CN217895781U - Electroplating device with metal ion supply mechanism - Google Patents
Electroplating device with metal ion supply mechanism Download PDFInfo
- Publication number
- CN217895781U CN217895781U CN202221044975.0U CN202221044975U CN217895781U CN 217895781 U CN217895781 U CN 217895781U CN 202221044975 U CN202221044975 U CN 202221044975U CN 217895781 U CN217895781 U CN 217895781U
- Authority
- CN
- China
- Prior art keywords
- metal ion
- electroplating
- ion supply
- supply mechanism
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to the technical field of electroplating equipment, in particular to an electroplating device with a metal ion supply mechanism, which comprises an electroplating pool, a metal ion supply mechanism, a first filter, a circulating pump and an overflow pipe; the metal ion supply mechanism comprises a cathode chamber, an anode chamber and a diaphragm positioned between the cathode chamber and the anode chamber; the input end of the first filter is communicated with the anode chamber through a pipeline, and the output end of the first filter is communicated with the electroplating tank through a pipeline; the input end of the circulating pump is communicated with the electroplating pool through a pipeline, and the output end of the circulating pump is communicated with the anode chamber through a pipeline; two ends of the overflow pipe are respectively communicated with the electroplating pool and the anode chamber. The metal ion supply mechanism continuously provides metal ions required by electroplating, and the cost of the electroplating metal raw material is reduced by 20-30%. And the utility model provides a metal ion supply mechanism can utilize the consumption and the supply of faraday's law's electrochemical reaction accurate control metal ion that electroplates, guarantees product quality's stability.
Description
Technical Field
The utility model relates to the technical field of electroplating equipment, in particular to an electroplating device with a metal ion supply mechanism.
Background
Along with the high-speed development of global electronic products, the requirement on the manufacturing precision of circuit boards is higher and higher, and an insoluble anode plating line is adopted for electroplating of the buried pore plates, so that the hole filling capacity is high, and the electroplating uniformity is good. And insoluble anode plating is also adopted in the fields of new energy and copper foil manufacture. Has wide market prospect.
At present, electroplating-grade metal oxide powder (such as copper oxide) is adopted in the industry to be stirred and dissolved to provide metal ion consumption during electroplating, the dissolving speed is general, and the cost is high; in addition, the consumption of the oxidized metal powder and the consumption of the plating metal ions cannot be precisely controlled, and the plating quality is unstable due to more or less metal ions. Therefore, there is a need to develop a method for providing metal ions for electroplating, which can effectively reduce the cost and satisfy the requirements of the process and quality.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide an electroplating device with metal ion supply mechanism that can reduce cost and promote the quality.
In order to solve the technical problem, the utility model adopts the following technical scheme:
the electroplating device with the metal ion supply mechanism comprises an electroplating pool, the metal ion supply mechanism, a first filter, a circulating pump and an overflow pipe;
the metal ion supply mechanism comprises a cathode chamber, an anode chamber and a diaphragm positioned between the cathode chamber and the anode chamber;
the input end of the first filter is communicated with the anode chamber through a pipeline, and the output end of the first filter is communicated with the electroplating tank through a pipeline;
the input end of the circulating pump is communicated with the electroplating pool through a pipeline, and the output end of the circulating pump is communicated with the anode chamber through a pipeline;
and two ends of the overflow pipe are respectively communicated with the electroplating pool and the anode chamber.
Preferably, the device further comprises a jet flow mechanism and/or a first stirring mechanism;
the jet flow mechanism comprises a second filter and a jet flow nozzle, the input end of the second filter is communicated with the electroplating pool through a pipeline, the output end of the second filter is connected with the jet flow nozzle through a pipeline, and the jet flow nozzle is positioned in the electroplating pool;
the first stirring mechanism comprises a first air stirring pipe positioned in the electroplating pool.
Preferably, the output end of the jet nozzle faces the object to be plated.
Preferably, the number of the jet nozzles is two, the two jet nozzles are both connected with the output end of the second filter, and the two jet nozzles are respectively positioned at two sides of the plated object.
Preferably, the metal ion supply mechanism further comprises a third filter and/or a second stirring mechanism; the input end and the output end of the third filter are respectively communicated with the anode chamber through pipelines; the second stirring mechanism comprises a second air stirring pipe positioned in the anode chamber.
Preferably, the metal ion supply mechanism further comprises a fourth filter, and an input end and an output end of the fourth filter are respectively communicated with the cathode chamber through pipelines.
Preferably, the metal ion supply means is provided with an exhaust port communicating with the cathode chamber.
The beneficial effects of the utility model reside in that:
there is provided an electroplating apparatus having a metal ion supply mechanism including a cathode chamber, an anode chamber, and a diaphragm located between the cathode chamber and the anode chamber; in the anode chamber, metal is continuously dissolved into metal ions, because the metal ions in the anode chamber are positive ions which cannot permeate through the diaphragm, the metal ions are completely dissolved in the anode chamber, the electroplating solution in the anode chamber and the electroplating solution in the electroplating pool are circulated, the metal ions required by electroplating are continuously provided, and the cost of the electroplating metal raw materials is reduced by 20-30%. And the utility model provides a metal ion supply mechanism can utilize the consumption and the supply of faraday's law's electrochemical reaction accurate control metal ion that electroplates, guarantees product quality's stability.
Drawings
FIG. 1 is a schematic sectional view of the side structure of the electroplating bath according to the present invention.
FIG. 2 is a schematic view of the side view of the electroplating solution removed according to the present invention.
Detailed Description
In order to facilitate the understanding of those skilled in the art, the present invention will be further described with reference to the following examples, which are not intended to limit the scope of the present invention.
As shown in FIGS. 1 to 2, an electroplating apparatus having a metal ion supply mechanism comprises an electroplating tank 1, a metal ion supply mechanism 2, a first filter 3, a circulation pump 4 and an overflow pipe 5;
the metal ion supply mechanism 2 comprises a cathode chamber 21, an anode chamber 22 and a diaphragm 23 positioned between the cathode chamber 21 and the anode chamber 22;
the input end of the first filter 3 is communicated with the anode chamber 22 through a pipeline, and the output end of the first filter 3 is communicated with the electroplating tank 1 through a pipeline;
the input end of the circulating pump 4 is communicated with the electroplating pool 1 through a pipeline, and the output end of the circulating pump 4 is communicated with the anode chamber 22 through a pipeline;
two ends of the overflow pipe 5 are respectively communicated with the electroplating pool 1 and the anode chamber 22.
In the electroplating apparatus having the metal ion supply mechanism according to the present embodiment, in practical application, the sum of the currents of the rectifier U1 and the rectifier U2 is equal to the current of the rectifier U3 according to faraday's law, so as to achieve balance of consumption and supply of metal ions. The electroplating pool 1 is internally provided with an object to be plated and two insoluble anode metal oxide electrodes, the anodes of the rectifier U1 and the rectifier U2 are respectively connected with the two insoluble anode metal oxide electrodes, and the cathodes of the rectifier U1 and the rectifier U2 are both connected with the object to be plated. A metal ion supply unit anode which is electroplated metal and can be columnar, granular and not limited in shape is arranged in the anode chamber 22, a metal ion supply unit cathode which is sheet-shaped and net-shaped and not limited in shape is arranged in the cathode chamber 21 and can be made of at least one of materials which can be used for the cathode, such as titanium, stainless steel and the like, the diaphragm 23 is made of an ionic material, the diaphragm 23 can isolate metal cations, the metal cations are larger than the pores of the diaphragm 23 and cannot pass through the diaphragm 23, and hydrogen ions can freely pass through the diaphragm 23 and are smaller than the hydrogen ions; the diaphragm 23 is used to separate the plating solution in the anode chamber 22 from the electrolyte in the cathode chamber 21 so that the two do not cross, and the anode metal is ionized to the anode chamber 22 when the rectifier U3 is turned on to provide the metal ions required for plating.
In the embodiment, the device further comprises a jet flow mechanism 6 and/or a first stirring mechanism 7;
the jet flow mechanism 6 comprises a second filter 61 and a jet flow nozzle 62, the input end of the second filter 61 is communicated with the electroplating pool 1 through a pipeline, the output end of the second filter 61 is connected with the jet flow nozzle 62 through a pipeline, and the jet flow nozzle 62 is positioned in the electroplating pool 1;
the first stirring mechanism 7 comprises a first air stirring pipe 71 positioned in the electroplating pool 1;
the output end of the jet nozzle 62 faces to the object to be plated;
the number of the jet nozzles 62 is two, the two jet nozzles 62 are both connected with the output end of the second filter 61, and the two jet nozzles 62 are respectively positioned at two sides of the plated object.
The second filter 61 pumps the electroplating solution in the electroplating pool 1 through a pipeline, sprays the electroplating solution from the spray nozzle 62 to the plated object to form circulation, effectively prevents electrode polarization caused by overlarge current density, and also can prevent electrode polarization through the first air stirring pipe 71; the rectifier U1 and the rectifier U2 can also be connected with the anode by the anode of one rectifier and connected with the cathode by the cathode for electroplating.
In this embodiment, the metal ion supply mechanism 2 further comprises a third filter 8 and/or a second stirring mechanism 9; the input end and the output end of the third filter 8 are respectively communicated with the anode chamber 22 through pipelines; the second stirring mechanism 9 includes a second air stirring pipe 91 located in the anode chamber 22.
The anode chamber 22 can generate anode by-products during the electrolytic reaction, the third filter 8 filters the anode by-products through the pipeline circulation, the inlet and outlet pipelines of the third filter 8 can be uniformly arranged in the metal ion unit to fully stir the electroplating solution to prevent the metal ion supply unit anode current density from overlarge electrode polarization, and the second air stirring pipe 91 can also be arranged to carry out air stirring current to prevent the density overlarge electrode polarization.
In this embodiment, the metal ion supply mechanism 2 further comprises a fourth filter 24, and an input end and an output end of the fourth filter 24 are respectively communicated with the cathode chamber 21 through a pipeline.
The fourth filter 24 filters impurities in the use of the cathode chamber 21 of the metal ion supply unit by circulating through a pipe while agitating the electrolyte.
In the present embodiment, the metal ion supply mechanism 2 is provided with an exhaust port 25 communicating with the cathode chamber 21. The cathode chamber 21 of the metal ion supply unit generates a large amount of gas during the electrolysis reaction, and the gas is discharged through the gas outlet 25.
In the description of the present invention, it should be noted that, for the orientation words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, the definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected", if any, are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; mechanical connection is also possible; the two elements can be directly connected with each other or connected with each other through an intermediate medium, and the two elements can be communicated with each other. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The above-mentioned embodiments only express a plurality of embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. An electroplating device with a metal ion supply mechanism is characterized in that: comprises an electroplating pool (1), a metal ion supply mechanism (2), a first filter (3), a circulating pump (4) and an overflow pipe (5);
the metal ion supply mechanism (2) comprises a cathode chamber (21), an anode chamber (22) and a diaphragm (23) positioned between the cathode chamber (21) and the anode chamber (22);
the input end of the first filter (3) is communicated with the anode chamber (22) through a pipeline, and the output end of the first filter (3) is communicated with the electroplating tank (1) through a pipeline;
the input end of the circulating pump (4) is communicated with the electroplating pool (1) through a pipeline, and the output end of the circulating pump (4) is communicated with the anode chamber (22) through a pipeline;
two ends of the overflow pipe (5) are respectively communicated with the electroplating pool (1) and the anode chamber (22).
2. An electroplating apparatus having a metal ion supply mechanism according to claim 1, wherein: the device also comprises a jet flow mechanism (6) and/or a first stirring mechanism (7);
the jet flow mechanism (6) comprises a second filter (61) and a jet flow nozzle (62), the input end of the second filter (61) is communicated with the electroplating pool (1) through a pipeline, the output end of the second filter (61) is connected with the jet flow nozzle (62) through a pipeline, and the jet flow nozzle (62) is positioned in the electroplating pool (1);
the first stirring mechanism (7) comprises a first air stirring pipe (71) positioned in the electroplating pool (1).
3. An electroplating apparatus having a metal ion supply mechanism according to claim 2, wherein: the output end of the spray nozzle (62) faces to the object to be plated.
4. An electroplating apparatus having a metal ion supply mechanism according to claim 3, wherein: the number of the jet nozzles (62) is two, the two jet nozzles (62) are connected with the output end of the second filter (61), and the two jet nozzles (62) are respectively positioned on two sides of the plated object.
5. An electroplating apparatus having a metal ion supply mechanism according to claim 1, wherein: the metal ion supply mechanism (2) also comprises a third filter (8) and/or a second stirring mechanism (9); the input end and the output end of the third filter (8) are respectively communicated with the anode chamber (22) through pipelines; the second stirring mechanism (9) comprises a second air stirring pipe (91) positioned in the anode chamber (22).
6. An electroplating apparatus having a metal ion supply mechanism according to claim 1, wherein: the metal ion supply mechanism (2) further comprises a fourth filter (24), and the input end and the output end of the fourth filter (24) are respectively communicated with the cathode chamber (21) through pipelines.
7. An electroplating device having a metal ion supply mechanism according to claim 1, wherein: the metal ion supply mechanism (2) is provided with an exhaust port (25) communicating with the cathode chamber (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221044975.0U CN217895781U (en) | 2022-04-29 | 2022-04-29 | Electroplating device with metal ion supply mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221044975.0U CN217895781U (en) | 2022-04-29 | 2022-04-29 | Electroplating device with metal ion supply mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217895781U true CN217895781U (en) | 2022-11-25 |
Family
ID=84110763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221044975.0U Active CN217895781U (en) | 2022-04-29 | 2022-04-29 | Electroplating device with metal ion supply mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217895781U (en) |
-
2022
- 2022-04-29 CN CN202221044975.0U patent/CN217895781U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112714803B (en) | Plating solution production and regeneration process and device for insoluble anode acid copper electroplating | |
| JP4484414B2 (en) | Method and apparatus for adjusting metal ion concentration in an electrolyte fluid, method of using the method and method of using the apparatus | |
| WO2018103621A1 (en) | Acid copper electroplating process using insoluble anode and equipment therefor | |
| CN217378068U (en) | Electroplating equipment | |
| CN114790567A (en) | Electroplating equipment | |
| CN217895781U (en) | Electroplating device with metal ion supply mechanism | |
| CN214361731U (en) | Ion waste liquid diaphragm electrolytic device | |
| CN213538147U (en) | Electroplating device for printed circuit board | |
| US11781228B2 (en) | Method for manufacturing sulfuric acid solution and electrolyzer used thereof | |
| KR102400469B1 (en) | Electrolytic cell and electrode plate for electrolytic cell | |
| JP2003096585A (en) | Method of producing cobalt sulfate solution | |
| KR20230173685A (en) | Coating device and coating method for coating components or semi-finished products with a chrome layer | |
| CN113832524A (en) | System for prolonging service life of insoluble anode in electroplating | |
| JP2004269955A (en) | Copper sulfate plating device, and plating method | |
| CN219079681U (en) | Simple electroplating tin bath for experiments | |
| CN216192822U (en) | System for prolonging service life of insoluble anode in electroplating | |
| CN219449919U (en) | Device for carrying out horizontal convection circulation on electroplating liquid medicine | |
| JP4242248B2 (en) | Tin plating method using insoluble anode | |
| CN217997399U (en) | Ferric iron dissolves copper circulation system | |
| TWI806328B (en) | An improved process and device for copper electroplating with sulfate bath and insoluble anode | |
| CN217378064U (en) | Electroplating device with deplating function | |
| EP3795717A1 (en) | Sulfuric acid solution production method, and electrolysis vessel which can be used in said production method | |
| CN216473515U (en) | Multistage electrolysis system for preparing strong alkaline electrolyzed water | |
| CN220413554U (en) | Copper recovery device | |
| CN215925136U (en) | Plating solution circulation system for coating machine and coating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |