TWI530593B - Multi-anode control device and electroplating equipment having the same - Google Patents

Description

Multi-anode control device and electroplating equipment therewith 【0001】

 The present invention relates to an anode mesh for electroplating, and more particularly to a multi-anode control device and an electroplating apparatus having the same.

【0002】

 Regarding the electroplating of the substrate, the cathode electricity is mainly electrically connected to one side of the substrate via the jig, and then the anode mesh is respectively disposed on the front and the back of the substrate to utilize the anode with the anode. The substrate is plated.

[0003]

 However, since the cathode electricity is electrically connected only to one side of the substrate, the closer the substrate is to the position sandwiched by the jig, the smaller the cathode power obtained. Therefore, in the electroplating, the plating thickness of the substrate is not uniform, that is, the thinner the plating thickness of the substrate from the position where the jig is clamped, which affects the conductivity of the substrate, which has long been a disease for a long time.

[0004]

 Therefore, how to improve the above-mentioned defects is a major issue that the inventors of the present invention are trying to solve.

[0005]

 An object of the present invention is to provide a multi-anode control device and an electroplating apparatus having the same, which can make the current density obtained by each anode net and the cathode electric power respectively obtained at different positions of the substrate complementary to each other, thereby uniformizing the substrate. plating.

[0006]

 In order to achieve the above object, the present invention provides a multi-anode control device for use with a cathode connector electrically connected to one side of a substrate, the multi-anode control device comprising: an anode module including side by side and a plurality of anode nets spaced apart from each other; and a power supply control module electrically connected to each of the anode nets, wherein the power supply control module respectively supplies power to each of the anode nets to generate respectively for each of the anode nets Current density.

【0007】

 The present invention further provides an electroplating apparatus having a multi-anode control device for electroplating a substrate, the electroplating apparatus comprising: a body defining a second direction for transporting the substrate; and a pair of transport roller sets on the body The bottom plate is oppositely disposed, the substrate is transported in the second direction between the pair of transport roller sets; a cathode connection group is disposed on the body, the cathode connection group has a plurality of cathode connectors, each of the cathode connectors Electrically connected to one side of the substrate; and a pair of multi-anode control devices disposed on the upper and lower sides of the substrate, each of the multi-anode control devices facing each side of the substrate through each of the transport roller sets, each of which The anode control device comprises: an anode module and a power supply control module: the anode module comprises a plurality of anode nets arranged side by side and spaced apart from each other; the power supply control module is electrically connected to each of the anode nets The power supply control module separately supplies power to each of the anode nets to generate a desired current density in each of the anode nets.

[0008]

 Compared with the prior art, the present invention has the following effects: the current density respectively obtained by each anode mesh, and the cathode electric power respectively obtained at different positions of the substrate are complementary to each other, thereby uniformly plating the substrate.

[0052]

 100...multi-anode control device

[0053]

 1...anode module

[0054]

 1a...first side

[0055]

 1b...second side

[0056]

 11...anode net

[0057]

 111... plating solution output hole

[0058]

 2...Power supply control module

[0059]

 21...electric output department

[0060]

 22...rectifier

[0061]

 3...insulated frame

[0062]

 31...frame

[0063]

 311... positioning rib

[0064]

 32...ribs

[0065]

 4... plating solution conveying structure

[0066]

 41... shunt tube

[0067]

 411... entrance

[0068]

 412...export

[0069]

 42...transport tube

[0070]

 421... plating solution output

[0071]

 500... substrate

[0072]

 600... body

[0073]

 700...transport roller set

[0074]

 800...cathode connection group

[0075]

 8...cathode connector

[0076]

 A... angle

[0077]

 D1...first direction

[0078]

 D2...second direction

[0079]

 S1, S2, S3, S4, S5... spacing

【0009】

 1 is a perspective view of a first embodiment of an anode module in accordance with the present invention.

[0010]

 2 is a plan view of a second embodiment of the anode module of the present invention.

[0011]

 Figure 3 is a plan view of a third embodiment of the anode module of the present invention.

[0012]

 Figure 4 is a plan view of a fourth embodiment of the anode module of the present invention.

[0013]

 Figure 5 is a partial perspective view of a multi-anode control device of the present invention (without plating solution transport structure).

[0014]

 Figure 6 is a partial perspective view of a multi-anode control device of the present invention (including a plating solution transport structure).

[0015]

 FIG. 7 is a schematic diagram of a power supply mode of a power supply control module in a multi-anode control device according to the present invention.

[0016]

 Figure 8 is a cross-sectional view of the plating apparatus of the present invention.

[0017]

 9 to 21 are top views of the fifth to seventeenth embodiment of the anode module of the present invention, respectively.

[0018]

 The detailed description and technical content of the present invention are set forth below with reference to the accompanying drawings.

[0019]

 The present invention provides an electroplating apparatus having a multi-anode control device. As shown in FIG. 8, an electroplating apparatus for electroplating a substrate 500 includes a cathode connection group 800 and a pair of multi-anode control devices 100. The cathode connection set 800 has a plurality of cathode connectors 8 for electrically connecting to one side of the substrate 500. The multi-anode control device 100 includes an anode module 1 and a power supply control module 2.

[0020]

 As shown in FIG. 1, it is a perspective view of the first embodiment of the anode module 1. The anode module 1 has a first side 1a corresponding to the cathode connector 8 (see Fig. 8) and a second side 1b opposite to the first side 1a. The first side 1a to the second side 1b of the anode module 1 is defined as a first direction D1. The anode module 1 includes a plurality of anode meshes 11 which are arranged side by side in the first direction D1 and are respectively provided with a plurality of plating solution output holes 111. Each of the anode webs 11 is spaced apart by a pitch, and each of the pitches may be a diagonally-shaped pitch S1 as shown in FIG. 1 (first embodiment of the anode module 1), and a linear-shaped pitch S2 as shown in FIG. 2 (anode) The second embodiment of the module 1), the pitch S3 of the circular arc shape shown in FIG. 3 (the third embodiment of the anode module 1) or the pitch S4 of the sawtooth bending line shape as shown in FIG. 4 (anode) The fourth embodiment of the module 1) is not limited by the present invention.

[0021]

 The direction in which the plating apparatus is used to transport the substrate 500 is defined as a second direction D2 (refer to FIGS. 2 and 8).

[0022]

 If the pitch S2 of the linear shape between the anode webs 11 of the second embodiment is parallel to the second direction D2 (not shown), an unplated line will be formed on the substrate 500; in order to avoid such a situation Occurs, as shown in FIG. 2, the anode module 1 of the second embodiment must be tilted so that the spacing S2 between any adjacent two anode webs 11 in the anode module 1 corresponds to the linear shape of the anode module 1. An angle A is formed between the second direction D2 and the angle A of the angle A is greater than 15 degrees and less than 75 degrees. The present invention is not limited, so that the formation of the unplated line on the substrate 500 can be avoided.

[0023]

 As for the pitch S1 of the oblique line shape shown in FIG. 1 (the first embodiment of the anode module 1), the pitch S3 of the circular arc shape shown in FIG. 3 (the third embodiment of the anode module 1), and The pitch S4 of the zigzag bent line shape shown in FIG. 4 (the fourth embodiment of the anode module 1) does not form the substrate 500 because the pitches S1, S3, and S4 are not parallel to the second direction D2. The electroplated wires, in other words, the anode modules 1 of the first, third and fourth embodiments are not necessarily inclined.

[0024]

 The power supply control modules 2 are electrically connected to the anode nets 11 respectively, so that the power supply control modules 2 respectively supply power to the anode nets 11, thereby generating respective current densities (unlabeled symbols) in the respective anode nets 11. Due to the marginal effect of the anode mesh 11, the current density at the margin of the anode mesh 11 is rather increased. Therefore, it is actually necessary to separately adjust the current supplied to each anode mesh 11 by the power supply control module 2 as the case may be; In the present embodiment, one of the following cases will be described as an example, but is not limited thereto:

[0025]

 The farther the anode web 11 is from the first side 1a, the greater the current density required for the anode web 11, that is, the magnitude of each current density is proportional to the length of each anode web 11 from the first side 1a. Accordingly, the higher the current density generated by the anode network 11 farther from the first side 1a, via the respective fine adjustment control of the power supply control module 2. As a result, the current density of the substrate 500 directly adjacent to the cathode connector 8 is complementary to each other, so that uniform plating can be performed on the substrate 500. Of course, in practice, the area of each anode mesh 11 is preferably the same as each other, so that the fine adjustment control of the power supply control module 2 tends to be simple.

[0026]

 As shown in FIG. 7, the power supply control module 2 can be an embodiment having a plurality of rectifiers 22. Therefore, the anodes of the rectifiers 22 are electrically connected to the anode grids 11 via the respective power output portions 21, and the cathodes of the rectifiers 22 are electrically connected to the substrate 500 via the cathode connectors 8 (shown in FIG. 8). One side and the other side. One side and the other side of the substrate 500 are opposed to each other. Thereby, the power supply control module 2 outputs the anode electric power of a desired magnitude to each of the anode nets 11 via the respective rectifiers 22.

[0027]

 Of course, the power supply control module 2 can also be a single rectifier (not shown), and the power supply control module 2 has a plurality of power output portions 21. Each of the power output units 21 is electrically connected to each of the anode nets 11 . Thereby, the power supply control module 2 outputs the anode power of a desired magnitude to each of the anode nets 11 via the respective power output units 21.

[0028]

 As shown in FIGS. 5 and 6, the multi-anode control device 100 of the present invention further includes an insulating frame body 3 and a plating solution conveying structure 4. The anode module 1 is disposed in the insulating frame 3, and the anode module 1 is disposed in the insulating frame 3 as follows. However, the present invention is not limited to the one described below.

[0029]

 The insulating frame 3 includes a frame 31 and a plurality of ribs 32 spanning the frame 31. The anode module 1 is mounted in the frame 31, and the ribs 32 are fixed to the anode module 1 at positions corresponding to the spacing S1 (or other spacings S2 to S4) between the adjacent two anode webs 1, thereby positioning the anode module 1 in the frame. 31 inside.

[0030]

 Of course, in order to stably position the anode module 1 in the frame 31, the frame 31 is respectively provided with a positioning rib 311 corresponding to the first side 1a and the second side 1b to allow the first side 1a of the anode module 1 and The second sides 1b are respectively positioned on the two positioning ribs 311 of the frame 31.

[0031]

 The plating solution delivery structure 4 includes a shunt tube 41 and a plurality of delivery tubes 42. The shunt tube 41 is coupled to the frame 31 and has an inlet 411 and a plurality of outlets 412. Each of the transport tubes 42 is connected between each of the outlets 412 and the frame 31, and each of the transport tubes 42 has a plurality of plating liquid output portions 421. Each of the plating solution output portions 421 protrudes from the anode module 1 via the plating solution output holes 111. Therefore, the plating solution is supplied into the shunt tube 41 through the inlet 411, and the plating solution is output to the respective transfer tubes 42 through the respective outlets 412. Finally, the plating solution is discharged through the respective plating solution output portions 421.

[0032]

 It should be noted that although the multi-anode control device 100 of the present invention can be implemented with the insulating frame 3, it can be implemented without the insulating frame 3 in practice. The former can be modularly assembled into an electroplating apparatus by the insulating frame body 3, and the latter can make the structure tend to be simple, and the invention is not limited.

[0033]

 As shown in FIG. 8, a cross-sectional view of a plating apparatus having a multi-anode control device 100 of the present invention is shown. The electroplating apparatus is used to electroplate a substrate 500. The electroplating apparatus includes a body 600, a pair of transport roller sets 700, the aforementioned cathode connection set 800, and the aforementioned pair of multi-anode control devices 100.

[0034]

 The body 600 defines a second direction D2 (refer to FIG. 1 or FIG. 2) that is useful for transporting the substrate 500. The two transport roller sets 700 are disposed on the upper and lower sides of the main body 600 so that the substrate 500 can be transported between the two transport roller sets 700 in the second direction D2. The cathode connection group 800 is disposed on the body 600, and each cathode connection member 8 of the cathode connection group 800 is located between the first sides 1a of the two anode modules 1.

[0035]

 The two-anode control device 100 is disposed above and below the main body 600, and each of the multi-anode control devices 100 faces one side and the other side of the substrate 500 through the respective transport roller groups 700.

[0036]

 Each of the multi-anode control devices 100 includes the aforementioned anode module 1 and power supply control module 2 (shown in FIG. 7).

[0037]

 Referring to FIG. 1, the spacing S between any adjacent two anode webs 11 in each anode module 1 forms an angle A between the linear shape of the anode module 1 and the second direction D2. The angle of the included angle A is greater than 15 degrees and less than 75 degrees, and the invention is not limited.

[0038]

 Accordingly, the substrate 500 advances in the second direction D2 via the conveyance of the two transport roller groups 700. Each of the cathode connectors 8 is electrically connected to one side of the substrate 500 to provide cathode electricity, and the farther the substrate 500 is from the position of the cathode connector 8, the smaller the cathode power obtained. At this time, each multi-anode control device 100 will control the power supply control module 2 to make the current density of the anode mesh 11 farther away from the position of the cathode connector 8 larger, so that they complement each other and enable the substrate. Uniform plating is performed on one side of the 500 side and the other side.

[0039]

 Further, as shown in FIGS. 9 to 21, the fifth to seventeenth embodiments of the anode module 1 are respectively shown. The anode modules 1 shown in FIG. 9 to FIG. 16 each include three anode nets 11 with a spacing between the anode webs 11; the anode modules 1 shown in FIG. 17 to FIG. 21 each include four. The anode grid 11 is also spaced apart from each other by an anode web 11 .

[0040]

 The pitches S1 of the hatched shape in Fig. 9 are parallel to each other (the fifth embodiment of the anode module 1), and the pitches S1 which are also hatched in Fig. 10 are symmetrical to each other (the sixth embodiment of the anode module 1) .

[0041]

 In Fig. 11, the pitches S3 in the shape of a circular arc are parallel to each other (the seventh embodiment of the anode module 1), and the pitch S3 in the shape of a circular arc in Fig. 12 is symmetrical to each other (the eighth of the anode module 1) Example).

[0042]

 The pitches S4 in the shape of the zigzag bent line in FIG. 13 are parallel to each other (the ninth embodiment of the anode module 1), and the pitch S4 in the shape of the zigzag bent line in FIG. 14 is symmetrical to each other (the tenth of the anode module 1) Example).

[0043]

 The pitches S5 in the shape of the arc curve line in Fig. 15 are parallel to each other (the eleventh embodiment of the anode module 1), and the pitch S5 in the shape of the arc curve line in Fig. 16 is symmetrical to each other (anode module 1) Twelfth embodiment).

[0044]

 The adjacent two pitches S1 of the oblique line shape in Fig. 17 are symmetrical with each other (the thirteenth embodiment of the anode module 1), and the embodiments in which the pitches S1 of the oblique line shape are parallel to each other are shown in Fig. 1 (see Fig. 1). First embodiment of the anode module 1).

[0045]

 In FIG. 18, any adjacent two pitches S3 having a circular arc shape are symmetrical with each other (the fourteenth embodiment of the anode module 1), and as for the embodiments in which the respective pitches S3 of the circular arc shape are parallel to each other, See Figure 3 (third embodiment of anode module 1).

[0046]

 In Fig. 19, the respective pitches S5 in the shape of a circular arc curve are parallel to each other (the fifteenth embodiment of the anode module 1), and any adjacent two pitches S5 which are also in the shape of a circular arc in Fig. 20 are symmetrical to each other (anode mode) Sixteenth embodiment of group 1).

[0047]

 In Fig. 21, any two adjacent pitches S4 in the shape of a zigzag bent line are symmetrical with each other (the seventeenth embodiment of the anode module 1), and as for the embodiments in which the respective pitches S4 of the zigzag bent line shape are parallel to each other, See Figure 4 (fourth embodiment of the anode module 1).

[0048]

 It should be noted that the area of each anode mesh 11 in any of the foregoing anode modules 1 (including the first to seventeenth embodiments) is the same, so that the fine adjustment control of the power supply control module 2 tends to be simple.

[0049]

 In summary, the present invention has the following effects as compared with the prior art: the power supply control module 2 can finely control the anode meshes 11 of the anode module 1 to make the anode mesh 11 farther away from the cathode connector 8 The larger the current density obtained, the more complementary the position of the substrate 500 to the cathode electrode 8 is, so that the substrate 500 can be uniformly plated.

[0050]

 In addition, the present invention has other effects: the multi-anode control device 100 can also be modularly assembled and unloaded by the plating apparatus due to the insulating frame body 3, making the assembly of the multi-anode control device 100 simple and easy.

[0051]

 The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and equivalent structural changes made by the description of the present invention and the contents of the drawings are included in the present invention. Within the scope of the rights, it is given to Chen Ming.

100...multi-anode control device

1...anode module

11...anode net

111... plating solution output hole

2...Power supply control module

21...electric output department

3...insulated frame

31...frame

311... positioning rib

32...ribs

Claims (17)

[Item 1] A multi-anode control device is used in conjunction with a cathode connector, the cathode connector is electrically connected to one side of the substrate, and the multi-anode control device comprises:
An anode module comprising a plurality of anode nets arranged side by side and spaced apart from each other; and a power supply control module electrically connected to each of the anode nets, wherein the power supply control module respectively supplies power to each of the anode nets The desired current density is produced in each of the anode networks. [Item 2]  The multi-anode control device of claim 1, wherein the anode module has a first side corresponding to the cathode connecting member and a second side opposite to the first side, the anode module is from the first One side to the second side is defined as a first direction, and each of the anode nets is spaced apart from each other in the first direction. [Item 3]  The multi-anode control device of claim 2, wherein the magnitude of the current density generated by each of the anode meshes is proportional to the length of each of the anode webs from the first side. [Item 4]  The multi-anode control device according to claim 1, wherein the pitch is a straight line, a diagonal line, a zigzag bending line, a circular arc line or a circular line. [Item 5]  The multi-anode control device of claim 1, wherein each of the anode meshes is provided with a plurality of plating solution output holes. [Item 6]  The multi-anode control device of claim 1, wherein each of the anode meshes has the same area as each other. [Item 7]  The multi-anode control device of claim 1, wherein the power supply control module is a rectifier having a plurality of power output portions, each of the power output portions being electrically connected to each of the anode nets. [Item 8]  The multi-anode control device of claim 1, wherein the power supply control module has a plurality of rectifiers, each of the rectifiers being electrically connected to each of the anode networks. [Item 9]  The multi-anode control device of claim 1, further comprising an insulating frame, the anode module being disposed on the insulating frame. [Item 10]  The multi-anode control device of claim 9, wherein the insulating frame comprises a frame and a plurality of ribs spanning the frame, the anode module being mounted in the frame, each rib corresponding to the adjacent two of the anode mesh The spacing between the positions fixes the anode module. [Item 11]  The multi-anode control device of claim 9, further comprising a plating solution conveying structure comprising a shunt tube and a plurality of conveying tubes, the shunt tube being connected to the insulating frame body, the shunt tube having an inlet And a plurality of outlets, each of the conveying pipes being respectively connected between each of the outlets and the insulating frame body, each of the conveying pipes further having a plurality of plating liquid output portions, wherein each of the plating liquid output portions protrudes from the anode module. [Item 12]  The multi-anode control device according to claim 11, wherein each of the anode nets is provided with a plurality of electroplating liquid output holes, and each of the electroplating liquid output portions of the electroplating liquid transporting structure respectively correspond to the electroplating liquid output holes of the anode module Extend. [Item 13] An electroplating apparatus having a multi-anode control device for electroplating a substrate, the electroplating apparatus comprising:
a body defining a second direction useful for transporting the substrate;
a pair of transport roller sets are disposed on the upper and lower sides of the body, and the substrate is transported in the second direction between the pair of transport roller sets;
a cathode connection group is disposed on the body, the cathode connection group has a plurality of cathode connectors, each of the cathode connectors is electrically connected to one side of the substrate; and a pair of multi-anode control devices are vertically opposed to the body The multi-anode control device is respectively disposed on both sides of the substrate through the respective transport roller groups, and each of the multi-anode control devices comprises: an anode module and a power supply control module:
The anode module comprises a plurality of anode meshes arranged side by side with a spacing therebetween;
The power supply control module is electrically connected to each of the anode nets, and the power supply control module separately supplies power to each of the anode nets to generate a required current density in each of the anode nets. [Item 14]  The electroplating apparatus of claim 13, wherein the anode module has a first side corresponding to the cathode connecting member and a second side opposite to the first side, the anode module is from the first side The second side is defined as a first direction, and each of the anode meshes is spaced apart from each other in the first direction. [Item 15]  The electroplating apparatus of claim 14, wherein the magnitude of the current density generated by each of the anode webs is proportional to the length of each of the anode webs from the first side. [Item 16]  The electroplating apparatus of claim 13, wherein the spacing between any two adjacent anode webs in the anode module corresponds to a linear shape exhibited by the anode module, and an angle is formed between the second direction. [Item 17]  The electroplating apparatus of claim 16, wherein the angle of the included angle is greater than 15 degrees and less than 75 degrees.