CN214612818U

CN214612818U - Local electroplating device of micro-electrolytic cell

Info

Publication number: CN214612818U
Application number: CN202120350321.XU
Authority: CN
Inventors: 陈云松; 王旭军
Original assignee: Dingqun Technology Shenzhen Co ltd
Current assignee: Dingqun Technology Shenzhen Co ltd
Priority date: 2021-02-07
Filing date: 2021-02-07
Publication date: 2021-11-05
Anticipated expiration: 2031-02-07

Abstract

The utility model relates to a little electrolytic cell local electroplating device, its including have the little electrolytic cell body of upper shed, arrange the inertia positive pole in little electrolytic cell in, the connector rather than inside intercommunication is seted up to little electrolytic cell body bottom, little electrolytic cell can be dismantled along connector edge seal and be connected with electroplating plate, electroplating plate sets up the electroplating mouth that matches with the work piece. The electroplating plate is integrally formed with an annular connecting ring along the edge of the electroplating plate, the connecting ring is in threaded connection with the inner wall of the connecting port or the outer wall of the micro-electrolysis cell body, and a sealing ring is arranged between the connecting ring and the side wall of the micro-electrolysis cell body. The electroplating device has the advantages that the electroplating cost of workpieces with different requirements is reduced, and the effect of local electroplating can be realized.

Description

Local electroplating device of micro-electrolytic cell

Technical Field

The application relates to the field of electroplating, in particular to a local electroplating device of a micro-electrolytic cell.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on some metal surfaces by using the principle of electrolysis, and different workpieces have different electroplating requirements in different practical application scenarios, such as local position electroplating of the workpiece.

Chinese patent publication No. CN104746115B discloses a local electroplating device for micro-electrolytic cells, comprising: the top of the micro-electrolytic cell is an open port, the bottom of the micro-electrolytic cell is provided with a lower end hole, the lower end hole has the shape with the same size as a local area to be electroplated, and the bottom of the side wall of the micro-electrolytic cell is provided with a liquid outlet; an inert anode disposed in the micro-electrolysis cell; a stirring system disposed in the micro-electrolysis cell; and the liquid outlet system is arranged at the lower part of the micro-electrolytic cell and is communicated with the micro-electrolytic cell through a liquid outlet.

In view of the above-mentioned related art, the inventor believes that the holes are formed in the bottom of the micro electrolytic cell to meet the local electroplating requirement of the workpiece surface, and if electroplating of different shapes is performed on the workpiece, one micro electrolytic cell is directly replaced, which results in high cost.

SUMMERY OF THE UTILITY MODEL

In order to reduce the cost of electroplating workpieces with different requirements, the application provides a local electroplating device of a micro-electrolytic cell.

The application provides a little electrolytic cell local plating device adopts following technical scheme:

the utility model provides a little electrolytic cell local electroplating device, is including having the little electrolytic cell body of upper shed, arranging the interior inert positive pole of little electrolytic cell in, the connector rather than inside intercommunication is seted up to little electrolytic cell body bottom, little electrolytic cell body is connected with the electroplate board along connector edge seal detachably, the electroplate board is seted up and is electroplated the mouth with the required fashioned plating layer matching of work piece.

Through adopting above-mentioned technical scheme, carry out the electroplating of different shape demands to platelike workpiece surface as required, as long as can dismantle the change to the electroplating plate of little electrolysis cell body bottom, because the electroplating mouth that the electroplating board was seted up of difference can design into different shapes according to the demand of difference, thereby when electroplating platelike work piece, just can be at the cladding material of the surface shaping different shapes of work piece, make same little electrolysis cell body just can electroplate the cladding material of different shapes to workpiece surface after changing electroplating plate, need not to replace whole little electrolysis cell body, the cost of production has been reduced.

Optionally, the electroplating plate is integrally formed with an annular connecting ring along the edge thereof, the connecting ring is in threaded connection with the inner wall of the connecting port or the outer wall of the micro-electrolysis cell body, and a sealing ring is arranged between the connecting ring and the side wall of the micro-electrolysis cell body.

Through adopting above-mentioned technical scheme, utilize threaded connection's go-between and little electrolysis cell body, can more conveniently change the installation to electroplating the board, reach the sealing performance who satisfies the requirement simultaneously, effectively avoid the inside plating solution of little electrolysis cell body outwards to ooze from the gap of go-between and little electrolysis cell body, when producing little electrolysis cell body, only need match the plating layer that produces multiple electroplating board just can realize shaping multiple shape.

Optionally, a sealing strip which is in sealing fit with the surface of the workpiece is arranged on one side, away from the micro-electrolysis cell body, of the electroplating plate along the edge of the electroplating opening.

Through adopting above-mentioned technical scheme, in electroplating process, can promote the sealing performance between electroplate board and the work piece surface, make the inside plating solution of micro-electrolysis cell body be difficult to flow to the rest positions on work piece surface from the gap between electroplate board and the work piece, effectively promote the quality of work piece surface electroplating.

Optionally, the electroplating opening is provided with a plurality of openings distributed on the electroplating plate, and the plurality of openings are different in shape.

By adopting the technical scheme, the plating layers in various shapes can be formed on the surface of the same plate workpiece by electroplating by utilizing the electroplating openings in different shapes on the same electroplating plate, so that the applicable processing range is expanded.

Optionally, the electroplating plate is detachably connected with a sealing block which is in one-to-one correspondence with the electroplating openings and seals the electroplating openings in a sealing manner.

Through adopting above-mentioned technical scheme, when the plating layer of needs shaping specific shape, utilize the closed block to seal and block other different electroplating mouths that need fashioned shape by the staff, then after installing this electroplate board to little electrolytic cell body, only required electroplating mouth and little electrolytic cell body inside intercommunication, and other seal by the closed block to be convenient for select the electroplating mouth of different shapes according to the fashioned plating layer of needs, further reduction in production cost.

Optionally, the sealing block has elasticity and is embedded in the inner wall of the electroplating opening in a sealing manner, and the bottom of the sealing block and the bottom of the electroplating plate are arranged on the same plane.

Through adopting above-mentioned technical scheme, this seals piece not only can seal unnecessary electroplating mouth, can play sealed effect again simultaneously, avoids the inside plating solution of micro-electrolysis cell body can outwards ooze from the electroplating mouth department that need not use, utilizes to seal the piece bottom in addition can further with the sealing performance between the work piece surface by force.

Optionally, the closing block is provided with a through hole penetrating through the upper end surface and the lower end surface of the closing block.

Through adopting above-mentioned technical scheme, when the closure block is filled in the grafting, can change the diameter or the size of electroplating mouth itself, then can come to change the size of original electroplating mouth through the closure block according to the fashioned electroplating layer size of actual needs to can be suitable for more different electroplating demands, and reduction in production cost.

Optionally, the electroplating opening inner wall is connected with the erection column along vertical direction sliding, the erection column bottom is connected with and is used for sealed conflict in the bottom piece that the work piece deviates from a side of the electroplate board.

Through adopting above-mentioned technical scheme, rely on electroplating board and the bottom piece that is located surface about the work piece respectively, can electroplate to the trompil inner wall on the work piece, then the trompil on the work piece is linked together with the electroplating mouth on the electroplating board, and bottom board and work piece bottom surface keep sealed simultaneously, and then the plating solution can enter into inside the trompil of work piece to accomplish and electroplate, promoted the monoblock and electroplated the scope that board was suitable for, reduction in production cost.

To sum up, the local electroplating device for the micro-electrolytic cell has the following beneficial technical effects that:

1. the electroplating plate connected to the bottom of the micro-electrolysis cell body in a sealing and detachable mode is utilized, electroplating holes with different sizes or shapes on the electroplating plate can be selected according to electroplating layers with different shapes which are formed in actual needs, the whole micro-electrolysis cell body does not need to be directly replaced, and the electroplating production cost is effectively reduced;

2. the combination is connected in the erection column and the bottom piece of electroplating mouthful inner wall, can accomplish to the inner wall of trompil on the work piece and electroplate, has promoted the applicable scope of whole electroplating to manufacturing cost has been reduced.

Drawings

Fig. 1 is a schematic cross-sectional view of a local electroplating apparatus for a micro-electrolytic cell according to example 1 of the present application.

Fig. 2 is a schematic cross-sectional view of a local electroplating apparatus for a micro-electrolytic cell according to example 2 of the present application.

Fig. 3 is a schematic cross-sectional view of a plating plate of a micro-electrolytic cell local plating apparatus according to embodiment 3 of the present application.

Fig. 4 is a schematic cross-sectional view of a plating plate of a micro-electrolytic cell local plating apparatus according to embodiment 4 of the present application.

Fig. 5 is a schematic cross-sectional view of a plating plate of a micro-electrolytic cell partial plating apparatus according to example 5 of the present application.

Description of reference numerals: 1. a micro-electrolysis cell body; 2. an inert anode; 3. a connecting port; 4. electroplating a plate; 5. electroplating the opening; 6. a connecting ring; 7. a seal ring; 8. a sealing strip; 9. a sealing block; 91. a through port; 10. mounting a column; 11. a bottom block; 12. an upper opening; 13. a mounting frame; 14. a metal bearing; 15. a motor; 16. and (4) discharging the water.

Detailed Description

The present application is described in further detail below with reference to figures 1-5.

The embodiment of the application discloses a local electroplating device of a micro-electrolytic cell.

Example 1

Referring to fig. 1, the local electroplating device of the micro-electrolytic cell comprises a hollow cylindrical micro-electrolytic cell body 1, wherein the upper end of the micro-electrolytic cell body 1 is provided with an upper opening 12 communicated with the interior of the micro-electrolytic cell body, the bottom of the micro-electrolytic cell body 1 is provided with a connecting port 3 communicated with the interior of the micro-electrolytic cell body, the upper end of the micro-electrolytic cell body 1 is provided with an inert anode 2 extending into the interior of the micro-electrolytic cell body, during the electroplating process, electrolyte is introduced into the interior of the micro-electrolytic cell body 1 and immerses the inert anode 2, a flat workpiece is arranged at the bottom of the micro-electrolytic cell body 1, the inert anode 2 is connected with a power supply anode, a plated workpiece is connected with a power supply cathode to form an electrochemical cathode-anode system, and under the action of an electric field, metal ions in an electroplating solution are reduced on a cathode to generate a metal plating layer with the same shape as the connecting port 3.

In order to change the shape of the formed plating layer on the surface of a workpiece, the bottom of the micro-electrolysis cell body 1 is detachably connected with a flat-plate-shaped electroplating plate 4, the electroplating plate 4 is made of the same material as the micro-electrolysis cell body 1, the material of the electroplating plate is PE or PP, polytetrafluoroethylene layers are coated on the electroplating plate 4 and the inner wall surfaces of the micro-electrolysis cell body 1, at least one electroplating opening 5 penetrating through the upper end surface and the lower end surface of the electroplating plate 4 is formed in the electroplating plate 4, and the shape of the electroplating opening 5 can be changed and designed according to the shape of the formed plating layer required actually. In order to be convenient for connect electroplating plate 4 and the bottom of little electrolysis cell body 1, upper end integrated into one piece who electroplates plate 4 has and is annular go-between 6, it is located the annular range that go-between 6 constitutes to electroplate mouthful 5, go-between 6 perpendicular to electroplates the up end of plate 4, the inner wall of go-between 6 and the outer wall threaded connection of little electrolysis cell body 1, and the juncture position department at the inner wall of go-between 6 and 4 upper surfaces of electroplate plate inlays and is equipped with and is annular sealing washer 7, in order to promote the leakproofness, also inlay on the bottom terminal surface of little electrolysis cell body 1 and be equipped with the sealing ring that can support tightly in 4 upper surfaces of electroplate plate. The electrolyte inside the micro-electrolysis cell body 1 is difficult to leak from between the connection ring 6 and the micro-electrolysis cell body 1 during the actual electroplating process.

In order to improve the sealing performance between the workpiece and the electroplating plate 4 in the electroplating process, a sealing strip 8 is embedded in the edge of the electroplating opening 5 of the lower end face of the electroplating plate 4 departing from the micro-electrolysis cell body 1, and when the electroplating plate 4 is abutted against the surface of the workpiece, the sealing effect is realized between the bottom of the electroplating plate 4 and the surface of the workpiece.

For better installation inertia positive pole 2, fixed welding has mounting bracket 13 at the top of little electrolysis cell body 1, inertia positive pole 2 is the bar-like and stretches into to little electrolysis cell body 1 inside, central point at mounting bracket 13 puts and inlays and be equipped with a metal bearing 14, metal bearing 14 is coaxial with little electrolysis cell body 1, inertia positive pole 2 wears to locate metal bearing 14 center and contradicts and connects in metal bearing 14's inner circle, fixed mounting has a motor 15 on mounting bracket 13, the output shaft of motor 15 is vertical and sets up downwards, bolt fixed connection is passed through with inertia positive pole 2's upper end to the output shaft of motor 15. In the electroplating process, the inert anode 2 is driven by the motor 15 to be stirred in the electroplating solution, so that the concentration polarization of metal ions in the solution in the micro-electrolysis cell body 1 can be improved, and the thickness of a plating layer is more uniform.

Meanwhile, in order to facilitate the discharge of the solution inside the micro-electrolysis cell body 1, a discharge pipe 16 communicated with the inside and capable of penetrating the connecting ring 6 is connected to the position, close to the bottom, of the outer side wall of the micro-electrolysis cell body 1 in a sealing threaded manner, and after the connecting ring 6 is installed on the outer wall of the micro-electrolysis cell body 1, the discharge pipe 16 penetrates the connecting ring 6 and is connected to the micro-electrolysis cell body 1 in a sealing threaded manner.

The implementation principle of the local electroplating device of the micro-electrolytic cell in the embodiment of the application is as follows: according to the shape of the plating layer to be formed on the surface of the workpiece, selecting a plating plate 4 with a plating port 5 with the same shape as the shape to be formed, carrying out sealed threaded connection on a connecting ring 6 of the plating plate 4 and the micro-electrolysis cell body 1, aligning the plating port 5 on the plating plate 4 to the position to be plated on the surface of the workpiece, and enabling the bottom of the plating plate 4 to be in sealed abutting joint with the upper surface of the workpiece. The anode of the power supply is connected with the metal bearing 14, the cathode of the power supply is connected with the workpiece, and the internal electrolyte is enabled to electroplate the surface position of the workpiece corresponding to the electroplating opening 5 under the action of the electric field and under the stirring of the inert anode 2.

Example 2

Referring to fig. 2, a local electroplating device for a micro-electrolytic cell is different from that of embodiment 1 in that the outer wall of a connecting ring 6 is in threaded connection with the inner wall of a connecting port 3 of a micro-electrolytic cell body 1, and a sealing ring 7 is embedded in the outer wall of the connecting ring 6 at a position close to an electroplating plate 4, so that the sealing performance between the connecting ring 6 and the inner wall of the micro-electrolytic cell body 1 is realized.

Example 3

Referring to fig. 3, a local electroplating device for a micro-electrolytic cell is different from embodiment 1 in that a plurality of electroplating openings 5 are uniformly distributed around the circumference of a central vertical line of an electroplating plate 4, each electroplating opening 5 has a different shape, a sealing block 9 having the same shape as the electroplating opening 5 is embedded in each electroplating opening 5, each sealing block 9 is made of a polytetrafluoroethylene material having elasticity, the size of each sealing block 9 is slightly larger than that of each electroplating opening 5, after the sealing blocks 9 are plugged into the electroplating openings 5, the inner walls of the sealing blocks 9 and the electroplating openings 5 are sealed, the corresponding electroplating openings 5 can be sealed, and after the sealing blocks 9 are plugged into the electroplating openings 5, the bottoms of the sealing blocks 9 and the bottoms of the electroplating plates 4 are arranged on the same plane. In the actual electroplating process, the sealing blocks 9 in the electroplating openings 5 required to be used can be taken out, and the sealing blocks 9 in other electroplating openings 5 are plugged, so that the subsequent electroplating is carried out.

Example 4

Referring to fig. 4, a local electroplating device for a micro-electrolytic cell, the difference between this embodiment and embodiment 3 is that the centers of a plurality of sealing blocks 9 are provided with through holes 91 penetrating the upper and lower end surfaces thereof, the shape of the through holes 91 is the same as that of the corresponding electroplating holes 5, and the size of the electroplating holes 5 is only reduced in proportion, so that the sealing blocks 9 having the through holes 91 with different sizes can be plugged into the electroplating holes 5 according to the actual electroplating requirements, and further more electroplating requirements can be met.

Example 5

Referring to fig. 5, a local electroplating device of micro-electrolytic cell, the difference between this embodiment and embodiment 1 lies in, it is connected with two erection columns 10 to slide along vertical direction at the inner wall of electroplating mouth 5, erection column 10 outer wall is the arc and contradicts in the inner wall of electroplating mouth 5, the bottom fixedly connected with of erection column 10 is parallel bottom piece 11 with electroplating plate 4, inlay in bottom piece 11 towards electroplating plate 4's surface and be equipped with along electroplating mouth 5 work piece trompil edge setting's sealing strip 8, then aim at electroplating mouth 5 in electroplating plate 4 with the trompil of work piece earlier, and upwards stretch into and slide erection column 10 from electroplating mouth 5 is interior, rely on gravity, make bottom piece 11 support tightly in the diapire of work piece, thereby can electroplate the trompil inner wall of work piece.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a little electrolytic cell local plating device, includes little electrolytic cell body (1) that has last opening (12), arranges inert anode (2) in little electrolytic cell body (1) in which characterized in that: the bottom of the micro-electrolysis cell body (1) is provided with a connector (3) communicated with the interior of the micro-electrolysis cell body, the micro-electrolysis cell body (1) is connected with an electroplating plate (4) along the edge of the connector (3) in a sealing and detachable manner, and the electroplating plate (4) is provided with an electroplating opening (5) matched with a plating layer required to be formed by a workpiece.

2. The local electroplating device of the micro-electrolytic cell according to claim 1, characterized in that: electroplate board (4) along its marginal integrated into one piece have and be annular go-between (6), go-between (6) threaded connection is in the inner wall of connector (3) or little electrolysis cell body (1) outer wall, be provided with between go-between (6) and little electrolysis cell body (1) lateral wall sealing washer (7).

3. The local electroplating device of the micro-electrolytic cell according to claim 1, characterized in that: and a sealing strip (8) which is in sealing fit with the surface of the workpiece is arranged on one side of the electroplating plate (4) departing from the micro-electrolysis cell body (1) along the edge of the electroplating opening (5).

4. The local electroplating device of the micro-electrolytic cell according to claim 1, characterized in that: the electroplating openings (5) are provided with a plurality of electroplating openings (5) distributed on the electroplating plate (4), and the shapes of the electroplating openings (5) are different.

5. The apparatus according to claim 4, wherein: the electroplating plate (4) is hermetically and detachably connected with sealing blocks (9) which correspond to the electroplating openings (5) one by one and seal the electroplating openings (5).

6. The apparatus according to claim 5, wherein: the sealing block (9) is elastic and is embedded in the inner wall of the electroplating opening (5) in a sealing manner, and the bottom of the sealing block (9) and the bottom of the electroplating plate (4) are arranged on the same plane.

7. The apparatus according to claim 6, wherein: the sealing block (9) is provided with a through hole (91) penetrating through the upper end surface and the lower end surface of the sealing block.

8. The apparatus according to claim 3, wherein: electroplating mouth (5) inner wall and sliding along vertical direction and being connected with erection column (10), erection column (10) bottom is connected with and is used for sealed conflict to deviate from bottom piece (11) of electroplating board (4) a side in the work piece.