CN204162822U - Electroplating cathode shield and plating tank - Google Patents
Electroplating cathode shield and plating tank Download PDFInfo
- Publication number
- CN204162822U CN204162822U CN201420606890.6U CN201420606890U CN204162822U CN 204162822 U CN204162822 U CN 204162822U CN 201420606890 U CN201420606890 U CN 201420606890U CN 204162822 U CN204162822 U CN 204162822U
- Authority
- CN
- China
- Prior art keywords
- insulation barrier
- electroplating
- cathode shield
- electroplating cathode
- fixed link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 46
- 238000007747 plating Methods 0.000 title claims abstract description 20
- 230000004888 barrier function Effects 0.000 claims abstract description 48
- 238000009413 insulation Methods 0.000 claims abstract description 48
- 210000005056 cell body Anatomy 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 241000826860 Trapezium Species 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 230000001154 acute effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 239000011810 insulating material Substances 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a kind of electroplating cathode shield and plating tank.Electroplating cathode shield comprises insulation barrier and electroplating clamp fixed link, insulation barrier comprises the first insulation barrier and the second insulation barrier, the side of the first insulation barrier is interconnected to form with the side of the second insulation barrier and is connected spine, and the angle between the first insulation barrier and the second insulation barrier is obtuse angle, one end of electroplating clamp fixed link be connected spine and connect.During use, electroplating cathode shield is inserted in plating tank, because insulation barrier adopts insulating material to make, therefore, when circuit card discontented one fly target time, the plating negative electrode shield in the utility model can shield fringing effect, thus serve the effect of screen current, thus, plating copper facing homogeneity can be improved, promote quality, have the advantages that structure is simple, cost is low.
Description
Technical field
The utility model relates to printed circuit board and manufactures field, particularly relates to a kind of electroplating cathode shield and plating tank.
Background technology
In prior art, in wiring board production process, when electroplating, circuit card is often above discontented with one and is flown target, and the plate copper facing at its two ends can be partially thick.
Utility model content
The utility model provides that a kind of structure is simple, cost is low, can improve plating copper facing homogeneity, the electroplating cathode shield promoting quality and plating tank.
For solving the problem, as an aspect of the present utility model, provide a kind of electroplating cathode shield, comprise insulation barrier and electroplating clamp fixed link, insulation barrier comprises the first insulation barrier and the second insulation barrier, the side of the first insulation barrier is interconnected to form with the side of the second insulation barrier and is connected spine, and the angle between the first insulation barrier and the second insulation barrier is obtuse angle, one end of electroplating clamp fixed link be connected spine and connect.
Further, the first insulation barrier and the second insulation barrier are flat board.
Further, electroplating clamp fixed link is with to be connected spine vertical.
Further, the shape of the first insulation barrier and the second insulation barrier is right-angled trapezium.
Further, one end of electroplating clamp fixed link is connected with the side at the place, right angle of right-angled trapezium.
Further, obtuse angle is 120 degree.
Further, the acute angle of right-angled trapezium is 30 degree.
The utility model additionally provides a kind of plating tank, comprise cell body, anode rod, anode carrier, titanium basket and above-mentioned electroplating cathode shield, wherein, anode carrier is arranged in cell body, anode rod and titanium basket are arranged on anode carrier, and electroplating cathode shield is vertically arranged in cell body.
During use, electroplating cathode shield is inserted in plating tank, because insulation barrier adopts insulating material to make, therefore, when circuit card discontented one fly target time, the plating negative electrode shield in the utility model can shield fringing effect, thus serve the effect of screen current, thus, plating copper facing homogeneity can be improved, promote quality, have the advantages that structure is simple, cost is low.
Accompanying drawing explanation
Fig. 1 schematically shows the structural representation of the electroplating cathode shield in the utility model;
Fig. 2 schematically shows the front view of the electroplating cathode shield in the utility model;
Fig. 3 schematically shows the right view of Fig. 2;
Fig. 4 schematically shows the vertical view of Fig. 2;
Fig. 5 schematically shows the structural representation of the plating tank in the utility model.
Reference numeral in figure: 1, insulation barrier; 2, electroplating clamp fixed link; 3, spine is connected; 4, cell body; 5, anode rod; 6, anode carrier; 7, titanium basket; 8, electroplating cathode shield; 9, circuit card; 10, current line.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail, but the multitude of different ways that the utility model can be defined by the claims and cover is implemented.
Please refer to Fig. 1 to Fig. 4, the utility model provides a kind of electroplating cathode shield, comprise insulation barrier 1 and electroplating clamp fixed link 2, insulation barrier 1 comprises the first insulation barrier and the second insulation barrier, the side of the first insulation barrier is interconnected to form with the side of the second insulation barrier and is connected spine 3, and the angle between the first insulation barrier and the second insulation barrier is obtuse angle, one end of electroplating clamp fixed link 2 be connected spine 3 and connect.Preferably, the thickness of electroplating clamp fixed link 2 is 2mm, and length is 12cm, and width is 2cm.
Please refer to Fig. 5, during use, electroplating cathode shield is inserted in plating tank, because insulation barrier 1 adopts insulating material to make, therefore, when circuit card 9 discontented one fly target time, plating negative electrode shield in the utility model can shield fringing effect, thus serves the effect of screen current, thus, plating copper facing homogeneity can be improved, promote quality, have the advantages that structure is simple, cost is low.
Preferably, the first insulation barrier and the second insulation barrier are flat board.
Preferably, electroplating clamp fixed link 2 is with to be connected spine 3 vertical.
Preferably, the shape of the first insulation barrier and the second insulation barrier is right-angled trapezium.
Preferably, one end of electroplating clamp fixed link 2 is connected with the side at the place, right angle of right-angled trapezium.
Preferably, described obtuse angle is 120 degree.
Preferably, the acute angle of described right-angled trapezium is 30 degree.
Please refer to Fig. 5, the utility model additionally provides a kind of plating tank, comprise cell body 4, anode rod 5, anode carrier 6, titanium basket 7 and above-mentioned electroplating cathode shield 8, wherein, anode carrier 6 is arranged in cell body 4, anode rod 5 and titanium basket 7 are arranged on anode carrier 6, and electroplating cathode shield 8 is vertically arranged in cell body 4.
Please refer to Fig. 5, anode rod 5, between titanium basket 7 and circuit card 9, form current circuit, when just can to copper facing on circuit card 9 after connection.In the prior art, do not arrange electroplating cathode shield, because the length of circuit card 9 is shorter than the length of titanium basket 7, therefore, the left end of circuit card 9 can plate thicker copper, thus have impact on quality.When adopting the plating tank shown in Fig. 5, owing to have employed electroplating cathode shield 8 at the right-hand member of circuit card 9, thus the current line 10 (dotted line in Fig. 5 is schematic theoretical current line) of circuit card 9 right-hand member is shielded, thus the length of flow of the current line 10 of right-hand member is increased, thus resistance is added, cause electric current to diminish, thus make copper-plated lower thickness, improve quality.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (8)
1. an electroplating cathode shield, it is characterized in that, comprise insulation barrier (1) and electroplating clamp fixed link (2), described insulation barrier (1) comprises the first insulation barrier and the second insulation barrier, the side of described first insulation barrier is interconnected to form with the side of described second insulation barrier and is connected spine (3), and the angle between described first insulation barrier and described second insulation barrier is obtuse angle, one end of described electroplating clamp fixed link (2) connects with the described spine (3) that is connected.
2. electroplating cathode shield according to claim 1, is characterized in that, described first insulation barrier and described second insulation barrier are flat board.
3. electroplating cathode shield according to claim 1, is characterized in that, described electroplating clamp fixed link (2) is with described to be connected spine (3) vertical.
4. electroplating cathode shield according to claim 1, is characterized in that, the shape of described first insulation barrier and described second insulation barrier is right-angled trapezium.
5. electroplating cathode shield according to claim 4, is characterized in that, described described one end of electroplating clamp fixed link (2) is connected with the side at the place, right angle of described right-angled trapezium.
6. electroplating cathode shield according to claim 1, is characterized in that, described obtuse angle is 120 degree.
7. electroplating cathode shield according to claim 4, is characterized in that, the acute angle of described right-angled trapezium is 30 degree.
8. a plating tank, it is characterized in that, comprise cell body (4), anode rod (5), anode carrier (6), titanium basket (7) and the electroplating cathode shield (8) according to any one of claim 1 to 7, wherein, described anode carrier (6) is arranged in described cell body (4), described anode rod (5) and described titanium basket (7) are arranged on described anode carrier (6), and described electroplating cathode shield (8) is vertically arranged in described cell body (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420606890.6U CN204162822U (en) | 2014-10-21 | 2014-10-21 | Electroplating cathode shield and plating tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420606890.6U CN204162822U (en) | 2014-10-21 | 2014-10-21 | Electroplating cathode shield and plating tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204162822U true CN204162822U (en) | 2015-02-18 |
Family
ID=52536530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420606890.6U Expired - Fee Related CN204162822U (en) | 2014-10-21 | 2014-10-21 | Electroplating cathode shield and plating tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204162822U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841784A (en) * | 2016-09-19 | 2018-03-27 | 北大方正集团有限公司 | Electroplating printed circuit board cathode shading device |
| CN110205668A (en) * | 2019-06-20 | 2019-09-06 | 大连达利凯普科技有限公司 | Single-layer capacitor is gold-plated to use hanger |
| CN110344102A (en) * | 2019-08-14 | 2019-10-18 | 重庆方正高密电子有限公司 | Accompany plating plate and plating line |
| CN112813486A (en) * | 2020-12-30 | 2021-05-18 | 江西志浩电子科技有限公司 | PCB electroplating floating frame |
-
2014
- 2014-10-21 CN CN201420606890.6U patent/CN204162822U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841784A (en) * | 2016-09-19 | 2018-03-27 | 北大方正集团有限公司 | Electroplating printed circuit board cathode shading device |
| CN110205668A (en) * | 2019-06-20 | 2019-09-06 | 大连达利凯普科技有限公司 | Single-layer capacitor is gold-plated to use hanger |
| CN110205668B (en) * | 2019-06-20 | 2023-04-28 | 大连达利凯普科技有限公司 | Single-layer capacitor gold plating hanger |
| CN110344102A (en) * | 2019-08-14 | 2019-10-18 | 重庆方正高密电子有限公司 | Accompany plating plate and plating line |
| CN112813486A (en) * | 2020-12-30 | 2021-05-18 | 江西志浩电子科技有限公司 | PCB electroplating floating frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Patentee after: SHENZHEN XUNJIEXING TECHNOLOGY Corp.,Ltd. Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Patentee before: SHENZHEN XUNJIEXING CIRCUIT TECH Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |