CN209779005U

CN209779005U - Electrodeposition copper recovery device and copper recovery production line applying same

Info

Publication number: CN209779005U
Application number: CN201920499989.3U
Authority: CN
Inventors: 李建光
Original assignee: Shenzhen Hongda Environment Technology Co Ltd
Current assignee: Zhuzhou Jiwei Environmental Technology Co ltd
Priority date: 2019-04-12
Filing date: 2019-04-12
Publication date: 2019-12-13
Anticipated expiration: 2029-04-12

Abstract

The utility model provides a line is produced in copper recovery of electrodeposition recovery copper device and applied it, a line is produced in copper recovery includes the electrodeposition recovery copper device, and the electrodeposition recovery copper device includes: the cylinder body comprises a bottom plate and a side plate, the bottom plate and the side plate are enclosed to form a reaction tank, and the circulating assembly comprises an overflow box, an overflow pipe, a pump body and a spraying structure. The in-process of electrolysis in the reaction tank is packed into to alkaline etching waste liquid, can follow the reaction tank internal flow to the overflow box, later under the drive of the pump body, etching waste liquid in the overflow box flows through the overflow pipe, feed liquor pipe and shower, spray hole blowout to the bottom of reaction tank on the shower at last, form the closed circuit that alkaline etching waste liquid flows promptly, make the etching waste liquid of co-altitude not obtain the intensive mixing in the reaction tank, concentration is more even, can effectively improve the efficiency when copper ion is reduced on the negative plate, and make the shape more even after the copper ion reduction.

Description

Electrodeposition copper recovery device and copper recovery production line applying same

Technical Field

The utility model belongs to the technical field of the copper is retrieved, especially, relate to a line is produced in copper recovery of electrodeposition recovery copper device and applied it.

Background

A large amount of copper-containing alkaline etching solution is discharged at the cleaning section of a production line for etching a PCB, electroplating copper, chemically plating copper and the like, the etching solution contains a large amount of copper elements, and if the copper-containing alkaline etching solution is directly discharged, copper resources are wasted, and the environment is seriously polluted.

For the copper-containing alkaline etching solution, copper can be recovered by adopting an electrolytic deposition method, but in the prior art, the problems of low efficiency and uneven shape when copper ions are reduced on a cathode plate due to uneven concentration of the alkaline etching waste solution in an electrodeposition device exist.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a copper device is retrieved in electrodeposition and its copper recovery line of using is provided, alkaline etching waste liquid concentration in can making the electrodeposition device is even to improve the efficiency of copper ion when being reduced on the negative plate, and make the shape more even after the copper ion reduction.

In order to solve the technical problem, the utility model discloses a realize like this, a copper device is retrieved in electrodeposition, include: cylinder body, negative pole, positive pole, upper cover and circulation subassembly, the cylinder body includes bottom plate and curb plate, the bottom plate with the curb plate encloses to close and forms the reaction tank, the negative pole with the positive pole sets up in the reaction tank, the upper cover is used for the lid to close sealedly on the reaction tank, the circulation subassembly includes overflow box, overflow pipe, the pump body and sprays the structure, the overflow box sets up being close to reaction tank notch department of curb plate, the overflow box with the reaction tank intercommunication, it sets up to spray the structure the tank bottom department of reaction tank, it includes feed liquor pipe and shower to spray the structure, the shower is connected on the feed liquor pipe, evenly seted up on the shower and sprayed the hole, the overflow pipe intercommunication the overflow box with the feed liquor pipe, the pump body with the overflow pipe is connected, the pump body drive etching waste liquid in the overflow box flows through in proper order overflow pipe, shower, The liquid inlet pipe and the spraying pipe are sprayed into the reaction tank.

Furthermore, the overflow box is tightly attached to the corresponding side plate, a plurality of overflow ports which are uniformly distributed are formed in the corresponding side plate, and the corresponding overflow box is communicated with the reaction tank through the overflow ports.

Furthermore, at least two liquid inlet holes are formed in the positions, close to the bottom plate, of the corresponding side plates, the spraying structure comprises at least two liquid inlet pipes, each liquid inlet pipe is assembled with each liquid inlet hole in a one-to-one correspondence mode, and at least two spraying pipes are arranged between every two adjacent liquid inlet pipes.

Further, the spray structure still includes the supporting seat, the top of supporting seat be provided with the arc structure that the shower matches, the supporting seat sets up the shower with between the bottom plate, the supporting seat is used for bearing the shower.

Further, the spraying structure further comprises a flow equalizing plate, the flow equalizing plate is arranged above the spraying pipe and parallel to the bottom plate, and flow equalizing holes are uniformly formed in the flow equalizing plate.

Furthermore, the outer hoops of the side plates are provided with outer reinforcing ribs, the inner sides of the two opposite side plates are provided with inner reinforcing ribs in the vertical direction, the edges of the corresponding sides of the flow equalizing plate are provided with notches, and when the flow equalizing plate is assembled in the reaction tank, the inner reinforcing ribs penetrate through the notches.

Furthermore, a circle of horizontal reinforcing panel is arranged at the upper edge of the side plate, and the overflow box is tightly attached to the bottom side of the reinforcing panel; two relatively the top of curb plate is provided with electrically conductive side copper respectively, just electrically conductive side copper sets up strengthen the upside of panel, two that correspond the inboard of curb plate is provided with the cathode draw-in groove and the positive pole draw-in groove of one-to-one, the cathode draw-in groove with the even interval of positive pole draw-in groove sets up and equal vertical extension, the inner circle of strengthening the panel is provided with the round flange board that upwards extends, with the constant head tank has been seted up on the flange board that electrically conductive side copper corresponds the side, the cathode with the positive pole inlay in when in the constant head tank, the cathode with the positive pole is connected with the electrically conductive side copper electricity that corresponds respectively, just the cathode with the positive pole inlays respectively in the cathode draw-in groove with in the positive pole.

Furthermore, a separation sleeve is arranged on the positioning groove and made of a teflon material.

Further, still include the convulsions structure, the convulsions structure includes exhaust box and exhaust column, the exhaust box sets up the upside of strengthening the panel and paste tightly the flange board, the gas outlet has been seted up on the corresponding position of flange board, the gas outlet intercommunication the reaction tank with the exhaust box, the exhaust column is connected the exhaust box.

Further, a copper recovery production line is provided, which comprises the electrodeposition copper recovery device.

The utility model discloses well electrodeposition retrieves copper device and uses its copper recovery production line to compare with prior art, beneficial effect lies in:

The in-process of electrolysis in the reaction tank is packed into to alkaline etching waste liquid, can follow the reaction tank internal flow to the overflow box, later under the drive of the pump body, etching waste liquid in the overflow box flows through the overflow pipe, feed liquor pipe and shower, spray hole blowout to the bottom of reaction tank on the shower at last, form the closed circuit that alkaline etching waste liquid flows promptly, make the etching waste liquid of co-altitude not obtain the intensive mixing in the reaction tank, concentration is more even, can effectively improve the efficiency when copper ion is reduced on the negative plate, and make the shape more even after the copper ion reduction.

Drawings

Fig. 1 is a schematic perspective exploded view of an electrodeposition copper recovery device according to an embodiment of the present invention.

In the drawings, each reference numeral denotes: 1. a cylinder body; 11. a base plate; 12. a side plate; 13. a reinforcement panel; 121. an overflow port; 122. reinforcing ribs are additionally arranged; 123. inner reinforcing ribs; 124. a cathode clamping groove; 125. an anode neck; 131. a flange plate; 1311. positioning a groove; 1312. an air outlet; 2. an upper cover; 3. a circulation component; 31. an overflow box; 32. a spraying structure; 33. a supporting seat; 34. a flow equalizing plate; 321. a liquid inlet pipe; 322. a shower pipe; 341. a notch; 4. conductive square copper; 5. an air draft structure; 51. an air draft box; 52. and (5) exhausting the air pipe.

Detailed Description

in order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example (b):

In this embodiment, there is provided a copper recycling line (not shown) for electrolyzing copper sulfate, including an electrodeposition copper recycling apparatus, wherein, as shown in fig. 1, the electrodeposition copper recycling apparatus includes: the device comprises a cylinder body 1, a cathode (not shown), an anode (not shown), an upper cover 2 and a circulating assembly 3, wherein the cylinder body 1 comprises a bottom plate 11 and a side plate 12, the bottom plate 11 and the side plate 12 enclose to form a reaction tank, the cathode and the anode are arranged in the reaction tank, the upper cover 2 is used for covering and sealing the reaction tank, the circulating assembly 3 comprises an overflow box 31, the overflow pipe, the pump body and spray structure 32, overflow box 31 sets up the reaction tank notch department that is close to of curb plate 12, overflow box 31 and reaction tank intercommunication, spray structure 32 sets up the tank bottom department at the reaction tank, spray structure 32 includes feed liquor pipe 321 and shower 322, shower 322 is connected on feed liquor pipe 321, spray hole has evenly been seted up on shower 322, overflow pipe intercommunication overflow box 31 and feed liquor pipe 321, the pump body is connected with the overflow pipe, the overflow pipe is flowed through in proper order to the etching waste liquid in the pump body drive overflow box 31, spray to the reaction tank behind feed liquor pipe 321 and the shower 322.

The in-process of electrolysis in the reaction tank is packed into to alkaline etching waste liquid, can follow the reaction tank internal flow to overflow box 31, later under the drive of the pump body, the etching waste liquid in the overflow box 31 flows through the overflow pipe, feed liquor pipe 321 and shower 322, spray the bottom to the reaction tank from the spray hole on the shower 322 at last, form the closed circuit that alkaline etching waste liquid flows promptly, make the etching waste liquid of co-altitude not obtain the intensive mixing in the reaction tank, concentration is more even, efficiency when can effectively improve copper ion by the reduction on the negative plate, and make the shape more even after the copper ion reduction.

The overflow box 31 is tightly attached to the corresponding side plate 12, a plurality of overflow ports 121 which are uniformly distributed are formed in the corresponding side plate 12, and the corresponding overflow box 31 is communicated with the reaction tank through the overflow ports 121. Specifically, in the present embodiment, the side plate 12 includes: preceding curb plate, the posterior lateral plate, left side board and right side board, respectively be provided with an overflow box 31 on preceding curb plate and the posterior lateral plate, and two overflow boxes 31 pass through the overflow board intercommunication, in order to strengthen overflow box 31's structural strength, even interval is provided with the enhancement piece in the overflow box 31, and seted up the opening on the reinforcing plate and supplied etching waste liquid to flow, because all set up overflow box 31 in relative both sides, consequently, be located the overflow box 31 that high-order etching waste liquid can flow to both sides in the reaction tank, and the phenomenon of flowing to overflow box 31 from single side can not appear, make etching waste liquid more even when mixing, the effect is better.

The position department that the curb plate 12 that corresponds is close to bottom plate 11 has seted up two at least feed liquor holes, and spraying structure 32 includes two at least feed liquor pipes 321, and each feed liquor pipe 321 and each feed liquor hole one-to-one assembly all are provided with two at least shower 322 between the adjacent feed liquor pipe 321. In this embodiment, for example, the spraying pipe 322 includes two liquid inlet pipes 321, a liquid inlet hole is respectively opened at a position close to the left side plate and the right side plate respectively at the bottom of the rear side plate, the positions of the two liquid inlet holes are approximately symmetrical, the two liquid inlet pipes 321 are respectively assembled with the liquid inlet holes, the liquid inlet pipes 321 are parallel to each other, the liquid inlet pipes 321 are communicated with the overflow box 31 through overflow pipes, three spraying pipes 322 are arranged between the two liquid inlet pipes 321, the three spraying pipes 322 are all perpendicular to the liquid inlet pipes 321, and the three liquid inlet pipes 321 are uniformly distributed in the bottom region of the reaction tank, so the etching waste liquid can be uniformly sprayed to the bottom of the reaction tank from the spraying pipes 322. In other embodiments, the spraying structure 32 may include three, four, five, etc. liquid inlet pipes 321, two, four, five, etc. spraying pipes 322 may be disposed between adjacent liquid inlet pipes 321, and the spraying pipes 322 may form an angle with the liquid inlet pipes 321, for example: 30 degrees and 60 degrees, and the spray pipes 322 can also be arranged in a crossed way. Liquid supplementing holes and liquid outlet holes are formed in the bottom of the cylinder body 1, the liquid supplementing holes and the liquid outlet holes can be formed in the bottom plate 11 and can also be formed in the side plate 12, etching waste liquid can enter the reaction tank through the pipeline liquid supplementing holes to be electrolyzed, and waste liquid after electrolysis can be discharged from an external pipeline through the liquid outlet holes.

in order to stably mount the spray structure 32 in the reaction tank, the spray structure 32 further comprises a support seat 33, an arc structure matched with the spray pipe 322 is arranged at the top of the support seat 33, the support seat 33 is arranged between the spray pipe 322 and the bottom plate 11, and the support seat 33 is used for bearing the spray pipe 322. In this embodiment, the supporting seat 33 is the separation setting, and every shower 322 all evenly is provided with three supporting seat 33 and bears, and in other embodiments, every shower 322 can set up two, four, five supporting seat 33 of waiting and bear, can set up the connecting rod between the supporting seat 33 to the bulk movement, it is more convenient.

In order to further make the concentration of the etching waste liquid uniform, in the embodiment, the spraying structure 32 further includes a flow equalizing plate 34, the flow equalizing plate 34 is disposed above the spraying pipes 322, the flow equalizing plate 34 is parallel to the bottom plate 11, the flow equalizing plate 34 is uniformly provided with flow equalizing holes, and the etching waste liquid can be further dispersed through the flow equalizing plate 34 after being sprayed out from the spraying pipes 322, so that the concentration of the etching waste liquid in the reaction tank is more uniform. In the present embodiment, the flow equalizing hole is a straight hole communicating the upper and lower surfaces of the flow equalizing plate 34; in other embodiments, the flow equalizing holes communicate between the upper and lower surfaces of the flow equalizing plate 34, but the channels of the flow equalizing holes may be curved; in other embodiments, the flow equalizing plates 34 may be arranged in two, three, four, etc. and the flow equalizing holes between adjacent flow equalizing plates 34 are offset, so that the etching waste can be further mixed when passing through the flow equalizing plates 34.

In order to improve the structural strength of the cylinder 1, the outer hoop of the side plate 12 is provided with an outer reinforcing rib 122, the inner sides of the two opposite side plates 12 are provided with inner reinforcing ribs 123 in the vertical direction, the corresponding side edges of the flow equalizing plate 34 are provided with notches 341, and when the flow equalizing plate 34 is assembled in the reaction tank, the inner reinforcing ribs 123 penetrate through the notches 341. In this embodiment, two rings of outer reinforcing ribs 122 are provided around the cylinder body 1, two inner reinforcing ribs 123 are provided on the inner sides of the left and right side plates, respectively, and the outer reinforcing ribs 122 and the inner reinforcing ribs 123 are fixed on the cylinder body 1 by welding using channel steel with a size of 80mm × 40mm × 5 mm. In other embodiments, the outer reinforcing ribs 122 may be provided in one, three, four, etc., and the inner reinforcing ribs 123 may be provided in one, three, four, etc., depending on the size of the electrodeposition copper recovery apparatus.

A circle of horizontal reinforcing panels 13 are arranged at the upper edges of the side plates 12, and the overflow boxes 31 are closely arranged at the bottom sides of the reinforcing panels 13; the top of relative both sides board 12 is provided with electrically conductive side copper 4 respectively, and electrically conductive side copper 4 sets up the upside at reinforcing panel 13, the inboard of corresponding both sides board 12 is provided with the cathode draw-in groove 124 and the positive pole draw-in groove 125 of one-to-one, cathode draw-in groove 124 and the even interval of positive pole draw-in groove 125 set up and equal vertical extension, the inner circle of reinforcing panel 13 is provided with the round flange board 131 that upwards extends, the constant head tank 1311 has been seted up on the flange board 131 of the side that corresponds with electrically conductive side copper 4, when negative pole and positive pole inlay card were in constant head tank 1311, negative pole and positive pole are connected with the electrically conductive side copper 4 electricity that corresponds respectively, and negative pole and positive pole inlay respectively in cathode draw-. The cathode and the anode are assembled through the cathode clamping groove 124 and the anode clamping groove 125 respectively, the working reliability of the cathode and the anode can be guaranteed in the electrolytic process, coating square bar cast iron (not shown) is arranged on the cathode and the anode, the cathode and the anode are locked by the dead weight of the coating square bar cast iron and three screws, an anti-corrosion coating is plated on the surface of the square bar coating cast iron, and a groove matched with the conductive square copper in 4 size is formed in the bottom of the square bar coating cast iron. A spacer sleeve (not shown) is arranged on the positioning groove 1311, and the spacer sleeve is made of teflon, so that the positioning groove 1311 is prevented from being damaged due to high temperature in the electrolysis process.

Copper installation is retrieved in electrodeposition still includes convulsions structure 5, and convulsions structure 5 includes convulsions box 51 and exhaust column 52, and convulsions box 51 sets up the upside of reinforcing panel 13 and pastes tight flange board 131, has seted up gas outlet 1312 on the corresponding position of flange board 131, and gas outlet 1312 intercommunication reaction tank and convulsions box 51, and box 51 is drawn in the connection of exhaust column 52. The box 51 that draws air sets up in the corresponding department with left side board and right side board of strengthening panel 13, and the both ends of reacting groove all are provided with a box 51 that draws air promptly, and the air in the reacting groove enters into the box 51 that draws air from both sides, later takes out by the exhaust column 52 and leaves, can guarantee the amount of air suction with the top that the box 51 that draws air designed to strengthen panel 13, can also avoid taking out etching waste liquid to prevent that the exhaust column 52 from blockking up because of the crystallization, it is more reliable.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An electrodeposition copper recovery apparatus, comprising: cylinder body (1), negative pole, positive pole, upper cover (2) and circulation subassembly (3), cylinder body (1) includes bottom plate (11) and curb plate (12), bottom plate (11) with curb plate (12) enclose to close and form the reaction tank, the negative pole with the positive pole sets up in the reaction tank, upper cover (2) are used for the lid to close sealed on the reaction tank, circulation subassembly (3) include overflow box (31), overflow pipe, the pump body and spray structure (32), overflow box (31) set up being close to reaction tank notch department of curb plate (12), overflow box (31) with the reaction tank intercommunication, spray structure (32) set up the tank bottom department of reaction tank, spray structure (32) including feed liquor pipe (321) and shower (322), shower (322) are connected on feed liquor pipe (321), the shower hole has evenly been seted up on shower (322), the overflow pipe is communicated with the overflow box (31) and the liquid inlet pipe (321), the pump body is connected with the overflow pipe, and the pump body drives etching waste liquid in the overflow box (31) to sequentially flow through the overflow pipe, the liquid inlet pipe (321) and the spray pipe (322) and then spray into the reaction tank.

2. The copper electrodeposition recovery device according to claim 1, wherein the overflow boxes (31) are tightly attached to the corresponding side plates (12), a plurality of overflow ports (121) are uniformly distributed on each corresponding side plate (12), and the corresponding overflow boxes (31) are communicated with the reaction tank through the overflow ports (121).

3. The copper electrodeposition recovery device according to claim 1, wherein at least two liquid inlet holes are formed in the positions, close to the bottom plate (11), of the corresponding side plates (12), the spraying structure (32) comprises at least two liquid inlet pipes (321), each liquid inlet pipe (321) is correspondingly assembled with each liquid inlet hole one by one, and at least two spraying pipes (322) are arranged between every two adjacent liquid inlet pipes (321).

4. The copper electrodeposition recovery device according to claim 3, wherein the spray structure (32) further comprises a support base (33), the top of the support base (33) is provided with an arc structure matching the spray pipe (322), the support base (33) is arranged between the spray pipe (322) and the bottom plate (11), and the support base (33) is used for bearing the spray pipe (322).

5. The copper electrodeposition recovery device according to any one of claims 1 to 4, wherein the spray structure (32) further comprises a flow equalizing plate (34), the flow equalizing plate (34) is disposed above the spray pipes (322), the flow equalizing plate (34) is parallel to the bottom plate (11), and flow equalizing holes are uniformly formed in the flow equalizing plate (34).

6. The copper electrodeposition recovery device according to claim 5, wherein the side plates (12) are externally hooped with external reinforcing ribs (122), the inner sides of the two opposite side plates (12) are provided with vertical internal reinforcing ribs (123), the corresponding side edges of the flow equalizing plate (34) are provided with notches (341), and when the flow equalizing plate (34) is assembled in the reaction tank, the internal reinforcing ribs (123) penetrate through the notches (341).

7. The copper electrodeposition recovery device according to claim 5, characterized in that the upper edge of the side plate (12) is provided with a horizontal reinforcing panel (13), and the overflow box (31) is closely arranged on the bottom side of the reinforcing panel (13); conductive square copper (4) is respectively arranged above the two opposite side plates (12), and the conductive square copper (4) is arranged on the upper side of the reinforcing panel (13), the inner sides of the two corresponding side plates (12) are provided with a cathode clamping groove (124) and an anode clamping groove (125) which are in one-to-one correspondence, the cathode clamping grooves (124) and the anode clamping grooves (125) are uniformly arranged at intervals and vertically extend, the inner ring of the reinforcing panel (13) is provided with a ring of flange plates (131) extending upwards, a positioning groove (1311) is arranged on the flange plate (131) at the side corresponding to the conductive square copper (4), when the cathode and the anode are clamped in the positioning groove (1311), the cathode and the anode are respectively and electrically connected with the corresponding conductive square copper (4), and the cathode and the anode are respectively embedded in the cathode clamping groove (124) and the anode clamping groove (125).

8. The electrodeposition copper recovery device according to claim 7, wherein the positioning groove (1311) is provided with a spacer sleeve, and the spacer sleeve is made of Teflon material.

9. The copper electrodeposition recovery device according to claim 7, further comprising an air draft structure (5), wherein the air draft structure (5) comprises an air draft box (51) and an air draft pipe (52), the air draft box (51) is arranged on the upper side of the reinforcement panel (13) and is tightly attached to the flange plate (131), an air outlet (1312) is formed in a corresponding position of the flange plate (131), the air outlet (1312) is communicated with the reaction tank and the air draft box (51), and the air draft pipe (52) is connected with the air draft box (51).

10. A copper recovery line comprising an electrodeposition copper recovery apparatus according to any one of claims 1 to 9.