CN212505140U - Electrode structure and electrochemical deposition apparatus - Google Patents
Electrode structure and electrochemical deposition apparatus Download PDFInfo
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- CN212505140U CN212505140U CN202020753538.0U CN202020753538U CN212505140U CN 212505140 U CN212505140 U CN 212505140U CN 202020753538 U CN202020753538 U CN 202020753538U CN 212505140 U CN212505140 U CN 212505140U
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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Abstract
An embodiment of the utility model provides an electrode structure for among electrochemical deposition equipment, include: a support frame; metal mesh and a plurality of conducting strip of setting on the support frame, the conducting strip with metal mesh electric connection, the conducting strip includes: the electric conduction device comprises a conductive main body and a protective layer wrapping the conductive main body, wherein the electric conductivity of the conductive main body is greater than that of the protective layer. The utility model also provides an electrochemical deposition equipment. The utility model discloses can improve electrochemical deposition's film forming uniformity.
Description
Technical Field
The utility model relates to a production field of display product, concretely relates to electrode structure and electrochemical deposition equipment for among electrochemical deposition equipment.
Background
The electrochemical deposition process is a low-cost chemical film forming mode, and can deposit a metal layer with the thickness of 2-20 um and lower resistance. The current electrochemical deposition equipment is generally suitable for performing electrochemical deposition on glass substrates with small size, and the problem of uneven film formation is easy to occur on the glass substrates with large size.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide an electrode structure and electrochemical deposition equipment for among the electrochemical deposition equipment.
In a first aspect, the present invention provides an electrode structure for use in an electrochemical deposition apparatus, the electrode structure comprising:
a support frame;
metal mesh and a plurality of conducting strip of setting on the support frame, the conducting strip with metal mesh electric connection, the conducting strip includes: the electric conduction device comprises a conductive main body and a protective layer wrapping the conductive main body, wherein the electric conductivity of the conductive main body is greater than that of the protective layer.
In some embodiments, at least one of the plurality of conductive strips extends along a length direction of the metal mesh, and at least one of the remaining conductive strips extends along a width direction of the metal mesh.
In some embodiments, the electrode structure is divided into a plurality of sections, the support frame comprises a support part in each section, the conductive strips are arranged in each section, and the parts of the metal mesh in different sections are insulated from each other.
In some embodiments, the plurality of zones includes a central zone and at least one edge zone surrounding the central zone.
In some embodiments, a dimension of the middle region along a first direction is 1 to 3 times a dimension of the edge region along the first direction, a dimension of the middle region along a second direction is 1 to 3 times a dimension of the edge region along the second direction, the first direction is a length direction of the electrode structure, and the second direction is a width direction of the electrode structure.
In some embodiments, the material of the support frame is the same as the material of the metal mesh.
In a second aspect, embodiments of the present invention further provide an electrochemical deposition apparatus, including: the electroplating device comprises a tank body with a holding tank, a substrate carrier and the electrode structure, wherein the holding tank is used for holding electroplating solution, the electrode structure is arranged in the holding tank, and the substrate carrier is used for loading a substrate to be electroplated.
In some embodiments, the electrochemical deposition apparatus further comprises a shunt plate in one-to-one correspondence with the electrode structures, the shunt plate being disposed on a side of the respective electrode structure facing the substrate carrier, wherein the shunt plate comprises: the receiver casing and a plurality of return line, the receiver casing includes: the substrate carrier comprises a first wall, a second wall arranged opposite to the first wall and a side wall connected between the first wall and the second wall, wherein the first wall is positioned on one side of the second wall facing the substrate carrier, a containing cavity is defined by the first wall, the second wall and the side wall, a liquid inlet and a plurality of liquid outlets are arranged on the containing shell, the liquid inlet and the liquid outlets are both communicated with the containing cavity, and the liquid outlets are arranged on the first wall; the liquid return pipeline penetrates through the accommodating cavity, and the liquid return pipeline penetrates through the accommodating shell along the thickness direction of the splitter plate.
In some embodiments, the electrochemical deposition apparatus further comprises a drain line, an inlet of the drain line being in communication with the holding tank,
the electrochemical deposition apparatus further comprises: the filtering device is provided with a filtering inlet and a filtering outlet, the filtering inlet is communicated with the outlet of the drainage pipeline, the filtering outlet is communicated with the liquid inlet of the flow distribution plate, and the filtering device is used for filtering electroplating liquid flowing into the filtering inlet of the filtering device.
In some embodiments, the drain pipeline comprises an upright part extending along the height direction of the tank body and a horizontal part positioned at the bottom of the electrochemical deposition equipment, an inlet of the upright part is communicated with the drain port on the tank body, an outlet of the upright part is communicated with an inlet of the horizontal part, an outlet of the horizontal part is communicated with a filtering inlet of the filtering device,
the electrochemical deposition apparatus further comprises an exhaust line in communication with the top of the upright portion.
In some embodiments, the electrochemical deposition apparatus further comprises: gas transmission pipeline, gas transmission pipeline sets up in the holding tank, and be located the holding tank bottom, gas transmission pipeline has air inlet and a plurality of gas outlet, gas transmission pipeline's air inlet and air supply intercommunication, the gas outlet be used for to discharge gas in the holding tank, with right the plating solution in the holding tank carries out the air mixing.
In some embodiments, the electrochemical deposition apparatus further comprises: and the ion supplementing device is communicated with the accommodating tank and is used for supplementing ions for electroplating to the electroplating solution in the accommodating tank.
In some embodiments, the electrochemical deposition apparatus further comprises a monitoring device for monitoring at least one of a temperature, a level, and an ion concentration of the plating solution in the holding tank.
In some embodiments, the electrochemical deposition apparatus further comprises a driving device connected to the substrate carrier for driving the substrate carrier to move along a length direction and/or a width direction of the substrate.
In some embodiments, the number of the electrode structures is two, and the two electrode structures are disposed opposite to each other and located on two sides of the substrate loaded on the substrate carrier, respectively.
In some embodiments, the electrochemical deposition apparatus further comprises a power supply device, an anode output of the power supply device being connected to the electrode structure, a cathode output of the power supply device being connected to the substrate carrier.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a first surface of an electrode structure provided in some embodiments of the present invention;
fig. 2 is a schematic second surface view of an electrode structure provided in some embodiments of the present invention;
fig. 3 is a schematic view of an electrode structure provided in further embodiments of the present invention;
fig. 4 is a perspective view of the overall structure of an electrochemical deposition apparatus provided in some embodiments of the invention;
fig. 5 is a perspective view of a partial structure of an electrochemical deposition apparatus provided in some embodiments of the present invention;
fig. 6 is a side view of a portion of the structure of an electrochemical deposition apparatus provided in some embodiments of the invention;
fig. 7 is a top view of a portion of an electrochemical deposition apparatus provided in some embodiments of the invention;
fig. 8 is a bottom view of a portion of the structure of an electrochemical deposition apparatus provided in some embodiments of the invention;
fig. 9 is a perspective view of a substrate carrier provided in some embodiments of the present invention;
fig. 10 is a front view of a substrate carrier provided in some embodiments of the present invention;
fig. 11 is a schematic view of a gas pipeline provided in some embodiments of the present invention;
fig. 12 is a perspective view of a diverter plate provided in accordance with some embodiments of the present invention;
fig. 13 is a cross-sectional view taken along line AA in fig. 12.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
Fig. 1 is a schematic view of a first surface of an electrode structure provided in some embodiments of the present invention, fig. 2 is a schematic view of a second surface of an electrode structure provided in some embodiments of the present invention, the first surface and the second surface are two opposite surfaces of the electrode structure, and the electrode structure 10 is used in an electrochemical deposition apparatus, as shown in fig. 1 and fig. 2, and the electrode structure includes: the device comprises a support frame 11, a metal mesh 12 arranged on the support frame 11 and a plurality of conductive strips 13. Wherein, conducting strip 13 is electrically connected with metal mesh 12, conducting strip 13 includes: the electric conduction device comprises a conductive main body and a protective layer for coating the conductive main body, wherein the electric conductivity of the conductive main body is greater than that of the protective layer. The protective layer is used for preventing the conductive main body from reacting with metal ions in the electroplating solution, and the activity of the protective layer is smaller than that of the conductive main body. For example, the conductive strip 13 is a titanium-clad copper structure in which the main component of the conductive body is copper and the main component of the protective layer is titanium.
When the electrochemical deposition process is carried out, a substrate to be electroplated is loaded on a substrate carrier, and the substrate carrier is used as a cathode and is connected with a negative output end of a power supply; the electrode structure 10 serves as an anode and is connected to a positive output terminal of a power supply, so that an electric field is formed between the anode and a substrate to be plated, and metal ions (e.g., Cu ions, Ni ions, Ag ions, etc.) in a plating solution are attached to the substrate to form a plated film.
When a large-sized substrate is subjected to electrochemical deposition, the size of the electrode structure 10 needs to be correspondingly increased, which easily causes a difference in voltage between the edge and the middle of the electrode structure 10, a difference in electric field between the edge and the center of the substrate, and thus poor uniformity of a film thickness formed on the substrate.
And in the embodiment of the utility model provides an in, be provided with a plurality of conducting strips 13 on the support frame 11, conducting strip 13 is including electrically conductive main part and protective layer, and electrically conductive main part adopts the better metal material of conductivity to make to can reduce the holistic resistivity of electrode structure, make the voltage homogeneity of metal mesh 12 different positions improve, and then make the electric field homogeneity in the base plate place region of treating the electroplating improve, improve the homogeneity of film-forming.
In some embodiments, as shown in fig. 2, at least one of the plurality of conductive strips 13 extends along a length direction of the metal mesh 12 (e.g., a left-right direction in fig. 2), and at least one of the remaining conductive strips 13 extends along a width direction of the metal mesh 12 (e.g., an up-down direction in fig. 2).
In some embodiments, the material of the support frame 11 is the same as the material of the metal mesh 12, for example, both made of titanium.
Optionally, the support frame 11 includes a support frame main body 11a and an energizing portion 11b, the metal mesh 12 is fixed on the support frame main body 11a, and the energizing portion 11b is used for connecting with a power supply device and loading an electrical signal.
In some embodiments, the width of the end of the power applying part 11b away from the support frame body 11a is smaller than the width of the end of the power applying part 11b close to the support frame body 11a, for example, the width of the end of the power applying part 11b close to the support frame body 11a is 1-1.4 times the width of the end of the power applying part 11b away from the support frame body 11 a.
In some embodiments, as shown in fig. 2, the metal mesh 12 is a unitary structure and has a rectangular shape, wherein one conductive strip 13 extends along the length of the electrode structure and the remaining conductive strips 13 extend along the width of the electrode structure and extend from one side of the anode structure 10 to the other.
In one embodiment, the length of the metal mesh 12 is 1 to 1.5 times the width.
In some embodiments, as shown in fig. 2, the support frame main body 11a includes a transverse support bar 111a and a longitudinal support bar 112a, the transverse support bar 111a extends along a first direction (i.e., a length direction of the electrode structure, i.e., a left-right direction in fig. 2), and the longitudinal support bar 112a extends along a second direction (i.e., a width direction of the electrode structure, i.e., an up-down direction in fig. 2). Optionally, each two adjacent longitudinal supporting bars 112a are provided with a conductive strip 13 parallel to the longitudinal supporting bar 112 a.
In some embodiments, the distance between two adjacent transverse support bars 111a is substantially equal to the distance between two adjacent longitudinal support bars 112 a. The distances between two adjacent longitudinal support bars 112a and the conductive strips 13 therebetween are substantially equal, so that the electric fields corresponding to different positions of the electrode structure are more uniform.
Fig. 3 is a schematic view of an electrode structure provided in other embodiments of the present invention, as shown in fig. 3, the anode structure 10 is divided into a plurality of partitions (a1, a2), the support frame body includes a support part 111 located in each partition, a plurality of conductive strips 13 are disposed in each partition, and portions of the metal mesh 12 located in different partitions are insulated from each other. In order to ensure that the parts of the metal mesh 12 located in different zones are insulated and spaced, when the support frame 11 is made of a conductive material, the parts of the support frame 11 located in different zones can be spaced, and the parts of the anode structure located in different zones are fixedly connected together by using insulated connecting pieces.
When the electrode structure 10 is divided into a plurality of partitions, the voltages of the different partitions can be controlled respectively, so as to improve the uniformity of the electric field corresponding to the different partitions, and thus improve the uniformity of the film formation on the substrate.
For example, when performing electrodeposition, the electrode structure 10 is prone to edge discharge, which results in a higher electric field strength at the edges than in the middle area, and thus results in a thicker film layer at the edges and a thinner film layer at the center. To prevent this phenomenon, the plurality of partitions of the electrode structure in the embodiment of the present invention may include: the central partition a1 and at least one edge partition a2 surrounding the central partition a1 improve the uniformity of film formation by individually controlling the voltage of the central partition a1 and each edge partition a 2.
In some embodiments, the dimension L11 of the central region A1 in the first direction is 1-3 times the dimension of the edge region A2 in the first direction L12, the dimension L21 of the central region A1 in the second direction is 1-3 times the dimension of the edge region A2 in the second direction L22, the first direction is the length direction of the electrode structure, and the second direction is the width direction of the electrode structure.
As another aspect of the present invention, an electrochemical deposition apparatus is provided, fig. 4 is a perspective view of an overall structure of the electrochemical deposition apparatus provided in some embodiments of the present invention, fig. 5 is a perspective view of a partial structure of the electrochemical deposition apparatus provided in some embodiments of the present invention, fig. 6 is a side view of a partial structure of the electrochemical deposition apparatus provided in some embodiments of the present invention, fig. 7 is a top view of a partial structure of the electrochemical deposition apparatus provided in some embodiments of the present invention, and fig. 8 is a bottom view of a partial structure of the electrochemical deposition apparatus provided in some embodiments of the present invention. As shown in fig. 4 to 8, the electrochemical deposition apparatus includes: a tank 20 having a receiving groove 20v, a substrate carrier 30, and the electrode structure 10 in the above embodiment. Wherein, the accommodating tank 20v is used for accommodating electroplating solution, the electrode structure is arranged in the accommodating tank 20v, and the substrate carrier 30 is used for loading the substrate to be electroplated. Because among the above-mentioned electrode structure, the voltage homogeneity of different positions improves, consequently, when the electrochemical deposition equipment who adopts above-mentioned electrode structure carries out electrochemical deposition, the electric field homogeneity in the base plate place region improves, consequently, the embodiment of the utility model provides an electrochemical deposition equipment can guarantee the thickness homogeneity of filming when carrying out electrochemical deposition to jumbo size (1850 mm for example 1500mm) base plate.
The process of electrochemical deposition of a substrate comprises: step one, loading a substrate on a substrate carrier 30; step two, carrying out acid cleaning on the substrate; step three, the substrate carrier 30 moves the substrate into the accommodating groove 20v to perform electrochemical deposition on the substrate; moving the substrate out of the accommodating groove 20v, and washing the substrate with water; fifthly, carrying out anti-oxidation treatment on the substrate to ensure that the film layer deposited on the substrate is not oxidized; and step six, carrying out pure water cleaning on the substrate, and drying by an air knife. When the substrate is subjected to electrochemical deposition, common liquid medicine (electroplating liquid) or quick deposition liquid medicine can be used, and deposition of various liquid medicines can be realized by controlling current density.
In order to improve the stability of the electrochemical deposition apparatus and prolong the service life thereof, optionally, the tank body 20 is made of a material which is not easy to deform, and is acid-resistant and alkali-resistant, and reinforcing ribs 21 may be arranged outside the side walls of the tank body 20.
In some embodiments, the electrochemical deposition apparatus further comprises a power supply device (not shown) having an anode output connected to the electrode structure 10 and a cathode output connected to the substrate carrier 30. Fig. 9 is a perspective view of a substrate carrier provided in some embodiments of the present invention, and fig. 10 is a front view of the substrate carrier provided in some embodiments of the present invention, as shown in fig. 9 and 10, the substrate carrier 30 includes an electrical portion 31 and a clamping portion 32, and the electrical portion 31 and the clamping portion 32 enclose a frame structure, so as to clamp a substrate 01. Of course, the substrate carrier 30 may have other structures, and is not limited herein.
In some embodiments, the number of the electrode structures 10 is two, and the two electrode structures 10 are disposed opposite to each other and respectively located at two sides of the substrate 01 loaded on the substrate carrier 30, so as to simultaneously electroplate two surfaces of the substrate 01, or the substrate carrier 30 is used to simultaneously load two substrates 01, so as to simultaneously electroplate two substrates 01, thereby improving productivity and saving electricity.
In some embodiments, the electrochemical deposition apparatus further comprises: gas transmission pipeline 40, fig. 11 is the utility model discloses a gas transmission pipeline's that some embodiments provided schematic diagram, wherein, gas transmission pipeline 40 sets up in holding tank 20v, and is located holding tank 20v bottom, as shown in fig. 11, gas transmission pipeline 40 has air inlet 41 and a plurality of gas outlet 42, gas transmission pipeline 40's air inlet 41 and air supply intercommunication, gas transmission pipeline 40's gas outlet 42 is used for discharging gas in the holding tank 20v to carry out air agitation to the plating solution in the holding tank 20 v. Before the electrodeposition process is carried out, the electroplating solution is stirred by air, so that the electroplating solution is fully mixed, and the film forming uniformity in the subsequent electrodeposition process is ensured.
As shown in fig. 4 and 5, in some embodiments, the electrochemical deposition apparatus further includes a shunt plate 50 corresponding to the electrode structures one to one, the shunt plate 50 being disposed at a side of the corresponding electrode structure 10 facing the substrate carrier 30. Fig. 12 is a perspective view of a flow distribution plate according to some embodiments of the present invention, and fig. 13 is a cross-sectional view along line AA of fig. 12, as shown in fig. 12 and 13, the flow distribution plate 50 includes: a containment case 51 and a plurality of return lines 52, the containment case 51 comprising: the substrate carrier device comprises a first wall, a second wall 512 arranged opposite to the first wall 511, and a side wall 513 connected between the first wall 511 and the second wall 512, wherein the first wall 511 is located on one side of the second wall 512 facing the substrate carrier 30, the first wall 511, the second wall 512 and the side wall 513 enclose an accommodating cavity, the accommodating shell 51 is provided with a liquid inlet 51a and a plurality of liquid outlets 51b, the liquid inlet 51a and the liquid outlets 51b are both communicated with the accommodating cavity, and the liquid outlets 51b are arranged on the first wall 511. Alternatively, the loading ports 51a are provided on the side wall 513, and the number of the loading ports 51a may be plural. The liquid return line 52 passes through the accommodation chamber, and the liquid return line 52 passes through the accommodation case 51 in the thickness direction of the diversion plate 50. The two end openings of the liquid return pipeline 52 may be respectively located on the first wall 511 and the second wall 512, and of course, the two end openings of the liquid return pipeline 52 may also respectively protrude from the first wall 511 and the second wall 512.
Alternatively, the flow dividing plate 50 may be fixed in the housing groove 20v so as to divide the housing groove 20v into a plurality of housing spaces, for example, as shown in fig. 5, the number of the flow dividing plate 50 is two, so as to divide the housing groove 20v into three housing spaces. The two electrode structures and the substrate are respectively positioned in the three accommodating spaces. When the electrochemical deposition process is performed, the plating solution is introduced into the accommodating chamber from the solution inlet and is output from the solution outlet 51b, and the solutions on both sides of the flow distribution plate 50 are circulated through the solution return line 52. In practical applications, the aperture and distribution density of the liquid outlet 51b can be adjusted as required, so as to further improve the uniformity of the thickness of the film deposited on the substrate.
In some embodiments, as shown in fig. 4 to 8, the electrochemical deposition apparatus further includes a drain line 71 and a filter device 60, and an inlet of the drain line 71 is in communication with the holding tank 20 v. The filtering device 60 has a filtering inlet and a filtering outlet, the filtering inlet is communicated with the outlet of the liquid discharge pipeline 71, the filtering outlet is communicated with the liquid inlet of the flow distribution plate 50, and the filtering device 60 is used for filtering the electroplating solution flowing into the filtering inlet thereof, so as to filter out some impurities in the electroplating solution.
Alternatively, as shown in fig. 4 to 6, the drain line 71 includes an upright portion 711 extending in the height direction of the tank body 20 and a horizontal portion 712 located at the bottom of the electrochemical deposition apparatus, and the tank body 20 is located above the horizontal portion 712. The inlet of the upright part 711 communicates with the drain port of the tank body 20, the outlet of the upright part 711 communicates with the inlet of the horizontal part 712, and the outlet of the horizontal part 712 communicates with the filtering inlet of the filtering device 60, thereby circulating and filtering the plating liquid in the housing tank 20 v. Upright portions 711 are provided on the side walls of the opposite sides of the tank body 20.
Optionally, the electrochemical deposition apparatus further comprises a power structure such as an electric pump 73 for driving the plating solution in the drain line into the filtering device for filtering.
In addition, as shown in fig. 5 to 8, the electrochemical deposition apparatus may further include a gas exhaust line 72, and the gas exhaust line 72 communicates with the top of the upright portion 711 to exhaust gas in the plating liquid.
In some embodiments, the electrochemical deposition apparatus further comprises a driving device for driving the substrate carrier 30 to move along the length direction and/or the width direction of the substrate.
For example, as shown in fig. 4, the driving device includes a power source and a support 81, the substrate carrier 30 is disposed on the support 81, and the power source is connected to the substrate carrier 30 to drive the substrate carrier 30 to move, so that the film formation uniformity on the substrate can be improved.
In some embodiments, the electrochemical deposition apparatus further comprises: and an ion replenishing device communicating with the housing tank 20v for replenishing the plating solution in the housing tank 20v with ions for plating. In the process, when the concentration of the metal ions in the plating solution is reduced, the ion replenishing device can timely replenish ions for plating to the plating solution in the holding tank 20v so as to ensure that a film layer with a required thickness can be formed on the substrate.
In some embodiments, the electrochemical deposition apparatus further comprises a monitoring device 90 for monitoring at least one of the temperature, the level, and the ion concentration of the plating solution in the holding tank 20 v. Optionally, when the monitoring device performs monitoring, at least one of the temperature, the liquid level and the ion concentration is monitored in real time or at a predetermined frequency.
As shown in fig. 4 and 5, the electrochemical deposition apparatus further includes an auxiliary tank body 93 located at one side of the tank body 20, the auxiliary tank body 93 has an auxiliary tank, the auxiliary tank is communicated with the holding tank 20v, and the monitoring device 90 may include at least one of a thermometer, a level gauge, and a concentration detector disposed in the auxiliary tank.
In a specific example, as shown in fig. 4, the monitoring device includes a thermometer 91 and a liquid level gauge 92. In addition, the electrochemical deposition apparatus further includes a heating member (not shown) disposed in the auxiliary tank for heating the plating solution.
Optionally, as shown in fig. 4, the electrochemical deposition apparatus further comprises a control device 94, and the control system 94 is configured to control the heating temperature of the heating member according to the temperature monitored by the thermometer. The control system 94 may also control the plating solution input device to input the amount of the plating solution to the manifold 50 based on the level monitored by the level gauge; and controlling the ion replenishment system to replenish the metal ions for plating into the housing tank 20v in accordance with the ion concentration detected by the concentration detection device.
In a specific example, the monitoring device 90 can also be used to monitor whether the holding tank 20 leaks, for example, when it is monitored that the holding tank 20 leaks, a warning signal is generated to warn an operator.
It is right above the introduction of electrode structure and electrochemical deposition equipment in the embodiment of the utility model, can see that in the utility model discloses in, the voltage homogeneity of the structural different positions of electrode improves to make the electric field homogeneity in the base plate place region of treating the electroplating improve, improve the homogeneity of film forming, consequently, the electrochemical deposition equipment who utilizes this electrode structure can be used for carrying out electrochemical deposition to the jumbo size base plate. In addition, the electrochemical deposition equipment can perform electrochemical deposition on a plurality of substrates at the same time, so that the production efficiency is improved.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (16)
1. An electrode structure for use in an electrochemical deposition apparatus, the electrode structure comprising:
a support frame;
metal mesh and a plurality of conducting strip of setting on the support frame, the conducting strip with metal mesh electric connection, the conducting strip includes: the electric conduction device comprises a conductive main body and a protective layer wrapping the conductive main body, wherein the electric conductivity of the conductive main body is greater than that of the protective layer.
2. The electrode structure of claim 1, wherein at least one of the plurality of conductive strips extends along a length of the metal mesh, and at least one of the remaining conductive strips extends along a width of the metal mesh.
3. The electrode structure of claim 1, wherein the electrode structure is divided into a plurality of sections, the support frame comprises a support portion in each section, the conductive strips are disposed in each section, and the portions of the metal mesh in different sections are insulated from each other.
4. The electrode structure of claim 3, wherein the plurality of zones comprises a central zone and at least one edge zone surrounding the central zone.
5. The electrode structure of claim 4, wherein the dimension of the middle region in a first direction is 1-3 times the dimension of the edge region in the first direction, the dimension of the middle region in a second direction is 1-3 times the dimension of the edge region in the second direction, the first direction is a length direction of the electrode structure, and the second direction is a width direction of the electrode structure.
6. The electrode structure of claim 1, wherein the material of the support frame is the same as the material of the metal mesh.
7. An electrochemical deposition apparatus, comprising: a tank having a holding tank for holding an electroplating solution, a substrate carrier for carrying a substrate to be electroplated, and an electrode structure according to any one of claims 1 to 6.
8. The electrochemical deposition apparatus of claim 7, further comprising a diverter plate in one-to-one correspondence with the electrode structures, the diverter plate being disposed on a side of the respective electrode structure facing the substrate carrier, wherein the diverter plate comprises: the receiver casing and a plurality of return line, the receiver casing includes: the substrate carrier comprises a first wall, a second wall arranged opposite to the first wall and a side wall connected between the first wall and the second wall, wherein the first wall is positioned on one side of the second wall facing the substrate carrier, a containing cavity is defined by the first wall, the second wall and the side wall, a liquid inlet and a plurality of liquid outlets are arranged on the containing shell, the liquid inlet and the liquid outlets are both communicated with the containing cavity, and the liquid outlets are arranged on the first wall; the liquid return pipeline penetrates through the accommodating cavity, and the liquid return pipeline penetrates through the accommodating shell along the thickness direction of the splitter plate.
9. The electrochemical deposition apparatus of claim 8, further comprising a drain line, an inlet of the drain line being in communication with the holding tank,
the electrochemical deposition apparatus further comprises: the filtering device is provided with a filtering inlet and a filtering outlet, the filtering inlet is communicated with the outlet of the drainage pipeline, the filtering outlet is communicated with the liquid inlet of the flow distribution plate, and the filtering device is used for filtering electroplating liquid flowing into the filtering inlet of the filtering device.
10. The electrochemical deposition apparatus of claim 9, wherein the drainage pipeline comprises an upright part extending along the height direction of the tank body and a horizontal part located at the bottom of the electrochemical deposition apparatus, an inlet of the upright part is communicated with the drainage port on the tank body, an outlet of the upright part is communicated with an inlet of the horizontal part, and an outlet of the horizontal part is communicated with a filtering inlet of the filtering device,
the electrochemical deposition apparatus further comprises an exhaust line in communication with the top of the upright portion.
11. The electrochemical deposition apparatus of claim 7, further comprising: the gas transmission pipeline, the gas transmission pipeline sets up in the holding tank, and be located the holding tank bottom, the gas transmission pipeline has air inlet and a plurality of gas outlet, the air inlet and the air supply intercommunication of gas transmission pipeline, the gas outlet be used for to discharge gas in the holding tank.
12. The electrochemical deposition apparatus of claim 7, further comprising: and the ion supplementing device is communicated with the accommodating tank and is used for supplementing ions for electroplating to the electroplating solution in the accommodating tank.
13. The electrochemical deposition apparatus of claim 7, further comprising a monitoring device for monitoring at least one of a temperature, a level, and an ion concentration of the plating solution in the holding tank.
14. The electrochemical deposition apparatus of claim 7, further comprising a drive device coupled to the substrate carrier, the drive device configured to drive the substrate carrier to move along a length and/or width direction of the substrate.
15. The electrochemical deposition apparatus of claim 7, wherein the number of the electrode structures is two, and the two electrode structures are disposed opposite to each other and located on two sides of the substrate loaded on the substrate carrier.
16. The electrochemical deposition apparatus of claim 7, further comprising a power supply device, an anode output of the power supply device being connected to the electrode structure, a cathode output of the power supply device being connected to the substrate carrier.
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| CN202020753538.0U CN212505140U (en) | 2020-05-09 | 2020-05-09 | Electrode structure and electrochemical deposition apparatus |
| PCT/CN2021/089774 WO2021227853A1 (en) | 2020-05-09 | 2021-04-26 | Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021227853A1 (en) * | 2020-05-09 | 2021-11-18 | 京东方科技集团股份有限公司 | Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor |
| CN113737260A (en) * | 2021-09-30 | 2021-12-03 | 京东方科技集团股份有限公司 | Anode assembly for electrochemical deposition and electrochemical deposition apparatus |
| WO2024192723A1 (en) * | 2023-03-22 | 2024-09-26 | 京东方科技集团股份有限公司 | Electrochemical deposition apparatus |
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| CN115537902B (en) * | 2022-10-19 | 2023-12-22 | 厦门海辰新材料科技有限公司 | Titanium net assembly and electroplating equipment |
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| WO2021227853A1 (en) * | 2020-05-09 | 2021-11-18 | 京东方科技集团股份有限公司 | Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor |
| CN113737260A (en) * | 2021-09-30 | 2021-12-03 | 京东方科技集团股份有限公司 | Anode assembly for electrochemical deposition and electrochemical deposition apparatus |
| WO2024192723A1 (en) * | 2023-03-22 | 2024-09-26 | 京东方科技集团股份有限公司 | Electrochemical deposition apparatus |
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