CN107841784A - Electroplating printed circuit board cathode shading device - Google Patents
Electroplating printed circuit board cathode shading device Download PDFInfo
- Publication number
- CN107841784A CN107841784A CN201610832341.4A CN201610832341A CN107841784A CN 107841784 A CN107841784 A CN 107841784A CN 201610832341 A CN201610832341 A CN 201610832341A CN 107841784 A CN107841784 A CN 107841784A
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- electric current
- baffle plate
- printed circuit
- baffle
- circuit board
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of electroplating printed circuit board cathode shading device, applies in the equipment electroplated to pcb board, device includes：Electric current baffle plate and suspension part；Electric current baffle plate is insulating materials, including first baffle and second baffle；The top margin of first baffle is connected with the top margin of second baffle, and first baffle and the angle of second baffle junction are less than 90 degree, so that the electric current baffle plate that first baffle and second baffle are formed is in the shape of the letter V；Suspension part one end is connected with the angle of electric current baffle plate；Wherein, electric current baffle plate setting is in the outside of pcb board, and at the v-shaped openings of electric current baffle plate towards pcb board vertical direction edge.The present invention provides a kind of electroplating printed circuit board cathode shading device, solve the problems, such as to be arranged on the pcb board edge strip at left and right sides of pcb board or stainless steel edge in the prior art because copper layer is easily fallen off, the scrappage of pcb board production process is reduced, improves pcb board plating copper mass.
Description
Technical field
The present embodiments relate to print circuit plates making field, more particularly to a kind of electroplating printed circuit board masked cathode
Device.
Background technology
In print circuit plates making field, printed circuit board (PCB) (English：Printed Circuit Board, referred to as：PCB)
Different production equipments is passed through according to technological process, to meet different manufacturing conditions, plating side is typically used in industry
Formula carries out thickening processing to the face copper and hole copper of printed circuit board, with up to the electrical standard designed by client.Therefore, galvanizer
Skill is the important step in course of manufacturing printed circuit board, and using electrolysis principle, uniform, cause is formed in print circuit board surface
Metal copper deposits that are close, being well combined.
The structural representation of Fig. 1 equipment of electroplating printed circuit board in the prior art, as shown in figure 1, the equipment is mainly wrapped
Include：Fly bars 11, snapclip 12 hangs over the pcb board 131 and pcb board 132 flown on bars 11 by snapclip 12, edge strip 14 with
And scaffold (not shown in figure 1), wherein, the edge strip 14 includes：It is arranged on the left of the first pcb board 131 and the first PCB
The first isometric edge strip 141 of plate 131, and be arranged on the right side of the first pcb board 132, isometric with first pcb board 132
Second edge strip 142, the first edge strip 141 and the second edge strip 142 are hung on winged bar 11 by snapclip 12.Wherein, this first
The material of the edge strip 142 of edge strip 141 and second typically uses pcb board or stainless steel, for preventing edge effect from causing
First pcb board 131 and 132 side electro-copperings are reported thicker than thickness so as to cause the first pcb board whole plate thickness deviation to exceed Customer Standard
It is useless；Scaffold is used for the edge effect for preventing the first pcb board lower edge, to solve the following blocked up phenomenon of rim copper facing of pcb board.
The first edge strip 141 and the second edge strip 142 in the prior art, because long-time participates in plating effect, its surface
Upper accompanying layers of copper can also increase therewith, such as be changed not in time, can be because of its own preponderance, beyond snapclip 12
Elastic force cause to come off, and edge strip can be caused after coming off pcb board side plating copper thickness increase, cause plate face copper thickness lack of homogeneity, from
And cause beyond Customer Standard and scrap；On the scaffold to drop in addition in electroplating pool such as overweight edge strip, can also cause scaffold without
Method rises in place, causes the following rim copper facing thickness increase of pcb board.
The content of the invention
The present invention provides a kind of electroplating printed circuit board cathode shading device, is in electroplating process to solve prior art
On the pcb board edge strip for being arranged on pcb board left and right sides edge for preventing pcb board edge copper plating blocked up and using or stainless steel edge
Copper layer, the problem of causing own wt overweight and easily fall off so as to cause pcb board face copper thickness lack of homogeneity, reduce
The scrappage of pcb board production process, improve pcb board plating copper mass.
Electroplating printed circuit board cathode shading device provided by the invention, apply in the equipment electroplated to the pcb board,
Described device includes：Electric current baffle plate and suspension part；
The electric current baffle plate is insulating materials, including first baffle and second baffle；The top margin of the first baffle and institute
The top margin for stating second baffle is connected, and the first baffle and the angle of the second baffle junction are less than 90 degree, so that
The electric current baffle plate that the first baffle and the second baffle are formed is in the shape of the letter V；
Described suspension part one end is connected with the angle of the electric current baffle plate；
Wherein, the electric current baffle plate setting is in the outside of the pcb board, and face at the v-shaped openings of the electric current baffle plate
To the edge of the vertical direction of the pcb board.
Further, the quantity of the electric current baffle plate is two, is provided with for the angle of each electric current baffle plate
At least two fastener holes so that insulated fasteners pass through any fastener hole of the angle of two electric current baffle plates, with described in realization
The connection of two electric current baffle plates.
Further, the angle is 15 °~20 °.
Further, the electric current baffle plate is formed in one, and the material of the electric current baffle plate is high density poly propylene sheet material.
Further, the multiple of predetermined arrangement rule are symmetrically arranged with the first baffle and the second baffle
Pod apertures.
Optionally, the suspension part includes：Insulation fixing plate and hook part；
Wherein, one end of the insulation fixing plate is connected with the angle of the electric current baffle plate, the other end and the extension
Hook part is connected.
Optionally, the suspension part includes：Insulation fixing plate, hook part and connecting rod；
Wherein, one end of the insulated connecting rod is connected with the angle of the electric current baffle plate, the insulated connecting rod it is another
One end is connected with one end of the insulation fixing plate, and the other end of the insulation fixing plate is connected with the hook part.
Further, the material of the insulation fixing plate and the insulated connecting rod is high density poly propylene sheet material.
Further, the hook part includes a kink；
One inclined shell fragment is set on the inside of the kink；
Kink position corresponding with the shell fragment is provided with lock screw, the end of the lock screw with it is described
Shell fragment contacts, so that the lock screw promotes the shell fragment to deform upon in screwing operations.
Further, it is provided with reinforcement on the outside of the kink.
Electroplating printed circuit board cathode shading device provided by the invention, the electroplating printed circuit board that the present embodiment provides are cloudy
Pole masking device, it is right by the electric current baffle plate of the V-shaped of insulating materials hung on by suspension part at left and right sides of printed circuit board (PCB)
Electroplate liquid plays certain stop at edge at left and right sides of printed circuit board (PCB), so as to block at left and right sides of printed circuit board (PCB) at edge
Power line, thus may be such that the electric force lines distribution at left and right sides of printed circuit board (PCB) at edge is more uniform, greatly improve
The plating copper mass at pcb board edge, it can prevent that pcb board edge copper plating is blocked up.And the electric current baffle plate of V-shaped is to pcb board edge
Covered effect is more preferable, and pcb board edge copper plating can be made more uniform.The electroplating printed circuit board cathode shading device of the present embodiment
It instead of and be arranged on the pcb board edge strip at edge or stainless steel edge at left and right sides of pcb board in the prior art, because electric current baffle plate is
Insulating materials, therefore the problem of copper layer is understood on its surface is not present, i.e., on the basis of improvement pcb board edge copper plating is uniform,
The problem of being increased weight in the absence of itself, so as to the problems such as will not occurring easily to fall off in the prior art, reduce pcb board production
The scrappage of process, improve pcb board plating copper mass.In addition, the electroplating printed circuit board cathode shading device of the present embodiment can be with
Reusability, and not copper layer, raw material can be saved, reduce cost.
Brief description of the drawings
Fig. 1 is the structural representation of the equipment of the electroplating printed circuit board described in background technology；
Fig. 2 is the structural representation of electroplating printed circuit board cathode shading device provided in an embodiment of the present invention；
Fig. 3 is the top view of the electroplating printed circuit board cathode shading device shown in Fig. 2；
Fig. 4 is the schematic diagram that the electroplating printed circuit board cathode shading device shown in Fig. 2 is applied on electroplating device；
Fig. 5 is the structural representation for the electroplating printed circuit board cathode shading device that another embodiment of the present invention provides；
Fig. 6 is the top view of the electroplating printed circuit board cathode shading device shown in Fig. 5；
Fig. 7 is the schematic diagram that the electroplating printed circuit board cathode shading device shown in Fig. 5 is applied on electroplating device；
Fig. 8 is the side view of suspension part 20 in electroplating printed circuit board cathode shading device provided in an embodiment of the present invention.
Embodiment
The embodiment of technical solution of the present invention is described in detail below in conjunction with accompanying drawing.Following examples are only used for
Clearly illustrate technical scheme, therefore be intended only as example, and the protection of the present invention can not be limited with this
Scope.It should be noted that unless otherwise indicated, technical term or scientific terminology used in this application should be institute of the present invention
The ordinary meaning that category art personnel are understood.
In the description of the present application, it is to be understood that term " length ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " top ", " bottom ", " interior ", " outer " are based on orientation shown in the drawings or position relationship, are only
Described for the ease of description is of the invention with simplified, rather than the device or element of instruction or hint meaning must be with specifically sides
Position, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second "
Etc. being only used for describing purpose, and it is not intended that instruction or implying relative importance or implicit indicating indicated technical characteristic
Quantity.In the description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.In this Shen
Please in, unless otherwise clearly defined and limited, the term such as term " connected ", " connection ", " fixation " should be interpreted broadly, example
Such as, can be fixedly connected or be detachably connected, or integrally；Can be joined directly together, middle matchmaker can also be passed through
Jie is indirectly connected, and can be connection or the interaction relationship of two elements of two element internals.For the common of this area
For technical staff, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Fig. 2 is electroplating printed circuit board cathode shading device provided in an embodiment of the present invention, and Fig. 3 is the printing shown in Fig. 2
The top view of circuit board electroplating cathode shading device, Fig. 4 are that the electroplating printed circuit board cathode shading device shown in Fig. 2 is applied to
Schematic diagram on electroplating device.As shown in Figures 2 to 4, the electroplating printed circuit board cathode shading device that the present embodiment provides, should
With in the equipment electroplated to pcb board, device includes：Electric current baffle plate 10 and suspension part 20；
Electric current baffle plate 10 is insulating materials, including first baffle 101 and second baffle 102；The top margin of first baffle 101 with
The top margin of second baffle 102 is connected, and first baffle 101 and the angle of the junction of second baffle 102 are less than 90 degree, so that the
The electric current that one baffle plate 101 and second baffle 102 are formed keeps off 10 plates and is in the shape of the letter V；
The one end of suspension part 20 is connected with the angle of electric current baffle plate 10；
Wherein, electric current baffle plate 10 is arranged on the outside of pcb board, and towards pcb board at the v-shaped openings of electric current baffle plate 10
The edge of vertical direction.
In the present embodiment, first baffle 101 and second baffle 102 form the electric current baffle plate 10 of V-shaped, first baffle
101 and the junction of second baffle 102 angle be less than 90 degree.The angle of electric current baffle plate 10 is connected with the one end of suspension part 20,
Hung on by suspension part 20 on winged bar 30.The electroplating printed circuit board cathode shading device that the present embodiment provides uses in pairs,
Due to that may hang polylith pcb board on winged bar 20, and the device hangs on outermost two pieces of pcb boards 40 in polylith pcb board
Outside, i.e., the left side of one pcb board for hanging on high order end, the right side of a pcb board for hanging on low order end, make electric current baffle plate
Polylith pcb board is clipped in the middle by 10 v-shaped openings towards the edge of the vertical direction of pcb board, two cathode shading devices, from
And prevent that the pcb board edge of the leftmost side and the rightmost side from depositing blocked up layers of copper due to edge effect, make uneven coating even.
Wherein, when edge effect refers to plating, the electromigration of metal ion is carried out by the arrangement of power line, because same
Property repel each other, the power line in plate center arranges sparse (low potential), and coating is thin；Edges of boards plate angle power line arrangement comparatively dense (high electricity
Position), the edge effect of thickness, i.e. flat board plating is plated, due to edge effect be present so the edge of pcb board has and partially thick become
Gesture.And the present embodiment is by the hanging printed circuit plate electroplating cathode masking device at left and right sides of pcb board, to pcb board or so two
Electroplate liquid plays certain stop at lateral edges, so as to be blinded by some electrical power line so that pcb board edge will not deposit blocked up
Layers of copper, the coating of whole pcb board are more uniform.
The electroplating printed circuit board cathode shading device that the present embodiment provides, by hanging on printed circuit by suspension part 20
The electric current baffle plate 10 of the V-shaped of insulating materials at left and right sides of plate, electroplate liquid at edge at left and right sides of printed circuit board (PCB) is played
Certain stop, so as to block the power line at left and right sides of printed circuit board (PCB) at edge, thus it may be such that printed circuit board (PCB) or so
Electric force lines distribution at both sides of the edge is more uniform, greatly improves the plating copper mass at pcb board edge, can prevent pcb board
Edge copper plating is blocked up.And the electric current baffle plate 10 of V-shaped is more preferable to the covered effect at pcb board edge, pcb board edge copper plating can be made
It is more uniform.The electroplating printed circuit board cathode shading device of the present embodiment instead of is arranged on pcb board or so in the prior art
The pcb board edge strip or stainless steel edge of both sides of the edge, it can be sunk because electric current baffle plate 10 is insulating materials, therefore in the absence of its surface
The problem of product layers of copper, i.e., on the basis of improvement pcb board edge copper plating is uniform, the problem of weightening in the absence of itself, so that will not
Generation easily falls off the problem of waiting in the prior art, reduces the scrappage of pcb board production process, raising pcb board copper facing
Quality.In addition, the electroplating printed circuit board cathode shading device of the present embodiment can be with Reusability, and not copper layer can be with
Save raw material, reduce cost.
As further improvement of this embodiment, as shown in Figures 5 to 7, the quantity of electric current baffle plate is two, for each
The angle of electric current baffle plate is provided with least two fastener holes so that insulated fasteners pass through the angle of two electric current baffle plates
Any fastener hole, to realize the connection of two electric current baffle plates.
In the present embodiment, the quantity of electric current baffle plate is two, i.e. electric current baffle plate 10 and electric current baffle plate 11, wherein, electric current
The angle of baffle plate 10 is connected with suspension part 20, and the inner surface of the outer surface of electric current baffle plate 10 and electric current baffle plate 11 is in contact or
The outer surface contact of the inner surface and electric current baffle plate 11 of electric current baffle plate 10, electric current baffle plate 11 can be relative to electric current baffle plate about 10
Slide, and realize the company of two electric current baffle plates through any fastener hole of the angle of two electric current baffle plates by insulated fasteners
Connect.By setting two electric current baffle plates, and slidable adjustment, adjust the length of electric current baffle plate, so as to the side with pcb board 40
Edge matches, and ensures the side of whole pcb board 40 and can be coated by electric current baffle plate.The angle of electric current baffle plate is provided with least
Two fastener holes, you can the regulation of electric current baffle length is realized, and fastener hole sets more, then the precision adjusted is more accurate,
The length of electric current baffle plate and the accurate match of the edge length of pcb board 40 can be realized.Certainly, the number of the electric current baffle plate of the present embodiment
Amount be not limited in two, can according to actual production need three or more are set, to match the length at the edge of pcb board 40
Degree.
In addition, fastener hole and insulated fasteners are not limited in being arranged at the angle of electric current baffle plate, can also be arranged on
On the first baffle 101 and second baffle 102 of electric current baffle plate, or it can also be realized using other arbitrary prior arts multiple
Slidable adjustment and fixation between electric current baffle plate.
In the above-described embodiments, the angle of electric current baffle plate 10 is 15 °~20 °.Because the angle angle of electric current baffle plate 10 is different
It is different to the occlusion effect of power line, and the angle of electric current baffle plate 10 is arranged in the range of 15 °~20 °, it is possible to achieve pcb board edge
Copper layer thickness and face copper thickness it is more close, so as to ensure that the plating copper thickness of whole pcb board is uniform, improve product quality.
As further improvement of this embodiment, electric current baffle plate 10 is formed in one, and the material of electric current baffle plate 10 is highly dense
Spend polypropylene board.Electric current baffle plate 10 is formed in one, and can simplify the production technology of electric current baffle plate 10；And electric current baffle plate 10
When material is high density poly propylene sheet material, the electric current baffle plate 10 can be produced by hot bending process, technique is simple, and cost is relatively low.
Meanwhile high density poly propylene sheet material has good insulation properties, it can ensure that the surface of electric current baffle plate 10 does not deposit in electroplating process
Layers of copper, and its intensity, toughness, hardness are preferable, for a long time using being not easy the damage phenomenon that fractures occur, can improve use
Life-span.Electric current baffle plate 10 needs to be processed by shot blasting, removes flash removed and corner angle, ensure electroplate liquid flowing in machine-shaping back edge
Smooth non-resistance, so as to ensure that electroplate liquid and pcb board edge ion exchange are good, coating is more uniform.
As further improvement of this embodiment, it is symmetrically arranged with first baffle 101 and second baffle 102 predetermined
Multiple pod apertures of queueing discipline.
In the present embodiment, it is symmetrically arranged with predetermined row on the first baffle 101 and second baffle 102 of electric current baffle plate 10
Multiple pod apertures of rule are arranged, allow electroplate liquid from pod apertures by the way that the intermediate ion of electroplate liquid can not directly contact pcb board
Edge, therefore the ion concentration of pcb board edge can be reduced, so as to play a part of cutting down marginal electrical power line, reduce pcb board
The thickness of edge copper layer, play pcb board uniformly copper-plated effect.Due to right on first baffle 101 and second baffle 102
The setting of title, therefore pass through pod apertures on first baffle 101 and the flow phase by the electroplate liquid of pod apertures on second baffle 102
Together, the effect to reducing ion concentration is identical and identical to the screening effect of power line, therefore can ensure the plating thickness of both sides
Spend identical.And pod apertures are regularly arranged by predetermined arrangement, the power to power line screening effect can be controlled, so as to control
Pcb board edge thickness of coating.In the present embodiment, the aperture 10mm of pod apertures, each pod apertures interval 20mm arranged distributions, Kong Bian
Edge requires uniform impulse- free robustness, and carries out chamfered, to reduce the obstruction to electroplate liquid flowing, makes the stream by each pod apertures
Measure uneven, be also possible to prevent contamination precipitation in electroplate liquid.
The structure of suspension part 20 can be the suspension arrangement of arbitrary structures in the prior art, can realize in the present invention
Suspension acts on.
Optionally, suspension part 20 includes：Insulation fixing plate 22 and hook part 21；
Wherein, one end of insulation fixing plate 22 is connected with the angle of electric current baffle plate, the other end and the phase of hook part 21
Connection.
In the present embodiment, suspension part 20 includes insulation fixing plate 22 and hook part 21, because electric current baffle plate is into V words
Shape, if directly setting hook part 21 in the angle of electric current baffle plate 10, due to centre-of gravity shift, when electroplating printed circuit board is cloudy
Pole masking device is difficult electric current baffle plate 10 is kept vertical when hanging on winged bar above, so that can not be completely by the edge bag of pcb board
Cover, can not uniformly cover power line, cause the edge thickness of coating of pcb board uneven.And pass through the connection suspension of insulation fixing plate 22
Hook part 21 and electric current baffle plate, the center of gravity of whole device can be adjusted so that electric current baffle plate 10 is vertically after suspension.In addition
Because one end of insulation fixing plate 22 is connected with the angle of electric current baffle plate 10, therefore insulation fixing plate 22 may also touch electricity
Plating solution, therefore be also required to use insulating materials, prevent from depositing copper thereon.
Optionally, suspension part 20 includes：Insulation fixing plate 22, hook part 21 and insulated connecting rod 23, as shown in Figure 5；
Wherein, one end of insulated connecting rod 23 is connected with the angle of electric current baffle plate 10, the other end of insulated connecting rod 23 with
One end of insulation fixing plate 22 is connected, and the other end of insulation fixing plate 22 is connected with hook part 21.
In the present embodiment, suspension part 20 includes insulation fixing plate 22, hook part 21 and insulated connecting rod 23, insulated connecting rod
23 are arranged between insulation fixing plate 22 and electric current baffle plate, and the one end of insulated connecting rod 23 is connected with the angle of electric current baffle plate 10,
The other end is connected with insulation fixing plate 22, can more convenient fixed current baffle plate 10 and insulation fixing plate 22, while
Electric current baffle plate 10 can be made more to be bonded the edge of pcb board.
As further improvement of this embodiment, the material of insulation fixing plate 22 and insulated connecting rod 23 is high density poly propylene
Sheet material.Equally, above-mentioned insulation fixing plate 22 and insulated connecting rod 23 use high density poly propylene sheet material, it is ensured that surface does not sink
Product layers of copper, and because high density poly propylene timber intensity, toughness, hardness are preferable, for a long time using being not easy to fracture
Phenomenon is damaged, service life can be improved.
Further, Fig. 8 is the side view of suspension part 20 in above-mentioned electroplating printed circuit board cathode shading device；Hook portion
Part 21 includes a kink 211；
The inner side of kink 211 sets an inclined shell fragment 212；
Kink 211 is provided with lock screw 213, the end of lock screw 213 and shell fragment with 212 corresponding position of shell fragment
212 contacts, so that lock screw 213 promotes shell fragment 212 to deform upon in screwing operations.
When the kink 211 of hook part 21 hangs on winged Ba Shangshi, the inclined shell fragment that the inner side of kink 211 is set
212 deform upon and withstand winged bar, and by screwing lock screw 213 so that shell fragment 212 can be winged bar with clamping, so as to not allow
It is easy to fall off, do not allow to be also easy to produce to rock, it is also ensured that electric current baffle plate 10 can keep vertical direction, can make printed circuit board (PCB) yet
Electroplating cathode masking device plays a part of covering power line, uniform pcb board edge coating in whole electroplating process.
Further, the outside of kink 211 is provided with reinforcement 214.The outside of kink 211 is provided with reinforcement
214, the fatigue strength and non-deformability of kink 211 are enhanced, the kink during the long-time use of hook part 21
211 deformation repeatedly improves service life without being easily deformed damage.
In the specification of the present invention, numerous specific details are set forth.It is to be appreciated, however, that embodiments of the invention can be with
Put into practice in the case of these no details.In some instances, known method, structure and skill is not been shown in detail
Art, so as not to obscure the understanding of this description.In this manual, the specific features of description, structure, material or feature can
To be combined in an appropriate manner in any one or more embodiments or example.In addition, in the case of not conflicting, ability
The technical staff in domain can be by the different embodiments or example and the feature of different embodiments or example described in this specification
It is combined and combines.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of electroplating printed circuit board cathode shading device, is applied in the equipment electroplated to pcb board, it is characterised in that institute
Stating device includes：Electric current baffle plate and suspension part；
The electric current baffle plate is insulating materials, including first baffle and second baffle；The top margin of the first baffle and described the
The top margin of two baffle plates is connected, and the first baffle and the angle of the second baffle junction are less than 90 degree, so that described
The electric current baffle plate that first baffle and the second baffle are formed is in the shape of the letter V；
Described suspension part one end is connected with the angle of the electric current baffle plate；
Wherein, the electric current baffle plate setting is in the outside of the pcb board, and towards institute at the v-shaped openings of the electric current baffle plate
State the edge of the vertical direction of pcb board.
2. electroplating printed circuit board cathode shading device according to claim 1, it is characterised in that
The quantity of the electric current baffle plate is two, and the angle of each electric current baffle plate is provided with least two fastenings
Hole so that insulated fasteners pass through any fastener hole of the angle of two electric current baffle plates, to realize described two electric current baffle plates
Connection.
3. electroplating printed circuit board cathode shading device according to claim 1, it is characterised in that the angle is 15 °
~20 °.
4. electroplating printed circuit board cathode shading device according to claim 3, it is characterised in that the electric current baffle plate is
It is integrally formed, the material of the electric current baffle plate is high density poly propylene sheet material.
5. electroplating printed circuit board cathode shading device according to claim 1, it is characterised in that in the first baffle
With multiple pod apertures that predetermined arrangement rule is symmetrically arranged with the second baffle.
6. the electroplating printed circuit board cathode shading device according to any one in claim 1-5, it is characterised in that institute
Stating suspension part includes：Insulation fixing plate and hook part；
Wherein, one end of the insulation fixing plate is connected with the angle of the electric current baffle plate, the other end and the hook portion
Part is connected.
7. the electroplating printed circuit board cathode shading device according to any one in claim 1-5, it is characterised in that institute
Stating suspension part includes：Insulation fixing plate, hook part and insulated connecting rod；
Wherein, one end of the insulated connecting rod is connected with the angle of the electric current baffle plate, the other end of the insulated connecting rod
It is connected with one end of the insulation fixing plate, the other end of the insulation fixing plate is connected with the hook part.
8. electroplating printed circuit board cathode shading device according to claim 7, it is characterised in that the insulation fixing plate
Material with the insulated connecting rod is high density poly propylene sheet material.
9. electroplating printed circuit board cathode shading device according to claim 1, it is characterised in that
The hook part includes a kink；
One inclined shell fragment is set on the inside of the kink；
Kink position corresponding with the shell fragment is provided with lock screw, the end of the lock screw and the shell fragment
Contact, so that the lock screw promotes the shell fragment to deform upon in screwing operations.
10. electroplating printed circuit board cathode shading device according to claim 9, it is characterised in that the kink
Outside is provided with reinforcement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610832341.4A CN107841784A (en) | 2016-09-19 | 2016-09-19 | Electroplating printed circuit board cathode shading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610832341.4A CN107841784A (en) | 2016-09-19 | 2016-09-19 | Electroplating printed circuit board cathode shading device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107841784A true CN107841784A (en) | 2018-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610832341.4A Pending CN107841784A (en) | 2016-09-19 | 2016-09-19 | Electroplating printed circuit board cathode shading device |
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| CN (1) | CN107841784A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110344102A (en) * | 2019-08-14 | 2019-10-18 | 重庆方正高密电子有限公司 | Accompany plating plate and plating line |
| CN110592652A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Shielding assembly and electrolytic device applying same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110344102A (en) * | 2019-08-14 | 2019-10-18 | 重庆方正高密电子有限公司 | Accompany plating plate and plating line |
| CN110592652A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Shielding assembly and electrolytic device applying same |
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