CN213538147U - Electroplating device for printed circuit board - Google Patents
Electroplating device for printed circuit board Download PDFInfo
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- CN213538147U CN213538147U CN202021494126.6U CN202021494126U CN213538147U CN 213538147 U CN213538147 U CN 213538147U CN 202021494126 U CN202021494126 U CN 202021494126U CN 213538147 U CN213538147 U CN 213538147U
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Abstract
The utility model relates to a printed circuit board's electroplating device, including electroplating bath and circulation subassembly, the electroplating bath has relative first pool wall and the second pool wall that sets up, can span between first pool wall and the second pool wall and treat the electroplate and can with first compartment and second compartment are separated into to the electroplating bath, first entry and first export have been seted up on the first pool wall of first compartment and the second pool wall respectively, second entry and second export have been seted up on the first pool wall of second compartment and the second pool wall respectively, first entry and first export with circulation subassembly connection forms first circulation return circuit, second entry and second export with circulation subassembly connection forms second circulation return circuit. The electroplating liquid is ensured to flow in the hole at a constant speed, and the copper plating in the hole is ensured to be even when the aperture of the thicker circuit board is small.
Description
Technical Field
The utility model relates to a printed circuit board electroplating technology especially relates to a printed circuit board's electroplating device.
Background
In the traditional electroplating line, a swing and vibration system and a stirring system are adopted to stir electroplating solution, so that the exchange of the electroplating solution in holes is promoted. The swing system can reduce the concentrated distribution of the cathode on the plate edge when the cathode is static, and reduce the edge effect; the vibration system is mainly used for removing bubbles on the board surface and in the holes, and is helpful for the infiltration and exchange of the solution on the board surface, so that the exchange degree of the solution in the holes can be improved; the stirring system comprises a side spraying mode or a bottom spraying mode, the side spraying mode directly sprays the plating solution to the board surface to realize the stirring of the solution, and the bottom surface spraying mode causes the liquid to flow upwards, so that pressure difference is generated for the liquid flow in the holes of the PCB board, and the exchange of the plating solution in the holes is promoted. The methods can realize uniform electroplating on the circuit board with larger aperture, but when the thickness of the circuit board is thicker and the aperture is smaller, the electroplating solution can not be ensured to flow in the whole hole, so that the copper thickness in the hole of the circuit board is uneven, even copper is not plated in part of the hole, and the copper thickness in the hole can not meet the specified requirement; even if some methods for generating differential pressure or flow rate difference on two sides of a hole of a PCB are used for electroplating, the condition of uneven electroplating still exists, and the electroplating requirement of a board with a high thickness-diameter ratio cannot be met.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a plating apparatus for a printed circuit board that can achieve uniform plating of a high aspect ratio board.
The technical scheme is as follows:
the utility model provides a printed circuit board's electroplating device, includes electroplating bath and circulation subassembly, the electroplating bath has relative first pool wall and the second pool wall that sets up, can span between first pool wall and the second pool wall and wait to electroplate the board just wait to electroplate the board can with the electroplating bath is separated into first compartment and second compartment, first entry and first export have been seted up respectively on the first pool wall of first compartment and the second pool wall, second entry and second export have been seted up respectively on the first pool wall of second compartment and the second pool wall, first entry and first export with circulation subassembly is connected and is formed first circulation return circuit, second entry and second export with circulation subassembly is connected and is formed second circulation return circuit.
When the electroplating device of the printed circuit board is used, the electroplating pool is divided into a first compartment and a second compartment by spanning the board to be electroplated between the first pool wall and the second pool wall, so that the electroplating solution in the electroplating pool is divided into two parts which are relatively independent, the circulating component drives the electroplating solution in the first compartment to flow out from the first outlet and flow in from the first inlet to form a circulating flow, the electroplating solution in the second compartment cannot flow with the electroplating solution in the first compartment due to being separated by the board to be electroplated, the pressure of the first compartment is lower than that of the second compartment according to Bernoulli's formula and energy conservation law, so that the pressure of the first compartment is lower than that of the second compartment, the pressure difference causes the electroplating solution in the second compartment to flow to the first compartment through the hole of the board to be electroplated to realize the hole electroplating of the board to be electroplated, and the driving of the electroplating solution in the first compartment is stopped after a preset time, the electroplating solution in the second compartment is driven by the circulating assembly to flow out from the second outlet and flow in from the second inlet to form circulating flow, the pressure difference causes the electroplating solution in the first compartment to flow to the second compartment through the hole of the plate to be electroplated, the electroplating in the hole of the plate to be electroplated is reversely realized, the preset times are sequentially alternated, the electroplating solution in the first compartment and the electroplating solution in the second compartment are alternately electroplated in the hole of the plate to be electroplated, the electroplating thickness in the hole is balanced, the electroplating is more uniform, and the electroplating solution can alternately flow due to the arrangement of the independent first circulating loop and the independent second circulating loop, the concentrations of the electroplating solutions in the first compartment and the second compartment are timely updated, the difference is small, the consumption is more uniform, and the thickness of the electroplating layer is more uniform. Through this electroplating device of printed circuit board, control the plating solution velocity of flow, form the pressure differential, guarantee that the plating solution is at the uniform velocity flow downthehole, when the aperture of thicker circuit board is very little, also can guarantee that downthehole copper facing is even.
In one embodiment, the circulation assembly includes a first liquid inlet pipe, a first liquid outlet pipe, a first circulation pump, a second liquid inlet pipe, a second liquid outlet pipe, and a second circulation pump, one end of the first liquid inlet pipe is connected to the first inlet, the other end of the first liquid inlet pipe is connected to one end of the first circulation pump, one end of the first liquid outlet pipe is connected to the first outlet, the other end of the first liquid outlet pipe is connected to the other end of the first circulation pump, one end of the second liquid inlet pipe is connected to the second inlet, the other end of the second liquid inlet pipe is connected to one end of the second circulation pump, one end of the second liquid outlet pipe is connected to the second outlet, and the other end of the second liquid outlet pipe is connected to the other end of the second circulation pump.
In one embodiment, the circulation assembly includes a main conveying pipe, a first liquid inlet pipe, a first liquid outlet pipe, a second liquid inlet pipe, a second liquid outlet pipe and a circulation pump body, the circulation pump body is disposed on the main conveying pipe, one end of the first liquid inlet pipe is connected to the first inlet, one end of the second liquid outlet pipe is connected to the second outlet, the other end of the first liquid inlet pipe and the other end of the second liquid outlet pipe are connected to one end of the main conveying pipe in parallel, one end of the first liquid outlet pipe is connected to the first outlet, one end of the second liquid inlet pipe is connected to the second inlet, and the other end of the first liquid outlet pipe and the other end of the second liquid inlet pipe are connected to the other end of the main conveying pipe in parallel.
In one embodiment, a first switch is arranged on the first liquid inlet pipe, and a second switch is arranged on the second liquid inlet pipe; a third switch is arranged on the second liquid outlet pipe, and a fourth switch is arranged on the first liquid outlet pipe;
and/or, the one end that main conveyer pipe is close to first income liquid pipe is equipped with the fifth switch, the one end that main conveyer pipe is close to first drain pipe is equipped with the sixth switch.
In one embodiment, the first inlet and the second outlet extend along the height direction of the first pool wall, and the length of the first inlet and the second outlet is not shorter than the height of the plate to be electroplated; the second inlet and the first outlet extend along the height direction of the second pool wall, and the lengths of the second inlet and the first outlet are not shorter than the height of the plate to be electroplated.
In one embodiment, the first inlet and the second outlet penetrate through the first tank wall from top to bottom; and the second inlet and the first outlet penetrate through the second pool wall from top to bottom.
In one embodiment, the centerline of the first inlet coincides with the centerline of the first outlet; a centerline of the second inlet coincides with a centerline of the second outlet.
In one embodiment, the distance between the center line of the first inlet and the plate to be plated is L1, the distance between the center line of the second inlet and the plate to be plated is L2, and L2 is L1.
In one embodiment, the first inlet is provided with a first nozzle and the second inlet is provided with a second nozzle;
and/or the first outlet and the second outlet are both in a horn shape, and the first outlet and the second outlet are gradually reduced along the flowing-out direction of the electroplating solution.
In one embodiment, the first tank wall is provided with a first clamping piece for clamping one side edge of the plate to be electroplated, and the second tank wall is provided with a second clamping piece for clamping the other side edge of the plate to be electroplated;
the first clamping piece is a first clamping groove arranged on the first pool wall, and the second clamping piece is a second clamping groove arranged on the second pool wall; or, be equipped with length and centre gripping width adjustable first centre gripping groove on the first holder, be equipped with length and centre gripping width adjustable second centre gripping groove on the second holder.
In one embodiment, the electroplating device of the printed circuit board further comprises metal anodes arranged at two sides of the board to be electroplated, the metal anodes are connected with a positive pole of a power supply, and the board to be electroplated is connected with a negative pole of the power supply; the plate to be electroplated is arranged in the middle of the electroplating pool, and the volumes of the first compartment and the second compartment are the same.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Furthermore, the drawings are not to scale of 1:1, and the relative dimensions of the various elements in the drawings are drawn only by way of example and not necessarily to true scale. In the drawings:
FIG. 1 is a schematic view of an electroplating apparatus for a printed circuit board according to an embodiment;
FIG. 2 is a schematic view of a plating apparatus for a printed circuit board according to another embodiment;
FIG. 3 is a schematic diagram illustrating the electrochemical reaction performed by the electroplating apparatus according to an embodiment of the present invention.
Description of reference numerals:
1. a plating tank 11, a first tank wall; 12. a second tank wall; 13. a first compartment; 31. a first inlet; 311. a first liquid inlet pipe; 42. a first outlet; 421. a first liquid outlet pipe; 14. a second compartment; 32. a second inlet; 321. a second liquid inlet pipe; 41. a second outlet; 411. a second liquid outlet pipe; 21. a first clamping member; 22. a second clamping member; 51. a first switch; 52. a second switch; 53. a third switch; 54. a fourth switch; 55. a fifth switch; 56. a sixth switch; 61. a circulating pump body; 62. a first circulation pump; 63. a second circulation pump; 621. a main conveying pipe 100 and a plate to be electroplated; 200. a metal anode; 300. a power source.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
Referring to fig. 1 and 2, an embodiment of the present application provides a plating apparatus for a printed circuit board, including a plating bath 1 and a circulation assembly, where the plating bath 1 has a first bath wall 11 and a second bath wall 12 that are disposed opposite to each other, the first bath wall 11 and the second bath wall 12 can cross over a board 100 to be plated, and the board to be plated can divide the plating bath 1 into a first compartment 13 and a second compartment 14, the first bath wall 11 and the second bath wall 12 of the first compartment 13 are respectively provided with a first inlet 31 and a first outlet 42, the first bath wall 11 and the second bath wall 12 of the second compartment 14 are respectively provided with a second inlet 32 and a second outlet 41, the first inlet 31 and the first outlet 42 are connected to the circulation assembly to form a first circulation loop, and the second inlet 32 and the second outlet 41 are connected to the circulation assembly to form a second circulation loop.
When in use, the plating pool 1 is divided into a first compartment 13 and a second compartment 14 by spanning the plate to be plated 100 between the first pool wall 11 and the second pool wall 12, so that the plating solution in the plating pool 1 is divided into two parts which are relatively independent, the circulating component drives the plating solution in the first compartment 13 to flow out from the first outlet 42 and flow into the first inlet 31 to form a circulating flow, while the plating solution in the second compartment 14 cannot flow with the plating solution in the first compartment 13 due to being separated by the plate to be plated 100, the pressure in the first compartment 13 is lower than that in the second compartment 14 according to Bernoulli's equation and energy conservation law, so that the pressure in the first compartment 13 is lower than that in the second compartment 14, the pressure difference causes the plating solution in the second compartment 14 to flow to the first compartment 13 through the hole of the plate to be plated 100, so as to realize the hole plating of the plate to be plated 100, and the driving of the plating solution in the first compartment 13 is stopped after a predetermined time, then the electroplating solution in the second compartment 14 is driven by the circulating component to flow out from the second outlet 41 and flow in from the second inlet 32 to form a circulating flow, the pressure difference causes the electroplating solution in the first compartment 13 to flow to the second compartment 14 through the hole of the plate 100 to be electroplated, the electroplating solution in the plate 100 to be electroplated is reversely plated, the electroplating solution in the first compartment 13 and the electroplating solution in the second compartment 14 are alternately plated for a predetermined number of times in sequence, the electroplating thickness in the hole is balanced, the electroplating is more uniform, and due to the arrangement of the independent first circulating loop and the independent second circulating loop, the electroplating solutions can alternately flow, the concentrations of the electroplating solutions in the first compartment 13 and the second compartment 14 are timely updated, the difference is small, the consumption is more uniform, and the plating thickness is more uniform. Through this electroplating device of printed circuit board, control the plating solution velocity of flow, form the pressure differential, guarantee that the plating solution is at the uniform velocity flow downthehole, when the aperture of thicker circuit board is very little, also can guarantee that downthehole copper facing is even.
The specific working principle of the embodiment is as follows:
based on Bernoulli's formula P +12ρv2Where P is the pressure at a point in the fluid, v is the flow velocity at that point, ρ is the fluid density, g is the acceleration of gravity, h is the height at that point, and C is a constant,
the flow rate v of the liquid in the first compartment 13 is set1Pressure of P1Depth of liquid h1，
The liquid flow rate of the second compartment 14 is v2Pressure of P2Depth of liquid h2，
The energy relationship between the first compartment 13 and the second compartment 14 can be obtained according to Bernoulli's equation and the law of conservation of energy
P1+1/2ρv1 2+ρgh1＝P2+1/2ρv2 2+ρgh2
1/2ρv1 2＝P2-P1
I.e. Δ P ═ 1-2ρv1 2
Setting the flow velocity in the hole of the circuit board as vHThe unit is m/s; average flow rate in the holes is QHUnit is m3S, pore radius rHIn the unit of m; the viscosity of the plating solution is eta; the thickness of the hole plate is L, and the unit is m; the laminar flow velocity in the holes of the circuit board is vcThe unit is m/s; the pore diameter is D in m.
According to the Hagen poiseuille law (Hagen Poiseuille law),
vc＝f(△P)
in this case the flow velocity v in the boreHI.e. the laminar velocity vc。
From D, L, the hole inner wall area and the hole inner volume can be obtained.
Desired flow velocity v in the holeHThe larger the average laminar flow velocity v of the plate 100 to be plated is, the larger the average laminar flow velocity v1And (4) finishing. But the design does not cover vHWhat should be considered, vHWhat should be, depending on how much copper ion replenishment is needed for practical use, the logic is as follows:
copper ions in the holes are consumed due to electroplating, and assuming that the copper consumption in unit time in the holes is A and the unit is mol/s;
copper ions in the hole enter the hole only by diffusion from the periphery without flow velocity in the hole, and if there is flow velocity in the hole, the copper ions in the hole mainly flow into the hole along with the plating solution around, if the hole is providedThe new copper ion supplement amount per unit time is B, and the unit is mol/s, then
Setting the E as a supplement coefficient, wherein the supplement coefficient E can be regarded as a design value of whether the copper ion supplement is sufficient or not, and the value is determined by actual use requirements.
Let the average current density in the pores be J, with the unit being A/m2；
The area of the pore wall is S, and the unit is m2；
The Faraday constant is F, and the unit is C/mol;
the reaction charge is Q;
1C＝1A·S；
then, the amount of copper consumed per unit time
Let the average flow velocity in the hole be vHThe unit is m/s;
cross-sectional area of hole AHUnit is m2；
The copper concentration of the bath solution is cCuIn units of g/m3；
The copper part molecular weight is mCuThe unit is g/mol;
then, the amount of copper ion replenishment per unit time
The velocity v in the hole can be calculated from thisHObtaining the quantity of delta P, and back-calculating v1。
Calculating v1The method of (1) is as follows:
thus:
in addition, the air conditioner is provided with a fan,
therefore, the temperature of the molten metal is controlled,
wherein
Turn-over of the orifice, i.e., how many cycles per unit time (in units of 1/s),
if order
V represents Viscosity, then
V obtained in this manner1Setting the flow rate in the first compartment 13;
as the plating solution in the first compartment 13 flows, the plating solution in the second compartment 14 is at rest (rest is the condition in which the plating solution in the second compartment 14 does not circulate with respect to the flow of the plating solution in the first compartment 13). The pressure P in the first compartment 13 is determined according to Bernoulli's equation and the law of conservation of energy1Less than the pressure P of the second compartment 142And since F is PS, the firstThe pressure in one compartment 13 is lower than the pressure in the second compartment 14, and the pressure difference causes the plating solution in the second compartment 14 to flow to the first compartment 13 through the hole of the circuit board, thereby realizing the plating in the hole of the circuit board.
After a period of electroplating, the plating solution flows from the second inlet to the second compartment 14 and out the second outlet, and due to the plate 100 to be electroplated, the plating solution in the second compartment 14 flows and the plating solution in the first compartment 13 is stationary (stationary is that the plating solution in the first compartment 13 does not circulate relative to the flow of the plating solution in the second compartment 14). Thereby enabling the electroplating solution in the two compartments to alternately pass through the holes of the plate to be electroplated 100, realizing the electroplating in the holes and enabling the coating in the holes to be uniform.
Since Δ P ═ 1-2ρv1 2When v is1At a constant pressure, the pressure difference between the two compartments is constant,
according to
Therefore, the flow rate of the electroplating solution in the hole is uniform, and the electroplating in the hole is uniform.
It should be noted that the first-order electric field line distribution is influenced by the geometry and relative position between the cathode and the anode; the second-order electric field line distribution is influenced by electrochemical reaction factors; the distribution of the third-order electric field lines is influenced by the transport mode of the copper ions. In the present embodiment, only the third-order electric field lines are affected by changing the flowing manner of the plating solution, and the first-order electric field line distribution and the second-order electric field line distribution are not affected.
This printed circuit board's electroplating device only electroplates a circuit board generally once, and whole device need not to set up too big, and other factor interferences can be got rid of in the electroplating process, and plating solution speed is controllable, guarantees better that the plating solution flows at the downthehole at the uniform velocity, and when the aperture of thicker circuit board is very little, also can guarantee that downthehole copper facing is even.
Alternatively, in one embodiment, the plating solution in the first compartment 13 and the plating solution in the second compartment 14 are switched after circulating and flowing sequentially for a predetermined time, wherein the predetermined time is T, and T is 0.5min-5 min. According to actual production requirements, after the flowing time T of the first circulation loop, the second circulation loop is switched to flow, after the flowing time T of the second circulation loop, the first circulation loop is switched to flow, the flowing is performed alternately in sequence, two sides of the plate to be electroplated 100 can be electroplated uniformly, and the problems that the number of copper ions in a hole is large and the number of copper ions in the hole gradually decreases due to unilateral circulation are solved, so that the copper plating at two ends of the hole to be electroplated 100 is not uniform.
Alternatively, in one embodiment, the flow rates of the plating solution in the first compartment 13 and the plating solution in the second compartment 14 are 0.1m/s to 2 m/s. According to the actual production requirement, the proper flow speed of the electroplating solution is selected, and the proper pressure difference is formed on the two sides of the plate to be electroplated 100 so as to meet the plate thickness, the hole diameter and the copper plating thickness requirements of specific requirements.
Referring to fig. 1, in one embodiment, the circulation assembly includes a main conveying pipe 621, a first liquid inlet pipe 311, a first liquid outlet pipe 421, a second liquid inlet pipe 321, a second liquid outlet pipe 411, and a circulation pump body 61, the circulation pump body 61 is disposed on the main conveying pipe 621, one end of the first liquid inlet pipe 311 is connected to the first inlet 31, one end of the second liquid outlet pipe 411 is connected to the second outlet 41, the other end of the first liquid inlet pipe 311 and the other end of the second liquid outlet pipe 411 are connected in parallel and then connected to one end of the main conveying pipe 621, one end of the first liquid outlet pipe 421 is connected to the first outlet 42, one end of the second liquid inlet pipe 321 is connected to the second inlet 32, and the other end of the first liquid outlet pipe 421 and the other end of the second liquid inlet pipe 321 are connected in parallel and then connected to the other end of the main conveying pipe 621. In this embodiment, first circulation circuit and second circulation circuit flow through the drive of same circulating pump, simple structure, it is with low costs.
Further, on the basis of the above embodiment, the first liquid inlet pipe 311 is provided with a first switch 51, and the second liquid inlet pipe 321 is provided with a second switch 52; a third switch 53 is arranged on the second liquid outlet pipe 411, and a fourth switch 54 is arranged on the first liquid outlet pipe 421. When the electroplating device is used, the first switch 51 and the fourth switch 54 are opened, the second switch 52 and the third switch 53 are closed, the circulating pump body 61 is started, the electroplating solution in the first compartment 13 is enabled to flow in a circulating mode, and the electroplating solution in the second compartment 14 is not enabled to flow in a circulating mode; after the preset time, the first switch 51 and the fourth switch 54 are closed, the second switch 53 and the third switch 53 are opened, so that the electroplating solution in the second compartment 14 forms a circular flow, the electroplating solution in the first compartment 13 does not form a circular flow, and the operation is alternated, so that uniform electroplating in the hole is realized.
Further, a fifth switch 55 is disposed at an end of the main delivery pipe 621 close to the first liquid inlet pipe 311, and a sixth switch 56 is disposed at an end of the main delivery pipe 621 close to the first liquid outlet pipe 421. When in use, the fifth switch 55, the sixth switch 56, the first switch 51 and the fourth switch 54 are opened, the second switch and the third switch 53 are closed, and the circulating pump body 61 is started; after a predetermined time, the circulation pump body 61 is closed, the first switch 51 and the fourth switch 54 are closed, the second switch and the third switch 53 are opened, and the circulation pump body 61 is started. The circulation pump body 61 is further provided with a fifth switch 55 and a sixth switch 56, which are provided on the main feed pipe 621 of the liquid flow line for turning on or off the plating liquid circulation state.
Referring to fig. 2, in another embodiment, the circulation assembly includes a first liquid inlet pipe 311, a first liquid outlet pipe 421, a first circulation pump 62, a second liquid inlet pipe 321, a second liquid outlet pipe 411 and a second circulation pump 63, one end of the first liquid inlet pipe 311 is connected to the first inlet 31, the other end of the first liquid inlet pipe 311 is connected to one end of the first circulation pump 62, one end of the first liquid outlet pipe 421 is connected to the first outlet 42, the other end of the first liquid outlet pipe 421 is connected to the other end of the first circulating pump 62, one end of the second liquid inlet pipe 321 is connected to the second inlet 32, the other end of the second liquid inlet pipe 321 is connected to one end of the second circulation pump 63, one end of the second liquid outlet pipe 411 is connected to the second outlet 41, and the other end of the second liquid outlet pipe 411 is connected to the other end of the second circulating pump 63. The present embodiment is different from the previous embodiment, and two independent circulation pumps are adopted to control the first circulation loop and the second circulation loop respectively, so that the operation is simple.
Further, on the basis of the above embodiment, the first liquid inlet pipe 311 is provided with a first switch 51, and the second liquid inlet pipe 321 is provided with a second switch 52; a third switch 53 is arranged on the second liquid outlet pipe 411, and a fourth switch 54 is arranged on the first liquid outlet pipe 421. When the electroplating device is used, the first switch 51 and the fourth switch 54 are opened, the first circulating pump 62 is started, so that the electroplating solution in the first compartment 13 forms a circulating flow, the electroplating solution in the second compartment 14 does not form a circulating flow, and at the moment, the electroplating solution in the second compartment 14 is higher than that in the first compartment 13 due to the fact that the circulating flow pressure is not formed, and then flows into the first compartment 13 through the holes on the plate to be electroplated 100; after a preset time, the first circulating pump 62, the first switch 51 and the fourth switch 54 are turned off, the second switch and the third switch 53 are turned on, the second circulating pump 63 is started, so that the electroplating solution in the second compartment 14 forms a circulating flow, the electroplating solution in the first compartment 13 does not form a circulating flow, and at the moment, the electroplating solution in the first compartment 13 is greater in pressure than the electroplating solution in the second compartment 14 due to the fact that the electroplating solution does not form a circulating flow, and then flows into the second compartment 14 through the holes on the plate to be electroplated 100.
In one embodiment, the first inlet 31 and the second outlet 41 extend along the height direction of the first tank wall 11, and the length of the first inlet 31 and the second outlet 41 is not shorter than the height of the plate to be plated 100; the second inlet 32 and the first outlet 42 extend along the height direction of the second pool wall 12, and the length of the second inlet 32 and the first outlet 42 is not shorter than the height of the plate to be electroplated 100. The first inlet 31, the first outlet 42, the second inlet 32 and the second outlet 41 are extended along the height direction of the wall of the plating tank 1, so that the plating solution entering or flowing out of the first compartment 13 and the second compartment 14 can flow in the height direction of the plate 100 to be plated, the laminar flow is uniform, and all holes on the height of the plate 100 to be plated can be plated uniformly.
Further, in one embodiment, the first inlet 31 and the second outlet 41 penetrate through the first tank wall 11 from top to bottom; the second inlet 32 and the first outlet 42 penetrate through the second tank wall 12 from top to bottom. In this example, the first inlet 31, the first outlet 42, the second inlet 32 and the second outlet 41 are disposed at the same height as the wall of the plating tank 1, and the laminar flow is more uniform, so that the holes at the height of the plate 100 to be plated can be plated uniformly.
In one embodiment, the first compartment 13 has a first inlet 31 and a first outlet 42 disposed opposite to each other, and the second compartment 14 has a second inlet 32 and a second outlet 41 disposed opposite to each other, so that the flow direction and flow rate of the plating solutions flowing in the first compartment 13 and the second compartment 14 are kept relatively stable, and the uniformity of the plating thickness can be further improved. Further, the center line of the first inlet 31 coincides with the center line of the first outlet 42; the centre line of the second inlet 32 coincides with the centre line of the second outlet 41. Namely, the first inlet 31 of the first compartment 13 is opposite to the first outlet 42, the second inlet 32 and the second outlet 41 of the second compartment 14 enable the plating solution in the first compartment 13 to flow along the central line direction of the first inlet 31 and the first outlet 42, thereby keeping the flow speed of the plating solution in the first compartment 13 stable, and enable the plating solution in the second compartment 14 to flow along the central line direction of the second inlet 32 and the second outlet 41, thereby keeping the flow speed of the plating solution in the second compartment 14 stable, and further improving the uniformity of plating thickness. Optionally, the sizes of the first inlet and the first outlet may be the same or different, and the relative arrangement of the two may be satisfied.
In one embodiment, the distance between the center line of the first inlet 31 and the plate to be plated 100 is L1, the distance between the center line of the second inlet 32 and the plate to be plated 100 is L2, and L2 is L1. Since the plating process requires alternating flows of the plating solutions in the first compartment 13 and the second compartment 14, setting L1 equal to L2 enables the flow conditions and plating effects of the plating solutions in the two compartments to be consistent during the alternating plating process, thereby enabling the plating in the holes and on the plate surface to be uniform.
Further, vertically immersing the board to be electroplated 100 in the electroplating solution in the electroplating pool 1; two side edges of the plate to be electroplated 100 close to the electroplating pool 1 are fixed and form sealing connection with the corresponding electroplating pool 1 wall; the plating tank 1 is divided into the first compartment 13 and the second compartment 14 which are relatively separated by the plate 100 to be plated. The first compartment 13 and the second compartment 14 are sealed except for the communication through the holes on the plate 100 to be electroplated, so that the pressure difference between the two compartments is more obvious and stable in the electroplating process, and the electroplating is more uniform and more efficient.
Specifically, in one embodiment, the plate to be plated 100 is perpendicular to both the first cell wall 11 and the second cell wall 12, the first cell wall 11 is provided with a first clamping member 21, the second cell wall 12 is provided with a second clamping member 22, one side of the plate to be plated 100 is clamped and fixed by the first clamping member 21, and the other side of the plate to be plated 100 is clamped and fixed by the second clamping member 22. The plate to be electroplated 100 is fixed by the first clamping piece 21 and the second clamping piece 22 on the opposite sides, and the joint of the plate to be electroplated 100 and the first clamping piece 21 and the second clamping piece 22 keeps sealed, so that the position of the plate to be electroplated 100 is kept constant in the electroplating process, the volumes of the first compartment 13 and the second compartment 14 are kept unchanged, and the pressure difference between the two sides is kept stable.
Alternatively, the first clamping member 21 is a first clamping groove disposed on the first tank wall 11, and the second clamping member 22 is a second clamping groove disposed on the second tank wall 12. Through directly seting up the centre gripping groove on electroplating bath 1, will treat that electroplate 100 both sides card is located first centre gripping groove and second centre gripping inslot, realize treating the firm centre gripping of electroplate 100, need not additionally to increase the accessory, realize simply. In other embodiments, a first clamping member 21 and a second clamping member 22, such as clamping jaws, having a specific clamping function may also be disposed on the first tank wall 11 and the second tank wall 12, the first clamping member 21 is provided with a first clamping groove with adjustable length and clamping width, and the second clamping member 22 is provided with a second clamping groove with adjustable length and clamping width, that is, the first clamping member 21 and the second clamping member 22 may be adjusted correspondingly according to the dimension of the plate 100 to be electroplated, so as to achieve stable clamping of the plate 100 to be electroplated, and have stronger applicability.
Optionally, the first clamping member 21 and the second clamping member 22 are arranged at the middle position of the electroplating tank 1, so that the plate 100 to be electroplated is fixed at the middle position of the electroplating tank 1, and the volume of the formed first compartment 13 is the same as that of the formed second compartment 14, thereby ensuring that the electroplating environments on two sides of the plate 100 to be electroplated are kept balanced, and further improving the electroplating uniformity.
In one embodiment, the first inlet 31 is provided with a first nozzle and the second inlet 32 is provided with a second nozzle. Through set up first nozzle at first entry 31, second entry 32 sets up the second nozzle, and the plating solution in first compartment 13 is by first nozzle blowout, and the plating solution in second compartment 14 is by the second nozzle blowout for it is bigger to correspond the plating solution flow velocity in the compartment, and the circulation is more smooth and easy, forms bigger pressure differential, satisfies the high thickness ratio downthehole electroplating demand better.
Alternatively, the first outlet 42 and the second outlet 41 are both trumpet-shaped, and the first outlet 42 and the second outlet 41 are gradually reduced in the plating liquid outflow direction. Set up first export 42 and second export 41 into the loudspeaker form of big-end-up, the plating solution is by first compartment 13, when the second compartment 14 flows out, advance the reentrant osculum by the macrostoma earlier, not only make things convenient for the plating solution to flow out, and can be in first export 42, second export 41 department forms certain negative pressure, produce certain suction, make the plating solution flow velocity in corresponding compartment bigger, it is more smooth to circulate, form bigger pressure differential, satisfy the high thickness ratio downthehole electroplating demand of diaphragm better.
Referring to fig. 3, in one embodiment, the electroplating apparatus for the printed circuit board further includes metal anodes 200 disposed at two sides of the board to be electroplated 100, the metal anodes 200 are connected to a positive electrode of a power supply 300, and the board to be electroplated 100 is connected to a negative electrode of the power supply 300. And metal anodes 200 immersed in the electroplating solution are arranged on both sides of the plate 100 to be electroplated, the metal anodes 200 are connected with the positive electrode of a power supply 300, the plate 100 to be electroplated is connected with the negative electrode of the power supply 300, and electroplating layers are formed on the plate surface and the hole wall of the plate 100 to be electroplated through electrochemical reaction.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Claims (11)
1. The electroplating device of the printed circuit board is characterized by comprising an electroplating pool and a circulating assembly, wherein the electroplating pool is provided with a first pool wall and a second pool wall which are arranged oppositely, a plate to be electroplated can stretch across the first pool wall and the second pool wall, the plate to be electroplated can divide the electroplating pool into a first compartment and a second compartment, the first pool wall and the second pool wall of the first compartment are respectively provided with a first inlet and a first outlet, the first pool wall and the second pool wall of the second compartment are respectively provided with a second inlet and a second outlet, the first inlet and the first outlet are connected with the circulating assembly to form a first circulating loop, and the second inlet and the second outlet are connected with the circulating assembly to form a second circulating loop.
2. The apparatus of claim 1, wherein the circulation assembly comprises a first inlet pipe, a first outlet pipe, a first circulation pump, a second inlet pipe, a second outlet pipe and a second circulation pump, wherein one end of the first inlet pipe is connected to the first inlet, the other end of the first inlet pipe is connected to one end of the first circulation pump, one end of the first outlet pipe is connected to the first outlet, the other end of the first outlet pipe is connected to the other end of the first circulation pump, one end of the second inlet pipe is connected to the second inlet, the other end of the second inlet pipe is connected to one end of the second circulation pump, one end of the second outlet pipe is connected to the second outlet, and the other end of the second outlet pipe is connected to the other end of the second circulation pump.
3. The electroplating apparatus for a printed circuit board according to claim 1, wherein the circulation assembly comprises a main conveying pipe, a first liquid inlet pipe, a first liquid outlet pipe, a second liquid inlet pipe, a second liquid outlet pipe, and a circulation pump, the circulation pump is disposed on the main conveying pipe, one end of the first liquid inlet pipe is connected to the first inlet, one end of the second liquid outlet pipe is connected to the second outlet, the other end of the first liquid inlet pipe and the other end of the second liquid outlet pipe are connected in parallel and then connected to one end of the main conveying pipe, one end of the first liquid outlet pipe is connected to the first outlet, one end of the second liquid inlet pipe is connected to the second inlet, and the other end of the first liquid outlet pipe and the other end of the second liquid inlet pipe are connected in parallel and then connected to the other end of the main conveying pipe.
4. The electroplating apparatus for PCB of claim 3, wherein the first liquid inlet tube has a first switch and the second liquid inlet tube has a second switch; a third switch is arranged on the second liquid outlet pipe, and a fourth switch is arranged on the first liquid outlet pipe;
and/or, the one end that main conveyer pipe is close to first income liquid pipe is equipped with the fifth switch, the one end that main conveyer pipe is close to first drain pipe is equipped with the sixth switch.
5. The plating apparatus for printed circuit board according to any of claims 1 to 3, wherein said first inlet and said second outlet extend along the height direction of said first bath wall, and the length of said first inlet and said second outlet is not shorter than the height of said board to be plated; the second inlet and the first outlet extend along the height direction of the second pool wall, and the lengths of the second inlet and the first outlet are not shorter than the height of the plate to be electroplated.
6. The PCB electroplating apparatus of claim 5, wherein the first inlet and the second outlet penetrate through the first tank wall from top to bottom; and the second inlet and the first outlet penetrate through the second pool wall from top to bottom.
7. The apparatus according to claim 5, wherein the first inlet is provided with a first nozzle, and the second inlet is provided with a second nozzle;
and/or the first outlet and the second outlet are both in a horn shape, and the first outlet and the second outlet are gradually reduced along the flowing-out direction of the electroplating solution.
8. The apparatus of claim 7, wherein a center line of the first inlet coincides with a center line of the first outlet; a centerline of the second inlet coincides with a centerline of the second outlet.
9. The plating apparatus for printed circuit boards as claimed in any one of claims 1 to 3, wherein the center line of the first inlet is spaced from the board to be plated by a distance L1, and the center line of the second inlet is spaced from the board to be plated by a distance L2, L2 being L1.
10. A plating apparatus for a printed circuit board according to claim 5, wherein said first bath wall is provided with a first holding member for holding one side of the board to be plated, and said second bath wall is provided with a second holding member for holding the other side of the board to be plated;
the first clamping piece is a first clamping groove arranged on the first pool wall, and the second clamping piece is a second clamping groove arranged on the second pool wall; or, be equipped with length and centre gripping width adjustable first centre gripping groove on the first holder, be equipped with length and centre gripping width adjustable second centre gripping groove on the second holder.
11. The electroplating device for the printed circuit board according to any one of claims 1 to 3, further comprising metal anodes arranged at both sides of the board to be electroplated, wherein the metal anodes are connected with a positive electrode of a power supply, and the board to be electroplated is connected with a negative electrode of the power supply; the plate to be electroplated is arranged in the middle of the electroplating pool, and the volumes of the first compartment and the second compartment are the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021494126.6U CN213538147U (en) | 2020-07-24 | 2020-07-24 | Electroplating device for printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021494126.6U CN213538147U (en) | 2020-07-24 | 2020-07-24 | Electroplating device for printed circuit board |
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| CN213538147U true CN213538147U (en) | 2021-06-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023123908A1 (en) * | 2021-12-31 | 2023-07-06 | 生益电子股份有限公司 | Electroplating device |
| WO2023123912A1 (en) * | 2021-12-31 | 2023-07-06 | 生益电子股份有限公司 | Electroplating apparatus |
-
2020
- 2020-07-24 CN CN202021494126.6U patent/CN213538147U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023123908A1 (en) * | 2021-12-31 | 2023-07-06 | 生益电子股份有限公司 | Electroplating device |
| WO2023123912A1 (en) * | 2021-12-31 | 2023-07-06 | 生益电子股份有限公司 | Electroplating apparatus |
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