CN109852996A - A kind of electro-deposition recycling copper device and the copper recycling producing line using it - Google Patents
A kind of electro-deposition recycling copper device and the copper recycling producing line using it Download PDFInfo
- Publication number
- CN109852996A CN109852996A CN201910294797.3A CN201910294797A CN109852996A CN 109852996 A CN109852996 A CN 109852996A CN 201910294797 A CN201910294797 A CN 201910294797A CN 109852996 A CN109852996 A CN 109852996A
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- copper
- plate
- spray
- reactive tank
- electro
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000010949 copper Substances 0.000 title claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 54
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 26
- 238000004064 recycling Methods 0.000 title claims abstract description 19
- 239000007921 spray Substances 0.000 claims abstract description 76
- 238000005530 etching Methods 0.000 claims abstract description 31
- 239000002699 waste material Substances 0.000 claims abstract description 28
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 230000002787 reinforcement Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 15
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 9
- 229910001431 copper ion Inorganic materials 0.000 abstract description 9
- 238000005868 electrolysis reaction Methods 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910001018 Cast iron Inorganic materials 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
Producing line is recycled the present invention provides a kind of electro-deposition recycling copper device and using its copper, a kind of copper recycling producing line includes electro-deposition recycling copper device, it includes: cylinder body, cathode, anode, upper cover and recirculation assembly that copper device is recycled in electro-deposition, cylinder body includes bottom plate and side plate, bottom plate and side plate are enclosed reactive tank, and recirculation assembly includes spill case, overflow pipe, the pump housing and spray structure.During alkaline etching waste liquid for producing is packed into reactive tank Inner electrolysis, spill case can be flowed to out of reactive tank, later under the driving of the pump housing, etching waste liquor in spill case flows through overflow pipe, inlet tube and spray tube, the bottom of reactive tank is finally ejected into from the spray apertures on spray tube, form the closed circuit of alkaline etching waste liquid for producing flowing, so that the etching waste liquor of different height is sufficiently mixed in reactive tank, concentration is more uniform, efficiency of the copper ion when being reduced on cathode plate can be effectively improved, and keeps shape after copper ion reduction more uniform.
Description
Technical field
The invention belongs to copper recovery technology field more particularly to a kind of electro-deposition recycling copper device and using its copper recycling
Producing line.
Background technique
The production lines cleaning sections such as etching pcb board, electro-coppering, electroless copper can discharge a large amount of cupric alkaline etching liquid, and
It can also seriously be polluted containing a large amount of copper if cupric alkaline etching liquid direct emission can be wasted copper resource in etching solution
Environment.
For cupric alkaline etching liquid, copper can be recycled using strike, but in the prior art, there are electro-deposition dresses
Alkaline etching waste liquid for producing uneven concentration in setting and lead to that copper ion is inefficient when being reduced on cathode plate, shape is uneven
Problem.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of electro-deposition recycling copper device and application its copper recycling
Producing line can make the alkaline etching waste liquid for producing even concentration in electric deposition device, to improve copper ion when being reduced on cathode plate
Efficiency, and make copper ion restore after shape it is more uniform.
In order to solve the above technical problems, the invention is realized in this way, a kind of electro-deposition recycling copper device, comprising: cylinder body,
Cathode, anode, upper cover and recirculation assembly, the cylinder body include bottom plate and side plate, and the bottom plate and the side plate are enclosed instead
Slot is answered, the cathode and the anode are arranged in the reactive tank, and the upper cover is sealed in the reactive tank for covering to close,
The recirculation assembly includes spill case, overflow pipe, the pump housing and spray structure, and the close anti-of the side plate is arranged in the spill case
It answers at slot notch, the spill case is connected to the reactive tank, and the spray structure is arranged at the slot bottom of the reactive tank, institute
Stating spray structure includes inlet tube and spray tube, and the spray tube is connected on the inlet tube, is uniformly opened on the spray tube
Equipped with spray apertures, the overflow pipe is connected to the spill case and the inlet tube, and the pump housing is connect with the overflow pipe, described
The pump housing drives the etching waste liquor in the spill case followed by spraying after the overflow pipe, the inlet tube and the spray tube
Into the reactive tank.
Further, the spill case is close to corresponding side plate, offers several equally distributed overflows on corresponding side plate
Mouthful, the corresponding spill case is connected to by the overflow port with reactive tank.
Further, the corresponding side plate offers at least two inlet openings at the position of the bottom plate, described
Spray structure includes at least two inlet tubes, and each inlet tube and each inlet opening, which correspond, to be assembled, it is adjacent it is described into
At least two spray tubes are provided between liquid pipe.
Further, the spray structure further includes support base, is provided at the top of the support base and the spray tube
Matched arcuate structure, the support base are arranged between the spray tube and the bottom plate, and the support base is for carrying institute
State spray tube.
Further, the spray structure further includes homogenizing plate, and the top of the spray tube, institute is arranged in the homogenizing plate
It states homogenizing plate and is parallel to the bottom plate, equal discharge orifice is uniformly provided on the homogenizing plate.
Further, the side plate outer hoop is equipped with outer ribs, is provided with vertical side on the inside of the side plate of opposite two
To interior ribs, the respective side edge of the homogenizing plate open up it is jagged, when the homogenizing plate is assemblied in the reactive tank
When interior, the interior ribs is passed through from the notch.
Further, the upper edge of the side plate is provided with the reinforcement panel of circle level, and the spill case, which is adjacent to, to be set
It sets in the bottom side for reinforcing panel；Conduction side's copper, and the conduction side are respectively arranged with above the side plate of opposite two
The upside for reinforcing panel is arranged in copper, is provided with one-to-one cathode card slot and sun on the inside of corresponding two side plate
Pole card slot, the cathode card slot and anode card slot uniform intervals setting and vertical extension, the inner ring for reinforcing panel
It is provided on the circle flanged plate, with the flanged plate of conduction side's copper respective side upwardly extended and offers locating slot, the yin
When pole and the anode card are in the locating slot, the cathode and the anode are electrically connected with corresponding conduction side's copper respectively
It connects, and the cathode and the anode are embedded at respectively in the cathode card slot and the anode card slot.
Further, separation sleeve is provided on the locating slot, the separation sleeve uses Teflon material.
It further, further include exhaust structure, the exhaust structure includes air extracting box and exhaust column, the air extracting box setting
In the upside for reinforcing panel and it is adjacent to the flanged plate, gas outlet is offered on the corresponding position of the flanged plate, it is described
Gas outlet is connected to the reactive tank and the air extracting box, and the exhaust column connects the air extracting box.
Further, a kind of copper recycling producing line is provided, recycles copper device including the electro-deposition as above described in any one.
Electro-deposition recycles copper device and recycles producing line compared with prior art using its copper in the present invention, and beneficial effect exists
In:
During alkaline etching waste liquid for producing is packed into reactive tank Inner electrolysis, spill case can be flowed to out of reactive tank, pumped later
Under the driving of body, the etching waste liquor in spill case flows through overflow pipe, inlet tube and spray tube, finally from the spray apertures on spray tube
Be ejected into the bottom of reactive tank, that is, formed alkaline etching waste liquid for producing flowing closed circuit so that in reactive tank different height erosion
Waste liquid to be carved to be sufficiently mixed, concentration is more uniform, efficiency of the copper ion when being reduced on cathode plate can be effectively improved, and
Shape is more uniform after restoring copper ion.
Detailed description of the invention
Fig. 1 is the dimensional decomposition structure diagram of electro-deposition recycling copper device in the embodiment of the present invention.
In the accompanying drawings, each appended drawing reference indicates: 1, cylinder body；11, bottom plate；12, side plate；13, reinforce panel；121, overflow
Mouthful；122, outer ribs；123, interior ribs；124, cathode card slot；125, anode card slot；131, flanged plate；1311, it positions
Slot；1312, gas outlet；2, upper cover；3, recirculation assembly；31, spill case；32, spray structure；33, support base；34, homogenizing plate；
321, inlet tube；322, spray tube；341, notch；4, conduction side's copper；5, exhaust structure；51, air extracting box；52, exhaust column.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment:
In the present embodiment, a kind of copper recycling producing line (not shown) is provided, for being electrolysed copper sulphate, including electro-deposition recycling
Copper device, wherein as shown in Figure 1, electro-deposition recycling copper device include: cylinder body 1, cathode (not shown), anode (not shown), on
Lid 2 and recirculation assembly 3, cylinder body 1 include bottom plate 11 and side plate 12, and bottom plate 11 and side plate 12 are enclosed reactive tank, cathode and sun
Pole is arranged in reactive tank, and upper cover 2 is sealed in reactive tank for covering to close, and recirculation assembly 3 includes spill case 31, overflow pipe, pump
Body and spray structure 32, spill case 31 are arranged at the close reactive tank notch of side plate 12, and spill case 31 is connected to reactive tank, spray
Leaching structure 32 is arranged at the slot bottom of reactive tank, and spray structure 32 includes inlet tube 321 and spray tube 322, and spray tube 322 connects
On inlet tube 321, spray apertures are uniformly provided on spray tube 322, overflow pipe is connected to spill case 31 and inlet tube 321, the pump housing
It is connect with overflow pipe, the pump housing drives the etching waste liquor in spill case 31 followed by overflow pipe, inlet tube 321 and spray tube 322
After spray in reactive tank.
During alkaline etching waste liquid for producing is packed into reactive tank Inner electrolysis, spill case 31, Zhi Hou can be flowed to out of reactive tank
Under the driving of the pump housing, the etching waste liquor in spill case 31 flows through overflow pipe, inlet tube 321 and spray tube 322, finally from spray tube
Spray apertures on 322 are ejected into the bottom of reactive tank, that is, the closed circuit of alkaline etching waste liquid for producing flowing are formed, so that in reactive tank
The etching waste liquor of different height is sufficiently mixed, and concentration is more uniform, can be effectively improved copper ion and be gone back on cathode plate
Efficiency when former, and keep shape after copper ion reduction more uniform.
Spill case 31 is close to corresponding side plate 12, offers several equally distributed overflow ports 121 on corresponding side plate 12, overflows
Corresponding spill case 31 is connected to by head piece 121 with reactive tank.Specifically, in the present embodiment, side plate 12 include: front side board, after
A spill case 31 is each provided on side plate, left plate and right side plate, front side board and back side panel, and two spill cases 31 pass through
Overflow plate connection, in order to reinforce the structural strength of spill case 31, uniform intervals are provided with reinforced sheet in spill case 31, and reinforce
Port is offered on plate to flow for etching waste liquor, due to being respectively provided with spill case 31 in opposite two sides, the position in reactive tank
The spill case 31 of two sides can be flowed in high-order etching waste liquor, without flowing to showing for spill case 31 from single side
As so that etching waste liquor is more uniform when mixing, effect is more preferable.
Corresponding side plate 12 offers at least two inlet openings at the position of bottom plate 11, and spray structure 32 includes at least
Two inlet tubes 321, each inlet tube 321 is corresponded with each inlet opening to be assembled, and is provided at least between adjacent inlet tube 321
Two spray tubes 322.In the present embodiment, by taking spray tube 322 includes two inlet tubes 321 as an example, in the bottom of back side panel point
Not offering an inlet opening respectively at the position of left plate and right side plate, the position of two inlet openings is substantially symmetric, and two
Inlet tube 321 is mutually assembled with inlet opening respectively, is parallel to each other between inlet tube 321, and inlet tube 321 passes through overflow pipe and spill case
31 are connected to, and are provided with three spray tubes 322 between two inlet tubes 321, and three spray tubes 322 are each perpendicular to inlet tube 321, and
Three inlet tubes 321 are evenly distributed in the bottom section of reactive tank, and therefore, etching waste liquor can be from spray tube 322 uniformly
Ground sprays to reaction tank bottom.In other embodiments, spray structure 32 may include three, four, five etc. inlet tubes
321, can be set two, four, five etc. spray tubes 322 between adjacent inlet tube 321, spray tube 322 can with into
Between liquid pipe 321 at an angle, such as: 30 °, 60 °, spray tube 322 can be with arranged in a crossed manner.The bottom of cylinder body 1 offers
Fluid infusion hole and fluid hole, fluid infusion hole and fluid hole can be set on bottom plate 11, also can be set on side plate 12, etching waste liquor
It can be electrolysed from being entered in reactive tank by pipeline fluid infusion hole, the waste liquid after being electrolysed can be by fluid hole from extension tube attached
Road discharge.
In order to make spray structure 32 install stabilization in reactive tank, spray structure 32 further includes support base 33, support base 33
Top be provided with the matched arcuate structure of spray tube 322, support base 33 be arranged between spray tube 322 and bottom plate 11, branch
Support seat 33 is for carrying spray tube 322.In the present embodiment, support base 33 is separately positioned, and every spray tube 322 is all uniformly
Setting is carried there are three support base 33, and in other embodiments, every spray tube 322 can be set two, four, five
Deng support base 33 carried, connecting rod can be set between support base 33, it is more convenient in order to move integrally.
In order to further make etching waste liquor even concentration, in the present embodiment, spray structure 32 further includes homogenizing plate 34,
The top of spray tube 322 is arranged in homogenizing plate 34, and homogenizing plate 34 is parallel to bottom plate 11, is uniformly provided on homogenizing plate 34 and flows
Hole, etching waste liquor sprays from spray tube 322 and then can further be dispersed by homogenizing plate 34, to make reactive tank
Interior etching waste liquor concentration is more uniform.In the present embodiment, equal discharge orifice is the straight hole for being connected to 34 upper and lower surface of homogenizing plate；At it
In his embodiment, the upper and lower surface of equal discharge orifice connection homogenizing plate 34, but the channel of discharge orifice can be flexure type；In other implementations
In example, homogenizing plate 34 can be set two pieces, three pieces, four pieces etc., and the equal discharge orifice between adjacent homogenizing plate 34 shifts to install, because
This, etching waste liquor can be mixed further when passing through from homogenizing plate 34.
In order to improve the structural strength of cylinder body 1,12 outer hoop of side plate is equipped with outer ribs 122, opposite both side plate 12 it is interior
Side is provided with the interior ribs 123 of vertical direction, and the respective side edge of homogenizing plate 34 opens up jagged 341, when homogenizing plate 34
When being assemblied in reactive tank, interior ribs 123 is passed through from notch 341.In the present embodiment, the side hoop of cylinder body 1 is equipped with two circles
Outer ribs 122, is respectively set that there are two interior ribs 123, outer ribs 122 and interior reinforcements on the inside of left plate and right side plate
Rib 123 is all made of the channel steel having a size of 80mm*40mm*5mm and is fixed on cylinder body 1 by welding manner.In other embodiments,
The size of copper device is recycled according to electro-deposition, outer ribs 122 can be set one, three, four etc., interior ribs
123 can be set one, three, four etc..
The upper edge of side plate 12 is provided with the reinforcement panel 13 of circle level, and spill case 31, which becomes placed against, is reinforcing panel
13 bottom side；The top of opposite both side plate 12 is respectively arranged with conduction side's copper 4, and panel 13 is being reinforced in the setting of conduction side's copper 4
Upside, the inside of corresponding both side plate 12 is provided with one-to-one cathode card slot 124 and anode card slot 125, cathode card slot
124 and the setting of 125 uniform intervals of anode card slot and it is vertical extend, the inner ring for reinforcing panel 13 is provided with the circle upwardly extended
Locating slot 1311, cathode and anode card are offered on flanged plate 131, with the flanged plate 131 of 4 respective side of conduction side's copper embedded in positioning
When in slot 1311, cathode and anode are electrically connected with corresponding conduction side's copper 4 respectively, and cathode and anode are embedded at cathode card respectively
In slot 124 and anode card slot 125.Cathode and anode pass through cathode card slot 124 respectively and anode card slot 125 is assembled, can be with
Guarantee the functional reliability of cathode and anode in electrolytic process, is provided with coating side cast iron on cathode and anode and (does not show
Out), using screw locking at the self weight and three of coating side cast iron, square coating Cast Iron Surface is coated with anticorrosion for cathode and anode
Coating, bottom are provided with and the matched groove of 4 size of conduction side's copper.It is provided with separation sleeve (not shown) on locating slot 1311, is isolated
Set uses Teflon material, to avoid in electrolytic process locating slot 1311 because high temperature is damaged.
Electro-deposition recycling copper device further includes exhaust structure 5, and exhaust structure 5 includes air extracting box 51 and exhaust column 52, exhausting
Box 51 is arranged in the upside for reinforcing panel 13 and is adjacent to flanged plate 131, offers gas outlet on the corresponding position of flanged plate 131
1312, gas outlet 1312 is connected to reactive tank and air extracting box 51, and exhaust column 52 connects air extracting box 51.Face is being reinforced in the setting of air extracting box 51
The corresponding position with left plate and right side plate of plate 13, the i.e. both ends of reactive tank are provided with an air extracting box 51, in reactive tank
Air enters in air extracting box 51 from two sides, is detached later by exhaust column 52, and air extracting box 51 is designed into and reinforces the upper of panel 13
Side can guarantee exhausting amount, can also avoid being extracted into etching waste liquor, to prevent exhaust column 52 from blocking because of crystallization, more may be used
It leans on.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. copper device is recycled in a kind of electro-deposition characterized by comprising cylinder body (1), cathode, anode, upper cover (2) and circulation group
Part (3), the cylinder body (1) include bottom plate (11) and side plate (12), and the bottom plate (11) and the side plate (12) are enclosed instead
Slot is answered, the cathode and the anode are arranged in the reactive tank, and the upper cover (2) is sealed in the reactive tank for covering to close
On, the recirculation assembly (3) includes spill case (31), overflow pipe, the pump housing and spray structure (32), spill case (31) setting
At the close reactive tank notch of the side plate (12), the spill case (31) is connected to the reactive tank, the spray structure
(32) it is arranged at the slot bottom of the reactive tank, the spray structure (32) includes inlet tube (321) and spray tube (322), institute
It states spray tube (322) to be connected on the inlet tube (321), spray apertures is uniformly provided on the spray tube (322), it is described to overflow
Flow tube is connected to the spill case (31) and the inlet tube (321), the pump housing are connect with the overflow pipe, the pump housing driving
Etching waste liquor in the spill case (31) is followed by the overflow pipe, the inlet tube (321) and the spray tube (322)
Afterwards in spray to the reactive tank.
2. copper device is recycled in electro-deposition according to claim 1, which is characterized in that the spill case (31) is close to respective side
Plate (12) offers several equally distributed overflow ports (121) on corresponding side plate (12), and the overflow port (121) will correspond to
The spill case (31) be connected to reactive tank.
3. copper device is recycled in electro-deposition according to claim 1, which is characterized in that the corresponding side plate (12) is close to institute
It states and offers at least two inlet openings at the position of bottom plate (11), the spray structure (32) includes at least two inlet tubes
(321), each inlet tube (321) and each inlet opening are corresponded and are assembled, and are all provided between the adjacent inlet tube (321)
It is equipped at least two spray tubes (322).
4. copper device is recycled in electro-deposition according to claim 3, which is characterized in that the spray structure (32) further includes branch
It supports seat (33), is provided with and the spray tube (322) matched arcuate structure, the support base at the top of the support base (33)
(33) it is arranged between the spray tube (322) and the bottom plate (11), the support base (33) is for carrying the spray tube
(322)。
5. copper device is recycled in electro-deposition described in any one of -4 according to claim 1, which is characterized in that the spray structure
It (32) further include homogenizing plate (34), the homogenizing plate (34) is arranged in the top of the spray tube (322), the homogenizing plate (34)
It is parallel to the bottom plate (11), is uniformly provided with equal discharge orifice on the homogenizing plate (34).
6. copper device is recycled in electro-deposition according to claim 5, which is characterized in that side plate (12) outer hoop is equipped with additional
Strong rib (122) is provided with the interior ribs (123) of vertical direction, the homogenizing plate on the inside of the side plate of opposite two (12)
(34) respective side edge opens up jagged (341), described interior when the homogenizing plate (34) is assemblied in the reactive tank
Ribs (123) is passed through from the notch (341).
7. copper device is recycled in electro-deposition according to claim 5, which is characterized in that the upper edge of the side plate (12) is set
It is equipped with the reinforcement panel (13) of circle level, the spill case (31) becomes placed against in the bottom side for reinforcing panel (13)；Phase
Pair two side plates (12) above be respectively arranged with conduction side's copper (4), and conduction side's copper (4) be arranged in the reinforcement
The upside of panel (13) is provided with one-to-one cathode card slot (124) and anode on the inside of corresponding two side plate (12)
Card slot (125), the cathode card slot (124) and anode card slot (125) uniform intervals setting and vertical extension, it is described to add
The inner ring of strong panel (13) is provided with circle flanged plate (131) upwardly extended, the flange with conduction side's copper (4) respective side
It is offered on plate (131) locating slot (1311), it is described when the cathode and the anode card are interior embedded in the locating slot (1311)
Cathode and the anode are electrically connected with corresponding conduction side's copper (4) respectively, and the cathode and the anode are embedded at institute respectively
It states in cathode card slot (124) and the anode card slot (125).
8. copper device is recycled in electro-deposition according to claim 7, which is characterized in that be provided on the locating slot (1311)
Separation sleeve, the separation sleeve use Teflon material.
9. copper device is recycled in electro-deposition according to claim 7, which is characterized in that further include exhaust structure (5), the pumping
Wind structure (5) includes air extracting box (51) and exhaust column (52), and air extracting box (51) setting reinforces the upper of panel (13) described
Side and be adjacent to the flanged plate (131), offered gas outlet (1312) on the corresponding position of the flanged plate (131), it is described go out
Port (1312) is connected to the reactive tank and the air extracting box (51), and the exhaust column (52) connects the air extracting box (51).
10. a kind of copper recycles producing line, which is characterized in that including the electro-deposition recycling as described in any one of claim 1-9
Copper device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910294797.3A CN109852996B (en) | 2019-04-12 | 2019-04-12 | Electrodeposition copper recovery device and copper recovery production line using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910294797.3A CN109852996B (en) | 2019-04-12 | 2019-04-12 | Electrodeposition copper recovery device and copper recovery production line using same |
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| Publication Number | Publication Date |
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| CN109852996A true CN109852996A (en) | 2019-06-07 |
| CN109852996B CN109852996B (en) | 2024-02-23 |
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| CN103757664A (en) * | 2013-12-13 | 2014-04-30 | 陶克（苏州）机械设备有限公司 | Electrolytic tank, etching liquid regeneration equipment using same and regeneration method |
| CN203653725U (en) * | 2013-12-31 | 2014-06-18 | 乐凯华光印刷科技有限公司 | Electrolysis equipment |
| CN104862767A (en) * | 2015-05-29 | 2015-08-26 | 东莞市开美电路板设备有限公司 | Copper plating tank |
| CN105177580A (en) * | 2015-08-25 | 2015-12-23 | 深圳市洁驰科技有限公司 | Acidic etching liquid copper electrolyzer |
| CN206219686U (en) * | 2016-11-22 | 2017-06-06 | 丰顺佳丰电子有限公司 | A kind of alkaline etching liquid electrolysis carries copper system system |
| CN208087748U (en) * | 2018-02-02 | 2018-11-13 | 何世武 | Two-component acidity etching liquid recycling device |
| CN108866572A (en) * | 2018-08-27 | 2018-11-23 | 苏碧云 | A kind of iron displacement copper electrolysis cells |
| CN209779005U (en) * | 2019-04-12 | 2019-12-13 | 深圳市泓达环境科技有限公司 | Electrodeposition copper recovery device and copper recovery production line applying same |
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