CN101962795A - Scaffold arranged in electroplating bath and provided with hole on side edge - Google Patents
Scaffold arranged in electroplating bath and provided with hole on side edge Download PDFInfo
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- CN101962795A CN101962795A CN 201010269593 CN201010269593A CN101962795A CN 101962795 A CN101962795 A CN 101962795A CN 201010269593 CN201010269593 CN 201010269593 CN 201010269593 A CN201010269593 A CN 201010269593A CN 101962795 A CN101962795 A CN 101962795A
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- scaffold
- hanger
- plating
- holes
- plating tank
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Abstract
The invention discloses a scaffold which is arranged in an electroplating bath and provided with a hole on a side edge. The scaffold is arranged in the solution of the electroplating bath; coated metal connected with the anode of a power supply is arranged in the electroplating bath; the top of the scaffold is provided with a rack connected with the cathode of the power supply; the rack is provided with a plurality of collets for clamping a plated part; the clamped plated part is positioned below the rack; and the front and back ends of the rack are provided with elevating devices for controlling the rack to ascend and descend. The scaffold is characterized in that: the scaffold consists of a front fixing plate, a back fixing plate, a left anode baffle plate, a right anode baffle plate and a middle beam; the middle beam is arranged between the middle part of the front fixing plate and the middle part of the back fixing plate; and the upper parts of the left anode baffle plate and the right anode baffle plate are provided with through holes respectively. The problems of non-uniform thicknesses of clad layers at the bottom of the plated part and at other positions of the plated part and the ununiformity of the whole clad layers in the prior art are solved and the scaffold with the hole on the side edge which has a simple structure and can improve the uniformity of the clad layers is provided.
Description
Technical field
The present invention relates to technical field of plating equipment, particularly relate to a kind of interior and side scaffold with holes of plating tank that is arranged on.
Background technology
Plating is exactly to utilize electrolysis principle to plate the process of other metal or alloy of skim on some metallic surface, be to utilize electrolytic action to make the technology of the surface attachment layer of metal film of metal or other material product, play preventing that burn into from improving wear resistance, electroconductibility, reflective and promoting effects such as attractive in appearance.Coated metal is connected on anode during plating, and plating piece is connected on negative electrode, and the electrolyte solution with plated metal ion between the anode and cathode links to each other, and plating piece must be invaded in the middle of the electrolyte solution.Because the degree of depth of plating tank inner anode is darker than the degree of depth of negative electrode, the electric current that the anode portion branch that has more like this sends can converge to the bottom of plating piece, cause the electric current of plating piece bottom excessive, make that plating piece bottom coating is thicker when electroplating, the homogeneity of coating is relatively poor, and quality descends, if but adopt the anode baffle of scaffold both sides that the plating piece bottom is blocked fully, can cause plating piece bottom to pass through electric current less, the coating of plating piece is thinner, coating is still even inadequately.
Summary of the invention
For bottom coating and other position coating thickness of plating piece that solves plating piece in the prior art differs, whole coating is uniform problem inadequately, the invention provides a kind of simple in structurely, can improve the side scaffold with holes of coating uniformity.
In order to achieve the above object, the technical solution used in the present invention is:
A kind of interior and side scaffold with holes of plating tank that is arranged on, described scaffold is placed in the solution of plating tank, in plating tank, be provided with the coated metal that links to each other with positive source, be provided with the hanger that links to each other with power cathode at the top of scaffold, hanger is provided with some chucks that are used for the clamping plating piece, the plating piece of clamping is positioned at the below of hanger, be provided with the lifting device of its lifting of control in the rear and front end of hanger, it is characterized in that: described scaffold is by front shoe, rear fixed plate, left side anode baffle, right anode baffle and middle beam are formed, between front shoe middle part and rear fixed plate middle part, be provided with middle beam, top at left anode plate washer and right anode plate washer offers 3～5 exhausting holes respectively, through hole is crisscross arranged between arranging up and down, longitudinal interval is 8cm, transverse pitch between each horizontally-arranged adjacent through-holes is 10cm, and the diameter range of each through hole is 1.0～1.2cm.
Aforesaid a kind of interior and side scaffold with holes of plating tank that is arranged on, it is characterized in that: the below retaining clip of described hanger is held some plating pieces, between the inboard of scaffold left side anode baffle and right anode baffle, be provided with a pair of set square in opposite directions every a segment distance symmetry, fixedly connected near the sidewall of its end one side with middle beam in the end of described each set square, four adjacent set squares of described front and back are formed standing groove, and corresponding standing groove can vertically be put in the bottom of described every plating piece.
Aforesaid a kind of interior and side scaffold with holes of plating tank that is arranged on is characterized in that: be respectively arranged with the coated metal that links to each other with positive source in the both sides of hanger.
Aforesaid a kind of interior and side scaffold with holes of plating tank that is arranged on, it is characterized in that: clamping has some plating pieces respectively below the sidewall of the both sides of hanger.
The invention has the beneficial effects as follows: scaffold of the present invention is because the anode baffle of both sides offers through hole, the anode baffle area of both sides reduces like this, its antianode electric current block ability drop, help readjusting the distribution of power line, after electric force lines distribution was adjusted, the coating uniformity of plating piece improved greatly, has improved the quality of plating piece, also reduce simultaneously the waste on the blocked up coated metal material that brings of coating, reduced cost.
Description of drawings
Fig. 1 is an electrolyzer front view of the present invention;
Fig. 2 is an electrolyzer vertical view of the present invention;
Fig. 3 is the structural representation of scaffold of the present invention;
Fig. 4 is scaffold of the present invention and plating piece fit structure synoptic diagram.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As depicted in figs. 1 and 2, the scaffold that a kind of side is with holes, scaffold 5 is placed in the solution of plating tank 3, be provided with the hanger 1 that links to each other with power cathode at the top of scaffold 5, be respectively arranged with some chucks that are used for clamping plating piece 2 on the sidewall of the both sides of hanger 1, the plating piece 2 of clamping is positioned at the below of hanger 1, is provided with the lifting device of control hanger 1 lifting in the rear and front end of hanger 1, in plating tank 3, the both sides of hanger 1 are respectively arranged with the coated metal 4 that links to each other with positive source.As shown in Figure 3, scaffold 5 is by front shoe 6, rear fixed plate 7, left side anode baffle 8, right anode baffle 9 and middle beam 10 are formed, between front shoe 6 middle parts and rear fixed plate 7 middle parts, be provided with middle beam 10, between the inboard of scaffold 5 left anode baffle 8 and right anode baffle 9, be provided with a pair of set square 11 in opposite directions every a segment distance symmetry, fixedly connected near the sidewall of this set square 11 ends one side with middle beam 10 in the end of each set square 11, adjacent four set squares 11 in front and back are formed standing grooves 12, corresponding standing groove 12 can vertically be put in the bottom of every plating piece 2, top at left anode plate washer 8 and right anode plate washer 9 offers 3～5 exhausting holes respectively, through hole is crisscross arranged between arranging up and down, longitudinal interval is 8cm, transverse pitch between each horizontally-arranged adjacent through-holes is 10cm, and the diameter range of each through hole is 1.0～1.2cm.
As shown in Figure 4, during plating, coated metal 4 connects positive source, and plating piece 2 is by hanger 1 and power cathode conducting, after the energising, produce electric current between coated metal 4 and the plating piece 2, the bottom of plating piece 2 is covered by the left anode plate washer 8 of scaffold 5 and right anode plate washer 9, and left anode plate washer 8 and right anode plate washer 9 are provided with through hole simultaneously, can regulate the distribution of power line like this, make plating piece 2 bottoms institute identical substantially with plating piece 2 other positions, guarantee that the coating of plating piece 2 is evenly distributed by electric current by electric current.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the specification sheets just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. one kind is arranged in the plating tank and side scaffold with holes, described scaffold is placed in the solution of plating tank, in plating tank, be provided with the coated metal that links to each other with positive source, be provided with the hanger that links to each other with power cathode at the top of scaffold, hanger is provided with some chucks that are used for the clamping plating piece, the plating piece of clamping is positioned at the below of hanger, be provided with the lifting device of its lifting of control in the rear and front end of hanger, it is characterized in that: described scaffold is by front shoe, rear fixed plate, left side anode baffle, right anode baffle and middle beam are formed, between front shoe middle part and rear fixed plate middle part, be provided with middle beam, top at left anode plate washer and right anode plate washer offers 3～5 exhausting holes respectively, through hole is crisscross arranged between arranging up and down, longitudinal interval is 8cm, transverse pitch between each horizontally-arranged adjacent through-holes is 10cm, and the diameter range of each through hole is 1.0～1.2cm.
2. a kind of interior and side scaffold with holes of plating tank that is arranged on according to claim 1, it is characterized in that: the below retaining clip of described hanger is held some plating pieces, between the inboard of scaffold left side anode baffle and right anode baffle, be provided with a pair of set square in opposite directions every a segment distance symmetry, fixedly connected near the sidewall of its end one side with middle beam in the end of described each set square, four adjacent set squares of described front and back are formed standing groove, and corresponding standing groove can vertically be put in the bottom of described every plating piece.
3. a kind of interior and side scaffold with holes of plating tank that is arranged on according to claim 2 is characterized in that: be respectively arranged with the coated metal that links to each other with positive source in the both sides of hanger.
4. a kind of interior and side scaffold with holes of plating tank that is arranged on according to claim 3, it is characterized in that: clamping has some plating pieces respectively below the sidewall of the both sides of hanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102695933A CN101962795B (en) | 2010-08-30 | 2010-08-30 | Scaffold arranged in electroplating bath and provided with hole on side edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102695933A CN101962795B (en) | 2010-08-30 | 2010-08-30 | Scaffold arranged in electroplating bath and provided with hole on side edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101962795A true CN101962795A (en) | 2011-02-02 |
| CN101962795B CN101962795B (en) | 2012-06-06 |
Family
ID=43515841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102695933A Expired - Fee Related CN101962795B (en) | 2010-08-30 | 2010-08-30 | Scaffold arranged in electroplating bath and provided with hole on side edge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101962795B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286772A (en) * | 2011-08-22 | 2011-12-21 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
| CN104532327A (en) * | 2014-12-24 | 2015-04-22 | 昆山元茂电子科技有限公司 | Anode baffles with uniform electroplating |
| CN108486618A (en) * | 2018-06-11 | 2018-09-04 | 深圳市博敏电子有限公司 | A method of improving thick metal plated uniformity |
| CN110029392A (en) * | 2019-05-31 | 2019-07-19 | 高德（无锡）电子有限公司 | The scaffold of vertical continuous electroplating bath plate face copper facing uniformity |
| CN111304727A (en) * | 2020-04-27 | 2020-06-19 | 侯光微 | Electroplating system and electroplating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4879007A (en) * | 1988-12-12 | 1989-11-07 | Process Automation Int'l Ltd. | Shield for plating bath |
| CN201228289Y (en) * | 2008-04-18 | 2009-04-29 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating apparatus of printed circuit board |
| CN201785528U (en) * | 2010-08-30 | 2011-04-06 | 昆山元茂电子科技有限公司 | Floating frame arranged in plating bath and provided with lateral holes |
-
2010
- 2010-08-30 CN CN2010102695933A patent/CN101962795B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4879007A (en) * | 1988-12-12 | 1989-11-07 | Process Automation Int'l Ltd. | Shield for plating bath |
| US4879007B1 (en) * | 1988-12-12 | 1999-05-25 | Process Automation Int L Ltd | Shield for plating bath |
| CN201228289Y (en) * | 2008-04-18 | 2009-04-29 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating apparatus of printed circuit board |
| CN201785528U (en) * | 2010-08-30 | 2011-04-06 | 昆山元茂电子科技有限公司 | Floating frame arranged in plating bath and provided with lateral holes |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286772A (en) * | 2011-08-22 | 2011-12-21 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN102286772B (en) * | 2011-08-22 | 2015-06-03 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
| CN104313668B (en) * | 2014-09-30 | 2017-03-15 | 苏州芯航元电子科技有限公司 | Electronics producing line electrochemical processing cell |
| CN104532327A (en) * | 2014-12-24 | 2015-04-22 | 昆山元茂电子科技有限公司 | Anode baffles with uniform electroplating |
| CN108486618A (en) * | 2018-06-11 | 2018-09-04 | 深圳市博敏电子有限公司 | A method of improving thick metal plated uniformity |
| CN108486618B (en) * | 2018-06-11 | 2021-01-01 | 深圳市博敏电子有限公司 | Method for improving uniformity of electroplated thick gold |
| CN110029392A (en) * | 2019-05-31 | 2019-07-19 | 高德（无锡）电子有限公司 | The scaffold of vertical continuous electroplating bath plate face copper facing uniformity |
| CN111304727A (en) * | 2020-04-27 | 2020-06-19 | 侯光微 | Electroplating system and electroplating method |
| CN111304727B (en) * | 2020-04-27 | 2021-04-13 | 深圳市联丰五金塑胶制品有限公司 | Electroplating system and electroplating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101962795B (en) | 2012-06-06 |
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Granted publication date: 20120606 Termination date: 20150830 |
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