CN108486618A - A method of improving thick metal plated uniformity - Google Patents
A method of improving thick metal plated uniformity Download PDFInfo
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- CN108486618A CN108486618A CN201810597042.6A CN201810597042A CN108486618A CN 108486618 A CN108486618 A CN 108486618A CN 201810597042 A CN201810597042 A CN 201810597042A CN 108486618 A CN108486618 A CN 108486618A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of methods improving thick metal plated uniformity, the sides 50MM are sealed by the surrounding making anode plate washer in plating bath and lower end making packaged type anode plate washer and in plating bath surrounding PP plates, to block the electric current point effect that periphery liquid medicine is more and gold ion offer is excessively formed；The present invention controls gold-plating current by grip size and clamping plate mode and is uniformly distributed, and ensure that the edges of boards of plate to be plated are close with the electrical distribution in plate significantly.Compared with prior art, the present invention realizes the uniformity promotion of plating thick, and gold-plated uniformity is increased to 90 95% by industry routine level 60 70%, gold salt cost is greatly reduced, ensure that the transmission quality of signal.
Description
Technical field
The invention belongs to PCB manufacturing technology fields, and in particular to be a kind of method improving thick metal plated uniformity.
Background technology
The core of active phase array antenna design is T/R components.The principal element that the design of T/R components considers has：Not similar shape
The number of formula integrated circuit, the height of power output, the noise coefficient size of reception, the precision etc. of amplitude and phase controlling.By
In T/R component generally use multi-chip modules（MCM）Technology come reduce volume, reduce weight, improve component integrated level, inside
Be integrated with a large amount of microwave chip, logic control chip and power pulse modulation chip etc., thus for as multi-chip and
More stringent requirements are proposed for the microwave printed board of inter-chip interconnection routing carrier.
Microwave printed board is very strict for the loss control of signal transmission, and accuracy has arrived millimeter wave rank, not only
Material needs to select the PTFE composite of ultra-low loss, and in terms of surface treatment, needs by the way of thick metal plated
It makes, i.e., electroplating gold thickness needs to reach 80 microinch or more, is layers of copper under layer gold, removes in traditional plating nickel gold mode
Nickel coating bottoming reduces the influence of passive intermodulation to eliminate interference of the nickel layer to electromagnetism, improves the stability of signal transmission.
But since the price of gold is very expensive, plates thick gold process and only used in small range high-end product.Its is gold-plated to set
Standby not carry out differentiation making, gold-plated uniformity is relatively poor always, and conventional gold in the field of business is thick to be required in 1-3 microinch,
Gold-plated uniformity is generally in 60-70%.But this gold-plated uniformity is amplified to the thickness of 80 microinch, the waste situation of gold salt
It is then very serious, and the difference of gold thickness can also generate signal transmission certain influence very much greatly.
For this purpose, in the microwave printed board surface treatment manufacture craft of high end communication, it is necessary to provide a kind of raising plating
The method of thick gold uniformity.
Invention content
For this purpose, the purpose of the present invention is to provide a kind of method improving thick metal plated uniformity, to solve microwave printing
The poor problem of the gold-plated uniformity of plate.
The purpose of the present invention is what is be achieved through the following technical solutions.
A method of thick metal plated uniformity is improved, including：Supplied materials inspection, sandblasting, bound edge, upper plate, oil removing, first time
Double washings, microetch, second pair of washing, first time acidleach, double washings for the third time, plating thin is golden, first time gold recycles, the 4th time
Double washings, second of acidleach, the 5th double washings, third time acidleach, the 6th double washings, thick metal plated, second of gold recycle,
7th double washings, support board slot, cleaning, drying at lower plate；The wherein described plating thin gold includes：Thin golden electroplating bath is made, it is described thin
Golden electroplating bath is made of ruthenium-iridium-tantalum net, and thin golden electroplating bath inside circumference side wall is each provided with a fixed anode baffle, internal
Lower end is provided with a mobile anode baffle, and four sides of any lateral wall of the thin golden electroplating bath, which are each provided with one, to prevent from being electroplated
Form the PP plates of electric current point effect；Cylinder is carried out out to thin golden electroplating bath, a concentration of 40% is added successively into thin golden electroplating bath
Auruna551 open cylinder agents, 275g potassium auricyanides and 333 milliliters of Auruna551 B replenishers；Wait for that thin golden electroplating bath opens cylinder completion
Afterwards, the plate to be plated after the double washings of third time is fixed by bilateral hanger, be correspondingly placed into thin golden electroplating bath and used
The gold-plated mode that turns around twice carries out plating thin gold；It is described thick metal plated to include：Make thick golden electroplating bath, the thick golden electroplating bath
It is made of platinum titanium net, and thick golden electroplating bath inside circumference side wall is each provided with a fixed anode baffle, interior lower end setting
There is a mobile anode baffle, four sides of any lateral wall of the thick golden electroplating bath, which are each provided with one, prevents plating from forming electric current
The PP plates of point effect；Cylinder is carried out out to thick golden electroplating bath, adds a concentration of 50% AURUNA successively into thick golden electroplating bath
5100 open cylinder agents, 1376g potassium auricyanides and 67 milliliters of 5100 replenishers of AURUNA；It, will after the completion of waiting for that thick golden electroplating bath opens cylinder
Plate to be plated after the 6th double washings is fixed by bilateral hanger, is correspondingly placed into use in thick golden electroplating bath and be turned around twice
Gold-plated mode carries out thick metal plated.
Further, the bottom both ends of the thin golden electroplating bath and thick golden electroplating bath be correspondingly arranged on one for adjust shifting
The lift PP scaffolds of dynamic formula anode baffle oscilaltion.
Further, four sides of any lateral wall of the thin golden electroplating bath and thick golden electroplating bath are each provided with one for preventing
The PP plates that only plating forms electric current point effect and width is 50mm.
Further, the bilateral conductive hook for gripping plate to be plated is provided on the bilateral hanger, and
It is provided with Telescopic cross rod.
Further, the flexible maximum length of the Telescopic cross rod is 300mm.
Further, the thin golden electroplating bath and thick golden electroplating bath are horizontal hunting slot, amplitude of fluctuation be 30mm ~
60mm。
The present invention by plating bath surrounding make anode plate washer and lower end make packaged type anode plate washer and
Plating bath surrounding seals the sides 50MM with PP plates, is imitated with blocking the electric current tip that periphery liquid medicine is more and gold ion offer is excessively formed
It answers；The present invention controls gold-plating current by grip size and clamping plate mode and is uniformly distributed, and ensure that the edges of boards of plate to be plated significantly
It is close with the electrical distribution in plate.Compared with prior art, the present invention realizes the uniformity promotion of plating thick, will be gold-plated uniform
Property is increased to 90-95% by the horizontal 60-70% of industry routine, greatly reduces gold salt cost, ensure that the transmission quality of signal.
Description of the drawings
Fig. 1 is the structural schematic diagram of the thin golden electroplating bath of the present invention；
Fig. 2 is the structural schematic diagram of the thick golden electroplating bath of the present invention；
Fig. 3 is the process flow chart that the present invention improves thick metal plated uniformity.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
80 microinch thickness are amplified to for the gold-plated uniformity of microwave printed board in current industry, there are the waste feelings of gold salt
Condition is serious, and golden thickness differs greatly, and there is a problem of that gold-plated uniformity is poor.It is thick metal plated uniformly that the present invention provides a kind of raisings
The method of property.
As shown in figure 3, method of the present invention mainly includes：Supplied materials inspection, sandblasting, bound edge, upper plate, oil removing,
Primary double washings, microetch, second pair of washing, first time acidleach, the double washings of third time, plating thin be golden, it is golden for the first time recycle, the
Four double washings, second of acidleach, the 5th double washings, third time acidleach, the 6th double washings, thick metal plated, second of gold
Recycling, lower plate, supports board slot, cleaning, drying at the 7th double washings.
Wherein of the invention thes improvement is that plating thin gold and thick metal plated technique.
One thin golden electroplating bath 10 and one thick golden electroplating bath 10 ' are made first.
As shown in Figure 1, thin gold electroplating bath 10 is made of ruthenium-iridium-tantalum net in the present embodiment, mainly by rear cell wall 11, left slot
Wall 12, preceding cell wall 13, right cell wall 14 and kerve wall are formed, and rear cell wall 11, left cell wall 12, preceding cell wall 13 and right cell wall 14
Four sides of lateral wall are each provided with a PP plate for preventing plating from forming electric current point effect, which is 50mm.
In the past for cell wall 13, the quadrangle of lateral wall at PP plates correspond to 131,132,133,134；Right cell wall 14
The quadrangle of lateral wall at PP plates correspond to 141,142,143,144.
Anode baffle component 20 there are one being formed in thin golden electroplating bath 10, the anode baffle component 20 is by rear anode baffle
21, left anode baffle 22, preceding anode baffle 23, right anode baffle 24 surround, and there are one mobile in anode baffle component 20
Formula anode baffle 25.
The bottom both ends of thin gold electroplating bath 10 are used to adjust 25 oscilaltion of mobile anode baffle there are one being correspondingly arranged
Lift PP scaffolds, by lift PP scaffolds can realize to 25 oscilaltion of mobile anode baffle control to adjust.For
The plating plate of different length makes the mobile anode baffle of 150mm high, passes through lifting when plate height is higher than 500mm
Formula PP scaffolds adjust mobile anode baffle 25 and are sunken to slot bottom, to block the tip electric current of bottom；If plate height is less than
When 500mm, is then corresponded to by lift PP scaffolds and adjust the rising of mobile anode baffle 25 with the reduction of plate height, to
Ensure that its anode blocking position bottom is identical as the height of plate bottom, can effectively reduce and be formed down because of plate height change
Gold thick plating in lower end is thick caused by holding point effect, influences thick metal plated uniformity.
Similarly, as shown in Fig. 2, thick gold electroplating bath 10 ' is made of ruthenium-iridium-tantalum net in the present embodiment, mainly by rear cell wall
11 ', left cell wall 12 ', preceding cell wall 13 ', right cell wall 14 ' and kerve wall are formed, and rear cell wall 11 ', left cell wall 12 ', preceding cell wall
13 ' and four sides of lateral wall of right cell wall 14 ' be each provided with one and prevent plating from forming the PP plates of electric current point effect, the PP plates
Width is 50mm.
In the past for cell wall 13 ', the quadrangle of lateral wall at PP plates correspond to 131 ', 132 ', 133 ', 134 '；It is right
The quadrangle of 14 ' lateral wall of cell wall at PP plates correspond to 141 ', 142 ', 143 ', 144 '.
Anode baffle component 20 ' there are one being formed in thick golden electroplating bath 10 ', the anode baffle component 20 ' is by rear anode
Baffle 21 ', left anode baffle 22 ', preceding anode baffle 23 ', right anode baffle 24 ' surround, and also have in anode baffle component 20 '
One mobile anode baffle 25 '.
The bottom both ends of thick gold electroplating bath 10 ' rise there are one being correspondingly arranged for adjusting about 25 ' mobile anode baffle
The lift PP scaffolds of drop can be realized by lift PP scaffolds and be controlled to adjust to the 25 ' oscilaltion of mobile anode baffle.It is right
In the plating plate of different length, the mobile anode baffle of 150mm high is made, passes through liter when plate height is higher than 500mm
Drop formula PP scaffolds adjust mobile anode baffle 25 ' and are sunken to slot bottom, to block the tip electric current of bottom；If plate height is less than
When 500mm, is then corresponded to by lift PP scaffolds and adjust the mobile rising of anode baffle 25 ' with the reduction of plate height, from
And ensure that its anode blocking position bottom is identical as the height of plate bottom, it can effectively reduce and be formed because of plate height change
Gold thick plating in lower end is thick caused by the point effect of lower end, influences thick metal plated uniformity.
It is correspondingly arranged on bilateral hanger above thin golden electroplating bath 10 and thick golden electroplating bath 10 ', the bilateral hanger both sides
It is designed with press strip, screw and adjusting nut, built-in spring is provided in screw to facilitate the electric conductivity of the plate of different-thickness good
It is good, Telescopic cross rod is designed up and down, and most wide scalable width is 300mm, and the plating thick golden plate more than 300mm can not produce；It is super
The bilateral hanger of embedded with spring can be split into the unilateral hanger production of two plating by crossing the plating thin golden plate of 300mm wide, detachable
Flexible connection design, to easy disassembly and replacement, and the product suitable for doing different specification size, to improve making for hanger
With property, gold-plated production efficiency is improved, the bilateral hanger of built-in spring is done encapsulated under all nuts for immersing gold-plated liquid medicine parts
Processing ensures the accuracy of electric current, saves gold salt and avoids liquid medicine cross contamination to do insulating layer.
It should be noted that 10 connecting leg road of the thin golden electroplating bath band leakproof basin in the present embodiment, internal control size are：
L350mm*W900mm*H800mm, groove body material make additional stirrup reinforcement with 12mmPP+20mm plates, and guarantee will not deform, slot
One group of screen pipe is inside put, it is stainless steel SUS316 flat (5mmX40MMX1100MM) that anode, which is fixed flat,.Anode ruthenium-iridium-tantalum net, ruler
It is very little：(unilateral ruthenium iridium is 5 microns thick by L600XW550X1.8）, anode ruthenium-iridium-tantalum net and the area ratio of work plate are at least 2:
1.Cathode 10*50*1100SUS316 stainless steel plates.Per hour flow 4000L the vertical PP filters of H it is (gold-plated）Cycle
10MTO/H or more.Rectifier specification:20A/12V/ (220V inputs) band hand control box and timing and alarming, are accurate to two small
Number, minimum resolution 0.1A.Heating tube Teflon heating tube connects control line 3KW/220V.
10 ' connecting line of thick gold electroplating bath band leakproof basin, internal control size are in the present embodiment：L350mm*W900mm*
H900mm, groove body material make additional stirrup reinforcement with 12mmPP+20mm plates, and guarantee will not deform, and one group of screen pipe is put in slot,
It is flat (5mmX40MMX1100MM) that anode fixes flat stainless steel SUS316.Anode platinum titanium net, size：L600XW550X1.8
(unilateral platinum is 1.5 microns thick）.Cathode 10*50*1100SUS316 stainless steel plates.Per hour flow 4000L H vertical PP filterings
Machine is (gold-plated）Recycle 10MTO/H or more.Rectifier specification:20A/12V/ (220V inputs) band hand control box and timing report
It is alert, it is accurate to two-decimal, minimum resolution 0.1A.
After thin golden electroplating bath 10 and thick golden electroplating bath 10 ' complete, need respectively to carry out out it in cylinder.
Cylinder is opened to thin golden electroplating bath 10, needs to add a concentration of 40% Auruna 551 successively into thin golden electroplating bath 10
400 milliliters of open cylinder agent, the potassium auricyanide solution of a concentration of 0.8g/L（Include 275g potassium auricyanides）And 333 milliliters
Auruna551 B replenishers（Include 50 grams of gold salts）.Often depositing 1 gram of proof gold just needs 1.5 gram of 68.3% gold salt of supplement and 10 milliliters
551 replenisher B, water and other losses separately supplement.Gold content is not lower than 0.8 gram/liter, and pH should not exceed 4.5, use lemon
Acid or sodium hydroxide adjustment, proportion can use No. 2 adjustment of conductive salt, 18 g/l that can increase 0.01g/ml, and design level is swung, pendulum
Width 3-6cm.
After the completion of thin golden electroplating bath 10 opens cylinder, the plate to be plated after the double washings of third time is led to reference to above-mentioned technique
Bilateral hanger is crossed to fix, be correspondingly placed into thin golden electroplating bath and using turn around twice it is gold-plated by the way of to carry out plating thin golden, twice
The gold-plated upper end for first gripping plate of turning around is electroplated, and after the completion of to be electroplated, the lower end of plate is turned around to be clamped in
End, is electroplated again, to ensure the uniformity of plating；Carry out gold recycling for the first time, the 4th successively after the completion of plating thin gold
Secondary double washings, second of acidleach, the 5th double washings, third time acidleach, the 6th double washings and then progress are thick metal plated.
Cylinder is carried out out to thick golden electroplating bath 10 ', adds a concentration of 50% AURUNA successively into thick golden electroplating bath 10 '
The potassium auricyanide solution of 5100 400 milliliters of open cylinder agents, a concentration of 4g/L（Include 1376g potassium auricyanides）And 67 milliliters of AURUNA
5100 replenishers（Include 50 grams of gold salts）, Line Continuity of going forward side by side filtering, design level swings, amplitude of oscillation 3-6cm so that workpiece waves,
And with citric acid or potassium hydroxide (chemistry is pure) adjustment pH.Plating solution proportion is maintained at 1.15 to 1.19 g/cm3,20 g/l
AURUNA 5100 can rise 0.01g/ milliliters of plating bath proportion than geavy salt.
After the completion of waiting for that thick golden electroplating bath opens cylinder, the plate to be plated after the 6th double washings is consolidated by bilateral hanger
It is fixed, be correspondingly placed into thick golden electroplating bath using turn around twice it is gold-plated by the way of carry out it is thick metal plated, it is thick metal plated later again successively
It carries out second of gold recycling, the 7th double washings, lower plate, support the operations such as board slot, cleaning, drying.
Two electroplating gold slots carry out thin gold plating to the present invention respectively and thick gold is electroplated by making, first time plating thin gold,
After making gold-plated deposition rate stablize, then by way of second time electroplating gold, achieve the purpose that improve thick metal plated uniformity.
The present invention makes two kinds of anode plate washers in plating bath, and surrounding makes anode plate washer in golden slot, under golden slot
End makes packaged type anode plate washer, and seals 50MM sides in the surrounding of plating bath PP plates, to block periphery liquid medicine it is more and
Gold ion provides the electric current point effect excessively formed；And the liftable that the removable plate washer made in golden slot passes through golden slot both ends
Formula PP scaffolds can correspond to the height of adjustment PP scaffolds according to the length and area of thick golden plate to be plated.
In conclusion the present invention is by scrap build and the innovation of production method, by gold-plated uniformity by industry routine water
Flat 60-70% is increased to 90-95%, and gold salt cost is greatly saved, and improves the uniformity of golden thickness, ensure that the transmission matter of signal
Amount.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (6)
1. a kind of method improving thick metal plated uniformity, which is characterized in that including：Supplied materials inspection, bound edge, upper plate, removes at sandblasting
Oily, double washings for the first time, microetch, second pair of washing, first time acidleach, the double washings of third time, plating thin is golden, gold returns for the first time
Receive, the 4th double washings, second of acidleach, the 5th double washings, third time acidleach, the 6th time pair wash, be thick metal plated, second
Secondary gold recycling, lower plate, supports board slot, cleaning, drying at the 7th double washings；The wherein described plating thin gold includes：Make thin gold plating
Slot, the thin golden electroplating bath is made of ruthenium-iridium-tantalum net, and thin golden electroplating bath inside circumference side wall is each provided with a fixed anode
Baffle, interior lower end are provided with a mobile anode baffle, and four sides of any lateral wall of the thin golden electroplating bath are each provided with
One prevents that the PP plates for forming electric current point effect are electroplated；Cylinder is carried out out to thin golden electroplating bath, is added successively into thin golden electroplating bath
A concentration of 40% Auruna551 open cylinder agents, 275g potassium auricyanides and 333 milliliters of Auruna551B replenishers；Wait for that Bao Jin is electroplated
After the completion of slot opens cylinder, the plate to be plated after the double washings of third time is fixed by bilateral hanger, is correspondingly placed into Bao Jin plating
In slot and using turn around twice it is gold-plated by the way of carry out plating thin gold；It is described thick metal plated to include：Thick golden electroplating bath is made, it is described
Thick gold electroplating bath is made of platinum titanium net, and thick golden electroplating bath inside circumference side wall is each provided with a fixed anode baffle, interior
Subordinate end is provided with a mobile anode baffle, and four sides of any lateral wall of the thick golden electroplating bath, which are each provided with one, prevents electricity
Plating forms the PP plates of electric current point effect；Cylinder is carried out out to thick golden electroplating bath, a concentration of 50% is added successively into thick golden electroplating bath
5100 open cylinder agents of AURUNA, 1376g potassium auricyanides and 67 milliliters of 5100 replenishers of AURUNA；Wait for that thick golden electroplating bath opens cylinder
After the completion, the plate to be plated after the 6th double washings is fixed by bilateral hanger, is correspondingly placed into thick golden electroplating bath and adopts
It is carried out with the gold-plated mode that turns around twice thick metal plated.
2. the method for improving thick metal plated uniformity as described in claim 1, which is characterized in that the thin golden electroplating bath and thickness
The bottom both ends of golden electroplating bath are correspondingly arranged on the lift PP scaffolds for adjusting mobile anode baffle oscilaltion.
3. the method for improving thick metal plated uniformity as claimed in claim 2, which is characterized in that the thin golden electroplating bath and thickness
It is 50mm that four sides of any lateral wall of golden electroplating bath, which are each provided with one for preventing plating from forming electric current point effect and width,
PP plates.
4. the method for improving thick metal plated uniformity as claimed in claim 3, which is characterized in that be arranged on the bilateral hanger
It is useful for gripping the bilateral conductive hook of plate to be plated, and is provided with Telescopic cross rod.
5. the method for improving thick metal plated uniformity as claimed in claim 4, which is characterized in that the Telescopic cross rod is stretched
Contracting maximum length is 300mm.
6. the method for improving thick metal plated uniformity as claimed in claim 5, which is characterized in that the thin golden electroplating bath and thickness
Golden electroplating bath is horizontal hunting slot, and amplitude of fluctuation is 30mm ~ 60mm.
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| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN112626582A (en) * | 2020-11-17 | 2021-04-09 | 威科赛乐微电子股份有限公司 | Method for improving uniformity of electroplated metal film |
| CN113347807A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Method for manufacturing same-hole different-net and double-sided contact pin back plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN112626582A (en) * | 2020-11-17 | 2021-04-09 | 威科赛乐微电子股份有限公司 | Method for improving uniformity of electroplated metal film |
| CN112626582B (en) * | 2020-11-17 | 2022-05-24 | 威科赛乐微电子股份有限公司 | Method for improving uniformity of electroplated metal film |
| CN113347807A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Method for manufacturing same-hole different-net and double-sided contact pin back plate |
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| CN108486618B (en) | 2021-01-01 |
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