CN201648554U - Special clamp for vertically electroplating thin PCB - Google Patents
Special clamp for vertically electroplating thin PCB Download PDFInfo
- Publication number
- CN201648554U CN201648554U CN2010201879808U CN201020187980U CN201648554U CN 201648554 U CN201648554 U CN 201648554U CN 2010201879808 U CN2010201879808 U CN 2010201879808U CN 201020187980 U CN201020187980 U CN 201020187980U CN 201648554 U CN201648554 U CN 201648554U
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- China
- Prior art keywords
- pcb
- thin plate
- draw
- clamp
- groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the manufacturing field of PCB, in particular to a clamp used for vertically electroplating the thin PCB. The clamp comprises brackets arranged in parallel; two ends of the bracket are provided with a clamping trough and a locking screw used for arranging the thin PCB correspondingly; the clamping trough has the depth of 2 to 3mm and the width of 0.6 to 0.8mm; and the external end of the clamping trough on the bracket is provided with a V-shaped opening. The special clamp has simple structure and is convenient for use; two sides of the PCB are fixed by the clamping trough and the locking trough on the bracket so that the vertical electroplating technology can be applied to the thinner PCB, thus greatly reducing the production cost of enterprises.
Description
Technical field
The utility model relates to PCB and makes the field, is specifically related to the anchor clamps that use when a kind of PCB thin plate is vertically electroplated.
Background technology
In the PCB manufacturing, the vertical plating than low many of horizontal electroplating cost, therefore widespread use in industry.But, for some relatively thin pcb boards, but and be not suitable for adopting vertical plating.Because in electroplating process; because pcb board is thin; hardness is not enough; it is subjected to the buoyancy of tank liquor and inflates etc. to influence, and thin plate floats, bends through regular meeting, or in the process of waving near anode; cause thickness of coating inhomogeneous; and then the operation production of influence back, increase back operation processing cost, even cause scrapping of pcb board.
Therefore be necessary to design a kind of thin plate and vertically electroplate and use anchor clamps, so that the low vertical plating mode of cost can be used reduction enterprise production cost more widely.
The utility model content
The problem that the utility model need solve provides a kind of PCB thin plate and vertically electroplates unit clamp.
For addressing the above problem, the technical scheme that the utility model is taked is: the PCB thin plate is vertically electroplated unit clamp, comprises the support that is arranged in parallel, and support two ends correspondence is provided with draw-in groove and the lock screw that is used to lay the PCB thin plate.
Concrete, the described draw-in groove degree of depth is 2-3mm, width is 0.6-0.8mm; The draw-in groove outer end is provided with the V-type opening on the described support.
The utility model is simple for structure, and is easy to use; It is fixed the pcb board both sides by draw-in groove on the support and lock screw, makes vertical plating can be applied to the pcb board of thinner thickness, reduces enterprise's production cost.
Description of drawings
Accompanying drawing 1 is a clamp structure synoptic diagram described in the utility model.
Embodiment
For the ease of those skilled in the art's understanding, the utility model structure is further described in detail below in conjunction with accompanying drawing:
When vertically electroplating, pcb board hangs over the plating tank top by hanger, and described anchor clamps draw-in groove is put on the pcb board both sides that hang up properly, and locks with lock screw.
As Fig. 1, PCB thin plate described in the utility model is vertically electroplated unit clamp, comprises some supports that are arranged in parallel 10, and the inboard correspondence of two stands is provided with draw-in groove 20 and lock screw 21, and lock screw generally is installed in the two ends up and down of draw-in groove; Draw-in groove 20 outer ends are provided with the V-type opening.Described anchor clamps user mode as shown in the figure, number in the figure 30 is the PCB thin plate.
Described anchor clamps are specifically designed to fixedly PCB thin plate (thickness is generally 0.5mm), so the draw-in groove width generally is made as 0.6-0.8mm, and the opening part of draw-in groove is arranged to V-structure, are convenient to the PCB thin slice and put into, and are locking with lock screw then.Generally reserve certain width in the pcb board making processes at the edge, so that processing, in the end operation is excised the edge, this border width is generally 3mm, therefore the degree of depth of described anchor clamps draw-in groove is set to 2-3mm, guarantees to fixedly secure pcb board, but does not damage circuit in the plate.
Claims (3)
1.PCB thin plate is vertically electroplated unit clamp, comprises the support (10) that is arranged in parallel, and it is characterized in that: support two ends correspondence is provided with draw-in groove (20) and the lock screw (21) that is used to lay the PCB thin plate.
2. PCB thin plate according to claim 1 is vertically electroplated unit clamp, it is characterized in that: the described draw-in groove degree of depth is 2-3mm, and width is 0.6-0.8mm.
3. PCB thin plate according to claim 2 is vertically electroplated unit clamp, it is characterized in that: the draw-in groove outer end is provided with the V-type opening on the described support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201879808U CN201648554U (en) | 2010-05-11 | 2010-05-11 | Special clamp for vertically electroplating thin PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201879808U CN201648554U (en) | 2010-05-11 | 2010-05-11 | Special clamp for vertically electroplating thin PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201648554U true CN201648554U (en) | 2010-11-24 |
Family
ID=43113783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201879808U Expired - Fee Related CN201648554U (en) | 2010-05-11 | 2010-05-11 | Special clamp for vertically electroplating thin PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201648554U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286772A (en) * | 2011-08-22 | 2011-12-21 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN103722509A (en) * | 2013-12-27 | 2014-04-16 | 昆山迈致治具科技有限公司 | PCB fixing device |
| CN103882501A (en) * | 2014-03-28 | 2014-06-25 | 珠海紫翔电子科技有限公司 | Hanging basket |
| CN104088004A (en) * | 2014-07-31 | 2014-10-08 | 开平依利安达电子第五有限公司 | Movable suspension frame applied to production line of vertical continuous electroplating circuit board |
-
2010
- 2010-05-11 CN CN2010201879808U patent/CN201648554U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286772A (en) * | 2011-08-22 | 2011-12-21 | 无锡鼎亚电子材料有限公司 | Device used for controlling thickness uniformity of electroplated layer |
| CN103722509A (en) * | 2013-12-27 | 2014-04-16 | 昆山迈致治具科技有限公司 | PCB fixing device |
| CN103882501A (en) * | 2014-03-28 | 2014-06-25 | 珠海紫翔电子科技有限公司 | Hanging basket |
| CN104088004A (en) * | 2014-07-31 | 2014-10-08 | 开平依利安达电子第五有限公司 | Movable suspension frame applied to production line of vertical continuous electroplating circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20160511 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |