电子有限公司 | Electroplating cabinet for lead frame |
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Effective date of registration: 20230417 Address after: 361000 South side of Lianfa Brick Factory, Group 5, Lilin Village, Guankou Town, Jimei District, Xiamen City, Fujian Province Patentee after: Xiamen Xinyi Changda Industry and Trade Co.,Ltd. Address before: 523000 building a, Ogilvy smart Industrial Park, 2 shaping Road, keyuancheng Information Industrial Park, Tangxia Town, Dongguan City, Guangdong Province Patentee before: Dongguan Omeite Technology Co.,Ltd. |
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Effective date of registration: 20240104 Address after: 523000 building a, Ogilvy smart Industrial Park, 2 shaping Road, keyuancheng Information Industrial Park, Tangxia Town, Dongguan City, Guangdong Province Patentee after: Dongguan Omeite Technology Co.,Ltd. Address before: 361000 South side of Lianfa Brick Factory, Group 5, Lilin Village, Guankou Town, Jimei District, Xiamen City, Fujian Province Patentee before: Xiamen Xinyi Changda Industry and Trade Co.,Ltd. |
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