CN205821499U - Plating bath arrangement - Google Patents
Plating bath arrangement Download PDFInfo
- Publication number
- CN205821499U CN205821499U CN201620710910.3U CN201620710910U CN205821499U CN 205821499 U CN205821499 U CN 205821499U CN 201620710910 U CN201620710910 U CN 201620710910U CN 205821499 U CN205821499 U CN 205821499U
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- CN
- China
- Prior art keywords
- cell body
- flow
- electroplate liquid
- spoilers
- plating bath
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Abstract
Embodiment of the present utility model discloses a plating bath arrangement, comprises a cell body, an orifice plate, an electroplate liquid flow tube, two groups of anode cassette and two flow spoilers；Wherein, form a space bottom described orifice plate and described cell body with accommodating described electroplate liquid flow tube, described orifice plate arranges multiple hole；Described electroplate liquid flow tube is penetrated by a wall of described cell body, so that electroplate liquid to inject described cell body；Described two groups of anode cassette are close two relative walls in being respectively arranged at described cell body；Described two flow spoilers are arranged between described two groups of anode cassette, the external actuating unit of described two flow spoilers, to promote described two flow spoilers to carry out movement repeatedly, so that the electroplate liquid in cell body is carried out disturbance；Can house between described two flow spoilers and put a circuit board tool to clamp circuit board to be plated.
Description
Technical field
This utility model is about a kind of plating bath arrangement, by referring to a kind of plating bath arrangement having disturbance ability, it is adaptable to
The electroplating process of circuit board.
Background technology
The microminiaturization of printed circuit board (PCB) (printed circuit board, or abbreviation circuit board) is also encountered by many systems
Difficulty in journey, therefore the microminiaturization with related semiconductor circuit is the technology people that many electronic products are scientific and technological with action in recent years
The research emphasis of member.Such as, commonly used copper facing in circuit board process (copper plating) step, in the skill of microminiaturization
Art becomes important technology door.For existing general copper facing technology, it is that a circuit board is immersed in a kind of copper facing electrolysis
In liquid (copper plating solution), then through electrolysis (electrolysis) mode, by cathode copper
(electrolytic copper) inserts the micro through hole (micro via) on circuit board, electroplating ventilating hole (plated through
Hole, PTH), high-aspect-ratio (aspect ratio, AR) copper post (Cu-pillar) or uniformly and entirely contain particular surface
Region.But, along with the microminiaturization of circuit board, through hole diminishes, the ratio of width to height improves, copper post or thin wire (fine line
Patterning) all become the door necessarily overcome and just can ensure that usefulness and the function of circuit board.Interconnect with existing high density
For (high density interconnection, HDI) circuit board process, wherein, how cathode copper is fully filled with micro-
Through hole and not stay gas hole (void) be key problem, be more than improving the quality of circuit board, the most also reduce expense and raising
Process rate.
Existing circuit board electroplating mode is to use the plating of vertical continuous formula, and the fluid control design case of electroplating bath is jet flow
Mode, the balance that the jet flow mechanism that its shortcoming is too strong in electroplating process can hinder filling hole is uniform, the most sometimes by dry film
Spray is from plated plate；Add plated sheet material to be typically in the way of double fastener or four folders to clamp, be easily caused conduction and flow field is uneven
Even situation, and then produce the result of copper post jumping plating (missing bump) and uniformity difference, therefore cannot be applied to volume production.Again
Person, existing electroplating cell body is relatively big, and plating liquid measure required during copper facing is more, increases cost of manufacture.Therefore, existing existing skill
Art is often limited to the practice limit and the reality of thin wire plating about 15um × 15um that copper post plating depth-to-width ratio is about 1:1
The business limit.It is not apply use for the microminiaturization circuit board of high request.
On the other hand, owing to industry circuit board process is totally different and complicated, therefore, many process apparatus the most only can be suitably used for
A particular step in one particular process, and different step in same processing procedure or not even with the step in processing procedure cannot be mutual
Enjoying in all, the most not only equipment investment is expensive, and placement equipment is carried out to perform processing procedure in manufacturing space that also must be bigger.
In view of this, how to improve electroplating bath design, use elasticity to can be suitably used for different processing procedure or step to increase, and
Reduce cell body with reduce needed for plating liquid measure to reduce spent cost, be for industry important issue.
Utility model content
Embodiment of the present utility model discloses a plating bath arrangement；Described plating bath arrangement comprise a cell body, an orifice plate, one
Electroplate liquid flow tube, two groups of anode cassette and two flow spoilers；Wherein, described orifice plate is arranged at the described cell body place close to bottom,
With form a space bottom described cell body with accommodating described electroplate liquid flow tube, described orifice plate arranges multiple hole；Described electroplate liquid
Flow tube is penetrated by a wall of described cell body, so that electroplate liquid to inject described cell body；Described two groups of anode cassette are respectively arranged at
Near two relative walls in described cell body, often group anode cassette also comprises a soluble anode (insoluble anode) and
Anode shield (anode shield), the anode shield of described two groups of anode cassette is arranged face-to-face；Described two flow spoilers are arranged at
Between described two groups of anode cassette, each flow spoiler also comprises multi-disc spoiler, with two connecting rods respectively by described multi-disc flow-disturbing
The two ends up and down of plate link fixing, and the external actuating unit of described two flow spoilers, to promote described two flow spoilers to carry out repeatedly
It is mobile, so that the electroplate liquid in cell body is carried out disturbance；Can house between described two flow spoilers put a circuit board tool with clamping treat
Plating circuit board.
Further, described two flow spoilers external in order to promote the actuating unit of flow spoiler to enter in low-frequency mode
Moving repeatedly of professional etiquette rule.
Further, described low frequency is between 0-10Hz.
Further, moving repeatedly of described two flow spoilers, can be along the side parallel with the surface of described circuit board to be plated
To up and down or move left and right.
Further, described electroplate liquid flow tube is positioned at the part below described orifice plate and also sets up multiple plating liquid stream upward
Portal.
Further, described two groups of anode cassette and described two flow spoilers all can be placed in described cell body wall with suspending way
Upper limb.
Further, described circuit board tool can be placed in the upper limb of described cell body wall with suspending way.
Accompanying drawing explanation
Fig. 1 show the cross-sectional schematic of an embodiment of plating bath arrangement of the present utility model.
Fig. 2 show the top view of the embodiment of Fig. 1.
Fig. 3 show the flow direction schematic diagram of the electroplate liquid of the embodiment of Fig. 1.
Description of reference numerals:
110-cell body；120-electroplate liquid flow tube；121-electroplate liquid portals；130-orifice plate；131-hole；140-anode cassette；
150-flow spoiler；151-spoiler；160-circuit board tool.
Detailed description of the invention
Hereinafter, with reference to adjoint diagram, describe in detail according to embodiment of the present utility model, so that this area person is prone to
Solve.Described intention can use the embodiment of multiple change, when being not limited to only these embodiments.This utility model saves
Slightly it is well known that the description of part (well-known part), and identical reference number represents identical in this utility model
Assembly.
Fig. 1 show the cross-sectional schematic of an embodiment of plating bath arrangement of the present utility model, is by described electroplating bath
Device cuts to present its internal composition structure.As it is shown in figure 1, the plating bath arrangement of the present embodiment comprises a cell body 110,
130, two groups of anode cassette of electroplate liquid flow tube 120, orifice plate 140 and two flow spoilers 150.Wherein, described cell body 110 is on one
Open type cell body, the upper limb of its wall is available for putting；Described orifice plate 130 is arranged at the described cell body 110 place close to bottom, with institute
State and form a space bottom cell body 110 with accommodating described electroplate liquid flow tube 120, described orifice plate 130 arranges multiple hole 131；Institute
State electroplate liquid flow tube 120 to be penetrated by a wall of described cell body 110, so that electroplate liquid to inject described cell body 110, described plating
Multiple holes 131 that liquid can pass through on described orifice plate 130 are flowed out from bottom to top；Described two groups of anode cassette 140 are respectively arranged at described
Both sides in cell body 110, near two relative walls, often group anode cassette 140 further includes a soluble anode (insoluble
Anode) with an anode shield (anode shield) (not shown), the anode shield of described two groups of anode cassette sets face-to-face
Put；Described two flow spoilers 150 are arranged between described two groups of anode cassette 140, and each flow spoiler 150 also comprises multi-disc spoiler
151, and respectively the two ends up and down of described multi-disc spoiler 151 are linked fixing, outside described two flow spoilers 150 by two connecting rods
Connect an actuating unit (not shown), to promote described two flow spoilers 150 to carry out movement repeatedly, with to the electricity in cell body 110
Plating solution carries out disturbance；Can house between described two flow spoilers 150 and put a circuit board tool (not shown) to clamp circuit to be plated
Plate.
It should be noted that described two groups of anode cassette 140, described two flow spoilers 150 and clamp the electricity of circuit board to be plated
Road plate tool (not shown) all can be inserted cell body 110 by the top of cell body 110, and is held on cell body wall with suspending way
Upper limb.Furthermore, described electroplate liquid flow tube 120 is positioned at the part below described orifice plate 130 and more arranges multiple plating liquid stream upward
Portal 121, flow into close to the local uniform of bottom from cell body 110 for described electroplate liquid.
Fig. 2 show the top view of the embodiment of Fig. 1.As in figure 2 it is shown, electroplating bath comprises a cell body 110, electroplates liquid stream
130, two groups of anode cassette of pipe 120, orifice plate 140 and two flow spoilers 150, in figure and show one circuit board tool 160 clamping treat
The circuit board of plating, is placed between described two flow spoilers 150.It should be noted that the multi-disc spoiler of described two flow spoilers 150
151 for be arrangeding in parallel, and and described connecting rod between can shape have angle, to reach the optimum efficiency of flow-disturbing.Noticeable
Be, described two flow spoilers 150 external in order to promote the actuating unit (not shown) of flow spoiler 150 can be with low-frequency side
Formula carries out moving repeatedly of rule, and such as, in a preferred embodiment, described frequency can be between 0-10Hz.The mesh of this disturbance
Be will electroplating process be discharged in produced hydrogen weight electroplate liquid.Further, moving repeatedly of described two flow spoilers 150,
Up and down or can move left and right along the direction parallel with the surface of described circuit board to be plated.
Fig. 3 show the flow direction schematic diagram of the electroplate liquid of the embodiment of Fig. 1.As it is shown on figure 3, work as described electroplate liquid certainly
After multiple electroplate liquid tap holes 131 that described electroplate liquid flow tube 120 is arranged upward flow out, can be from multiple holes of described orifice plate 130
131 flow from bottom to top, then described in flow direction from bottom to top again through the disturbance repeatedly of described two flow spoilers 150, can
Equably in the Surface runoff of circuit board to be plated, improve the effect of plating.
Sum it up, the electroplating bath design that embodiment of the present utility model discloses, use elasticity can be increased and can be suitably used for not
With processing procedure or step, and reduce cell body plating liquid measure needed for reducing to reduce spent cost.
Therefore, electroplating bath of the present utility model really can borrow disclosed skill, reaches desired purpose and effect, meets
The important document of the novelty of utility model patent, progressive and industry applications.
Only, above disclosed diagram and explanation, preferred embodiment the most of the present utility model, non-in order to limit
Enforcement of the present utility model, be generally familiar with this skill personage its depended on spirit of the present utility model, the change made or repair
Decorations, all should contain in the right of following this case.
Claims (8)
1. a plating bath arrangement, it is characterised in that comprise:
One cell body, an orifice plate, an electroplate liquid flow tube, two groups of anode cassette and two flow spoilers, each described flow spoiler also comprises many
Sheet spoiler, described multi-disc spoiler is for be arrangeding in parallel, and by two connecting rods respectively by up and down the two of described multi-disc spoiler
End links fixing, and between described multi-disc spoiler and described connecting rod, shape has angle；
Wherein, described orifice plate is arranged at the described cell body place close to bottom, forms a space with accommodating bottom described cell body
Described electroplate liquid flow tube, described orifice plate arranges multiple hole；
Described electroplate liquid flow tube is penetrated by a wall of described cell body, so that an electroplate liquid is injected described cell body；
Described two groups of anode cassette are respectively arranged at the both sides in described cell body, near two relative walls；
Described two flow spoilers are arranged between described two groups of anode cassette, described two flow spoilers can an external actuating unit to promote institute
State two flow spoilers and carry out movement repeatedly, to reach the electroplate liquid in cell body is carried out disturbance；Can hold between described two flow spoilers
Put a circuit board tool to clamp circuit board to be plated.
2. plating bath arrangement as claimed in claim 1, it is characterised in that often group anode cassette also comprises a soluble anode and
Anode shield, and the anode shield of described two groups of anode cassette arranges face-to-face.
3. plating bath arrangement as claimed in claim 1, it is characterised in that described two flow spoilers external in order to promote flow-disturbing
The actuating unit of device carries out moving repeatedly of rule in low-frequency mode.
4. plating bath arrangement as claimed in claim 3, it is characterised in that described low frequency is between 0-10Hz.
5. plating bath arrangement as claimed in claim 3, it is characterised in that moving repeatedly of described two flow spoilers, can along with
The direction that the surface of described circuit board to be plated is parallel up and down or moves left and right.
6. plating bath arrangement as claimed in claim 1, it is characterised in that described electroplate liquid flow tube is positioned at below described orifice plate
Part also sets up multiple electroplate liquid tap hole upward.
7. plating bath arrangement as claimed in claim 1, it is characterised in that described two groups of anode cassette and described two flow spoilers all may be used
The upper limb of described cell body wall it is placed in suspending way.
8. plating bath arrangement as claimed in claim 1, it is characterised in that described circuit board tool can be placed in suspending way
The upper limb of described cell body wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620710910.3U CN205821499U (en) | 2016-07-07 | 2016-07-07 | Plating bath arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620710910.3U CN205821499U (en) | 2016-07-07 | 2016-07-07 | Plating bath arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205821499U true CN205821499U (en) | 2016-12-21 |
Family
ID=57565726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620710910.3U Expired - Fee Related CN205821499U (en) | 2016-07-07 | 2016-07-07 | Plating bath arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205821499U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106167913A (en) * | 2015-05-20 | 2016-11-30 | 台湾先进系统股份有限公司 | Plating bath device |
| CN114062113A (en) * | 2021-11-29 | 2022-02-18 | 昆明理工大学 | Test system for simulating erosion and corrosion effects of water flow on test piece |
-
2016
- 2016-07-07 CN CN201620710910.3U patent/CN205821499U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106167913A (en) * | 2015-05-20 | 2016-11-30 | 台湾先进系统股份有限公司 | Plating bath device |
| CN106167913B (en) * | 2015-05-20 | 2018-02-13 | 台湾先进系统股份有限公司 | Plating bath device |
| CN114062113A (en) * | 2021-11-29 | 2022-02-18 | 昆明理工大学 | Test system for simulating erosion and corrosion effects of water flow on test piece |
| CN114062113B (en) * | 2021-11-29 | 2024-01-26 | 昆明理工大学 | Test system for simulating erosion and corrosion effects of water flow on test piece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20180707 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |