CN202881424U - Anode baffle for electroplating - Google Patents
Anode baffle for electroplating Download PDFInfo
- Publication number
- CN202881424U CN202881424U CN 201220368804 CN201220368804U CN202881424U CN 202881424 U CN202881424 U CN 202881424U CN 201220368804 CN201220368804 CN 201220368804 CN 201220368804 U CN201220368804 U CN 201220368804U CN 202881424 U CN202881424 U CN 202881424U
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- CN
- China
- Prior art keywords
- baffle plate
- electroplating
- anode
- anode used
- plate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an anode baffle for electroplating, and the baffle is a space structure provided with a groove on one surface, and the baffle is inserted into titanium baskets on the left and right sides of the anode. The anode baffle for electroplating can effectively prevent wasting of electroplating copper and simultaneously increases the yield as well as ensures the uniformity of the copper.
Description
Technical field
The utility model relates to a kind of circuit board electroplating copper groove anode titanium basket and blocks auxiliary means, is specifically related to a kind of anode used for electroplating baffle plate, is mainly used in blocking a separately titanium basket at each copper groove two.
Background technology
Develop rapidly along with electronic industry, manufacturing technology as the printed circuit board (PCB) of electronic component (being called for short " circuit card ") requires more and more higher, more and more finer and closely woven to the circuit requirement, the principal element that affects line quality when circuit is made is the thick homogeneity of copper.
Circuit board electroplating mainly takes traditional gantry line to electroplate at present, electroplates to fly the form upper plate of target, to be put in the copper groove, and two edges of boards that fly target in the making processes generally are the larger places of electric current, and edges of boards are electroplated easily partially thick.
For the homogeneity that guarantees that electro-coppering is thick, when at present traditional way is upper plate at the two that flies target on each a slice accompany plating plate (plate for non-production purposes), this accompany the plating plate can Reusability several times, but need to abandon during thick blocked up can not the use of copper more renew again accompany the plating plate.
Above this way not only can be sacrificed eighth at least production capacity, and can waste eighth at least copper ball.
The utility model content
The utility model purpose: for the problem and shortage of above-mentioned existing existence, the purpose of this utility model provides a kind of anode used for electroplating baffle plate, can effectively prevent the electro-coppering waste, is guaranteeing to improve production capacity again under the thick inhomogeneity prerequisite of copper simultaneously.
Technical scheme: for realizing above-mentioned utility model purpose, the technical solution adopted in the utility model is a kind of anode used for electroplating baffle plate, and described baffle plate is for having the three-dimensional arrangement of a groove in one side, and the titanium basket that is positioned at anode the right and left inserts this baffle plate.
Preferably, described baffle plate comprises a front and two sides that link to each other with described front.
Preferably, the back position of described baffle plate is provided with a horizontal blend stop, and this blend stop links to each other with two sides, can make the titanium basket well fixing, can not move.Described baffle plate is made no distinction of rank, and which can be adjusted as required head-up or down.
Preferably, described blend stop is arranged on the mid-way at the baffle plate back side.
Preferably, the front of described baffle plate is provided with some through holes, blocks power line.
Preferably, the right flank that is positioned at the baffle plate on the anode left side is provided with some through holes, and the left surface that is positioned at the baffle plate on anode the right is provided with some through holes, can effectively block power line.
Preferably, the Length Ratio titanium basket of described baffle plate is slightly short, and the Width titanium basket diameter of baffle plate is slightly large, so that the titanium basket can insert this baffle plate like a cork.
Preferably, described baffle plate is the insulation material, can not make the Current Decomposition of anode when contacting with the titanium basket.
Preferably, described baffle plate is PP (Polypropylene, polypropylene) material.
Preferably, described baffle plate is for having the cylindrical structure of a groove in the side.
Preferably, described baffle plate does not use hook, does not need to fix, and can directly be enclosed within on the titanium basket.
Beneficial effect: the utility model anode used for electroplating baffle arrangement is simple, easy for installation up and down, can not produce loosening after baffle plate and titanium basket are fixing, using behind the baffle plate no longer need to each accompanies the plating plate at the two that flies target, can be directly flying the full plank of target folder, not having unnecessary copper to be plated to accompany on the plating plate, the plank copper facing on the limit has good uniformity, thereby under the prerequisite that guarantees electroplating quality, saved cost, promoted production capacity.
Description of drawings
Fig. 1 is the schematic diagram (from the back side) of anode used for electroplating baffle plate;
Fig. 2 is the schematic diagram (from left surface) of anode used for electroplating baffle plate.
Embodiment
Below in conjunction with the drawings and specific embodiments, further illustrate the utility model, should understand these embodiment only is used for explanation the utility model and is not used in restriction scope of the present utility model, after having read the utility model, those skilled in the art all fall within the application's claims limited range to the modification of the various equivalent form of values of the present utility model.
As shown in Figure 1, anode used for electroplating baffle plate integral body is the PP material, and material thickness is 3mm, and total is u-shaped, long 605mm, wide 155mm, high 175mm, back position has the blend stop 1 of wide approximately 50mm, and the front has row's diameter 10mm from top to bottom, and width between centers is the first through hole 2 of 50mm.As shown in Figure 2, the left surface of anode used for electroplating baffle plate has three to ranked second the aperture of through hole 3, the second through holes 3 and the same front of width between centers specification in hole from top to bottom.Hole back gauge baffle plate is long limit Edge Distance 100mm vertically.
Principle of work in actual the use is: have electric current at the electroplating process Anodic and pass through, anode titanium basket can produce power line, can pass porose place according to power line, the local electricity line of atresia can be stopped, so that power line is applied to negative electrode, and to be plated the distribution of plate face different, thus distribution that can balancing plate face power line.
In actual use, as long as this baffle plate is produced by size, respectively overlapping a baffle plate on the titanium basket of direction as required on the limit at two of anode gets final product: when having the position of blend stop 1 to install near the inside of anode, during over against titanium basket and baffle plate, the left surface that is positioned at the baffle plate on anode right side has three and ranked second through hole 3 (as shown in Figure 2), and the right flank that is positioned at the baffle plate on the left of the anode has three exhausting holes (not shown).
After using this anode used for electroplating baffle plate to block anode titanium basket on the limit, when electroplating upper plate, the two that flies target is upper plate directly, increase no longer in addition and accompany the plating plate, thereby each upper plate can be gone up at least a slice plate more, the copper ball of additive decrementation when accompanying the plating plate on having reduced originally, thus cost saved, improved production capacity.
Claims (9)
1. anode used for electroplating baffle plate, described baffle plate is for having the three-dimensional arrangement of a groove in one side, and the titanium basket that is positioned at anode the right and left inserts this baffle plate.
2. described anode used for electroplating baffle plate according to claim 1, it is characterized in that: described baffle plate comprises positive and two sides that link to each other with described front.
3. described anode used for electroplating baffle plate according to claim 2, it is characterized in that: the back position of described baffle plate is provided with a horizontal blend stop, and this blend stop links to each other with two sides.
4. described anode used for electroplating baffle plate according to claim 3, it is characterized in that: described blend stop is arranged on the mid-way at the baffle plate back side.
5. described anode used for electroplating baffle plate according to claim 2, it is characterized in that: the front of described baffle plate is provided with some through holes.
6. described anode used for electroplating baffle plate according to claim 2, it is characterized in that: the right flank that is positioned at the baffle plate on the anode left side is provided with some through holes, and the left surface that is positioned at the baffle plate on anode the right is provided with some through holes.
7. described anode used for electroplating baffle plate according to claim 1, it is characterized in that: described baffle plate is the insulation material.
8. described anode used for electroplating baffle plate according to claim 1, it is characterized in that: described baffle plate is the PP material.
9. described anode used for electroplating baffle plate according to claim 1, it is characterized in that: described baffle plate is for having the cylindrical structure of a groove in the side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220368804 CN202881424U (en) | 2012-07-27 | 2012-07-27 | Anode baffle for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220368804 CN202881424U (en) | 2012-07-27 | 2012-07-27 | Anode baffle for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202881424U true CN202881424U (en) | 2013-04-17 |
Family
ID=48072869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220368804 Expired - Fee Related CN202881424U (en) | 2012-07-27 | 2012-07-27 | Anode baffle for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202881424U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532327A (en) * | 2014-12-24 | 2015-04-22 | 昆山元茂电子科技有限公司 | Anode baffles with uniform electroplating |
| CN104195625B (en) * | 2014-08-08 | 2016-07-06 | 南开大学 | A kind of method making thick plating gravure printing roller surface coating homogenization |
| CN107119307A (en) * | 2017-05-18 | 2017-09-01 | 杨凌美畅新材料有限公司 | A kind of electroplated diamond Wiring technology groove baffle plate |
| CN110344102A (en) * | 2019-08-14 | 2019-10-18 | 重庆方正高密电子有限公司 | Accompany plating plate and plating line |
-
2012
- 2012-07-27 CN CN 201220368804 patent/CN202881424U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104195625B (en) * | 2014-08-08 | 2016-07-06 | 南开大学 | A kind of method making thick plating gravure printing roller surface coating homogenization |
| CN104532327A (en) * | 2014-12-24 | 2015-04-22 | 昆山元茂电子科技有限公司 | Anode baffles with uniform electroplating |
| CN107119307A (en) * | 2017-05-18 | 2017-09-01 | 杨凌美畅新材料有限公司 | A kind of electroplated diamond Wiring technology groove baffle plate |
| CN110344102A (en) * | 2019-08-14 | 2019-10-18 | 重庆方正高密电子有限公司 | Accompany plating plate and plating line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Guoqiang Inventor before: Lei Ming |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LEI MING TO: ZHANG GUOQIANG |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20210727 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |