KR970001600A - Electrodeposition method of metal film and apparatus for same - Google Patents

Abstract

For electrodeposition of a uniform metal film, preferably of copper, with certain physical-mechanical properties, no soluble anode is used because the geometry changes through electrodeposition and the magnetic field distribution continuously changes in the electrolyzer.

In order to solve this problem, a method of converting a compound of a redox system added to a plating solution during electrodeposition to an insoluble anode is proposed. Here, the resulting compound dissolves new metal ions from the vessel containing the metal part to be electrodeposited in order to replenish the metal ions consumed by electrodeposition.

The present invention, unlike the prior art, suggests a method in which no further compound is destroyed.

Description

Electrodeposition method of metal film and apparatus for same

Since this is an open matter, no full text was included.

FIG. 1 shows the principle of the apparatus for liquid immersion treatment, FIG. 2 shows the principle of the apparatus with or without the diaphragm, and FIG. 3 shows the principle of the apparatus by the serial induction of electrolyte.

Claims (18)

cathode; Insoluble dimensional stability anodes; A metal ion generator for passing a plating solution containing an oxidation compound of a redox system formed by anodic oxidation to dissolve a corresponding metal part to form metal ions; And means for minimizing the concentration of the oxidizing compound in the immediate vicinity of the cathode, preferably at less than about 0.015 Mol / l, ions of the attached metal, the compound of the electrochemically reversible redox system. And a method for electrodepositing a uniform metal film, in particular a copper film of characteristic physical-mechanical properties, at high current efficiency from a plating solution containing an additional compound for controlling the physical-mechanical properties of the metal film. The method of claim 1 wherein the concentration of the compound of the redox system is kept slightly below the value required to maintain the metal ion concentration. The method of claim 1 or 2, wherein the surface area of the metal portion is selected so as to pass through the metal ion generator so that the concentration of the oxidizing compound is reduced to a value of about zero. The method according to any one of claims 1 to 3, wherein the plating liquid flows toward the anode at a high flow rate and moves from there to the metal ion generator at a high speed. 5. The process according to claim 1, wherein at least one second oxidizing compound, preferably oxygen, is further introduced into the metal ion generator. 6. The method of claim 1, wherein a portion of the solution present at the cathode is fed directly to the metal ion generator without being supplied to the anode. 7. A method according to any one of claims 1 to 6, characterized in that it flows directly to the cathode of the plating liquid introduced through the metal ion generator and flows to the anode with the flow direction reversed. An electrolyte chamber 1 disposed between the positive electrode and the negative electrode, means for supplying the plating liquid to the negative electrode and the positive electrode, metal ion generators 2, 21, 44, 66, and a agent for moving the plating liquid supplied to the positive electrode to the metal ion generator. A first means and a second means for moving the plating liquid from the metal ion generator to the electrolyte chamber, characterized in that the two means connect a small space between the anode and the metal ion generator, the cathodes 6, 24, 69 and Apparatus for electrodepositing a uniform metal film, in particular a copper film, of certain physical-mechanical properties with high current efficiency from a plating solution in contact with an insoluble, preferably perforated, dimensional stable cathode (5, 23, 74). The device (31, 62) according to claim 8, wherein the plating liquid near the anode is sucked at a high flow rate or removed through the outlets (4, 61, 77) and moved to the metal ion generators (2, 21, 44, 66). , 76). 10. An apparatus according to claim 8 or 9, characterized in that the electrolyte chamber (1) is separated into a plurality of compartments by ion permeable partitions (17, 38, 80). The outlet 18 according to any one of claims 8 to 10, wherein the plating liquid existing near the cathode can be removed from the electrolyte chamber 1 and introduced into the metal ion generators 2, 21, 44, 66. 75). 12. The at least one pipe connection (49) according to any one of claims 8 to 11, which can be charged from the top as a metal ion generator, has a bottom in the lower region, and has side openings for the inflow of plating liquid. Apparatus characterized in that a tubular device is provided in the upper region with an overflow (54,78) for discharging to the electrolyte container (45,67). The method according to any one of claims 8 to 12, which is installed obliquely inside the metal ion generators (2, 21, 44, 66). Preferably, the device is characterized by a perforated plate (55). The method according to any one of claims 8 to 13, which is disposed at the lower end of the metal ion generators (2, 21, 44, 66). Apparatus characterized by means for air injection (56). 15. Apparatus according to any one of claims 8 to 14, characterized by means (26, 70, 82) for holding in the horizontal direction, making electrical contact and for moving the cathode in the horizontal direction. Use of the method according to any one of claims 1 to 7 for metal coating a circuit board. A method for electrodeposition of metals, each characterized by all or a combination of new or known features. Electrodeposition apparatus of metal characterized by each or all novel features or a combination of known features. ※ Note: The disclosure is based on the initial application.