CN109852996B - Electrodeposition copper recovery device and copper recovery production line using same - Google Patents
Electrodeposition copper recovery device and copper recovery production line using same Download PDFInfo
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- CN109852996B CN109852996B CN201910294797.3A CN201910294797A CN109852996B CN 109852996 B CN109852996 B CN 109852996B CN 201910294797 A CN201910294797 A CN 201910294797A CN 109852996 B CN109852996 B CN 109852996B
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- reaction tank
- pipe
- plate
- copper recovery
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 55
- 239000010949 copper Substances 0.000 title claims abstract description 55
- 238000011084 recovery Methods 0.000 title claims abstract description 32
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 75
- 238000006243 chemical reaction Methods 0.000 claims abstract description 51
- 239000007921 spray Substances 0.000 claims abstract description 33
- 238000005507 spraying Methods 0.000 claims abstract description 23
- 230000003014 reinforcing effect Effects 0.000 claims description 30
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005728 strengthening Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 36
- 239000002699 waste material Substances 0.000 abstract description 32
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 12
- 229910001431 copper ion Inorganic materials 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 5
- 238000005868 electrolysis reaction Methods 0.000 description 5
- 229910001018 Cast iron Inorganic materials 0.000 description 4
- 230000001502 supplementing effect Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention provides an electrodeposition copper recovery device and a copper recovery production line using the same, wherein the copper recovery production line comprises the electrodeposition copper recovery device, and the electrodeposition copper recovery device comprises: the cylinder body comprises a bottom plate and side plates, the bottom plate and the side plates enclose to form a reaction tank, and the circulating assembly comprises an overflow box, an overflow pipe, a pump body and a spraying structure. In the process of the alkaline etching waste liquid in the reaction tank, the alkaline etching waste liquid flows from the reaction tank to the overflow box, then under the driving of the pump body, the etching waste liquid in the overflow box flows through the overflow pipe, the liquid inlet pipe and the spray pipe, and finally is sprayed out from the spray hole on the spray pipe to the bottom of the reaction tank, namely, a closed loop for the flow of the alkaline etching waste liquid is formed, so that the etching waste liquid with different heights in the reaction tank is fully mixed, the concentration is more uniform, the efficiency of copper ions when the copper ions are reduced on the cathode plate can be effectively improved, and the shape of the reduced copper ions is more uniform.
Description
Technical Field
The invention belongs to the technical field of copper recovery, and particularly relates to an electrodeposition copper recovery device and a copper recovery production line using the same.
Background
The cleaning section of the production line for etching the PCB, electroplating copper, electroless copper plating and the like can discharge a large amount of copper-containing alkaline etching liquid, and the etching liquid contains a large amount of copper elements, so that copper resources can be wasted and the environment can be seriously polluted if the copper-containing alkaline etching liquid is directly discharged.
For the alkaline etching solution containing copper, an electrolytic deposition method can be adopted to recycle copper, but in the prior art, the problems of low efficiency and uneven shape when copper ions are reduced on a cathode plate due to uneven concentration of alkaline etching waste liquid in an electrodeposition device exist.
Disclosure of Invention
The invention aims to solve the technical problem of providing an electrodeposition copper recovery device and a copper recovery production line using the same, which can make the concentration of alkaline etching waste liquid in the electrodeposition device uniform so as to improve the efficiency of reducing copper ions on a cathode plate and make the shape of the reduced copper ions more uniform.
In order to solve the technical problems, the invention is realized by an electrodeposition copper recovery device, comprising: cylinder body, negative pole, positive pole, upper cover and circulating assembly, the cylinder body includes bottom plate and curb plate, the bottom plate with the curb plate encloses to close and forms the reaction tank, the negative pole with the positive pole sets up in the reaction tank, the upper cover is used for the lid to close and seals on the reaction tank, circulating assembly includes overflow box, overflow pipe, the pump body and sprays the structure, the overflow box sets up being close to the reaction tank notch department of curb plate, the overflow box with the reaction tank intercommunication, it sets up to spray the structure the tank bottom department of reaction tank, it includes feed liquor pipe and shower to spray the structure, the shower is connected on the feed liquor pipe, evenly seted up on the shower and sprayed the hole, the overflow pipe intercommunication the overflow box with the feed liquor pipe, the pump body with the overflow pipe is connected, the pump body drive etching waste liquid in the overflow box flows through in proper order the overflow pipe the feed liquor pipe with after the shower is in the reaction tank.
Further, the overflow boxes are tightly attached to the corresponding side plates, a plurality of uniformly distributed overflow ports are formed in the corresponding side plates, and the overflow ports are communicated with the corresponding overflow boxes and the reaction tank.
Further, the position of the corresponding side plate, which is close to the bottom plate, is provided with at least two liquid inlet holes, the spraying structure comprises at least two liquid inlet pipes, each liquid inlet pipe is assembled in one-to-one correspondence with each liquid inlet hole, and at least two spraying pipes are arranged between every two adjacent liquid inlet pipes.
Further, the spraying structure further comprises a supporting seat, an arc-shaped structure matched with the spraying pipe is arranged at the top of the supporting seat, the supporting seat is arranged between the spraying pipe and the bottom plate, and the supporting seat is used for bearing the spraying pipe.
Further, the spray structure further comprises a flow equalizing plate, the flow equalizing plate is arranged above the spray pipe and is parallel to the bottom plate, and flow equalizing holes are uniformly formed in the flow equalizing plate.
Further, the outer hoops of the side plates are provided with outer reinforcing ribs, the inner sides of the two opposite side plates are provided with inner reinforcing ribs in the vertical direction, gaps are formed in the corresponding side edges of the flow equalizing plates, and when the flow equalizing plates are assembled in the reaction tank, the inner reinforcing ribs penetrate through the gaps.
Further, a circle of horizontal reinforcing panel is arranged at the upper edge of the side plate, and the overflow box is tightly attached to the bottom side of the reinforcing panel; the upper side of the side plates is respectively provided with conductive square copper, the conductive square copper is arranged on the upper side of the reinforced panel, the corresponding two side plates are respectively provided with cathode clamping grooves and anode clamping grooves which are in one-to-one correspondence, the cathode clamping grooves and the anode clamping grooves are uniformly arranged at intervals and vertically extend, the inner ring of the reinforced panel is provided with a circle of flange plate which extends upwards, a positioning groove is formed in the flange plate on the corresponding side of the conductive square copper, and when the cathode and the anode are clamped in the positioning groove, the cathode and the anode are respectively connected with the corresponding conductive square copper, and the cathode and the anode are respectively embedded in the cathode clamping grooves and the anode clamping grooves.
Further, a spacer sleeve is arranged on the positioning groove, and the spacer sleeve is made of teflon materials.
Further, still include the exhaust structure, the exhaust structure includes exhaust box and exhaust column, the exhaust box sets up the upside of strengthening the panel and paste tightly the flange board, the gas outlet has been seted up on the corresponding position of flange board, the gas outlet intercommunication the reaction tank with the exhaust box, the exhaust column is connected the exhaust box.
Further, there is provided a copper recovery line comprising an electrodeposition copper recovery device as described in any one of the above.
Compared with the prior art, the electro-deposition copper recovery device and the copper recovery production line using the electro-deposition copper recovery device have the beneficial effects that:
in the process of the alkaline etching waste liquid in the reaction tank, the alkaline etching waste liquid flows from the reaction tank to the overflow box, then under the driving of the pump body, the etching waste liquid in the overflow box flows through the overflow pipe, the liquid inlet pipe and the spray pipe, and finally is sprayed out from the spray hole on the spray pipe to the bottom of the reaction tank, namely, a closed loop for the flow of the alkaline etching waste liquid is formed, so that the etching waste liquid with different heights in the reaction tank is fully mixed, the concentration is more uniform, the efficiency of copper ions when the copper ions are reduced on the cathode plate can be effectively improved, and the shape of the reduced copper ions is more uniform.
Drawings
FIG. 1 is a schematic view showing a three-dimensional exploded structure of an apparatus for recovering copper by electrodeposition according to an embodiment of the present invention.
In the drawings, each reference numeral denotes: 1. a cylinder; 11. a bottom plate; 12. a side plate; 13. reinforcing the panel; 121. an overflow port; 122. an outer reinforcing rib; 123. an inner reinforcing rib; 124. a cathode clamping groove; 125. an anode clamping groove; 131. a flange plate; 1311. a positioning groove; 1312. an air outlet; 2. an upper cover; 3. a circulation assembly; 31. an overflow box; 32. a spray structure; 33. a support base; 34. a flow equalizing plate; 321. a liquid inlet pipe; 322. a shower pipe; 341. a notch; 4. conducting square copper; 5. an air draft structure; 51. an exhaust box; 52. and an exhaust tube.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Examples:
in this embodiment, a copper recovery line (not shown) is provided for electrolyzing copper sulfate, including an electrodeposition recovery copper device, wherein the electrodeposition recovery copper device includes, as shown in fig. 1: cylinder body 1, the negative pole (not shown), the positive pole (not shown), upper cover 2 and circulation subassembly 3, cylinder body 1 includes bottom plate 11 and curb plate 12, bottom plate 11 and curb plate 12 enclose and close and form the reaction tank, negative pole and positive pole set up in the reaction tank, upper cover 2 is used for the lid to close and seals on the reaction tank, circulation subassembly 3 includes overflow box 31, the overflow pipe, the pump body and spray structure 32, overflow box 31 sets up being close to the reaction tank notch department at curb plate 12, overflow box 31 and reaction tank intercommunication, spray structure 32 sets up the tank bottom department at the reaction tank, spray structure 32 includes feed liquor pipe 321 and shower 322, shower 322 is connected on feed liquor pipe 321, evenly seted up the spray hole on the shower 322, overflow pipe intercommunication overflow box 31 and feed liquor pipe 321, the pump body is connected with the overflow pipe, etching waste liquid in the pump body drive overflow box 31 flows through overflow pipe in proper order, feed liquor pipe 321 and shower 322 after the shower to the reaction tank.
In the process of filling alkaline etching waste liquid into the reaction tank for electrolysis, the alkaline etching waste liquid flows from the reaction tank to the overflow box 31, then under the drive of the pump body, the etching waste liquid in the overflow box 31 flows through the overflow pipe, the liquid inlet pipe 321 and the spray pipe 322, and finally is sprayed out from the spray hole on the spray pipe 322 to the bottom of the reaction tank, namely, a closed loop for flowing the alkaline etching waste liquid is formed, so that the etching waste liquid with different heights in the reaction tank is fully mixed, the concentration is more uniform, the efficiency of copper ions when the copper ions are reduced on the cathode plate can be effectively improved, and the shape of the reduced copper ions is more uniform.
The overflow boxes 31 are closely attached to the corresponding side plates 12, a plurality of uniformly distributed overflow ports 121 are formed in the corresponding side plates 12, and the overflow ports 121 are communicated with the corresponding overflow boxes 31 and the reaction tank. Specifically, in the present embodiment, the side plate 12 includes: the front side plate, the rear side plate, the left side plate and the right side plate are respectively provided with an overflow box 31, the front side plate and the rear side plate are communicated through the overflow plates, reinforcing sheets are uniformly arranged in the overflow boxes 31 at intervals for reinforcing the structural strength of the overflow boxes 31, and through holes are formed in the reinforcing sheets for etching waste liquid to flow, and the overflow boxes 31 are arranged on two opposite sides, so that the etching waste liquid in a high position in the reaction tank can flow to the overflow boxes 31 on two sides, the phenomenon that the etching waste liquid flows to the overflow boxes 31 from a single side surface can not occur, and the etching waste liquid is more uniform and better in effect.
At least two liquid inlet holes are formed in the position, close to the bottom plate 11, of the corresponding side plate 12, the spraying structure 32 comprises at least two liquid inlet pipes 321, each liquid inlet pipe 321 is assembled in one-to-one correspondence with each liquid inlet hole, and at least two spraying pipes 322 are arranged between every two adjacent liquid inlet pipes 321. In this embodiment, taking the shower pipe 322 including two liquid inlet pipes 321 as an example, a liquid inlet hole is respectively opened at the position of the bottom of the rear side plate, which is close to the left side plate and the right side plate, the positions of the two liquid inlet holes are approximately symmetrical, the two liquid inlet pipes 321 are respectively assembled with the liquid inlet holes, the liquid inlet pipes 321 are parallel to each other, the liquid inlet pipes 321 are communicated with the overflow box 31 through overflow pipes, three shower pipes 322 are arranged between the two liquid inlet pipes 321, the three shower pipes 322 are perpendicular to the liquid inlet pipes 321, and the three liquid inlet pipes 321 are uniformly distributed in the bottom area of the reaction tank, so that etching waste liquid can be uniformly sprayed to the bottom of the reaction tank from the shower pipes 322. In other embodiments, the spraying structure 32 may include three, four, five, etc. liquid inlet pipes 321, two, four, five, etc. spraying pipes 322 may be disposed between adjacent liquid inlet pipes 321, and the spraying pipes 322 may form an angle with the liquid inlet pipes 321, for example: 30 °, 60 °, the shower pipes 322 may also be arranged crosswise. The bottom of the cylinder body 1 is provided with a liquid supplementing hole and a liquid outlet hole, the liquid supplementing hole and the liquid outlet hole can be arranged on the bottom plate 11 and the side plate 12, etching waste liquid can enter the reaction tank for electrolysis through the liquid supplementing hole of the pipeline, and the waste liquid after the electrolysis can be discharged from the external pipeline through the liquid outlet hole.
In order to make the spray structure 32 install stably in the reaction tank, the spray structure 32 further includes a support base 33, an arc structure matching with the spray pipe 322 is provided on the top of the support base 33, the support base 33 is provided between the spray pipe 322 and the bottom plate 11, and the support base 33 is used for bearing the spray pipe 322. In this embodiment, the supporting seats 33 are separately arranged, each spray pipe 322 is uniformly provided with three supporting seats 33 for carrying, in other embodiments, each spray pipe 322 can be provided with two, four, five or other supporting seats 33 for carrying, and a connecting rod can be arranged between the supporting seats 33, so that the whole spray pipe is convenient to move, and more convenient.
In order to further make the concentration of the etching waste liquid uniform, in this embodiment, the spraying structure 32 further includes a flow equalizing plate 34, where the flow equalizing plate 34 is disposed above the spraying pipe 322, the flow equalizing plate 34 is parallel to the bottom plate 11, and flow equalizing holes are uniformly formed on the flow equalizing plate 34, and after the etching waste liquid is sprayed from the spraying pipe 322, the etching waste liquid can be further dispersed through the flow equalizing plate 34, so that the concentration of the etching waste liquid in the reaction tank is more uniform. In this embodiment, the flow equalizing holes are straight holes for communicating the upper and lower surfaces of the flow equalizing plate 34; in other embodiments, the flow equalizing holes communicate with the upper and lower surfaces of the flow equalizing plate 34, but the channels of the flow equalizing holes may be curved; in other embodiments, two, three, four, etc. flow equalization plates 34 may be provided, and flow equalization holes between adjacent flow equalization plates 34 are arranged in a staggered manner, so that etching waste liquid can be further mixed when passing through the flow equalization plates 34.
In order to improve the structural strength of the cylinder body 1, the outer hoop of the side plate 12 is provided with an outer reinforcing rib 122, the inner sides of the opposite side plates 12 are provided with inner reinforcing ribs 123 in the vertical direction, the corresponding side edges of the flow equalizing plates 34 are provided with notches 341, and when the flow equalizing plates 34 are assembled in the reaction tank, the inner reinforcing ribs 123 pass through the notches 341. In this embodiment, the circumferential hoop of the cylinder body 1 is provided with two rings of external reinforcing ribs 122, the inner sides of the left side plate and the right side plate are respectively provided with two internal reinforcing ribs 123, and the external reinforcing ribs 122 and the internal reinforcing ribs 123 are all fixed on the cylinder body 1 by adopting channel steel with the size of 80mm by 40mm by 5mm in a welding mode. In other embodiments, the outer reinforcing ribs 122 may be provided in one, three, four, etc., and the inner reinforcing ribs 123 may be provided in one, three, four, etc., depending on the size of the electrodeposition copper recovery device.
A circle of horizontal reinforcing panel 13 is arranged at the upper edge of the side plate 12, and the overflow box 31 is tightly attached to the bottom side of the reinforcing panel 13; the upper side of the opposite side plates 12 is respectively provided with conductive square copper 4, the conductive square copper 4 is arranged on the upper side of the reinforced panel 13, the inner sides of the corresponding side plates 12 are provided with cathode clamping grooves 124 and anode clamping grooves 125 which are in one-to-one correspondence, the cathode clamping grooves 124 and the anode clamping grooves 125 are uniformly arranged at intervals and vertically extend, the inner ring of the reinforced panel 13 is provided with a circle of flange plates 131 which extend upwards, the flange plates 131 on the sides corresponding to the conductive square copper 4 are provided with positioning grooves 1311, and when the cathodes and the anodes are embedded in the positioning grooves 1311, the cathodes and the anodes are respectively electrically connected with the corresponding conductive square copper 4, and the cathodes and the anodes are respectively embedded in the cathode clamping grooves 124 and the anode clamping grooves 125. The cathode and the anode are assembled through the cathode clamping groove 124 and the anode clamping groove 125 respectively, so that the working reliability of the cathode and the anode can be ensured in the electrolysis process, coated square bar cast iron (not shown) is arranged on the cathode and the anode, the cathode and the anode are locked by utilizing the dead weight of the coated square bar cast iron and three screws, the surface of the square bar coated cast iron is plated with an anti-corrosion coating, and the bottom of the square bar coated cast iron is provided with a groove matched with the conductive square copper 4 in size. The positioning groove 1311 is provided with a spacer (not shown) made of teflon material, so that the positioning groove 1311 is prevented from being damaged due to high temperature in the electrolysis process.
The electro-deposition copper recovery device further comprises an air draft structure 5, the air draft structure 5 comprises an air draft box 51 and an air draft tube 52, the air draft box 51 is arranged on the upper side of the reinforcing panel 13 and is tightly attached to the flange plate 131, an air outlet 1312 is formed in the corresponding position of the flange plate 131, the air outlet 1312 is communicated with the reaction tank and the air draft box 51, and the air draft tube 52 is connected with the air draft box 51. The exhaust box 51 is arranged at the corresponding position of the reinforcing panel 13 with the left side plate and the right side plate, namely, the two ends of the reaction tank are respectively provided with an exhaust box 51, air in the reaction tank enters the exhaust box 51 from two sides and is then exhausted by the exhaust pipe 52, the exhaust box 51 is designed above the reinforcing panel 13 to ensure the exhaust volume, and etching waste liquid can be prevented from being exhausted, so that the exhaust pipe 52 is prevented from being blocked due to crystallization and is more reliable.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (6)
1. An electrodeposition copper recovery device, comprising: the device comprises a cylinder body (1), a cathode, an anode, an upper cover (2) and a circulating assembly (3), wherein the cylinder body (1) comprises a bottom plate (11) and a side plate (12), the bottom plate (11) and the side plate (12) are enclosed to form a reaction tank, the cathode and the anode are arranged in the reaction tank, the upper cover (2) is used for being covered and sealed on the reaction tank, the circulating assembly (3) comprises an overflow box (31), an overflow pipe, a pump body and a spraying structure (32), the overflow box (31) is arranged at the position, close to the notch of the reaction tank, of the side plate (12), the overflow box (31) is communicated with the reaction tank, the spraying structure (32) is arranged at the bottom of the reaction tank, the spraying structure (32) comprises a liquid inlet pipe (321) and a spraying pipe (322), the spraying pipe (322) is connected to the liquid inlet pipe (321), holes are uniformly formed in the spraying pipe (322), the overflow box (31) and the overflow pipe (321) are communicated, and the overflow pipe (321) is driven to flow through the overflow pipe and the overflow pipe (31) to the reaction tank in turn; the spray structure (32) further comprises a flow equalizing plate (34), the flow equalizing plate (34) is arranged above the spray pipe (322), the flow equalizing plate (34) is parallel to the bottom plate (11), and flow equalizing holes are uniformly formed in the flow equalizing plate (34); the overflow boxes (31) are closely attached to the corresponding side plates (12), a plurality of uniformly distributed overflow ports (121) are formed in the corresponding side plates (12), and the overflow ports (121) are used for communicating the corresponding overflow boxes (31) with the reaction tank; at least two liquid inlet holes are formed in the position, close to the bottom plate (11), of the corresponding side plate (12), the spraying structure (32) comprises at least two liquid inlet pipes (321), the liquid inlet pipes (321) are assembled in one-to-one correspondence with the liquid inlet holes, and at least two spraying pipes (322) are arranged between every two adjacent liquid inlet pipes (321); the upper edge department of curb plate (12) is provided with round horizontally strengthens panel (13), and two opposite curb plate (12) top is provided with electrically conductive square copper (4) respectively, the inner circle of strengthening panel (13) is provided with round flange board (131) of upwards extending, with locating slot (1311) have been seted up on flange board (131) of electrically conductive square copper (4) corresponding side, be provided with the spacer sleeve on locating slot (1311), the spacer sleeve adopts the teflon material.
2. The electro-deposition copper recovery device according to claim 1, wherein the spray structure (32) further comprises a support base (33), an arc-shaped structure matched with the spray pipe (322) is arranged at the top of the support base (33), the support base (33) is arranged between the spray pipe (322) and the bottom plate (11), and the support base (33) is used for bearing the spray pipe (322).
3. The electrodeposition copper recovery device according to claim 1 or 2, wherein the outer hoops of the side plates (12) are provided with outer reinforcing ribs (122), the inner sides of the two opposite side plates (12) are provided with inner reinforcing ribs (123) in the vertical direction, gaps (341) are formed at the corresponding side edges of the flow equalizing plates (34), and when the flow equalizing plates (34) are assembled in the reaction tank, the inner reinforcing ribs (123) penetrate through the gaps (341).
4. An electrodeposition copper recovery device according to claim 3, wherein the overflow box (31) is provided closely to the bottom side of the reinforcement panel (13); and electrically conductive square copper (4) set up the upside of reinforcing panel (13), two that correspond the inboard of curb plate (12) is provided with negative pole draw-in groove (124) and positive pole draw-in groove (125) of one-to-one, negative pole draw-in groove (124) with positive pole draw-in groove (125) evenly spaced sets up and all vertically extends, the negative pole with the positive pole inlay card is in when in constant head tank (1311), the negative pole with positive pole is connected with electrically conductive square copper (4) electricity that corresponds respectively, just the negative pole with the positive pole inlay respectively in negative pole draw-in groove (124) with in positive pole draw-in groove (125).
5. The electro-deposition copper recovery device according to claim 4, further comprising an air suction structure (5), wherein the air suction structure (5) comprises an air suction box (51) and an air suction tube (52), the air suction box (51) is arranged on the upper side of the reinforcing panel (13) and is tightly attached to the flange plate (131), an air outlet (1312) is formed in a corresponding position of the flange plate (131), the air outlet (1312) is communicated with the reaction tank and the air suction box (51), and the air suction tube (52) is connected with the air suction box (51).
6. A copper recovery line comprising an electrodeposition copper recovery device according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910294797.3A CN109852996B (en) | 2019-04-12 | 2019-04-12 | Electrodeposition copper recovery device and copper recovery production line using same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910294797.3A CN109852996B (en) | 2019-04-12 | 2019-04-12 | Electrodeposition copper recovery device and copper recovery production line using same |
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| CN109852996A CN109852996A (en) | 2019-06-07 |
| CN109852996B true CN109852996B (en) | 2024-02-23 |
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| CN109852996A (en) | 2019-06-07 |
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