CN217922391U - Electroplating equipment and coating machine - Google Patents

Abstract

The utility model discloses an electroplating device and coating machine, electroplating device includes the plating bath, first anode assembly and at least one second anode assembly, the plating bath has relative income groove side and goes out the groove side, the membrane direction of walking of electrically conductive base film is first direction, the direction perpendicular or that inclines in first direction is the second direction, first anode assembly locates in the plating bath, first anode assembly includes a plurality of first anode units of arranging along the second direction, the interval portion has between two at least adjacent first anode units, second anode assembly locates in the plating bath and is close to out the groove side for first anode assembly, at least one second anode assembly is corresponding to at least part of at least one interval portion. Because this electroplating device's second anode unit can electroplate the position that electrically conductive base film corresponds to the interval portion to increase the cladding material thickness of electrically conductive base film corresponding to the position of interval portion, thereby improve the homogeneity of the cladding material thickness of electrically conductive base film.

Description

Electroplating equipment and coating machine

Technical Field

The utility model relates to an electroplate technical field, especially relate to an electroplating device and coating machine.

Background

The conductive base film is used for preparing a current collector of a lithium battery by increasing the thickness of a metal plating layer through electroplating in an electroplating device. In the related art, an anode plate is disposed in an electroplating tank of the electroplating apparatus, and the anode plate includes a plurality of first anode units disposed at intervals, and the plurality of first anode units are electrically connected to an anode of a power supply to electroplate the conductive base film.

However, the plating layer thickness of the conductive base film plated at a position corresponding to between two adjacent first anode units is thin, and the uniformity of the plating layer thickness of the conductive base film is not good.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model discloses electroplating device and coating machine, this electroplating device can improve the cladding material thickness homogeneity of electrically conductive base film.

In order to achieve the above object, in a first aspect, an embodiment of the present invention discloses an electroplating apparatus for electroplating a conductive base film, the electroplating apparatus comprising:

the electroplating bath is provided with a bath inlet side and a bath outlet side which are opposite, the bath inlet side is one side for the conductive base film to enter the electroplating bath, the bath outlet side is one side for the conductive base film to be output from the electroplating bath, the film running direction of the conductive base film is a first direction, and the direction vertical to or inclined from the first direction is a second direction;

the first anode assembly is arranged in the electroplating bath and comprises a plurality of first anode units which are arranged along the second direction, a spacing part is arranged between at least two adjacent first anode units, and each first anode unit is electrically connected with a power supply; and

the second anode assembly at least comprises a second anode unit, the second anode unit is arranged in the electroplating bath and is close to the bath outlet side relative to the first anode assembly, the at least one second anode unit corresponds to at least part of the at least one partition part, and each second anode unit is electrically connected to the power supply.

This electroplating device is through the second positive pole unit that sets up the second positive pole subassembly corresponding to the spacer of two adjacent first positive pole units to can electroplate the position that electrically conductive base film corresponds to the spacer, with the cladding material thickness that increases the position that electrically conductive base film corresponds to the spacer, thereby improve the homogeneity of the cladding material thickness of electrically conductive base film.

As an alternative, in an embodiment of the first aspect of the present invention, an extension line of the central axis of the second anode unit intersects the spacer. Because the extension line of the axis of the second anode unit is compared with the spacing part, so that the middle part of at least part of the second anode unit corresponds to the spacing part, the second anode unit is further ensured to electroplate the position of the conductive base film corresponding to the spacing part, the plating thickness of the position of the conductive base film corresponding to the spacing part is increased, and the uniformity of the plating thickness of the conductive base film is improved.

As an alternative implementation, in an embodiment of the first aspect of the present invention, along the second direction, the middle region of the second anode unit and the middle of the spacer are disposed opposite to each other. Because the middle region of the second anode unit and the middle of the spacing part are oppositely arranged along the second direction, in other words, the second anode unit is right opposite to the spacing part, the second anode unit is further ensured to electroplate the position of the conductive base film corresponding to the spacing part, so that the plating thickness of the position of the conductive base film corresponding to the spacing part is increased, and the uniformity of the plating thickness of the conductive base film is improved.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the spacer is in an elongated shape, a length direction of the spacer is parallel to the first direction, and the second anode assembly is disposed along an extending direction of the spacer corresponding to the spacer. Because the spacer part is on a parallel with first direction, then, the relatively thin condition of cladding material can appear in the position that electrically conductive base film corresponds to the spacer part, and the second anode assembly sets up corresponding to the spacer part along the extending direction of spacer part to can electroplate the relatively thin position of cladding material of electrically conductive base film, with the cladding material homogeneity that improves electrically conductive base film.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the spacer is in a shape of an elongated strip, a length direction of the spacer is inclined with respect to the first direction, and the second anode assembly corresponds to a middle region of the spacer along the length direction of the spacer. The inventor finds that the electroplating uniformity of the conductive base film can be effectively improved when the spacing part inclines relative to the first direction, the condition that the plating thickness is thinner at the position of the conductive base film corresponding to the spacing part is avoided to a large extent, however, a region with a thinner plating thickness still exists in the middle region of the conductive base film corresponding to the spacing part along the length direction of the spacing part, and the electroplating uniformity of the plating thickness of the conductive base film can be further improved by arranging the second anode assembly corresponding to the middle region of the spacing part along the length direction of the spacing part, so that the region with a thinner plating thickness of the conductive base film can be electroplated.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the first anode unit is a trapezoidal plate, a plurality of the trapezoidal plates have equal heights, the spacing portion is located between two waists of two adjacent trapezoidal plates, and a straight line passing through the middle point of the two waists of two adjacent trapezoidal plates and parallel to the height direction of the trapezoidal plate passes through the second anode assembly. When first positive pole unit is trapezoidal plate, the line of the midpoint of the waist of two adjacent trapezoidal plates passes through the midpoint of the interval portion between these two adjacent trapezoidal plates, and electrically conductive base film is thin on the left corresponding to the cladding material thickness of this position department, and the second positive pole subassembly is passed through to this application setting through the midpoint of the waist of two adjacent trapezoidal plates and the straight line that is on a parallel with the direction of height of trapezoidal plate to can electroplate the position that cladding material thickness is thin on the right side of electrically conductive base film, with the homogeneity that improves the cladding material.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, a plurality of the first anode units are trapezoidal plates, the median line of the trapezoidal plates is perpendicular to the first direction, the length of the median line of the trapezoidal plates is D1, the second anode assembly is a rectangular square plate, the width of the second anode assembly is D2, and D1/D2= 1.5-2.5. Illustratively, D1/D2=1.5, D1/D2=1.7, D1/D2=2.0, D1/D2=2.2, D1/D2=2.5, etc. When the median line of trapezoidal board is longer, the scope that the cladding material thickness of electrically conductive base film is thinner is bigger, when the median line of trapezoidal board is shorter, the scope that the cladding material thickness of electrically conductive base film is thinner is littleer, through the ratio scope of the length of the median line that sets up trapezoidal board and the width of second anode assembly, can make the second anode assembly electroplate the region that the cladding material thickness of electrically conductive base film is thinner, can not electroplate the region that the cladding material thickness of electrically conductive base film is thicker again, thereby improve the homogeneity of the cladding material thickness of electrically conductive base film.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the length of the median line of the trapezoidal plate is 30mm to 500mm, the second anode assembly is an elongated plate, and the width of the second anode assembly is 20mm to 200mm. Illustratively, the length of the waist of the trapezoidal plate is 30mm, 100mm, 200mm, 300mm, 400mm, etc., the second anode assembly is an elongated plate, and the width of the second anode unit is 20mm, 50mm, 100mm, 150mm, 200mm, etc. Through the size of the median line of reasonable control trapezoidal plate, thereby can control the trapezoidal plate size at reasonable within range, when connecing the trapezoidal plate, trapezoidal plate current homogeneity everywhere is better, thereby can realize the homogeneity of electroplating to electrically conductive base film, and simultaneously, through the scope of the width of control second anode unit, can make the second anode unit electroplate the region that the cladding material thickness of electrically conductive base film is thinner, can not electroplate the region that the cladding material thickness of electrically conductive base film is thicker again, thereby improve the homogeneity of the cladding material thickness of electrically conductive base film.

When the length of the median line of trapezoidal plate is less than 30mm, because the width broad of plating bath along the second direction, the width of electrically conductive base film is also broad, then, the quantity of the first anode unit (that is, trapezoidal plate) that a first anode assembly need set up is more, the equipment of being not convenient for, and need the electricity to connect in too much power, connects the complicated and power use quantity of electric mode more, has increased cost and the operation degree of difficulty. When the length of the median line of the trapezoidal plate is greater than 500mm, at the moment, the width of the first anode unit along the second direction is too wide, and when the first anode unit is connected with electricity, the current density of the middle part of the first anode unit is smaller, and the circuit density of the electricity connection end of the first anode unit is larger, so that the current density of each part of the first anode unit is uneven, and the problem of uneven plating thickness of electroplating on the conductive base film is caused. When the width of the second anode assembly is less than 20mm, the width of the second anode assembly is not enough to completely plate the region of the conductive base film with the thinner plating layer, and when the width of the second anode assembly is greater than 200mm, the electroplating range of the second anode assembly on the conductive base film will exceed the region of the conductive base film with the thinner plating layer, and the plating uniformity of the conductive base film will be poor.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the length of the second anode unit along the first direction is 200mm to 1000mm. Illustratively, the length of the second anode unit in the first direction is 200mm, 400mm, 600mm, 800mm, or the like. Through the length of rationally setting up the second anode unit, can make the time that electrically conductive base film passes through the second anode unit better reasonable, can increase suitable cladding material thickness to the region that electrically conductive base film cladding material thickness is thinner to guarantee the homogeneity that electrically conductive base film was electroplated. When the length of the second anode unit in the first direction is less than 200mm, the time for the conductive base film to pass through the second anode unit is too short, the plating thickness of the region of the conductive base film having a relatively thin thickness is insufficiently increased, that is, there is still a problem that the conductive base film has a relatively thin thickness at a position corresponding to the spacer. When the length of the second anode unit along the first direction is greater than 1000mm, the time that the conductive base film passes through the second anode unit is too long, and the plating thickness of the region with the thicker thickness of the conductive base film is increased too much, so that the problem that the plating thickness is too thick at the position of the conductive base film corresponding to the spacing part is caused.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, there is one spacer between every two adjacent first anode units, the number of the first anode units is greater than three, so as to form a plurality of spacers arranged along the second direction, the second anode units are arranged in a plurality, and the plurality of second anode units are arranged in sequence in the second direction and are respectively used for corresponding to the plurality of spacers. Because the plurality of second anode units are respectively used for corresponding to the plurality of spacing parts, the supplementary plating is carried out on the parts of the conductive base film which cannot be plated by the plurality of spacing parts, so that the plating uniformity of the conductive base film is improved.

As an alternative implementation, in an embodiment of the first aspect of the present invention, the number of the spacers and the number of the second anode units are matched, and each of the second anode units is used for corresponding to one of the spacers. Therefore, the part of the conductive base film corresponding to each spacing part can be electroplated through the second anode unit, and the plating uniformity of the conductive base film is further improved.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the current passed through the second anode unit is I, the current density of the second anode unit is J, the area of the side of the second anode unit facing the conductive base film is S, I = J × S, where J ≦ 6A/dm ² . Be in less current density through restricting the second anode unit to make the metallic coating of electroplating conductive base film compacter, have more excellent structural strength and electric conductive property, when connecing the electricity to this second anode unit, can confirm the electric current that lets in according to the area of second anode unit, in order to guarantee that the second anode unit has reasonable current density, when electroplating different batches of conductive base film, the cladding thickness uniformity of many batches of products is better.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the number of the first anode assemblies is n, n of the first anode assemblies are arranged along the first direction, where n is greater than or equal to 2 and n is a positive integer, and the second anode assembly is disposed between the nth first anode assembly and the outlet side. In other words, along the first direction, n first anode assemblies and n second anode assemblies are sequentially arranged in the electroplating bath, and when the conductive base film is electroplated, the conductive base film firstly passes through the n first anode assemblies and then passes through the second anode assembly. Therefore, the second anode assembly can electroplate and thicken the region of the conductive base film with a lower thickness after the first anode assembly is electroplated so as to improve the electroplating uniformity of the conductive base film.

As an alternative, in an embodiment of the first aspect of the present invention, the spacer comprises a spacer, the spacer is in an elongated shape, and the spacer is made of an insulating material. Because the spacer is the elongated insulating member, the condition that the first anode units are electroplated due to potential difference between two adjacent first anode units can be effectively relieved.

In a second aspect, the present invention also discloses a film plating machine, which comprises a conveyer and the electroplating apparatus as described in the first aspect, wherein the conveyer is arranged on at least one side of the second direction of the electroplating apparatus, and the conveyer is used for conveying the conductive base film.

Compared with the prior art, the embodiment of the utility model has the advantages that:

adopt the electroplating device and coating machine that this embodiment provided, this electroplating device is through setting up the second positive pole unit and corresponding to the interval portion of two adjacent first positive pole units to can electroplate the position that electrically conductive base film corresponds to the interval portion, with the cladding material thickness that increases the position that electrically conductive base film corresponds to the interval portion, thereby improve the homogeneity of the cladding material thickness of electrically conductive base film.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a coater provided in the present embodiment;

FIG. 2 is a schematic view of the structure of a plating tank provided in the present embodiment;

FIG. 3 is a schematic illustration of the structure of one of the electroplating cells of the electroplating cell of FIG. 2;

FIG. 4 is a schematic view of another plating bath.

An icon: 10. a film coating machine; 1. electroplating equipment; 11. an electroplating bath; 111. a trough body; 11a, the groove entering side; 11b, a groove outlet side; 12. a first anode assembly; 121. a first anode unit; 122. a spacer section; 13. a second anode assembly; 2. a conveying device; 21. a drive structure; 22. a clamping structure; x, a first direction; y, a second direction; 20. a conductive base film.

Detailed Description

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Moreover, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific type and configuration may or may not be the same), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

In the related art, an anode plate is disposed in an electroplating tank of the electroplating apparatus, the anode plate includes a plurality of first anode units disposed at intervals, and the plurality of first anode units are electrically connected to a power supply to electroplate the conductive base film.

Since both sides of the conductive base film in the width direction are electrically connected, the current density of the conductive base film is smaller as the conductive base film is farther away from the position where the conductive base film is electrically connected, then, for one first anode unit, the current introduced by the first anode unit is the same, the electroplating rate of the conductive base film is slower at the position where the first anode unit is far away from the electrically connected end of the conductive base film, so that the plating layer thickness at the position of the conductive base film is thinner.

Based on this, this application provides an electroplating device and coating machine, can effectively alleviate the less problem of coating thickness of electrically conductive base film corresponding to the interval department of two adjacent first anode unit to improve the coating homogeneity of electrically conductive base film.

The technical solution of the present invention will be further described with reference to the following examples and drawings.

Referring to fig. 1 to 4 together, the application discloses a film coating machine 10, the film coating machine 10 includes a conveying device 2 and a plating apparatus 1, the plating apparatus 1 is used for plating a conductive base film 20, the conveying device 2 is disposed on at least one side of the plating apparatus 1 along a second direction y, and the conveying device 2 is used for conveying the conductive base film 20.

It is understood that the conveying device 2, as the conveying device 2 of the conductive base film 20, may include a driving structure 21 (e.g., a conveyor belt) and a clamping structure 22 (e.g., a conductive clip), where the clamping structure 22 is configured to clamp the conductive base film 20, and the driving structure 21 is configured to drive the clamping structure 22 to move, so that the clamping structure 22 drives the conductive base film 20 to move along the first direction x.

In some embodiments, the electroplating apparatus 1 includes an electroplating bath 11, a first anode assembly 12 and at least one second anode assembly 13, the electroplating bath 11 has an opposite in-tank side 11a and an out-tank side 11b, the in-tank side 11a is a side for the conductive base film 20 to enter the electroplating bath 11, the out-tank side 11b is a side for the conductive base film 20 to exit the electroplating bath 11, a film running direction of the conductive base film 20 is a first direction x, a direction perpendicular or oblique to the first direction x is a second direction y, the first anode assembly 12 is disposed in the electroplating bath 11, the first anode assembly 12 includes a plurality of first anode units 121 arranged along the second direction y, a spacing portion 122 is disposed between two adjacent first anode units 121 and is insulated, each first anode unit 121 is used for a power supply (not shown), the second anode assembly 13 includes at least one second anode unit 131, the second anode unit 131 is disposed in the electroplating bath 11 and is closer to the out-tank side 11b than the first anode assembly 12, the at least one second anode unit 131 corresponds to at least a portion of the spacing portion 122, and each second anode unit 131 is used for the power supply.

The plating apparatus 1 of the present application can plate the position of the conductive base film 20 corresponding to the spacing part 122 by setting the second anode unit 131 corresponding to the spacing parts 122 of the adjacent two first anode units 121 to increase the plating thickness of the conductive base film 20 corresponding to the position of the spacing part 122, thereby improving the uniformity of the plating thickness of the conductive base film 20. It can be understood that the coater 10 including the electroplating apparatus 1 as described above has all the technical effects of the electroplating apparatus 1 as described above, and thus, the detailed description thereof is omitted.

It is understood that since the plating bath 11 has a generally rectangular structure and the first direction x is a longitudinal direction of the plating bath 11, when the first anode assembly 12 also has a rectangular plate-like structure, the second direction y is a width direction of the plating bath 11, i.e., the second direction y is perpendicular to the first direction x, but in other embodiments, the first anode assembly 12 has other shapes, e.g., the first anode assembly 12 has a parallelogram shape, an arrangement direction of the plurality of first anode units 121 of the first anode assembly 12 is inclined with respect to the first direction x, i.e., the second direction y may be inclined with respect to the first direction x. It will be appreciated that the second anode assembly 13 may also be of a rectangular plate-like configuration.

It should be further noted that, the electrically connecting each first anode unit 121 to the power supply includes electrically connecting each first anode unit 121 to different power supplies, or electrically connecting each first anode unit 121 to the same power supply, or electrically connecting some first anode units 121 to the same power supply. The power source may be an external power source not included in the electroplating apparatus, and of course, the electroplating apparatus may also include a power source as long as the first and second anode assemblies 12 and 13 can be electrically connected to the power source to supply the current required by the first and second anode assemblies.

Alternatively, the spacer 122 may include a spacer 123, the spacer 123 having an elongated shape, the spacer being made of an insulating material. Illustratively, the spacer may be an insulating material such as a rubber strip, a plastic strip, or the like. In this way, the first anode unit 121 can be effectively prevented from being plated by the spacer. In other embodiments, the spacer 122 may further include an air gap, that is, a spacer 123 and an air gap may be included between two adjacent first anode units 121.

In the electroplating, the plurality of first anode units 121 of the first anode assembly 12 are arranged in the second direction y in the anode box, and the first anode assembly 12 is disposed in the electroplating bath 11 by fixing the anode box in the electroplating bath 11, so that the conductive base film 20 is electroplated. In addition, one anode cartridge may be provided with a plurality of first anode assemblies 12, and the plurality of first anode assemblies 12 may be spaced along the first direction x.

It is understood that in some embodiments, the length of the plating tank 11 is relatively long, so that the time for the conductive base film 20 to pass through the plating tank 11 is long enough to be plated to a required plating thickness under a suitable current, so as to ensure the plating thickness of the conductive base film 20 and the uniformity of the plating layer, then, in order to facilitate installation and cleaning of the plating tank 11, optionally, the plating tank 11 may include a plurality of tank bodies 111, and the plurality of tank bodies 111 are connected and arranged along the transportation direction of the conductive base film 20.

Optionally, n first anode assemblies 12 are arranged, the n first anode assemblies 12 are arranged along the first direction x, where n is greater than or equal to 2 and n is a positive integer, and the second anode assembly 13 is arranged on one side of the nth first anode assembly 12 close to the slot outlet side 11 b. In other words, in the first direction x, n first anode assemblies 12 and n second anode assemblies 13 are sequentially disposed in the electroplating bath 11, and when the conductive base film 20 is electroplated, the conductive base film 20 passes through the n first anode assemblies 12 and the second anode assemblies 13. In this way, the second anode assembly 13 can thicken the electroplated region of the conductive base film 20 of the first anode assembly 12, which has a small thickness, to improve the electroplating uniformity of the conductive base film 20. Exemplarily, the first anode assemblies 12 are provided in 5.

It should be noted that, along the first direction x, the n first anode assemblies 12 are respectively a first anode assembly and a second first anode assembly … … nth first anode assembly, in other words, the nth first anode assembly refers to one of the n first anode assemblies that is closer to the slot exit side 11 b.

In some embodiments, the central axis of the second anode unit 131 is extended compared to the spacer. It can be understood that when the extension line of the central axis of the second anode unit 131 intersects the partition, the central axis of the second anode unit 131 corresponds to the partition, and then the second anode unit 131 can effectively plate the position of the conductive base film 20 corresponding to the partition 122 to improve the plating uniformity of the conductive base film 20.

Further, in the second direction y, a middle region of the second anode unit 131 and a middle of the spacer 122 are oppositely disposed. In this way, the second anode unit 131 can be further made to correspond to the spacing portion 122, so that the second anode unit 131 can effectively plate the position of the conductive base film 20 corresponding to the spacing portion 122 to improve the plating uniformity of the conductive base film 20.

As shown in fig. 2 and 3, in some embodiments, the spacing portion 122 is inclined with respect to the first direction x, and the second anode assembly 13 corresponds to a middle region of the spacing portion 122 along a length direction of the spacing portion 122. The inventor finds that the electroplating uniformity of the conductive base film 20 can be effectively improved when the spacing portion 122 is inclined relative to the first direction x, and the situation that the plating thickness is too thin at the position of the conductive base film 20 corresponding to the spacing portion 122 is largely avoided, however, a region with a thinner plating thickness still exists in the middle region of the conductive base film 20 corresponding to the spacing portion 122 along the length direction of the spacing portion 122, and in the present embodiment, the second anode assembly 13 is disposed in the middle region of the spacing portion 122 corresponding to the length direction of the spacing portion 122, so that the region with a thinner plating thickness of the conductive base film 20 can be electroplated, and the plating thickness uniformity of the conductive base film 20 is further improved.

Alternatively, the first anode unit 121 may be triangular, trapezoidal, or irregular in shape as long as the spacer 122 can be inclined with respect to the first direction x.

Illustratively, the first anode unit 121 is a trapezoidal plate, the heights of the plurality of trapezoidal plates are equal, the spacer 122 is located between two waists of two adjacent trapezoidal plates, and a straight line passing through the midpoints of the waists of two adjacent trapezoidal plates and parallel to the height direction of the trapezoidal plates passes through the second anode assembly 13. As shown in fig. 2 and 3, the midpoints of the plurality of trapezoidal plates are connected by a dotted line o to illustrate the positional relationship of the second anode assembly 13 with the first anode unit 121, i.e., a straight line passing through the midpoints of the waists of the adjacent two trapezoidal plates and parallel to the height direction of the trapezoidal plates passes through the second anode assembly 13.

When the first anode unit 121 is a trapezoidal plate, the connection line of the middle points of the waists of two adjacent trapezoidal plates passes through the middle point of the length direction of the partition 122, and the thickness of the plating layer at the position corresponding to the connection line is thinner, and the straight line passing through the middle points of the waists of two adjacent trapezoidal plates and parallel to the height direction of the trapezoidal plates passes through the second anode assembly 13, so that the region of the plating layer of the conductive base film 20 with a thinner thickness can be electroplated, and the uniformity of the plating layer can be improved.

In some embodiments, the plurality of first anode units 121 are trapezoidal plates, the median line m of the trapezoidal plates is perpendicular to the first direction x, the median line m of the trapezoidal plates has a length D1, the second anode units 131 are elongated plates, the second anode units 131 have a width D2, and D1/D2= 1.5-2.5. Illustratively, D1/D2=1.5, D1/D2=1.7, D1/D2=2.0, D1/D2=2.2, D1/D2=2.5, and so on. When the median line m of the trapezoidal plate is long, the range of the plating thickness of the conductive base film 20 is relatively large, when the median line m of the trapezoidal plate is relatively short, the range of the plating thickness of the conductive base film 20 is relatively small, and the ratio range of the length of the median line m of the trapezoidal plate and the width of the second anode unit 131 is set, so that the second anode unit 131 can electroplate the region line with the relatively thin plating thickness of the conductive base film 20, and the region with the relatively thick plating thickness of the conductive base film 20 can not be electroplated, thereby improving the uniformity of the plating thickness of the conductive base film 20.

Further, the length of the median line m of the trapezoidal plate is 30mm to 500mm, the second anode unit 131 is a strip-shaped plate, and the width of the second anode unit 131 is 20mm to 200mm. Illustratively, the length of the median line m of the trapezoidal plate is 30mm, 100mm, 200mm, 300mm, 400mm, etc., and the width of the second anode cell 131 is 20mm, 50mm, 100mm, 150mm, 200mm, etc. Through the size of the median line m of reasonable control trapezoidal plate, thereby can control the trapezoidal plate size at reasonable within range, when connecing the trapezoidal plate, trapezoidal plate current homogeneity everywhere is better, thereby can realize the homogeneity of electroplating electrically conductive base film 20, and simultaneously, through the scope of the width of control second anode unit 131, can make second anode unit 131 electroplate the regional line that the cladding material thickness of electrically conductive base film 20 is thinner, can not electroplate the region that the cladding material thickness of electrically conductive base film 20 is thicker again, thereby improve the homogeneity of the cladding material thickness of electrically conductive base film 20.

When the length of the median line m of the trapezoidal plate is less than 30mm, since the width of the plating bath 11 along the second direction y is wider and the width of the conductive base film 20 is also wider, the number of the first anode units 121 (i.e., the trapezoidal plates) required to be disposed in one first anode assembly 12 is greater, which is inconvenient for assembly, and needs to be electrically connected to too many power supplies, the power connection method is complex, the number of the power supplies is greater, and the cost and the operation difficulty are increased. When the length of the median line m of the trapezoidal plate is greater than 500mm, the width of the first anode unit 121 is too wide, and when the first anode unit 121 is electrically connected, the current density at the middle of the first anode unit 121 is low, and the circuit density at the electrical connection end of the first anode unit 121 is high, so that the current density at each position of the first anode unit 121 is not uniform, thereby causing a problem of non-uniform plating thickness of the conductive base film 20. When the width of the second anode unit 131 is less than 20mm, the width of the second anode unit 131 is not enough to plate the whole of the region of the conductive base film 20 where the plating layer thickness is thin, and when the width of the second anode unit 131 is greater than 200mm, the plating range of the conductive base film 20 by the second anode unit 131 will exceed the region of the conductive base film 20 where the plating layer thickness is thin, and the plating uniformity of the conductive base film 20 will be poor.

As shown in fig. 4, in other embodiments, the spacing portion 122 is parallel to the first direction x, and the second anode unit 131 is disposed along the extending direction of the spacing portion 122 corresponding to the spacing portion 122. Since the partition part 122 is parallel to the first direction x, a plating layer may be thinner at a position of the conductive base film 20 corresponding to the partition part 122, and the second anode unit 131 is disposed along the extending direction of the partition part 122 corresponding to the partition part 122, so that the plating layer of the conductive base film 20 can be plated at the position where the plating layer is thinner to improve the plating layer uniformity of the conductive base film 20.

It is understood that the first anode units 121 of the first anode assembly 12 may have a rectangular structure, and the length direction or the width direction of the first anode units 121 is parallel to the first direction x, and then the spacing portions 122 formed between two adjacent first anode units 121 will be parallel to the first direction x. Alternatively, the second anode unit 131 may be a rectangular anode plate, and the length direction of the second anode unit 131 is parallel to the first direction x.

Optionally, the current applied to the second anode unit 131 is I, the current density of the second anode unit 131 is J, and the area of the side of the second anode unit 131 facing the conductive base film 20 is S, I = J × S, where J ≦ 6A/dm ² . The second anode unit 131 is limited to be at a lower current density, so that a metal plating layer electroplated on the conductive base film 20 is more compact, and the conductive base film has more excellent structural strength and conductivity, when the second anode unit 131 is electrified, the current can be determined according to the area of the second anode unit 131, so that the second anode unit 131 has reasonable current density, and when the conductive base films 20 of different batches are electroplated, the consistency of products of multiple batches is better.

Further, the length L of the second anode unit 131 in the first direction x is 200mm to 1000mm, and exemplarily, the length L of the second anode unit 131 in the first direction x is 200mm, 400mm, 600mm, 800mm, and the like. Through the length L of rationally setting up second anode unit 131, can make electrically conductive base film 20 better reasonable through the time of second anode unit 131, in the above-mentioned electric current scope is injectd simultaneously, can increase suitable cladding material thickness to the region that electrically conductive base film 20 cladding material thickness is thinner to guarantee the homogeneity that electrically conductive base film 20 electroplated. When the length of the second anode unit 131 in the first direction x is less than 200mm, the time for the conductive base film 20 to pass through the second anode unit 131 is too short, the plating thickness of the region of the conductive base film 20 where the thickness is thin is insufficiently increased, that is, the position of the conductive base film 20 corresponding to the spacer 122 still has a problem of being thin. When the length of the second anode unit 131 in the first direction x is greater than 1000mm, the time for the conductive base film 20 to pass through the second anode unit 131 is too long, and the plating thickness is excessively increased to a region where the thickness of the conductive base film 20 is thick, thereby causing a problem that the plating thickness is excessively thick at a position of the conductive base film 20 corresponding to the spacer part 122.

In some embodiments, there is one spacer 122 between every two adjacent first anode units 121, the number of the first anode units 121 is greater than three, so as to form a plurality of spacers 122 arranged along the second direction y, the second anode units 131 are arranged in plurality, and the plurality of second anode units 131 are arranged in sequence along the second direction y and respectively correspond to the plurality of spacers 122. In this way, the plurality of spacers 122 are provided with the second anode units 131 corresponding thereto, so that it is ensured that the positions of the conductive base film 20 corresponding to the plurality of spacers 122 can be electroplated by the second anode units 131, thereby improving the plating uniformity of the conductive base film 20.

Further, the number of the spacers 122 matches the number of the second anode units 131, each of the second anode units 131 being respectively used to correspond to one of the spacers 122. In this way, each of the spacers 122 is provided with the corresponding second anode unit 131, so that the positions of the conductive base film 20 corresponding to the plurality of spacers 122 can be electroplated through the second anode units 131, and the plating uniformity of the conductive base film 20 is further improved.

According to the electroplating equipment 1 and the film coating machine 10, the second anode assembly 13 is arranged on the electroplating equipment 1 to correspond to the spacing parts 122 of the two adjacent first anode units 121, so that the position of the conductive base film 20 corresponding to the spacing parts 122 can be electroplated, the plating thickness of the position of the conductive base film 20 corresponding to the spacing parts 122 is increased, and the uniformity of the plating thickness of the conductive base film 20 is improved.

The electroplating device and the film coating machine disclosed by the embodiment of the utility model are described in detail, and the principle and the implementation mode of the utility model are explained by applying specific examples, and the description of the above embodiments is only used for helping to understand the electroplating device and the film coating machine and the core idea thereof; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, and in summary, the content of the present specification should not be understood as the limitation of the present invention.

Claims (15)

1. An electroplating apparatus for electroplating a conductive base film, comprising:

the electroplating bath is provided with a bath inlet side and a bath outlet side which are opposite, the bath inlet side is one side for the conductive base film to enter the electroplating bath, the bath outlet side is one side for the conductive base film to be output from the electroplating bath, the film running direction of the conductive base film is a first direction,

the direction vertical to or inclined to the first direction is a second direction;

the first anode assembly is arranged in the electroplating bath and comprises a plurality of first anode units arranged along the second direction, a spacing part is arranged between at least two adjacent first anode units, and each first anode unit is electrically connected to a power supply; and

a second anode assembly including at least one second anode unit disposed in the plating bath and adjacent to the outlet side with respect to the first anode assembly, the at least one second anode unit corresponding to at least a portion of the at least one partition, each of the second anode units being configured to be electrically connected to the power supply.

2. The plating apparatus as recited in claim 1, wherein an extension line of a central axis line of the second anode unit intersects the partition.

3. The plating apparatus as recited in claim 1, wherein a middle region of the second anode unit and a middle of the partition portion are disposed opposite to each other in the second direction.

4. The plating apparatus as recited in claim 1, wherein said spacer is elongated, a lengthwise direction of said spacer is parallel to said first direction, and said second anode assembly is disposed in correspondence with said spacer in an extending direction of said spacer.

5. The plating apparatus as recited in claim 1, wherein said spacer is elongated, a lengthwise direction of said spacer is inclined with respect to said first direction, and said second anode assembly corresponds to a central region of said spacer in the spacer lengthwise direction.

6. The plating apparatus as recited in claim 5, wherein the first anode unit is a trapezoidal plate, a plurality of the trapezoidal plates have the same height, the space is located between two waists of two adjacent trapezoidal plates, and a straight line passing through a midpoint of the waists of two adjacent trapezoidal plates and parallel to a height direction of the trapezoidal plates passes through the second anode unit.

7. The plating apparatus as recited in claim 1, wherein a plurality of the first anode units are trapezoidal plates having a median line perpendicular to the first direction, the median line of the trapezoidal plates has a length of D1, the second anode units are elongated plates having a width of D2, and D1/D2=1.5 to 2.5.

8. The plating apparatus as recited in claim 7, wherein the length of the median line of the trapezoidal plate is 30mm to 500mm, the second anode unit is an elongated plate, and the width of the second anode unit is 20mm to 200mm.

9. The plating apparatus as recited in claim 7, wherein a length of said second anode unit in said first direction is 200mm to 1000mm.

10. The electroplating apparatus according to any one of claims 1-9, wherein the second anode unit is energized with a current I, the second anode assembly has a current density J, and the second anode assembly has an area S on the side facing the conductive base film, I = js, wherein J ≦ 6A/dm ² 。

11. The plating apparatus as recited in any one of claims 1 to 9, wherein there is one said spacing portion between every adjacent two of said first anode units, the number of said first anode units is more than three to form a plurality of said spacing portions arranged in said second direction, said second anode units are provided in plurality, and a plurality of said second anode units are arranged in sequence in said second direction and are respectively provided to correspond to a plurality of said spacing portions.

12. The plating apparatus as recited in claim 11, wherein the number of said spacers and the number of said second anode units, each for corresponding to one of said spacers, are matched.

13. The plating apparatus as recited in any one of claims 1 to 9, wherein said first anode assembly is provided in n number, n number of said first anode assemblies being arranged along said first direction, wherein n is not less than 2 and n is a positive integer, said second anode assembly being provided between an nth one of said first anode assemblies and said outlet side.

14. The plating apparatus as recited in any one of claims 1 to 9, wherein said spacer includes a spacer, said spacer being elongated, said spacer being composed of an insulating material.

15. A coater comprising a conveyor provided on at least one side of said plating apparatus in said second direction and the plating apparatus as set forth in any one of claims 1 to 14, said conveyor being adapted to convey said conductive base film.

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