CN104088004A - Movable suspension frame applied to production line of vertical continuous electroplating circuit board - Google Patents
Movable suspension frame applied to production line of vertical continuous electroplating circuit board Download PDFInfo
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- CN104088004A CN104088004A CN201410373800.8A CN201410373800A CN104088004A CN 104088004 A CN104088004 A CN 104088004A CN 201410373800 A CN201410373800 A CN 201410373800A CN 104088004 A CN104088004 A CN 104088004A
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- circuit board
- guide plate
- guide groove
- circuit card
- production line
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a movable suspension frame applied to a production line of a vertical continuous electroplating circuit board. The movable suspension frame comprises a bottom guide plate capable of lifting and moving up and down, wherein the bottom guide plate is arranged below a clamp for suspending the circuit board; a guide groove capable of preventing the lower part of the circuit board from being bent and shifted relative to the upper part of the circuit board is formed in the bottom guide plate; the lower part of the circuit board can be inserted into the guide groove and can move along the guide groove. According to the movable suspension frame, the bottom guide plate for preventing the lower part of the circuit board from being bent and shifted relative to the upper part of the circuit board is arranged below the clamp, and the circuit board is guided to slide and move in a groove body limited by the guide groove through the guide groove in the bottom guide plate, so that the bending and shifting phenomenon of the circuit board due to resistance of a chemical liquid when the circuit board is dipped in a chemical liquid tank can be avoided, the upper part and lower part of the circuit board can be positioned in the same vertical plane, and the distances from the upper part, middle part and lower part of the circuit board to an anode of an electroplating tank are basically same, so that electroplating is relatively uniform.
Description
Technical field
The present invention relates to a kind of movable scaffold, be particularly applied to the movable scaffold of the production line of vertical connection electroplating circuit board.
Background technology
The circuit board making of electron trade is made to the HDI line of production development with features such as multilayer laminate (the multistage blind hole of 6 ~ 10 floor), fine rule road (client's Original manuscript design 2/2mil), small-bore (0.25mm), thin plates (completing thickness of slab 30mil) by traditional list/dual platen at present, in the time that internal layer IVH electroplates (making sheet thickness is at 10 ~ 20mil) production, produce HDI thin plate with traditional vertical plating production line and certainly will be difficult to guaranteed quality and shipment, make HDI thin plate with high-end horizontal electroplating assembly line and certainly will aggravate the cost of manufacture pressure of company.
When traditional vertical plating production line is produced the thinner circuit card of HDI equal thickness, circuit card can be subject to the resistance of liquid medicine in the time entering processing solution tank and the irregular processing solution tank that enters can aggravate its degree of crook in the effect of waving; Enter the plate impact by bending of plating tank rear section can be inserted into scaffold outside or circuit card in plating tank because opposite end in the middle of twisted plate causes copper facing inhomogeneous near anode, simultaneously because the length of circuit card differs, the power line of its circuit card bottom relatively more causes copper facing partially thick, badly influences operation shipment and quality.
When vertical continuous plating lines is produced the thinner circuit card of HDI equal thickness, the copper facing homogeneity of circuit card bottom is difficult to control, particularly, at the circuit card of producing different size length, the thick meeting of the thick copper with respect to its top of copper of circuit card bottom is partially thick, badly influences operation shipment and quality.
Aspect shipment and quality, having absolute predominance although high-end horizontal electroplating assembly line is produced the thinner circuit card of HDI equal thickness, its running cost is 4 ~ 5 times of traditional vertical plating production line running cost, directly has influence on the entirety operation of company.
Summary of the invention
In order to address the above problem, the object of the present invention is to provide a kind of simple in structurely, can prevent that circuit card that Thickness Ratio is thinner from easily bending entering while electroplating in processing solution tank, can make again the more uniform movable scaffold of copper facing on circuit card.
The present invention is that the technical scheme that its technical problem of solution adopts is:
A kind of movable scaffold of the production line that is applied to vertical continuous electroplating circuit board, comprise the bottom guide plate can oscilaltion moving, this bottom guide plate is arranged at the below for the fixture of suspension circuit plate, on the guide plate of bottom, offer simultaneously and can prevent electroplax plate bottom the bend guide groove of skew of its top relatively, the bottom of described circuit card can be inserted in guide groove and can be moved to direction along the groove of guide groove.
As the improvement of technique scheme, the both sides of described bottom guide plate are also provided with the shifting board for stopping the power line that circuit card bottom is subject to, and this shifting board has at least a part overlapping with the bottom of circuit card.
As the further improvement of technique scheme, described shifting board comprises overhead gage and the lower baffle plate of movable its lap of adjusting.
In the present invention, on the cell wall of described guide groove, be convenient to steering circuit plate and insert the V-arrangement chamfering in it along offering.
The invention has the beneficial effects as follows: because the present invention by being provided with bottom for preventing circuit card the bend bottom guide plate of skew of its top relatively below fixture, in the cell body limiting at guide groove by the guide groove steering circuit plate on the guide plate of bottom, slide mobile, while avoiding circuit card to be immersed in processing solution tank because being subject to the resistance of the liquid medicine shift phenomenon that bends, the upper and lower that ensures circuit card can be positioned at same vertical surface substantially, therefore circuit card upper, middle and lower each several part is substantially equal near the distance of anode of electrolytic cell, therefore electroplates more even, the both sides of bottom guide plate are also provided with the shifting board of the power line for blocking circuit card bottom in addition, by the power line that regulates circuit card bottom that shifting board blocks different lengths to touch, thereby the electric force lines distribution that can make the bottom of the circuit card of different model touch is more even, greatly improve the copper facing homogeneity of superthin PCB circuit card (10 ~ 20mil), rise to extreme difference 0.24mil by original extreme difference 0.4 ~ 0.5mi, circuit card drops to 0.1% left and right by the unclear ratio of scrapping of the inhomogeneous etching causing of copper facing, greatly improve the qualification rate of product, the punctual shipment rate of operation.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is structural representation of the present invention;
Fig. 2 is the enlarged diagram at A place in Fig. 1.
Embodiment
With reference to Fig. 1, Fig. 2, a kind of movable scaffold of the production line that is applied to vertical continuous electroplating circuit board, comprise the bottom guide plate 3 can oscilaltion moving, above-mentioned bottom guide plate 3 is connected in by certain hoisting appliance on the portalframe of plating tank, for example bottom guide plate 3 adds the array modes such as chain by screw body or slide plate and is connected on portalframe, this bottom guide plate 3 is arranged at the below for the fixture 2 of suspension circuit plate 1, on the guide plate 3 of bottom, offer simultaneously and can prevent electroplax plate 1 bottom the bend guide groove 30 of skew of its top relatively, the bottom of described circuit card 1 can be inserted in guide groove 30 and can be moved to direction along the groove of guide groove 30, preferably, in the present invention, the top of described circuit card 1 is aimed in the center of described guide groove 30 and both are positioned at same vertical surface, because the present invention by being provided with bottom for preventing circuit card 1 the bend bottom guide plate 3 of skew of its top relatively below fixture 2, in the cell body limiting at guide groove 30 by the guide groove 30 steering circuit plates 1 on bottom guide plate 3, slide mobile, the bottom of avoiding circuit card 1 is because being subject to the resistance of the liquid medicine shift phenomenon that bends, the upper and lower that ensures circuit card 1 can be positioned at same vertical surface substantially, therefore circuit card 1 upper, middle and lower each several part is substantially equal near the distance of anode of electrolytic cell, therefore electroplate more even, in addition because bottom guide plate 3 can oscilaltion, can be for the circuit card of different model 1 and the adjustable height of free adjustment bottom guide plate 3, to adapt to the circuit card 1 of different lengths.
Further, insert in guide groove 30 for the ease of steering circuit plate 1, preferably, on the cell wall of described guide groove 30, be convenient to along offering the V-arrangement chamfering 300 that steering circuit plate 1 inserts in it.
Because the quantity of the power line of the position of the inner different depths of plating tank is not identical, the power line quantity variance that its underpart touches for fear of in the circuit card immersion plating groove of different model time is too large, the both sides of described bottom guide plate 3 are also provided with the shifting board 4 for stopping the power line that circuit card 1 bottom is subject to, this shifting board 4 has at least a part and the bottom of circuit card 1 overlapping, said overlappingly refers to that shifting board 4 has at least a part of level height higher than circuit card 1 bottom here.By regulating shifting board 4 to block the power line that circuit card 1 bottom of different lengths touches, thereby the electric force lines distribution that can make the bottom of the circuit card 1 of different model touch is more even, greatly improve the copper facing homogeneity of superthin PCB circuit card (10 ~ 20mil).Here, make the preferred embodiment of the present invention, described shifting board 4 comprises overhead gage 41 and the lower baffle plate 42 of movable its lap of adjusting, by regulating the size of lap of overhead gage 41 and lower baffle plate 42, can change the overall shielded area of shifting board 4, thereby can change its shielded area according to the circuit card of different lengths 1, more even with the electric force lines distribution that circuit card 1 bottom is touched, and then improve the copper facing homogeneity of circuit card 1.
The foregoing is only preferential embodiment of the present invention, as long as within the technical scheme that realizes the object of the invention with basic identical means all belongs to protection scope of the present invention.
Claims (4)
1. one kind is applied to the movable scaffold of the production line of vertical continuous electroplating circuit board, it is characterized in that: comprise the bottom guide plate (3) can oscilaltion moving, this bottom guide plate (3) is arranged at the below for the fixture (2) of suspension circuit plate (1), on bottom guide plate (3), offer simultaneously and can prevent electroplax plate (1) bottom the bend guide groove (30) of skew of its top relatively, the bottom of described circuit card (1) can be inserted in guide groove (30) and can be moved to direction along the groove of guide groove (30).
2. the movable scaffold of a kind of production line that is applied to vertical continuous electroplating circuit board according to claim 1, it is characterized in that: the both sides of described bottom guide plate (3) are also provided with the shifting board (4) for stopping the power line that circuit card (1) bottom is subject to, and this shifting board (4) has at least a part overlapping with the bottom of circuit card (1).
3. the movable scaffold of a kind of production line that is applied to vertical continuous electroplating circuit board according to claim 2, is characterized in that: described shifting board (4) comprises overhead gage (41) and the lower baffle plate (42) of movable its lap of adjusting.
4. according to the movable scaffold of the arbitrary described a kind of production line that is applied to vertical continuous electroplating circuit board of claim 1-3, it is characterized in that: on the cell wall of described guide groove (30), be convenient to steering circuit plate (1) and insert the V-arrangement chamfering (300) in it along offering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410373800.8A CN104088004B (en) | 2014-07-31 | 2014-07-31 | A kind of movable scaffold of the production line being applied to vertical continuous electroplating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410373800.8A CN104088004B (en) | 2014-07-31 | 2014-07-31 | A kind of movable scaffold of the production line being applied to vertical continuous electroplating circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104088004A true CN104088004A (en) | 2014-10-08 |
| CN104088004B CN104088004B (en) | 2016-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410373800.8A Active CN104088004B (en) | 2014-07-31 | 2014-07-31 | A kind of movable scaffold of the production line being applied to vertical continuous electroplating circuit board |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2106836U (en) * | 1991-10-26 | 1992-06-10 | 郭明宏 | Full-automatic load device for electroplates |
| JPH0774477B2 (en) * | 1990-11-02 | 1995-08-09 | 栄電子工業株式会社 | Jig for electrolytic plating of printed wiring board and electrolytic plating method using the jig |
| CN1388273A (en) * | 2001-05-25 | 2003-01-01 | 日本爱铝美克斯株式会社 | Surface treating apparatus |
| JP2009191303A (en) * | 2008-02-13 | 2009-08-27 | Hitachi Aic Inc | Fixing jig for plating printed circuit board |
| CN201648554U (en) * | 2010-05-11 | 2010-11-24 | 惠州中京电子科技股份有限公司 | Special clamp for vertically electroplating thin PCB |
| CN204080163U (en) * | 2014-07-31 | 2015-01-07 | 开平依利安达电子第五有限公司 | A kind of movable scaffold being applied to the production line of vertical continuous electroplating circuit board |
-
2014
- 2014-07-31 CN CN201410373800.8A patent/CN104088004B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0774477B2 (en) * | 1990-11-02 | 1995-08-09 | 栄電子工業株式会社 | Jig for electrolytic plating of printed wiring board and electrolytic plating method using the jig |
| CN2106836U (en) * | 1991-10-26 | 1992-06-10 | 郭明宏 | Full-automatic load device for electroplates |
| CN1388273A (en) * | 2001-05-25 | 2003-01-01 | 日本爱铝美克斯株式会社 | Surface treating apparatus |
| JP2009191303A (en) * | 2008-02-13 | 2009-08-27 | Hitachi Aic Inc | Fixing jig for plating printed circuit board |
| CN201648554U (en) * | 2010-05-11 | 2010-11-24 | 惠州中京电子科技股份有限公司 | Special clamp for vertically electroplating thin PCB |
| CN204080163U (en) * | 2014-07-31 | 2015-01-07 | 开平依利安达电子第五有限公司 | A kind of movable scaffold being applied to the production line of vertical continuous electroplating circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 张健 等，: ""垂直拉近装置在带式输送机中的结构优化"", 《中国新技术新产品》, no. 2, 10 February 2014 (2014-02-10), pages 2014 - 2 * |
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| Publication number | Publication date |
|---|---|
| CN104088004B (en) | 2016-11-02 |
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