CN201228289Y - Electroplating apparatus of printed circuit board - Google Patents
Electroplating apparatus of printed circuit board Download PDFInfo
- Publication number
- CN201228289Y CN201228289Y CNU2008200466213U CN200820046621U CN201228289Y CN 201228289 Y CN201228289 Y CN 201228289Y CN U2008200466213 U CNU2008200466213 U CN U2008200466213U CN 200820046621 U CN200820046621 U CN 200820046621U CN 201228289 Y CN201228289 Y CN 201228289Y
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- CN
- China
- Prior art keywords
- wiring board
- circuit board
- printed circuit
- side plate
- electroplanting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a printed circuit board electroplating device, wherein two opposite anodes are arranged in an electroplating tank; the two anodes are electrically connected with a positive electrode; a floating tank is arranged between the two anodes in the electroplating tank; and a printed circuit board connected with a negative electrode is arranged on the floating tank. The floating tank includes two side plates; the circuit board is arranged between the side plates; and side plate holes are formed on both of the side plates. The electroplating device can readjust electric force lines in the electroplating tank to achieve more uniform electroplating on the circuit board and good electroplating effect.
Description
Technical field
The utility model relates to a kind of electroplanting device of printed circuit board.
Background technology
Present electronic product develops to light, thin, little direction gradually, make the integrated level of electronic product improve constantly, as the printed circuit board that connects components and parts in the electronic product, its conductive pattern, via are more and more intensive, wire density, spacing and conducting aperture are more and more littler, and this brings stern challenge for the production of printed circuit board.In the electroplating process of printed circuit board, skin conductor copper has the certain standard requirement, and because the electric force lines distribution in the plating tank is inhomogeneous, particularly comparatively intensive in the electric force lines distribution of whole plating window periphery, so the peripheral copper facing of wiring board is thicker than wiring board central authorities, this phenomenon is more outstanding when the high-density printed circuit board, and copper facing is in uneven thickness, have influence on the processing quality of product,, can't control the live width tolerance accurately as in subsequent etch technology.
Summary of the invention
The purpose of this utility model is to provide the electroplanting device of the more uniform printed circuit board of a kind of plating.
The utility model is achieved through the following technical solutions:
A kind of electroplanting device of printed circuit board is provided with two relative anodes in plating tank, two anodes and positive electrode electrically connect, and are provided with floating trough between two anodes in plating tank, are provided with the wiring board that is connected with negative potential on floating trough; This floating trough comprises two side plates, and wiring board is equipped with the side plate hole on two side plates between side plate.
In electroplating process, cupric ion moves to negative pole (being wiring board) from anode, and the formation electric force lines distribution, but owing to the skewness of power line in plating tank has influence on electroplating effect, after on the side plate of floating trough the side plate hole being set, make the power line redistribution of wiring board bottom, behind the power line uniform distribution, electroplating effect is greatly improved, and the plating of wiring board is more even.
Side plate hole on each described side plate is a plurality of rounds that form, and in the side plate hole on each described side plate, the mean diameter in the described side plate hole on top is greater than the mean diameter in the described side plate hole of bottom.The quantity in side plate hole is relevant with the size of side plate with diameter, when the side plate height is low, and the corresponding minimizing of quantity in the side plate hole on it.
Described two side plates are parallel with described wiring board.
Distance between described two side plates and the described wiring board is 75 millimeters to 95 millimeters (are 85 millimeters than the figure of merit); Described wiring board and described anodic distance are d, and described side plate is partly picked up retaining with described wiring board, and the difference of altitude between the vertex of described side plate and the lower-most point of described wiring board is j, wherein, and 0.34d＜j＜0.39d.When negative electrode and anodic distance is big more, the size of floating trough latus superius is also big more.
In described plating tank, be provided with anode baffle between described wiring board and the described anode.Anode baffle also plays the retaining effect of picking up of power line, makes the distribution of the power line in the plating tank reach perfect condition as far as possible.
Two described anode baffle are respectively near two described anodes, and the lower-most point of each described anode baffle is lower than the vertex of described wiring board.At this moment, anode baffle plays the retaining effect of picking up to the power line on wiring board top.
This electroplanting device also includes spreader plate, and spreader plate is positioned at the side of described wiring board and electrically connects with described negative potential; Described spreader plate is that two and its are measure-alike, and two spreader plates lay respectively at vertical both sides of described wiring board; Described two anode baffle measure-alike.In electroplating process, the power line of wiring board both sides is closeer, be provided with after the spreader plate, under the effect of the strong density power line in both sides, simultaneously the spreader plate of both sides is electroplated, and wiring board place power line is even relatively, and this structure can further be adjusted the power line of wiring board both sides, so that the electric force lines distribution of wiring board both sides is even.
Description of drawings
Fig. 1 is a structure iron of the present utility model;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is among Fig. 1, the johning knot composition of wiring board and floating trough;
Fig. 4 is the distribution schematic diagram of wiring board in plating tank;
Fig. 5 is the structure iron of floating trough latus superius;
Fig. 6 is the anode baffle structure iron;
Description of reference numerals:
1, plating tank, 2, anode, 3, floating trough, 4, wiring board, 5, side plate, 6, the side plate hole, 7, anode baffle, 8, spreader plate, 9, hanger, 10, fly crust, 11, hangers.
Embodiment
Extremely shown in Figure 6 as Fig. 1, a kind of electroplanting device of printed circuit board is provided with relative 2, two anodes of two anodes 2 and electrically connects with positive electrode in plating tank 1, between plating tank 1 interior two anodes 2, be provided with floating trough 3, on floating trough 3, be provided with the wiring board 4 that is connected with negative potential; This floating trough 3 comprises two side plates 5, and wiring board 4 is equipped with side plate hole 6 on two side plates 5 between two side plates 5.
Wherein, be provided with on plating tank 1 and fly to cling to 10 (being fixed cross beam), be provided with hanger 9 on 10 flying to cling to, a plurality of wiring boards are suspended on the hanger 9; Two side plates 5 are parallel with wiring board 4, and the side plate hole 6 on each side plate 5 is a plurality of rounds that form, and in the side plate hole 6 on the side plate 5, the mean diameter in the side plate hole 6 on top is greater than the mean diameter in the side plate hole 6 of bottom; Distance between two side plates 5 and the wiring board 4 is 85 millimeters; Wiring board 4 is d with the distance of anode 2, and side plate 5 is picked up retaining with wiring board 4 parts, and the difference of altitude between the lower-most point of the vertex of side plate 5 and wiring board 4 is j, wherein, and j=0.372d.
In plating tank 1, be provided with anode baffle 7 between wiring board 4 and the anode 2, two anode baffle 7 are respectively near two anodes 2, and the lower-most point of each anode baffle 7 is lower than the vertex (both sides of anode baffle 7 respectively are provided with a hangers 11, and this anode baffle 7 hangs on the plating tank 1 by the hangers 11 of both sides) of wiring board 4.
This electroplanting device also includes spreader plate 8, and spreader plate 8 is positioned at the side of wiring board 4 and electrically connects with negative potential; Spreader plate 8 is that two and its are measure-alike, and two spreader plates 8 lay respectively at vertical both sides of wiring board 4, two spreader plates 8 measure-alike.
In electroplating process, the cupric ion of positively charged moves to negative pole (being wiring board 4) from anode 2, and the formation electric force lines distribution, but owing to the skewness of power line in plating tank 1 has influence on electroplating effect, for making the electric force lines distribution in the plating tank 1 even, the described electroplanting device of present embodiment is done following main improvement: on the side plate 5 of floating trough 3 side plate hole 6 is set, anode baffle 7 is set in plating tank 1, in the both sides of wiring board 4 spreader plate 8 is set, respectively to the bottom of wiring board 4, top, the electric power of the strong density of the left and right sides is picked up retaining or shunting by force, make the electric force lines distribution at wiring board 4 places in the plating tank 1 more even, electroplating effect is good.
Claims (10)
1, a kind of electroplanting device of printed circuit board is provided with two relative anodes in plating tank, two anodes and positive electrode electrically connect, and are provided with floating trough between two anodes in plating tank, are provided with the wiring board that is connected with negative potential on floating trough; It is characterized in that this floating trough comprises two side plates, wiring board is equipped with the side plate hole on two side plates between side plate.
2, the electroplanting device of printed circuit board according to claim 1 is characterized in that the side plate hole on each described side plate is a plurality of rounds that form.
3, the electroplanting device of printed circuit board according to claim 1 is characterized in that in the side plate hole on each described side plate, the mean diameter in the described side plate hole on top is greater than the mean diameter in the described side plate hole of bottom.
4, the electroplanting device of printed circuit board according to claim 1 is characterized in that described two side plates are parallel with described wiring board.
5, as the electroplanting device of printed circuit board as described in the claim 4, it is characterized in that the distance between described two side plates and the described wiring board is 75 millimeters to 95 millimeters.
6, the electroplanting device of printed circuit board according to claim 1, it is characterized in that, described wiring board and described anodic distance are d, described side plate is partly picked up retaining with described wiring board, difference of altitude between the vertex of described side plate and the lower-most point of described wiring board is j, wherein, 0.34d＜j＜0.39d.
7, as the electroplanting device of printed circuit board as described in each in the claim 1 to 6, it is characterized in that, in described plating tank, be provided with anode baffle between described wiring board and the described anode.
As the electroplanting device of printed circuit board as described in the claim 7, it is characterized in that 8, two described anode baffle are respectively near two described anodes, and the lower-most point of each described anode baffle is lower than the vertex of described wiring board.
9, as the electroplanting device of printed circuit board as described in each in the claim 1 to 6, it is characterized in that this electroplanting device also includes spreader plate, spreader plate is positioned at the side of described wiring board and electrically connects with described negative potential.
As the electroplanting device of printed circuit board as described in the claim 9, it is characterized in that 10, described spreader plate is that two and its are measure-alike, two spreader plates lay respectively at vertical both sides of described wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200466213U CN201228289Y (en) | 2008-04-18 | 2008-04-18 | Electroplating apparatus of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200466213U CN201228289Y (en) | 2008-04-18 | 2008-04-18 | Electroplating apparatus of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201228289Y true CN201228289Y (en) | 2009-04-29 |
Family
ID=40633245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200466213U Expired - Lifetime CN201228289Y (en) | 2008-04-18 | 2008-04-18 | Electroplating apparatus of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201228289Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962795A (en) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | Scaffold arranged in electroplating bath and provided with hole on side edge |
| CN102286772A (en) * | 2011-08-22 | 2011-12-21 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN102337578A (en) * | 2010-07-19 | 2012-02-01 | 北大方正集团有限公司 | Double-sided plating tank, sheet and plating method |
| CN102400192A (en) * | 2011-11-10 | 2012-04-04 | 深南电路有限公司 | Method for electroplating gold to circuit boards |
| CN103774203A (en) * | 2014-01-16 | 2014-05-07 | 黄海 | Full-automatic printed circuit board (PCB) plating system |
| CN108486618A (en) * | 2018-06-11 | 2018-09-04 | 深圳市博敏电子有限公司 | A method of improving thick metal plated uniformity |
| CN117894691A (en) * | 2024-03-14 | 2024-04-16 | 深圳和美精艺半导体科技股份有限公司 | Encapsulation substrate with uniform electroplating gold and manufacturing method thereof |
-
2008
- 2008-04-18 CN CNU2008200466213U patent/CN201228289Y/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337578A (en) * | 2010-07-19 | 2012-02-01 | 北大方正集团有限公司 | Double-sided plating tank, sheet and plating method |
| CN101962795A (en) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | Scaffold arranged in electroplating bath and provided with hole on side edge |
| CN102286772A (en) * | 2011-08-22 | 2011-12-21 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN102286772B (en) * | 2011-08-22 | 2015-06-03 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN102400192A (en) * | 2011-11-10 | 2012-04-04 | 深南电路有限公司 | Method for electroplating gold to circuit boards |
| CN103774203A (en) * | 2014-01-16 | 2014-05-07 | 黄海 | Full-automatic printed circuit board (PCB) plating system |
| CN103774203B (en) * | 2014-01-16 | 2016-08-24 | 黄海 | A kind of full-automatic PCB electroplating system |
| CN108486618A (en) * | 2018-06-11 | 2018-09-04 | 深圳市博敏电子有限公司 | A method of improving thick metal plated uniformity |
| CN108486618B (en) * | 2018-06-11 | 2021-01-01 | 深圳市博敏电子有限公司 | Method for improving uniformity of electroplated thick gold |
| CN117894691A (en) * | 2024-03-14 | 2024-04-16 | 深圳和美精艺半导体科技股份有限公司 | Encapsulation substrate with uniform electroplating gold and manufacturing method thereof |
| CN117894691B (en) * | 2024-03-14 | 2024-05-28 | 深圳和美精艺半导体科技股份有限公司 | Encapsulation substrate with uniform electroplating gold and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090429 |