CN102286772A - Device used for controlling thickness uniformity of electroplated layer - Google Patents

Device used for controlling thickness uniformity of electroplated layer Download PDF

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Publication number
CN102286772A
CN102286772A CN2011102408651A CN201110240865A CN102286772A CN 102286772 A CN102286772 A CN 102286772A CN 2011102408651 A CN2011102408651 A CN 2011102408651A CN 201110240865 A CN201110240865 A CN 201110240865A CN 102286772 A CN102286772 A CN 102286772A
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China
Prior art keywords
thickness uniformity
shaped groove
electroplated layer
shaped grooves
control
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CN2011102408651A
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Chinese (zh)
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CN102286772B (en
Inventor
朱虬
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WUXI DINGYA ELECTRONIC PARTS CO Ltd
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WUXI DINGYA ELECTRONIC PARTS CO Ltd
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Priority to CN201110240865.1A priority Critical patent/CN102286772B/en
Publication of CN102286772A publication Critical patent/CN102286772A/en
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Publication of CN102286772B publication Critical patent/CN102286772B/en
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Abstract

The invention discloses a device used for controlling thickness uniformity of an electroplated layer. The device comprises two V-shaped grooves and is characterized in that the two V-shaped grooves are arranged in opposite along an opening direction, and two glass rods are connected between the two V-shaped grooves. The invention is used for controlling the thickness uniformity of the electroplated layer in the process of material electroplating, is suitable for various electroplating processes, has broad universality, requires less equipment and ensures that the electroplated layer is more uniform.

Description

Be used to control the device of thickness uniformity of electroplated layers
Technical field
The present invention relates to the device of electrolytic coating gauge control in a kind of electroplating technology process, particularly a kind of device that is used to control thickness uniformity of electroplated layers.
Background technology
The lead-in wire of semicon industry and connector industry and connector assembly etc. need be electroplated, be specially the material surface that electro-conductive material is deposited to corresponding component from electrolyte solution, the electroplating technology of existing relevant industries can be realized technologies such as plating, parcel plating, least bit degree, comprise nickel plating, gold-plated, silver-plated etc., electroplate for this specific aim, need V-shaped groove to have versatility widely, promptly be fit to most of parts and realize uniformly-coating technology.
For existing V-shaped groove device, because the characteristics of distribution of current when electroplating, the two-end thickness of product can compare thick middle, the scope of the rapid bed thickness in two ends is 5~15mm, only be fit to have the product of width, need change the aperture widths that allows the electrolyte flow warp when product width changes, versatility is poor.In addition, because the prior art dividing plate is by two sides, left and right sides control current, but after electric current is by dividing plate, also have the effect of certain most advanced and sophisticated high electric current, so whole control effect is relatively poor.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of device that is used to control thickness uniformity of electroplated layers, the versatility height, electrolytic coating thickness is even, and is controlled good.
The present invention realizes by following technical scheme:
A kind of device that is used to control thickness uniformity of electroplated layers comprises V-shaped groove, and described V-shaped groove has two, and two V-shaped grooves connect with two glass sticks between described two V-shaped grooves along the opening direction opposite disposed.
The setting device that described V-shaped groove is floated down along its rod is contained at the top of described glass stick one end on one's body.
Described each root V-shaped groove outside surface body is provided with two groups of through holes.
When the present invention carried out work, electroplating parts is vertically walking in two V-shaped grooves, was inserted in ceramic rod and controlled the degree of depth of workpiece in V-shaped groove in the different through holes, the thickness of coating homogeneity of the workpiece of control different in width.The material of V-shaped groove is the PP plastics.The top of glass stick is fixed with rubber plug, places a spring between rubber plug and the V-shaped groove, and spring is used for the active V-shaped groove is pressed on workpiece.
Beneficial effect of the present invention is:
(1) the present invention is not subjected to the restriction of electroplating parts shape, and the product that can be fit to various width is electroplated, and has improved versatility, thereby has reduced the equipment cost of electroplating technology;
(2) by the V-arrangement design, make electroplating layer of both sides solution electron migration direction change in the plating tank, effectively make and electroplate two ends (high galvanic areas) electrolytic coating thickness attenuation, thus the homogeneity control of realization electroplating technology.
Description of drawings
Fig. 1 is the structural representation that is used to control the device of thickness uniformity of electroplated layers
Fig. 2 is the principle of work synoptic diagram that is used to control the device of thickness uniformity of electroplated layers
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described.
As Fig. 1, be the structural representation that is used to control the device of thickness uniformity of electroplated layers, comprise V-shaped groove 1, described V-shaped groove has two, and two V-shaped grooves 1 connect with two glass sticks 3 between described two V-shaped grooves 1 along the direction opposite disposed of opening 2.
The setting device 4 that described V-shaped groove 1 is floated down along its rod is contained at the top of glass stick 3 one ends on one's body.Select for use among this figure on glass stick 3 surfaces and be provided with screw thread, use bolt to carry out slide control, regulate the setting device that to use other to slide up and down except using screw thread and bolt.
Each root V-shaped groove outside surface body is provided with two groups of through holes 5.Through hole 5 can insert ceramic rod when the present invention works, and the degree of depth of ceramic rod control workpiece in V-shaped groove is so through hole 5 has good guide effect.
As Fig. 2, it is the principle of work synoptic diagram that is used to control the device of thickness uniformity of electroplated layers, by adjusting setting device 4, with plated item 6 in V-shaped groove 1 internal fixation, begin to electroplate, after electroplating beginning, plated item 6 begins to move, and dotted portion is the distribution of the electric current 7 after V-shaped groove 1 shielding in the electroplating process among the figure.
According to V-arrangement design of the present invention, can make the workpiece surface electrolytic coating even, the versatility height, the workpiece aftertreatment is simple, has high economic worth.

Claims (3)

1. a device that is used to control thickness uniformity of electroplated layers comprises V-shaped groove, it is characterized in that described V-shaped groove has two, and two V-shaped grooves connect with two glass sticks between described two V-shaped grooves along the opening direction opposite disposed.
2. the device that is used to control thickness uniformity of electroplated layers as claimed in claim 1 is characterized in that the setting device that described V-shaped groove is floated down along its rod is contained at the top of described glass stick one end on one's body.
3. the device that is used to control thickness uniformity of electroplated layers as claimed in claim 1 is characterized in that described each root V-shaped groove outside surface body is provided with two groups of through holes.
CN201110240865.1A 2011-08-22 2011-08-22 Device used for controlling thickness uniformity of electroplated layer Active CN102286772B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110240865.1A CN102286772B (en) 2011-08-22 2011-08-22 Device used for controlling thickness uniformity of electroplated layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110240865.1A CN102286772B (en) 2011-08-22 2011-08-22 Device used for controlling thickness uniformity of electroplated layer

Publications (2)

Publication Number Publication Date
CN102286772A true CN102286772A (en) 2011-12-21
CN102286772B CN102286772B (en) 2015-06-03

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122752B2 (en) * 1998-05-26 2001-01-09 株式会社大野製作所 Printed circuit board plating jig
JP2009021412A (en) * 2007-07-12 2009-01-29 Hitachi Chem Co Ltd Method of manufacturing surface blackened copper metal, method of manufacturing base material with conductor layer pattern, base material with conductor pattern, and electromagnetic wave shielding member using the base material
CN201228289Y (en) * 2008-04-18 2009-04-29 深圳市兴森快捷电路科技股份有限公司 Electroplating apparatus of printed circuit board
CN201343579Y (en) * 2009-01-09 2009-11-11 深圳崇达多层线路板有限公司 Circuit board fixing bracket
CN201648554U (en) * 2010-05-11 2010-11-24 惠州中京电子科技股份有限公司 Special clamp for vertically electroplating thin PCB
CN101914800A (en) * 2010-08-31 2010-12-15 广州杰赛科技股份有限公司 Electroplating rack and electroplating device for printed circuit board
CN101962795A (en) * 2010-08-30 2011-02-02 昆山元茂电子科技有限公司 Scaffold arranged in electroplating bath and provided with hole on side edge
CN202193873U (en) * 2011-08-22 2012-04-18 无锡鼎亚电子材料有限公司 Device used for controlling thickness of electroplated layer to be uniform

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122752B2 (en) * 1998-05-26 2001-01-09 株式会社大野製作所 Printed circuit board plating jig
JP2009021412A (en) * 2007-07-12 2009-01-29 Hitachi Chem Co Ltd Method of manufacturing surface blackened copper metal, method of manufacturing base material with conductor layer pattern, base material with conductor pattern, and electromagnetic wave shielding member using the base material
CN201228289Y (en) * 2008-04-18 2009-04-29 深圳市兴森快捷电路科技股份有限公司 Electroplating apparatus of printed circuit board
CN201343579Y (en) * 2009-01-09 2009-11-11 深圳崇达多层线路板有限公司 Circuit board fixing bracket
CN201648554U (en) * 2010-05-11 2010-11-24 惠州中京电子科技股份有限公司 Special clamp for vertically electroplating thin PCB
CN101962795A (en) * 2010-08-30 2011-02-02 昆山元茂电子科技有限公司 Scaffold arranged in electroplating bath and provided with hole on side edge
CN101914800A (en) * 2010-08-31 2010-12-15 广州杰赛科技股份有限公司 Electroplating rack and electroplating device for printed circuit board
CN202193873U (en) * 2011-08-22 2012-04-18 无锡鼎亚电子材料有限公司 Device used for controlling thickness of electroplated layer to be uniform

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PE01 Entry into force of the registration of the contract for pledge of patent right
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Denomination of invention: Device for controlling thickness uniformity of electroplating layer

Effective date of registration: 20221216

Granted publication date: 20150603

Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi Huishan branch

Pledgor: WUXI DINGYA ELECTRONIC PARTS Co.,Ltd.

Registration number: Y2022980027309