CN216998653U - Titanium basket, electroplating device and electroplating equipment - Google Patents

Titanium basket, electroplating device and electroplating equipment Download PDF

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Publication number
CN216998653U
CN216998653U CN202123215317.1U CN202123215317U CN216998653U CN 216998653 U CN216998653 U CN 216998653U CN 202123215317 U CN202123215317 U CN 202123215317U CN 216998653 U CN216998653 U CN 216998653U
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Prior art keywords
titanium basket
titanium
electroplating
plating
base film
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CN202123215317.1U
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Chinese (zh)
Inventor
周龙
张汉都
王芝芝
陈嘉圣
张喜冲
扈锋
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Xiamen Hithium Energy Storage Technology Co Ltd
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Xiamen Haichen New Energy Technology Co Ltd
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Abstract

The utility model discloses a titanium basket, an electroplating device and electroplating equipment, wherein the titanium basket comprises a first titanium basket part and a second titanium basket part, the first titanium basket part is used for corresponding to a groove entering section to electroplate the groove entering section, the second titanium basket part is connected with the first titanium basket part and is electrically connected with the first titanium basket part, an opening is formed in the second titanium basket part and/or the first titanium basket part, and the second titanium basket part is used for corresponding to a groove discharging section to electroplate the groove discharging section. Because this titanium basket includes first titanium basket portion and the second titanium basket portion of being connected with first titanium basket portion, like this, use a titanium basket can realize electroplating the income groove section and the play groove section of electrically conductive base film, and during the electroplating operation, the quantity of placing the titanium basket is less to be convenient for electroplate the operation.

Description

Titanium basket, electroplating device and electroplating equipment
Technical Field
The utility model relates to the technical field of electroplating, in particular to a titanium basket, an electroplating device and electroplating equipment.
Background
The current collector is an important component of a lithium battery, and the current collector is usually plated on two surfaces of a conductive base film by an electroplating method to form a metal plating layer during manufacturing.
In the related art, the plating is performed by immersing the conductive base film in a plating bath. When electroplating, the conductive base film is approximately in a V-shaped structure when electroplated in the electroplating bath, the conductive base film in the electroplating bath comprises an inlet section and an outlet section, the inlet section is a part of the conductive base film, which enters the electroplating bath from the outside of the electroplating bath, and the outlet section is a part of the conductive base film, which is transported to the outside of the electroplating bath from the electroplating bath. In order to improve the electroplating efficiency, titanium baskets are required to be placed in the electroplating bath corresponding to the groove entering section of the conductive base film and the groove outlet section of the conductive base film, so that the operation of the electroplating bath is complicated, and the power connection mode is complicated because each titanium basket is required to be electrically connected with a power supply anode.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model discloses a titanium basket, an electroplating device and electroplating equipment, wherein the titanium basket is more reasonable in structural arrangement, so that the number of titanium baskets to be placed during electroplating can be reduced, the electroplating operation is more convenient and faster, and the power connection mode of the titanium basket is simplified.
In order to achieve the above object, in a first aspect, an embodiment of the present invention discloses a titanium basket, where the titanium basket is applied to an electroplating apparatus, and is used to electroplate a conductive base film that passes through an electroplating bath of the electroplating apparatus, where the conductive base film includes a groove entering section and a groove exiting section, and the titanium basket includes:
the first titanium basket part is used for corresponding to the groove entering section so as to electroplate the groove entering section; and
the second titanium basket part is connected to the first titanium basket part and electrically connected with the first titanium basket part, an opening is formed in the second titanium basket part and/or the first titanium basket part and used for putting in an electroplating component, and the second titanium basket part is used for corresponding to the groove outlet section to electroplate the groove outlet section. Because this titanium basket includes first titanium basket portion and the second titanium basket portion of being connected with first titanium basket portion, like this, the first titanium basket portion of this titanium basket can be corresponding to the groove section of going into, the second titanium basket portion is corresponding to the groove section of going out, promptly, use a titanium basket can realize electroplating conductive base film's income groove section and play groove section, during electroplating operation, the quantity of placing the titanium basket is less, thereby be convenient for electroplating operation, furthermore, because first titanium basket portion and second titanium basket portion electricity are connected, so, when electroplating, can only be with first titanium basket portion or second titanium basket portion and the anodal electric connection of power, make first titanium basket portion and second titanium basket portion can both realize connecing the electricity, in order to realize carrying out the electricity to conductive base film's income groove section and play groove section, electroplating mode is simpler.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, the titanium basket further includes a third titanium basket portion, the second titanium basket portion is connected to the first titanium basket portion through the third titanium basket portion, the third titanium basket portion is located between the second titanium basket portion and the first titanium basket portion, the third titanium basket portion is electrically connected to the first titanium basket portion and the second titanium basket portion, and the third titanium basket portion is configured to contain the electroplating component. Through setting up third titanium basket portion, not only can make first titanium basket portion and second titanium basket portion electricity connect, and because third titanium basket portion also can be used for the splendid attire to electroplate the part to can improve the accommodation space of titanium basket with more conductive parts of splendid attire, and then can improve electroplating efficiency.
In an alternative embodiment of the first aspect of the present invention, the first titanium basket, the second titanium basket, and the third titanium basket are integrally formed. Therefore, the titanium basket is more convenient to process and manufacture, in addition, when electroplating operation is carried out, the whole titanium basket consisting of the first titanium basket part, the second titanium basket part and the third titanium basket part is only required to be put into the electroplating bath, the groove entering section of the conductive base film and the groove exiting section of the conductive base film can both correspond to the titanium basket, and therefore the efficiency of the electroplating bath operation can be improved, and the titanium baskets corresponding to the groove entering section and the groove exiting section do not need to be placed respectively.
As an alternative, in the embodiment of the first aspect of the present invention, a cross-sectional shape of the third titanium basket taken along a plane perpendicular to the opening is any one of a V shape, a U shape, and a circular arc shape. Therefore, the surface shape of the conductive base film in the electroplating bath can be better matched, and the electroplating effect is favorably improved. Illustratively, the cross-sectional shape of the third titanium basket portion is circular arc, so that the third titanium basket portion can be ensured to have approximately the same distance with the conductive base film close to the third titanium basket portion, which is beneficial to improving the plating uniformity and the plating efficiency.
As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the first titanium basket portion and the second titanium basket portion are arranged in parallel, or an included angle is formed between the first titanium basket portion and the second titanium basket portion. When the first titanium basket portion and the second titanium basket portion are parallel and are applied to the electroplating device, the first titanium basket portion and the second titanium basket portion occupy smaller space in the length direction of the electroplating tank, and therefore the length of the electroplating tank is favorably reduced. When the first titanium basket part and the second titanium basket part are provided with included angles and placed in the electroplating bath, the area of the titanium basket immersed in the electroplating solution of the electroplating bath is larger, so that the utilization rate of the titanium basket is improved, and the electroplating efficiency is improved.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, when the first titanium basket portion and the second titanium basket portion have an included angle therebetween, the included angle between the first titanium basket portion and the second titanium basket portion is Φ, and 0 ° < Φ ≦ 120 °. Illustratively, Φ is 30 °, 40 °, 50 °, 60 °, 70 °, 80 °, 90 °, 100 °, 110 °, 120 °. Like this, when placing first titanium basket portion and second titanium basket portion in the plating bath, the inclination of the relative bottom surface of plating bath of first titanium basket portion and second titanium basket portion and the income groove section of electrically conductive base film and go out the groove section more matches to can improve the utilization ratio to the metal ion that electroplates parts (for example copper ball) and produce in the titanium basket, be favorable to improving electroplating efficiency. In addition, because the range of the inclination angle of the first titanium basket part and the second titanium basket part in the electroplating bath is reasonable, the first titanium basket part and the second titanium basket part can not occupy the larger space of the electroplating bath in the length direction due to the overlarge inclination angle, and the titanium basket is easier to maintain. When the included angle between the first titanium basket portion and the second titanium basket portion is greater than 120 °, the distance between the top ends of the first titanium basket portion and the second titanium basket portion is large, that is, when the first titanium basket portion and the second titanium basket portion are applied to the plating bath, the length of the first titanium basket portion and the length of the second titanium basket portion in the length direction of the plating bath are long, and therefore, the space occupied by the plating bath is large.
As an alternative implementation, in the embodiment of the first aspect of the present invention, the first titanium basket part has a first end and a second end opposite to the first end, the second end is used for connecting with the second titanium basket part, the vertical distance between the second end and the first end is H1, 200mm & lt, H1 & lt, 1500 mm; illustratively, H1 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500 mm; or the second titanium basket part is provided with a third end and a fourth end which are opposite, the fourth end is used for being connected with the first titanium basket part, the vertical distance between the fourth end and the third end is H2, and H2 is more than or equal to 200mm and less than or equal to 1500 mm; illustratively, H2 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500 mm; the opening is arranged on the end surface of the first end and/or the second end. Through injecing first titanium basket portion and second titanium basket portion vertical height between 200mm ~ 1500mm, thereby can guarantee on the one hand that first titanium basket portion and second titanium basket portion have sufficient size to have more copper balls of great volume with the splendid attire, and then can provide sufficient copper ion to guarantee to electroplate efficiency. On the other hand, the situation that the electroplating bath needs to be used deeply due to too high height of the first titanium basket part and the second titanium basket part along the depth direction of the electroplating bath when the first titanium basket part and the second titanium basket part are applied to the electroplating bath can be avoided, and the electroplating bath is difficult to maintain. When the vertical height of the first titanium basket part and the second titanium basket part is smaller than 200mm, the first titanium basket part and the second titanium basket part are smaller in size, the copper balls capable of being contained are fewer due to the smaller volume of the titanium basket, so that fewer copper ions can be provided, and the electroplating efficiency is lower. When the power is connected to the titanium basket, the first end of the first titanium basket part or the third end of the second titanium basket part is generally connected to the power, that is, the top of the first titanium basket part or the second titanium basket part is electrically connected to the positive electrode of the power supply, so that when the vertical height of the first titanium basket part and the vertical height of the second titanium basket part are greater than 1500mm, the distance from the second end of the first titanium basket part to the first end is far, and the distance from the fourth end of the second titanium basket part to the third end is far, so that the current density of the second end and the fourth end is small, the electroplating efficiency of the second end and the fourth end is low, and the utilization rate of the first titanium basket part and the second titanium basket part is small.
As an alternative implementation, in the embodiment of the first aspect of the present invention, the first titanium basket part has a first side and a second side opposite to each other, the length of the first titanium basket part along the direction from the first side to the second side is L1, and L1 is 500mm ≦ 3000 mm; illustratively, L1 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000 mm; or the second titanium basket part is provided with a third side and a fourth side which are opposite, the length of the second titanium basket part along the direction from the third side to the fourth side is L2, and L2 is more than or equal to 500mm and less than or equal to 3000 mm; illustratively, L2 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000 mm; the opening extends in a direction from the first side to the second side, or the opening extends in a direction from the third side to the fourth side. Therefore, the lengths of the first titanium basket part and the second titanium basket part can be limited, the first titanium basket part and the second titanium basket part are ensured to have enough areas so as to ensure the electroplating efficiency, and the condition that the current density distribution is uneven due to the fact that the lengths of the first titanium basket part and the second titanium basket part are long can be avoided. When the length of the first titanium basket part and the second titanium basket part is less than 500mm, the width of the titanium basket is small, and the area of the titanium basket is small, so that the electroplating efficiency is low. When the length of the first titanium basket and the second titanium basket is greater than 3000mm, the current density distribution of the first titanium basket and the second titanium basket is not uniform, which may result in poor plating uniformity.
In a second aspect, an embodiment of the present invention discloses an electroplating apparatus, including:
an electroplating bath; and
a titanium basket as described above with respect to the first aspect, the titanium basket being disposed in the plating bath.
As an alternative implementation manner, in an embodiment of the second aspect of the present invention, the titanium basket is provided in a plurality, and the plurality of titanium baskets are provided at intervals along a length direction of the plating tank. It can be understood that the electroplating equipment with the titanium basket has the full technical effect of the titanium basket. Namely, because this titanium basket includes first titanium basket portion and the second titanium basket portion of being connected with first titanium basket portion, consequently, use a titanium basket can realize electroplating the income groove section and the play groove section of electrically conductive base film, and during the electroplating operation, the quantity of placing the titanium basket is less to be convenient for electroplating operation and electric connection mode are simple and convenient. Since the above technical effects have been described in detail in the embodiments of the electroplating apparatus, they will not be described herein again.
As an optional implementation manner, in an embodiment of the second aspect of the present invention, the titanium basket is provided in a plurality, the plurality of titanium baskets are provided at intervals along a depth direction of the plating bath, and the adjacent two titanium baskets are used for allowing the conductive base film to pass through therebetween, so as to plate the front surface of the conductive base film and the back surface of the conductive base film. Like this, through setting up a plurality of titanium baskets along the degree of depth direction of plating bath to the realization is electroplated simultaneously to the front of electrically conductive base film and the reverse side of electrically conductive base film, is favorable to improving electroplating efficiency.
As an optional implementation manner, in an embodiment of the second aspect of the present invention, the electroplating apparatus further includes a submerged roller, the submerged roller is disposed in the electroplating tank and located between two adjacent titanium baskets, and the submerged roller is configured to transport the conductive base film between two adjacent titanium baskets. Like this, through setting up the electrically conductive base film of roll transportation down to can make the transportation of electrically conductive base film more smooth and easy.
As an optional implementation manner, in an embodiment of the second aspect of the present invention, the first titanium basket portion is disposed obliquely with respect to the bottom surface of the plating bath, and an included angle between the first titanium basket portion and the bottom surface of the plating bath is Φ 1, and is greater than or equal to 30 ° and less than or equal to 90 °; illustratively, φ 1 is 30 °, 40 °, 50 °, 60 °, 70 °, 80 °, 90 °. Or the second titanium basket part is obliquely arranged relative to the bottom surface of the electroplating bath, and the included angle between the second titanium basket part and the bottom surface of the electroplating bath is phi 2, wherein phi 2 is more than or equal to 30 degrees and less than or equal to 90 degrees. Illustratively, Φ 2 is 30 °, 40 °, 50 °, 60 °, 70 °, 80 °, 90 °. Like this, the relative bottom surface of plating bath of first titanium basket portion and second titanium basket portion matches more with the inclination of the income groove section of electrically conductive base film and play groove section to can improve the utilization ratio to the copper ion that copper ball produced in the titanium basket, be favorable to improving electroplating efficiency. In addition, because the range of the inclination angle of the first titanium basket part and the second titanium basket part in the plating bath is reasonable, the first titanium basket part and the second titanium basket part cannot cause the overlong length of the plating bath due to the overlarge inclination angle, and the titanium basket is easier to maintain. When the inclination angle of the first titanium basket part and the second titanium basket part relative to the bottom surface of the electroplating bath is larger than 90 degrees, the matching performance of the inclination angle of the first titanium basket part and the second titanium basket part and the inclination angle of the groove entering section and the groove outlet end of the conductive base film is poor, so that the copper ions generated by the copper balls in the titanium basket are not utilized fast, and the electroplating efficiency is reduced. In addition, the titanium baskets are not easy to maintain due to overlarge inclination angles of the first titanium basket part and the second titanium basket part relative to the bottom surface of the electroplating bath. When the inclination angle of the first titanium basket part and the second titanium basket part relative to the bottom surface of the electroplating bath is smaller than 30 degrees, the matching performance of the inclination angle of the first titanium basket part and the second titanium basket part and the inclination angle of the groove entering section and the groove outlet end of the conductive base film is poor, so that the copper ions generated by the copper balls in the titanium basket are not favorably and quickly utilized, and the electroplating efficiency is reduced. In addition, when the inclination angles of the first titanium basket portion and the second titanium basket portion with respect to the bottom surface of the plating tank are too small, the lengths of the first titanium basket portion and the second titanium basket portion in the length direction of the plating tank are long, and therefore, the space occupied by the plating tank is large.
As an optional implementation manner, in an embodiment of the second aspect of the present invention, a height of the first titanium basket portion in a depth direction of the plating bath is H1, 200mm ≦ H1 ≦ 1500mm, and exemplarily, H1 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500 mm. Or the height of the second titanium basket part along the depth direction of the plating bath is H2, and H2 is more than or equal to 200mm and less than or equal to 1500 mm. Illustratively, H2 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500 mm. By limiting the height of the first titanium basket part and the second titanium basket part to be 200-1500 mm along the depth direction of the electroplating bath, on one hand, the first titanium basket part and the second titanium basket part can be guaranteed to have enough sizes to contain more copper balls, and then enough copper ions can be provided, so that the electroplating efficiency is guaranteed. On the other hand, the situation that the electroplating bath is difficult to maintain due to the fact that the first titanium basket part and the second titanium basket part are too high in the depth direction of the electroplating bath and the electroplating bath with deeper depth needs to be used can be avoided. When the height of the first titanium basket part and the height of the second titanium basket part in the depth direction of the electroplating bath are smaller than 200mm, the first titanium basket part and the second titanium basket part are smaller in size, the copper balls capable of being contained are fewer due to the smaller volume of the titanium basket, and therefore fewer copper ions can be provided, and electroplating efficiency is lower. When the heights of the first titanium basket part and the second titanium basket part in the depth direction of the electroplating bath are larger than 1500mm, because the tops of the first titanium basket part and the second titanium basket part are electrically connected with the positive electrode of the power supply, the distance between the areas of the first titanium basket part and the second titanium basket part close to the bottom of the electroplating bath and the top of the titanium basket is far, so the current density is small, and similarly, the current density of the areas of the conductive base film close to the bottom of the electroplating bath is also small, therefore, when the first titanium basket part and the second titanium basket part are arranged to be high, the electroplating efficiency of the bottoms of the first titanium basket part and the second titanium basket part is low, and the utilization rate of the first titanium basket part and the second titanium basket part is low.
As an alternative embodiment, in the embodiment of the second aspect of the present invention, the length of the first titanium basket along the width direction of the plating bath is L1, and L1 is 500mm or more and 3000mm or less, and for example, L1 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000 mm. Or the length of the second titanium basket part along the width direction of the plating bath is L2, and L2 is more than or equal to 500mm and less than or equal to 3000 mm. Illustratively, L2 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000 mm. Therefore, the lengths of the first titanium basket part and the second titanium basket part can be limited, the first titanium basket part and the second titanium basket part are ensured to have enough areas so as to ensure the electroplating efficiency, and the condition that the current density distribution is uneven along the width direction of the electroplating bath due to the fact that the lengths of the first titanium basket part and the second titanium basket part are large can also be avoided. When the length of the first titanium basket portion and the second titanium basket portion in the width direction of the plating tank is less than 500mm, the area of the titanium basket is small, resulting in low plating efficiency. When the length of the first titanium basket portion and the second titanium basket portion in the width direction of the plating tank is greater than 3000mm, the current density distribution in the width direction of the plating tank is not uniform, and the thickness of the plated copper layer in the width direction of the conductive base film is not uniform.
As an alternative embodiment, in an embodiment of the second aspect of the utility model, the lower end of the plating tank is provided with an overflow pipe, which is used for communicating with and being located in the mother liquor tank. Like this, can set up the mother cistern in the below of plating bath to the overflow pipe of being convenient for lets in the mother cistern, thereby exchanges the plating solution in the plating bath and the plating solution in the mother cistern, because the overflow pipe is located the mother cistern in addition, compare in letting in the mother cistern with the overflow pipe from the lateral part of plating bath, be difficult to lead to the plating solution in the plating bath to leak outside plating bath and the mother cistern.
In a third aspect, an embodiment of the present invention discloses an electroplating apparatus, including:
a mother liquor tank; and
the electroplating device is the electroplating device according to the second aspect, the electroplating tank of the electroplating device is arranged on the mother liquid tank, and the mother liquid tank is used for supplying liquid to the electroplating tank. It can be understood that the electroplating equipment with the electroplating device also has the whole technical effects of the electroplating device. That is, because first titanium basket portion and second titanium basket portion are connected, consequently, use a titanium basket to realize electroplating conductive base film's income groove section and play groove section, during electroplating operation, the quantity of placing the titanium basket is less to be convenient for electroplate the operation, and connect the electric mode simpler.
Compared with the prior art, the embodiment of the utility model has the beneficial effects that:
adopt the titanium basket that this embodiment provided, electroplate device and electroplating device, because this titanium basket includes first titanium basket portion and the second titanium basket portion of being connected with first titanium basket portion, first titanium basket portion is used for the electroplating of the income groove section in order to realize going into the groove section corresponding to electrically conductive base film, second titanium basket portion is corresponding to the play groove section of electrically conductive base film in order to realize the electroplating to going out the groove section, and like this, use a titanium basket can realize the electroplating to the income groove section of electrically conductive base film and play groove section, so, the quantity of titanium basket can set up still less during electroplating, thereby it is more convenient to make the electroplating operation. In addition, because first titanium basket portion and second titanium basket portion electricity are connected, like this, only need connect the electricity that can realize whole titanium basket portion to first titanium basket portion and second titanium basket portion one of the two, connect the electric mode simpler, and then make the electroplating operation more convenient.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view showing a structure of a plating apparatus according to the related art;
FIG. 2 is a schematic structural diagram of a titanium basket provided in the present embodiment;
FIG. 3 is a schematic structural diagram of an electroplating apparatus provided in this embodiment;
FIG. 4 is a schematic view of an internal structure of the plating apparatus according to the present embodiment;
FIG. 5 is an enlarged view taken at I in FIG. 4;
FIG. 6 is a schematic view of the internal structure of the electroplating apparatus shown in FIG. 4 at another angle;
fig. 7 is a schematic structural diagram of the electroplating apparatus provided in this embodiment.
Detailed Description
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Moreover, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific type and configuration may or may not be the same), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The current collector of the lithium battery is formed by plating metal layers at two ends of a conductive base film. In the electroplating process, a titanium basket provided with an electroplating component (such as a copper ball, which will be described by taking a conductive component as the copper ball as an example) is arranged in the electroplating tank, a power supply positive electrode is connected to the titanium basket, so that the copper ball in the titanium basket is electrolyzed to form copper ions, a conductive base film is placed in the electroplating solution of the electroplating tank in the electroplating process and is connected to a power supply negative electrode, so that the copper ions in the electroplating solution are reduced to copper atoms on the conductive base film and are deposited on the conductive base film, and the electroplating efficiency is ensured.
Referring to fig. 1, in the related art, an electroplating apparatus includes an electroplating bath 101, two bath rollers 102, two bath rollers 103, and four titanium baskets 104. The plating tank 101 is used for containing a plating solution, the two tank inlet rollers 102 are arranged on one side of the plating tank 101, the two tank outlet rollers 103 are arranged on the other side of the plating tank 101, and the titanium basket 104 is arranged in the plating tank 101.
During electroplating, the conductive base film 300 which is not electroplated is positioned on one side of the electroplating bath 101, which is provided with the groove entering rollers 102, the conductive base film 300 is unreeled, so that the conductive base film 300 is conveyed into the electroplating bath 101 through the two groove entering rollers 102, meanwhile, the two groove entering rollers 102 are connected to a negative electrode of a power supply, and the front side and the back side of the conductive base film 300 are electrified while the conductive base film 300 is conveyed to the electroplating bath 101 by the two groove entering rollers 102. The two groove outlet rollers 103 are connected to a negative electrode of a power supply, the two groove outlet rollers 103 convey the conductive base film 300 from the electroplating groove 101 to the outside of the electroplating groove 101 and electrify the front surface and the back surface of the conductive base film 300, that is, the groove inlet roller 102 and the groove outlet rollers 103 are both connected to the negative electrode of the power supply, so that the conductive base film 300 is connected to the negative electrode of the power supply when the groove inlet roller 102 and the groove outlet rollers 103 transport the conductive base film 300, thereby realizing electroplating of the conductive base film 300. The discharging roller 103 conveys the electroplated conductive base film 300 out of the plating tank 101, and then winds up the electroplated conductive base film 300 for storage.
It is understood that, when the conductive base film 300 is plated in the plating tank 101, the edge portion of the conductive base film 300 located in the plating tank 101 is connected to the inlet roll 102 and the outlet roll 103, the middle portion of the conductive base film 300 located in the plating tank 101 is located inside the plating tank 101 and is immersed in the plating solution for plating, and thus, the conductive base film 300 is substantially V-shaped in the plating tank 101, so that the portion of the conductive base film 300 located in the plating tank 101 can be divided into the inlet section 31 and the outlet section 32, the portion of the conductive base film 300 located in the plating tank 101 and connected to the inlet roll 102 is the inlet section 31, and the portion of the conductive base film 300 located in the plating tank 101 and connected to the outlet roll 103 is the outlet section 32. It should be noted that, in some cases, the conductive base film 300 passes through the electroplating bath for multiple times, that is, the portion of the conductive base film 300 in the electroplating bath is in a plurality of V-shaped structures connected in sequence, in this case, for each V-shaped conductive base film 300, the portion close to the groove inlet roller 102 is the groove inlet section 31, and the portion close to the groove outlet roller 103 is the groove outlet section 32.
In order to improve the electroplating efficiency, in the electroplating bath 101, the titanium baskets 104 are required to be arranged corresponding to the groove entering section 31 and the groove exiting section 32 of the conductive base film 300, and each titanium basket 104 is required to be electrically connected with the positive electrode of the power supply, so that the titanium baskets 104 which need to be placed are more in number and the power connection mode is more complicated.
In addition, since the copper layer on the surface of the conductive base film 300 is thin when the conductive base film 300 is not immersed in the plating solution or is just immersed in the plating solution, and the current density that the conductive base film 300 can carry is small, only a small current can be set for the groove entering roller 102 that transports the conductive base film 300 into the plating tank 101, so that the situation that the conductive base film 300 is deformed due to excessive heat generated by excessive current is avoided. In addition, when the negative electrode of the power supply is connected to the groove outlet roller 103, the current of the groove outlet roller 103 is also transmitted to the groove inlet section 31 of the conductive base film 300, and therefore, only a small current can be supplied to the groove outlet roller 103, so as to ensure that the current density applied to the groove inlet section 31 of the conductive base film 300 by the groove outlet roller 103 is smaller than the difference between the current density which can be borne by the conductive base film 300 and the current density applied to the groove inlet section 31 by the groove inlet roller 102. Thus, the current to the grooved rollers 102 and 103 is greatly restricted, and only a small current can be applied, resulting in a low plating efficiency.
Based on this, this application embodiment provides a titanium basket, electroplating device and electroplating device, and this titanium basket's structure sets up rationally so that electroplate the operation more portably, connect the electric mode simpler.
The technical solution of the present invention will be further described with reference to the following examples and drawings.
Referring to fig. 2, the first aspect of the present invention discloses a titanium basket 14, in which the titanium basket 14 is applied to an electroplating apparatus, and is used for electroplating a conductive base film in an electroplating bath introduced into the electroplating apparatus, and the conductive base film includes a groove entering section and a groove exiting section. For the definition of the groove entering section and the groove exiting section of the conductive base film, reference may be made to the foregoing description. The titanium basket 14 includes a first titanium basket portion 141 and a second titanium basket portion 142. The first titanium basket portion 141 is used for corresponding to the groove entering section to electroplate the groove entering section, the second titanium basket portion 142 is connected to the first titanium basket portion 141 and electrically connected with the first titanium basket portion 141, an opening 144 is provided on the second titanium basket portion 142 and/or the first titanium basket portion 141, the opening is used for throwing an electroplating component (such as a copper ball, for the convenience of understanding, the description will be given by taking a conductive component as the copper ball as an example), and the second titanium basket portion 142 is used for corresponding to the groove exiting section to electroplate the groove exiting section.
In the titanium basket of the first aspect of the present invention, since the titanium basket 14 includes the first titanium basket portion 141 and the second titanium basket portion 142 connected to the first titanium basket portion 141, such that the first titanium basket portion 141 of the titanium basket 14 can correspond to the groove entering section 31 and the second titanium basket portion 142 corresponds to the groove exiting section 32, that is, electroplating of the groove entering section 31 and the groove exiting section 32 of the conductive base film 300 can be achieved by using one titanium basket 14, and the number of the titanium baskets placed during electroplating is small, thereby facilitating the electroplating operation, and in addition, since the first titanium basket portion 141 and the second titanium basket portion 142 are electrically connected, during electroplating, only the first titanium basket portion 141 or the second titanium basket portion 142 can be electrically connected to a power supply positive electrode, so that both the first titanium basket portion 141 and the second titanium basket portion 142 can be electrically connected to achieve electroplating of the groove entering section 31 and the groove exiting section 32 of the conductive base film 300, and the electrical connection mode is simpler. Of course, both the first titanium basket 141 and the second titanium basket 142 may be electrically connected to the positive power supply.
It can be understood that the first titanium basket 141 and the second titanium basket 142 are respectively used for electroplating the groove entering section 31 and the groove exiting section 32 of the conductive base film 300, and therefore, the openings 144 may be formed on both the first titanium basket 141 and the second titanium basket 142, so that copper balls may be put into the first titanium basket 141 and the second titanium basket 142 through the openings 144, and copper ions may be precipitated from the portions of the first titanium basket 141 and the second titanium basket 142 soaked in the electroplating solution, thereby improving the electroplating efficiency of the conductive base film 300.
Furthermore, a plurality of fastening holes are formed in the first titanium basket 141 and the second titanium basket 142 and communicate with the inside of the first titanium basket 141 and the second titanium basket 142, and the diameter of each fastening hole is smaller than the diameter of the copper ball, so that the copper ball 400 is dissolved in the plating solution in the plating tank 11 through the hole by the electrolyzed copper ions, and the copper ball 400 can be prevented from falling from the fastening hole.
As can be seen from the above description, the first titanium basket 141 and the second titanium basket 142 are electrically connected, and specifically, the way in which the first titanium basket 141 and the second titanium basket 142 are electrically connected includes a plurality of ways, which will be exemplified in two ways.
In an alternative embodiment, the first titanium basket part 141 and the second titanium basket part 142 are electrically connected through a conductive member or the bottom parts of the first titanium basket part 141 and the second titanium basket part 142 are directly connected to realize electrical connection, and the bottom parts of the first titanium basket part 141 and the second titanium basket part 142 are directly connected to realize electrical connection, so that no additional connecting member is required to be provided, and the structure of the titanium basket 14 is simpler. When the first titanium basket part 141 and the second titanium basket part 142 are electrically connected through the conductive member, the first titanium basket part 141 and the second titanium basket part 142 may be disposed at an interval, and the first titanium basket part 141 and the second titanium basket part 142 may be disposed at more flexible positions, so that the shape of the first titanium basket part 141 and the second titanium basket part 142 in the plating bath 11 may be matched with the shape of the conductive base film 300 in the plating bath 11, thereby improving the plating efficiency.
In another alternative embodiment, the titanium basket 14 further includes a third titanium basket portion 143, the third titanium basket portion 143 is connected between the first titanium basket portion 141 and the second titanium basket portion 142 and electrically connected to the first titanium basket portion 141 and the second titanium basket portion 142, and the third titanium basket portion 143 may also be used to contain the plating component. By providing the third titanium basket 143, not only the first titanium basket 141 and the second titanium basket 142 can be electrically connected, but also the third titanium basket 143 can be used for accommodating plating parts, so that the plating efficiency can be improved.
In order to facilitate the processing and manufacturing of the titanium basket 14, optionally, the first titanium basket portion 141, the second titanium basket portion 142 and the third titanium basket portion 143 may be integrally formed, so that the processing and manufacturing of the titanium basket 14 are simpler and more convenient, and in addition, when performing the electroplating operation, only the titanium basket 14 formed by the first titanium basket portion 141, the second titanium basket portion 142 and the third titanium basket portion 143 needs to be integrally placed in the electroplating bath 11, that is, the groove entering section 31 of the conductive base film 300 and the groove exiting section 32 of the conductive base film 300 can both correspond to the titanium basket 14, so that the operation efficiency of the electroplating bath 11 can be improved, and the titanium baskets 14 corresponding to the groove entering section 31 and the groove exiting section 32 do not need to be placed respectively.
During electroplating, the surface shape of the titanium basket 14 is matched with the surface shape of the conductive base film 300, so that the utilization rate of copper ions generated by copper balls in the titanium basket 14 can be greatly improved, and the electroplating efficiency can be improved, therefore, in some embodiments, the cross-sectional shape of the third titanium basket part 143, which is cut along a plane perpendicular to the opening 144, is any one of a V shape, a U shape and an arc shape, so that the surface shape of the conductive base film 300 in the electroplating bath 11 can be better matched, and the electroplating effect can be improved. Illustratively, the cross-sectional shape of the third titanium basket portion 143 is an arc, so that the distance between the third titanium basket portion 143 and the conductive base film 300 close to the third titanium basket portion 143 is substantially the same, which is beneficial to improving the plating uniformity and the plating efficiency of the conductive base film.
In some embodiments, the first titanium basket 141 and the second titanium basket 142 are disposed in parallel, or the first titanium basket 141 and the second titanium basket 142 have an included angle therebetween. When the first titanium basket 141 and the second titanium basket 142 are parallel to each other and the first titanium basket 141 and the second titanium basket 142 are applied to a plating apparatus, the first titanium basket 141 and the second titanium basket 142 occupy a smaller space in the length direction of the plating bath, thereby being advantageous to reducing the length of the plating bath. When the first titanium basket part 141 and the second titanium basket part 142 have an included angle, when the first titanium basket part 141 and the second titanium basket part 142 are placed in the plating tank, the area of the titanium basket 14 immersed in the plating solution in the plating tank is larger, so that the utilization rate of the titanium basket 14 is improved, and the plating efficiency is improved.
Alternatively, when there is an included angle between the first and second titanium baskets 141 and 142, the included angle is φ, 0 ° < φ ≦ 120 °, illustratively, φ is 30 °, 40 °, 50 °, 60 °, 70 °, 80 °, 90 °, 100 °, 110 °, 120 °. Thus, when the first titanium basket 141 and the second titanium basket 142 are placed in the plating bath, the inclination angles of the first titanium basket 141 and the second titanium basket 142 relative to the bottom surface of the plating bath 11 and the groove entering section 31 and the groove exiting section 32 of the conductive base film 300 are more matched, so that the utilization rate of copper ions generated by copper balls in the titanium basket 14 can be improved, and the plating efficiency is improved. In addition, since the ranges of the inclination angles of the first titanium basket 141 and the second titanium basket 142 in the plating tank 11 are reasonable, the first titanium basket 141 and the second titanium basket 142 do not occupy a large space in the length direction of the plating tank 11 due to an excessively large inclination angle, and the titanium basket 14 is easier to maintain. When the included angle between the first titanium basket portion 141 and the second titanium basket portion 142 is greater than 120 °, the distance between the top ends of the first titanium basket portion 141 and the second titanium basket portion 142 is greater, i.e., when the first titanium basket portion 141 and the second titanium basket portion 142 are applied to the plating bath, the length of the first titanium basket portion 141 and the second titanium basket portion 142 along the length direction of the plating bath 11 is longer, and thus the space occupied by the plating bath 11 is larger.
In some embodiments, the first titanium basket 141 has a first end 1a and a second end 1b opposite to each other, the second end 1b is used for connecting with the second titanium basket 142, the vertical distance between the second end 1b and the first end 1a is H1, 200mm ≦ H ≦ 1500mm, illustratively, H1 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500mm, or the second titanium basket 142 has a third end 1c and a fourth end 1d opposite to each other, the fourth end 1d is used for connecting with the first titanium basket 141, the vertical distance between the fourth end 1d and the third end 1c is H2,200mm ≦ H2 ≦ 1500mm, illustratively, H2 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500mm, and the opening 144 is disposed on the end surface of the first end and/or the second end. By limiting the vertical height of the first titanium basket 141 and the second titanium basket 142 to be 200 mm-1500 mm, it can be ensured that the first titanium basket 141 and the second titanium basket 142 have sufficient size and thus have a large volume to contain more copper balls, so as to provide sufficient copper ions, thereby ensuring the electroplating efficiency. On the other hand, when the first titanium basket 141 and the second titanium basket 142 are applied to the plating tank, the plating tank with a deep depth may be used because the height of the plating tank 11 is too high, which may make the plating tank difficult to maintain. When the vertical height of the first titanium basket part 141 and the second titanium basket part 142 is less than 200mm, the first titanium basket part 141 and the second titanium basket part 142 are smaller in size, and the volume of the titanium basket 14 is smaller, so that the copper balls 400 can be accommodated in the titanium basket part, and therefore, less copper ions can be supplied, and the electroplating efficiency is lower. When the titanium basket 14 is powered on, the first end 1a of the first titanium basket 141 or the third end 1c of the second titanium basket 142 is generally powered on, that is, the top of the first titanium basket 141 or the second titanium basket 142 is electrically connected to the positive electrode of the power supply, and then, when the vertical height of the first titanium basket 141 and the second titanium basket 142 is greater than 1500mm, the second end 1b of the first titanium basket 141 is farther from the first end 1a, and the fourth end 1d of the second titanium basket 142 is farther from the third end 1c, so that the current density at the second end 1b and the fourth end 1d is smaller, the plating efficiency at the positions of the second end 1b and the fourth end 1d is lower, and the utilization rate of the first titanium basket 141 and the second titanium basket 142 is smaller.
In some embodiments, the first titanium basket 141 has first and second opposing sides in a direction perpendicular to the opening 144, the first titanium basket has a length L1 in the direction of the first side to the second side of 500mm L1 3000mm, illustratively L1 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000mm, or the second titanium basket has third and fourth opposing sides, the second titanium basket has a length L2 in the direction of the third side to the fourth side of 500mm L2 mm 3000mm, illustratively L2 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000 mm. In this way, the lengths of the first titanium basket 141 and the second titanium basket 142 can be limited, so as to ensure that the first titanium basket 141 and the second titanium basket 142 have sufficient areas to ensure the electroplating efficiency, and the condition that the current density distribution is not uniform due to the longer lengths of the first titanium basket 141 and the second titanium basket 142 can also be avoided. When the lengths of the first and second titanium baskets 141 and 142 are less than 500mm, the length of the titanium basket 14 is small and the area of the titanium basket 14 is small, resulting in low plating efficiency. When the lengths of the first titanium basket 141 and the second titanium basket 142 are greater than 3000mm, the current density distribution of the first titanium basket 141 and the second titanium basket 142 is not uniform, which may result in poor plating uniformity.
In some embodiments, the end of the titanium basket 14 is further provided with a fixing portion 145, and the fixing portion 145 is used for fixing with the plating tank. Specifically, the fixing portion 145 can be disposed on the first titanium basket 141 and/or the second titanium basket 142. Alternatively, the fixing portion 145 may be a protrusion protruding along the length direction of the titanium basket 14, and when the titanium basket 14 is mounted in the plating tank, the protrusion may be hung on the wall of the plating tank, so that the titanium basket is fixed in the plating tank.
In the titanium basket of the first aspect of the present invention, since the titanium basket 14 includes the first titanium basket portion 141 and the second titanium basket portion 142 connected to the first titanium basket portion 141, electroplating can be performed on the groove entering section 31 and the groove exiting section 32 of the conductive base film 300 by using one titanium basket 14, and during the electroplating operation, the number of titanium baskets to be placed is small, thereby facilitating the electroplating operation.
Referring to fig. 2 to 4, a second aspect of the present invention discloses an electroplating apparatus 100, which includes an electroplating tank 11 and a titanium basket 14, wherein the titanium basket 14 is the titanium basket 14 described in the first aspect, and the titanium basket 14 is disposed in the electroplating tank 11.
Referring to FIGS. 2, 4 and 5, optionally, when the titanium basket is installed in the plating vessel 11, the first titanium basket portion 141 can be inclined at an angle φ 1, 30 ≦ φ 1 ≦ 90, and illustratively, φ 1 can be 30, 40, 50, 60, 70, 80, or 90. Alternatively, the inclination angle of the second titanium basket 142 with respect to the bottom surface of the plating bath 11 is Φ 2, 30 ° - Φ 2 ≤ 90 °, and exemplary Φ 2 is 30 °, 40 °, 50 °, 60 °, 70 °, 80 °, and 90 °. In this way, the inclination angles of the bottom surface of the first titanium basket 141 and the second titanium basket 142 relative to the plating tank 11 and the inlet section 31 and the outlet section 32 of the conductive base film 300 are more matched, so that the utilization rate of copper ions generated by the copper ball 400 in the titanium basket 14 can be improved, and the plating efficiency can be improved. In addition, since the ranges of the inclination angles of the first titanium basket 141 and the second titanium basket 142 in the plating tank 11 are reasonable, the first titanium basket 141 and the second titanium basket 142 do not cause an excessive length of the plating tank 11 due to an excessive inclination angle, and the titanium basket 14 is easier to maintain. When the inclination angles of the first titanium basket 141 and the second titanium basket 142 with respect to the bottom surface of the plating tank 11 are greater than 90 °, the matching between the inclination angles of the first titanium basket 141 and the second titanium basket 142 and the inclination angles of the groove entering section 31 and the groove exiting end of the conductive base film 300 is poor, which is not favorable for rapidly utilizing the copper ions generated by the copper balls 400 in the titanium basket 14, resulting in a situation of reduced plating efficiency. In addition, too large an inclination angle of the first titanium basket 141 and the second titanium basket 142 with respect to the bottom surface of the plating vessel 11 is also not favorable for maintenance of the titanium basket 14. When the inclination angles of the first titanium basket 141 and the second titanium basket 142 with respect to the bottom surface of the plating tank 11 are smaller than 30 °, the matching between the inclination angles of the first titanium basket 141 and the second titanium basket 142 and the inclination angles of the groove entering section 31 and the groove exiting end of the conductive base film 300 is poor, which is not favorable for rapidly utilizing the copper ions generated by the copper balls 400 in the titanium basket 14, resulting in a situation of reduced plating efficiency. In addition, when the inclination angles of the first titanium basket 141 and the second titanium basket 142 with respect to the bottom surface of the plating vessel 11 are too small, the lengths of the first titanium basket 141 and the second titanium basket 142 in the length direction x of the plating vessel 11 are long, and the space occupied by the plating vessel 11 is large.
In some embodiments, the height of the first titanium basket 141 in the depth direction y of the plating bath 11 is H1, 200mm ≦ H ≦ 1500mm, and for example, H1 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500 mm. Alternatively, the height of the second titanium basket 142 in the depth direction y of the plating bath 11 is H2,200mm ≦ H2 ≦ 1500mm, and illustratively, H2 may be 200mm, 300mm, 500mm, 800mm, 1000mm, 1200mm, 1400mm, 1500 mm. By limiting the height of the first titanium basket 141 and the second titanium basket 142 to 200mm to 1500mm in the depth direction y of the plating tank 11, it is ensured that the first titanium basket 141 and the second titanium basket 142 have a sufficient size and thus a large volume to contain more plating members 400, and sufficient copper ions are supplied, thereby ensuring the plating efficiency. On the other hand, it is possible to avoid a situation in which the plating vessel 11 needs to be used with a deeper depth due to too high heights of the first titanium basket 141 and the second titanium basket 142 in the depth direction y of the plating vessel 11, thereby making it difficult to maintain the plating vessel 11. When the height of the first titanium basket 141 and the second titanium basket 142 in the depth direction y of the plating tank 11 is less than 200mm, the first titanium basket 141 and the second titanium basket 142 are smaller in size, and the titanium basket 14 has a smaller volume, so that fewer plating parts 400 can be accommodated, fewer copper ions can be supplied, and plating efficiency is lower. When the heights of the first titanium basket 141 and the second titanium basket 142 in the depth direction y of the plating bath 11 are greater than 1500mm, since the tops of the first titanium basket 141 and the second titanium basket 142 are electrically connected to the positive electrode of the power supply, the distance between the region of the first titanium basket 141 and the second titanium basket 142 near the bottom of the plating bath 11 and the top of the titanium basket 14 is relatively long, so that the current density is relatively small, and similarly, the current density of the region of the conductive base film 300 near the bottom of the plating bath 11 is relatively small, so that when the first titanium basket 141 and the second titanium basket 142 are relatively high, the plating efficiency of the bottoms of the first titanium basket 141 and the second titanium basket 142 is relatively low, and the utilization rate of the first titanium basket 141 and the second titanium basket 142 is relatively low.
In some embodiments, the length of the first titanium basket 141 in the width direction z of the plating bath 11 is L1, 500mm ≦ L1 ≦ 3000mm, and illustratively, L1 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000 mm. Alternatively, the length of the second titanium basket 142 in the width direction z of the plating tank 11 is L2, L2 mm 3000mm is 500mm or less, and L2 may be 500mm, 800mm, 1000mm, 1500mm, 2000mm, 2500mm, 3000mm, for example. Thus, the lengths of the first titanium basket 141 and the second titanium basket 142 can be limited, the first titanium basket 141 and the second titanium basket 142 can be ensured to have sufficient areas to ensure the plating efficiency, and the condition that the current density distribution is not uniform along the width direction z of the plating tank 11 due to the large length of the first titanium basket 141 and the second titanium basket 142 can be avoided. When the length of the first titanium basket part 141 and the second titanium basket part 142 in the width direction z of the plating vessel 11 is less than 500mm, the width of the titanium basket 14 is small and the area of the titanium basket 14 is small, resulting in low plating efficiency. When the lengths of the first and second titanium basket parts 141 and 142 in the width direction z of the plating tank 11 are greater than 3000mm, the width of the titanium basket 14 is too large, resulting in non-uniform distribution of current density in the width direction z of the plating tank 11, so that the thickness of the plated copper layer in the width direction z of the conductive base film 300 is not uniform.
In order to improve the electroplating efficiency, in some embodiments, since the conductive base film 300 includes both front and back surfaces, when it is required to electroplate both surfaces of the conductive base film 300, the titanium baskets 14 may be provided in plurality, the titanium baskets 14 are provided at intervals along the depth direction y of the electroplating bath 11, and between two adjacent titanium baskets 14, the conductive base film 300 is provided to pass through, so as to electroplate both the front surface of the conductive base film 300 and the back surface of the conductive base film 300. Illustratively, the titanium baskets 14 are provided in two. Thus, two titanium baskets 14 adjacently arranged are arranged in the depth direction y of the electroplating bath 11, so that the front side of the conductive base film 300 and the back side of the conductive base film 300 can be electroplated simultaneously, and the electroplating efficiency can be improved.
It can be understood that the titanium basket 14 has a V-shaped structure, and thus, when the two titanium baskets 14 are disposed along the depth direction y of the plating bath 11, the upper titanium basket 14 is disposed in the lower titanium basket 14, so that when the conductive base film 300 passes through the gap between the two titanium baskets 14, the first titanium basket portion 141 and the second titanium basket portion 142 of the two titanium baskets 14 can respectively correspond to the groove entering section 31 and the groove exiting section 32 of the conductive base film 300.
Referring to fig. 6, in order to improve the electroplating efficiency, in some embodiments, a plurality of titanium baskets 14 may also be disposed along the length direction x of the electroplating tank 11, so that a plurality of sections of the conductive base film 300 may be electroplated simultaneously, which is beneficial to improving the electroplating efficiency.
Further, the titanium baskets 14 may be provided in multiple sets, the multiple sets of titanium baskets 14 are provided at intervals along the length direction x of the plating bath 11, each set of titanium baskets 14 includes multiple titanium baskets 14, and the multiple titanium baskets 14 in each set are provided at intervals along the depth direction y of the plating bath 11, so that the conductive base film 300 passes through the gap between two adjacent titanium baskets 14, and the front and the back of the conductive base film 300 are plated. Illustratively, four sets of titanium baskets 14 are provided along the length direction x of the plating bath 11, from the side of the conductive base film 300 entering the plating bath 11 to the side of the conductive base film 300 exiting from the plating bath 11, and the four sets of titanium baskets 14 are respectively referred to as a first titanium basket set 14a, a second titanium basket set 14b, a third titanium basket set 14b and a fourth titanium basket set 14 d. Each set of titanium baskets 14 includes two titanium baskets, referred to as a first titanium basket 14a1 and a second titanium basket 14a2, which are disposed at an interval in the depth direction y of the plating tank 11. Since the plurality of sets of titanium baskets 14 are provided along the plating tank 11, during plating, the conductive base film 300 enters the plating tank 11 from the in-tank roll 12 and passes between the first titanium basket 14a1 and the second titanium basket 14a2 of the first titanium basket group 14a, passes through the first titanium basket 14a1 and the second titanium basket 14a2 of the second titanium basket group 14b, the first titanium basket 14a1 and the second titanium basket 14a2 of the third titanium basket group 14b, and the first titanium basket 14a1 and the second titanium basket 14a2 of the fourth titanium basket group 14d in sequence, and is finally output from the out-tank roll 13 located at the end of the plating tank 11. Thus, the electroplating effect and the electroplating efficiency can be effectively improved.
Optionally, the electroplating apparatus 100 further comprises a submerged roller 15, the submerged roller 15 is disposed in the electroplating bath 11 and located between the two titanium baskets 14, and the submerged roller 15 is used for transporting the conductive base film 300 in the gap between the two adjacent titanium baskets 14. In this way, the conductive base film 300 is transported by providing the submerged roller 15, so that the transportation of the conductive base film 300 can be made smoother.
In some embodiments, the electroplating apparatus 100 further includes a plurality of support plates 17, the plurality of support plates 17 are disposed in the electroplating bath 11 and are spaced apart from each other along a length direction x of the electroplating bath 11, the plurality of support plates 17 divide the electroplating bath 11 into a plurality of electroplating spaces arranged and communicated along the length direction x of the electroplating bath 11, the groove-entering roller 12 is disposed at an end of one end of the electroplating bath 11, the groove-exiting rollers 13 and the titanium baskets 14 are both disposed in plurality, and the plurality of titanium baskets 14 and the plurality of groove-exiting rollers 13 are disposed in the plurality of electroplating spaces, respectively. Divide plating bath 11 into a plurality of electroplating spaces through setting up backup pad 17 to all set up out groove roller 13 in a plurality of electroplating spaces, thereby make electrically conductive base film 300 loop through a plurality of electroplating spaces and electroplate in a plurality of electroplating spaces, be favorable to improving the smooth and easy nature of electrically conductive base film 300 transportation, improve electroplating effect and electroplating efficiency.
Further, the support plate 17 is provided with the through hole 171, and the through hole 171 is used for communicating the plurality of plating spaces, so that the plating liquids in the plurality of plating spaces can circulate each other, thereby better improving the fluidity of the plating liquids, uniformly dispersing a plurality of components in the plating liquids, improving the uniformity of plating, and sufficiently utilizing the plating liquids. In addition, the structure of the support plate 17 is simple.
As can be seen from the above, connecting both the grooving roller 12 and the grooving roller 13 to the negative electrode of the power supply will cause both the grooving roller 12 and the grooving roller 13 to be greatly influenced by the current carrying capacity of the conductive base film 300, so that only a small current can be applied, resulting in a low plating efficiency. Based on this, in some embodiments, the electroplating apparatus 100 further includes a groove entering roller 12 and a groove exiting roller 1, the groove entering roller 12 is disposed in the electroplating bath 11, the groove entering roller 12 is used for conveying the conductive base film 300 into the electroplating bath 11, the groove entering roller 12 is not powered, the groove exiting roller 13 is disposed in the electroplating bath 11 and spaced apart from the groove entering roller 12, the groove exiting roller 13 is used for conveying the conductive base film 300 from the electroplating bath 11 to the outside of the electroplating bath 11, and the groove exiting roller 13 is used for electrically connecting with a power supply negative electrode to apply current to the conductive base film 300. In using the plating apparatus 100, the conductive base film 300 is transferred from the in-groove roll 12 to the plating tank 11 while copper ions are supplied from the copper balls 400 contained in the titanium basket 14, so that the conductive base film 300 is plated in the plating tank 11. The conductive base film 300 is transported out of the electroplating tank 11 by the discharging roller 13, and the discharging roller 13 is used for electrifying the conductive base film 300, so that the electroplating of the conductive base film 300 is realized. Since the groove outlet roller 13 is closer to the groove outlet section 32 of the conductive base film 300 and farther from the groove inlet section 31 of the conductive base film 300, the current density applied to the groove outlet section 32 of the conductive base film 300 by the groove outlet roller 13 is higher, and the current density applied to the groove inlet section 31 of the conductive base film 300 by the groove outlet roller 13 is lower. Therefore, only connect the power to the grooving roller 13, apply the great electric current to the grooving roller 13 and also difficult to lead to the situation that the current density overloads to the grooving section 31 of the conductive base film 300, like this, the grooving roller 13 can be connected in the power negative pole of the great electric current, thus make the grooving roller 13 provide bigger electric current to the grooving section 32 of the conductive base film 300 in order to improve the electroplating efficiency, can guarantee again simultaneously that the grooving section 31 of the conductive base film 300 can not be overloaded, and guarantee electroplating yield and security.
Since the groove inlet roll 12 is not powered, and only the groove outlet roll 13 is electrically connected to the negative electrode of the power supply, the current density of the groove inlet section 31 of the conductive base film 300 is relatively low, and the current density of the groove outlet section 32 of the conductive base film 300 is relatively high, in order to improve the plating efficiency and the plating stability, in some embodiments, the first titanium basket portion 141 and the second titanium basket portion 142 are respectively provided with the electrical connection terminal 16, so that the current of the electrical connection terminal 16 arranged on the first titanium basket portion 141 is lower than the current of the electrical connection terminal 16 arranged on the second titanium basket portion 142, and the current density of the first titanium basket portion 141 is lower than the current density of the second titanium basket portion 142, so as to correspond to the relatively low current density of the groove inlet section 31 and the relatively high current density of the groove outlet section 32, and improve the plating efficiency and the plating stability.
In other embodiments, the electrical terminal 16 is disposed only on the second titanium basket portion 142, so that, since the second titanium basket portion 142 is closer to the electrical terminal 16, the first titanium basket portion 141 is farther from the electrical terminal 16 than the second titanium basket portion 142, and therefore, the current density of the second titanium basket portion 142 is higher, and the current density of the first titanium basket portion 141 is lower, so that the current density of the groove entering section 31 can be respectively matched with the current density of the groove exiting section 32, thereby improving the plating efficiency and the plating stability.
Alternatively, the plurality of electrical terminals 16 may be provided, and the plurality of electrical terminals 16 are spaced apart along the length of the second titanium basket 142. By providing a plurality of electrical terminals 16, the distribution uniformity of the current density in the length direction of the second titanium basket 142 and the first titanium basket 141 is improved, and the electroplating uniformity in the width direction of the conductive base film 300 is improved. Illustratively, two electrical terminals 16 are provided, and the two electrical terminals 16 are respectively provided at both ends of the second titanium basket 142 in the length direction.
In some embodiments, the number of the grooving rollers 13 is at least two, the two grooving rollers 13 are respectively used for applying current to the front side and the back side of the conductive base film 300, and the at least two grooving rollers 13 are provided, so that the conductive base film 300 and the front side and the back side can be electroplated. Since the grooved roll 12 is not electrically connected, only one grooved roll 12 needs to be provided, and the cost of the plating apparatus 100 can be reduced.
Since the plating apparatus further includes the mother liquid tank, the plating liquid in the mother liquid tank and the plating tank 11 is circulated when the plating is performed, thereby increasing the fluidity of the plating liquid to improve the plating effect. Thus, in some embodiments, the lower end of the plating vessel 11 is provided with an overflow pipe 18, the overflow pipe 18 being adapted to communicate with and be located within the mother liquor tank. In this way, the mother liquid tank may be disposed below the plating tank 11 so that the overflow pipe 18 is easily introduced into the mother liquid tank, thereby exchanging the plating liquid in the plating tank 11 with the plating liquid in the mother liquid tank, and since the overflow pipe 18 is located in the mother liquid tank, it is less likely to cause the plating liquid in the plating tank 11 to leak out of the plating tank 11 and the mother liquid tank than when the overflow pipe 18 is introduced into the mother liquid tank from the side of the plating tank 11.
Further, the overflow pipe 18 is integrally formed with the plating tank 11, so that the overflow pipe 18 can be easily processed and is not prone to leakage.
In the electroplating apparatus according to the second aspect of the present invention, since the first titanium basket 141 and the second titanium basket 142 are connected, electroplating can be performed on the groove entering section 31 and the groove exiting section 32 of the conductive base film 300 by using one titanium basket 14, and the number of titanium baskets to be placed is small during electroplating, thereby facilitating the electroplating operation. In addition, since the grooving roller 12 is not electrified and only the grooving roller 13 is electrified, the current of the grooving roller 13 can be increased, the current density of the grooving section 32 of the conductive base film 300 can be increased, and the electroplating efficiency can be improved.
Referring to fig. 7, a plating apparatus 200 according to a third aspect of the present invention includes a mother liquid tank 22 and a plating device 100, wherein the plating device 100 is the plating device 100 according to the second aspect, the plating device 100 is disposed on the mother liquid tank 22, and the mother liquid tank 22 is used for supplying liquid to the plating tank 11. It can be understood that the electroplating apparatus having the electroplating apparatus 100 described above also has all the technical effects of the electroplating apparatus 100 described above. That is, since the first titanium basket 141 and the second titanium basket 142 are connected, electroplating of the groove entering section 31 and the groove exiting section 32 of the conductive base film 300 can be achieved by using one titanium basket 14, and the number of titanium baskets to be placed is small during electroplating operation, thereby facilitating the electroplating operation. In addition, since the grooving roller 12 is not electrified and only the grooving roller 13 is electrified, the current of the grooving roller 13 can be increased, the current density of the grooving section 32 of the conductive base film 300 can be increased, and the electroplating efficiency can be improved. Since the above technical effects have been described in detail in the embodiment of the electroplating apparatus 100, they will not be described herein again.
The titanium basket, the electroplating device and the electroplating equipment disclosed by the embodiment of the utility model are described in detail, the principle and the implementation mode of the utility model are explained by applying specific examples, and the description of the embodiment is only used for helping to understand the titanium basket, the electroplating device and the electroplating equipment and the core ideas thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (17)

1. The utility model provides a titanium basket, its characterized in that, titanium basket is applied to electroplating device for electroplate the electrically conductive base film in letting in the plating bath of electroplating device, electrically conductive base film is including going into the groove section and going out the groove section, titanium basket includes:
the first titanium basket part is used for corresponding to the groove entering section so as to electroplate the groove entering section; and
the second titanium basket part is connected to the first titanium basket part and electrically connected with the first titanium basket part, an opening is formed in the second titanium basket part and/or the first titanium basket part and used for putting an electroplating component, and the second titanium basket part is used for corresponding to the groove outlet section to electroplate the groove outlet section.
2. The titanium basket according to claim 1, further comprising a third titanium basket portion, wherein said second titanium basket portion is connected to said first titanium basket portion through said third titanium basket portion, and wherein said third titanium basket portion is located between said second titanium basket portion and said first titanium basket portion, and wherein said third titanium basket portion is electrically connected to said first titanium basket portion and said second titanium basket portion, and wherein said third titanium basket portion is adapted to contain said plating component.
3. The titanium basket of claim 2, wherein said first titanium basket portion, said second titanium basket portion, and said third titanium basket portion are integrally formed.
4. The titanium basket according to claim 2, wherein a cross-sectional shape of the third titanium basket portion taken along a plane perpendicular to the opening is any one of a V-shape, a U-shape, and a circular arc shape.
5. The titanium basket according to any one of claims 1 to 4, wherein said first titanium basket portion is disposed parallel to said second titanium basket portion or wherein said first titanium basket portion is angled relative to said second titanium basket portion.
6. The titanium basket according to claim 5, wherein when said first titanium basket portion and said second titanium basket portion have an included angle therebetween, said included angle therebetween is φ, 0 ° < φ ≦ 120 °.
7. The titanium basket according to claim 5, wherein said first titanium basket portion has opposite first and second ends, said second end for connection to said second titanium basket portion, said second end being spaced a vertical distance H1, 200mm H1 mm 1500 mm; or,
the second titanium basket part is provided with a third end and a fourth end which are opposite, the fourth end is used for being connected with the first titanium basket part, the vertical distance between the fourth end and the third end is H2, and H2 is more than or equal to 200mm and less than or equal to 1500 mm;
the opening is arranged on the end surface of the first end and/or the second end.
8. The titanium basket of claim 5, wherein said first titanium basket portion has opposing first and second sides, said first titanium basket portion having a length in a direction from said first side to said second side of L1, 500mm L1 mm 3000 mm; or,
the second titanium basket part is provided with a third side and a fourth side which are opposite, the length of the second titanium basket part along the direction from the third side to the fourth side is L2, and L2 is more than or equal to 500mm and less than or equal to 3000 mm;
the opening extends in a direction from the first side to the second side, or the opening extends in a direction from the third side to the fourth side.
9. An electroplating apparatus, comprising:
an electroplating bath; and
the titanium basket as claimed in any one of claims 1 to 8, wherein the titanium basket is disposed in the plating bath.
10. The plating apparatus as recited in claim 9, wherein the titanium basket is provided in plurality, and the plurality of titanium baskets are provided at intervals along a length direction of the plating tank.
11. The electroplating device according to claim 9, wherein a plurality of the titanium baskets are provided, the plurality of the titanium baskets are provided at intervals along a depth direction of the electroplating bath, and the conductive base film passes between two adjacent titanium baskets to electroplate the front surface of the conductive base film and the back surface of the conductive base film.
12. The plating apparatus as recited in claim 11, further comprising a submerged roller disposed in said plating tank and between two adjacent ones of said titanium baskets, said submerged roller being configured to transport said electrically conductive base film between said two adjacent ones of said titanium baskets.
13. The electroplating device according to claim 9, wherein the first titanium basket part is obliquely arranged relative to the bottom surface of the electroplating bath, and the included angle between the first titanium basket part and the bottom surface of the electroplating bath is phi 1, and phi 1 is more than or equal to 30 degrees and less than or equal to 90 degrees; or,
the second titanium basket part is obliquely arranged relative to the bottom surface of the electroplating bath, and the included angle between the second titanium basket part and the bottom surface of the electroplating bath is phi 2, wherein phi 2 is more than or equal to 30 degrees and less than or equal to 90 degrees.
14. The plating apparatus as recited in claim 9, wherein a height of the first titanium basket in a depth direction of the plating tank is H1, 200mm ≦ H1 ≦ 1500 mm; or,
the height of the second titanium basket part along the depth direction of the electroplating bath is H2, and H2 is more than or equal to 200mm and less than or equal to 1500 mm.
15. The plating apparatus as recited in claim 9, wherein a length of the first titanium basket in a width direction of the plating tank is L1, 500mm ≦ L1 ≦ 3000 mm; or,
the length of the second titanium basket part along the width direction of the plating bath is L2, and L2 is more than or equal to 500mm and less than or equal to 3000 mm.
16. The plating apparatus as recited in claim 9, wherein an overflow pipe is provided at a lower end of the plating vessel, the overflow pipe being adapted to communicate with and be located within the mother liquor tank.
17. An electroplating apparatus, comprising:
a mother liquor tank; and
the electroplating device according to any one of claims 9 to 16, wherein the electroplating tank of the electroplating device is arranged on a mother liquid tank, and the mother liquid tank is used for supplying liquid to the electroplating tank.
CN202123215317.1U 2021-12-20 2021-12-20 Titanium basket, electroplating device and electroplating equipment Active CN216998653U (en)

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Application Number Priority Date Filing Date Title
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Patentee after: Xiamen Haichen Energy Storage Technology Co.,Ltd.

Address before: 361100 201-1, complex building 5, No. 11, Butang Middle Road, torch high tech Zone (Tongxiang) industrial base, Xiamen, Fujian Province

Patentee before: Xiamen Haichen New Energy Technology Co.,Ltd.