CN113737260B - Anode assembly for electrochemical deposition and electrochemical deposition apparatus - Google Patents

Abstract

The embodiment of the application provides an anode assembly for electrochemical deposition and electrochemical deposition equipment. The anode assembly includes: the bracket is fixed on the side wall of the electroplating bath; the anode structure comprises an anode plate, a plurality of adjusting plates and a connecting piece, wherein the anode assembly is fixed on a bracket, and the anode plate is parallel to the side wall fixed by the bracket; any adjusting plate is located between the anode plate and the side wall fixed by the support, or located on one side of the anode plate away from the side wall fixed by the support, and the distances between the anode plate and the substrate to be plated serving as the cathode are different when the number of the adjusting plates located between the anode plate and the side wall fixed by the support is different. The anode assembly in the embodiment can adjust the cathode and anode distances by adjusting the position of the adjusting plate so that the cathode and anode distances are in a range required by an electroplating process, and therefore the quality of an electroplating film layer is improved.

Description

Anode assembly for electrochemical deposition and electrochemical deposition apparatus

Technical Field

The present application relates to the field of electroplating, and in particular, the present application relates to an anode assembly for electrochemical deposition and an electrochemical deposition apparatus.

Background

The electrochemical deposition process is a low-cost chemical film forming mode, and can deposit thick metal of 2-20 um, so that lower resistance is obtained. Electrodeposition has the advantages of high efficiency, low stress, low risk and the like, and is widely applied to manufacturing of display substrates.

However, in the case of manufacturing a large-sized substrate, it is difficult to adjust the distance between the plating anode and the substrate as the cathode due to the size limitation of the plating tank, and the plating film forming effect is affected.

Disclosure of Invention

The application provides an anode assembly for electrochemical deposition and electrochemical deposition equipment aiming at the defects of the existing mode, and can realize rapid adjustment of cathode-anode distance in an electroplating bath, so that quality of an electroplating film layer is improved.

In a first aspect, embodiments of the present application provide an anode assembly for electrochemical deposition, the anode assembly comprising:

the bracket is fixed on the electroplating bath;

an anode structure comprising an anode plate and a plurality of adjusting plates,

the connecting piece is used for fixing the anode structure on the bracket and enabling the anode plate to be parallel to the side wall of the electroplating bath;

any adjusting plate is located between the anode plate and the side wall fixed by the support, or located on one side of the anode plate away from the side wall fixed by the support, and the distances between the anode plate and the substrate to be plated serving as a cathode are different when the number of the adjusting plates located between the anode plate and the side wall fixed by the support is different.

Optionally, the thickness of the adjusting plate is 1 mm-20 mm.

Optionally, the adjusting plate includes a first adjusting plate and a second adjusting plate having different thicknesses.

Optionally, at least one of the adjusting plates is an insulating adjusting plate, and the insulating adjusting plate is located at an edge area of the anode plate.

Optionally, at least one of the adjusting plates is a conductive adjusting plate, wherein the conductivity of the conductive adjusting plate is greater than that of the anode plate and the activity of the conductive adjusting plate is less than that of the anode plate; the conductive adjusting plate is electrically connected with the anode plate.

Optionally, the anode plate is made of titanium metal with a net structure.

Optionally, the connecting piece is a bolt.

Optionally, the bracket comprises a cross beam and a frame connected with the cross beam, the cross beam is fixed on the side wall, and the anode assembly is fixed on the frame through the connecting piece.

In a second aspect, embodiments of the present application provide an electrochemical deposition apparatus, comprising:

plating bath;

the anode assembly described above;

and the carrier is used for clamping the substrate to be plated so that the substrate to be plated is opposite to the anode plate.

Optionally, the number of the anode assemblies is two, and the anode assemblies are respectively fixed on the side walls of the electroplating tank which are oppositely arranged; the substrate to be plated is positioned between the two anode assemblies.

The beneficial technical effects that technical scheme that this application embodiment provided brought are:

according to the anode component for electrochemical deposition and the electrochemical deposition equipment, the anode-cathode distance can be adjusted by adjusting the position of the adjusting plate, so that the anode-cathode distance is in a range required by an electroplating process, and the quality of an electroplating film layer is improved.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic diagram illustrating connection between an anode assembly and a plating tank according to an embodiment of the present disclosure;

FIG. 2 is a schematic illustration of a first assembly of an anode assembly according to one embodiment provided herein;

FIG. 3 is a schematic illustration of a second assembly of an anode assembly according to one embodiment provided herein;

FIG. 4 is a schematic illustration of a third embodiment of an anode assembly according to an embodiment of the present application;

FIG. 5 is a schematic view of a first assembly of an anode assembly according to another embodiment provided herein;

FIG. 6 is a schematic illustration of a second assembly of an anode assembly according to another embodiment provided herein;

FIG. 7 is a schematic illustration of a third embodiment of an anode assembly according to an embodiment of the present application;

FIG. 8 is a fourth schematic illustration of an anode assembly according to another embodiment provided herein;

FIG. 9 is a fifth schematic illustration of an anode assembly according to another embodiment provided herein;

FIG. 10 is a front view of the anode assembly shown in FIG. 1;

FIG. 11 is a schematic view of an electrochemical deposition apparatus according to an embodiment of the present disclosure;

fig. 12 is a schematic structural view of another electrochemical deposition apparatus according to an embodiment of the present application.

Reference numerals:

1-a bracket; 11-a cross beam; 12-frame;

2-anode structure; 21-an anode plate; 211-an electrode body; 212-an electrode frame; 2121-cross bar; 2122-vertical bars; 22-adjusting plate; 221-a first adjusting plate; 222-a second adjustment plate;

3-connectors;

4-electroplating bath; 41-side walls; 42-groove bottom;

5-a substrate to be plated;

6-a carrier;

7-a circulation system; 71-a liquid inlet; 72-spraying disc; 73-a circulation pipe; 731-a first leg; 732-a second line; 74-motor; 75-a filter;

8-a controller;

9-a monitor; 91-a first monitor; 92-a second monitor.

Detailed Description

Examples of embodiments of the present application are illustrated in the accompanying drawings, in which like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the present application.

It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

With the development of display technology, the micro light emitting diode has wide market prospect, has the advantages of thinning, microminiaturization and array, and is gradually introduced into industrial application. From the application scene of the terminal, the application field of the micro light emitting diode can be divided into two large scenes of direct display and backlight.

Since the micro led requires a higher amplitude driving signal, in order to reduce power consumption and avoid overheating of the device caused by long-time light emission, it is necessary to reduce the channel impedance of the trace as much as possible, and the reduction of the trace impedance is usually achieved by thickening the trace.

The electrochemical deposition process is a low-cost chemical film forming mode, and can deposit metal with the thickness of 2-20 um, so that lower resistance is obtained, and the electrochemical deposition process has the advantages of high efficiency, low stress, low risk and the like. In particular, taking the example of preparing a large-sized substrate for providing electrical signals to a micro light emitting diode, a large number of low-impedance traces need to be prepared on the substrate, wherein the low-impedance traces can be formed by preparing a thicker metal film layer by electrochemical deposition and patterning.

Because electrochemical deposition equipment is complex, and the size of the existing electroplating bath is limited, for manufacturing large-size substrates, it is difficult to add a complex structure in a limited electroplating bath space to realize adjustment of cathode-anode distance (the distance between an electroplating anode and a substrate serving as a cathode), and the cathode-anode distance has a great influence on a film forming electric field, a film forming rate and the like, so that the electroplating film forming effect is affected.

The application provides an anode component for electrochemical deposition and electrochemical deposition equipment, and aims to solve the technical problems in the prior art.

The embodiment of the application provides an anode assembly for electrochemical deposition, as shown in fig. 1, the anode assembly for electrochemical deposition provided in the embodiment includes:

a bracket 1 fixed to a side wall 41 of the plating tank 4;

the anode structure 2, comprising an anode plate 21 and a plurality of adjusting plates 22,

a connecting member 3 for fixing the anode structure 2 to the bracket 1;

any adjusting plate 22 is located between the anode plate 21 and the side wall 41 fixed by the bracket 1, or is located at one side of the anode plate 21 away from the side wall 41 fixed by the bracket 1, and the different numbers of adjusting plates 22 located between the anode plate 21 and the side wall 41 fixed by the bracket 1 make the distance between the anode plate 21 and the substrate 5 to be plated as the cathode different.

Specifically, the plating tank 4 further includes a tank bottom 42, and a plurality of side walls 41 and the tank bottom 42 are vertically arranged to form a rectangular tank.

For convenience of description, in the following embodiments, the "side wall 41 to which the above-described bracket 1 is fixed" is simply referred to as a side wall 41.

Specifically, taking the anode structure 2 including two adjusting plates 22 as an example, as shown in fig. 2, when both adjusting plates 22 are located between the anode plate 21 and the side wall 41, the anode-cathode distance is a first distance D1; as shown in fig. 3, when one adjusting plate 22 is located between the anode plate 21 and the side wall 41, the other adjusting plate 22 is located on the side of the anode plate 21 away from the side wall 41, and the distance between the anode and the cathode is the second distance D2; as shown in fig. 4, when both the adjusting plates 22 are located on the side of the anode plate 21 away from the sidewall 41, the distance between the anode and the cathode is the third distance D3. And the first distance D1 is smaller than the second distance D2, and the second distance D2 is smaller than the third distance D3.

The anode assembly provided in this embodiment can adjust the distance between the anode and the cathode by adjusting the position of the adjusting plate 22, so that the distance between the anode and the cathode is in the range required by the electroplating process, and the quality of the electroplating film layer is improved.

Alternatively, as shown in fig. 1, in the anode assembly provided in this embodiment, the anode plate 21 is made of titanium metal having a mesh structure, and the connecting member 3 is a bolt.

Alternatively, as shown in fig. 1, in the anode assembly provided in this embodiment, the bracket 1 includes a cross member 11 and a frame 12 connected to the cross member 11, the cross member 11 is fixed to the side wall 41, and the anode structure 2 is fixed to the frame 12 by the connection member 3.

Alternatively, as shown in fig. 1, in the anode assembly provided in this embodiment, the thickness of the adjustment plate 22 is 1mm to 20mm. The adjusting ranges of the cathode and anode distances are different according to the parameters such as the size of the substrate 5 to be plated, the required plating thickness, the required plating speed and the like, so that the adjusting plates 22 with different thicknesses can be selected according to the parameters of the substrate 5 to be plated.

As shown in fig. 2 to 4, in a specific embodiment, two adjusting plates 22 with a thickness of 10mm may be used in the electroplating process of a substrate with a size of 1500mm x 1300mm, and the positions of the adjusting plates 22 are adjusted to make the cathode and the anode have three steps, namely, a first distance D1, a second distance D2 and a third distance D3. Assuming that the second distance is 150mm, the cathode-anode distance can be adjusted to be 140mm for the first distance D1, 150mm for the second distance D2, and 160mm for the third distance D3, respectively.

Of course, anode assemblies suitable for use in electrochemical deposition apparatus for electroplating substrates of different sizes may employ different thicknesses and different numbers of conditioning plates 22.

Alternatively, the adjusting plate 22 includes a first adjusting plate 221 and a second adjusting plate 222 having different thicknesses. By designing the adjusting plates 22 of different thicknesses, the adjusting range of the cathode-anode distance can be increased, thereby adjusting the cathode-anode distance to a more accurate range.

For example, in the electroplating process of a substrate with a size of 1500mm x 630 mm, one first adjusting plate 221 with a thickness of 10mm and two second adjusting plates 222 with a thickness of 5mm may be used, and the positions of the adjusting plates 221 are adjusted to make the cathode and the anode have five steps, namely, a first distance D1, a second distance D2, a third distance D3, a fourth distance D4 and a fifth distance D5. Wherein, the liquid crystal display device comprises a liquid crystal display device,

as shown in fig. 5, a first adjusting plate 221 and two second adjusting plates 222 are located between the anode plate 21 and the sidewall 41, and the anode-cathode distance is a first distance D1.

As shown in fig. 6, one first adjusting plate 221 and one second adjusting plate 222 are located between the anode plate 21 and the side wall 41, and the other second adjusting plate 222 is located on the side of the anode plate 21 away from the side wall 41, so that the anode-cathode distance is a second distance D2.

As shown in fig. 7, a first adjusting plate 221 is located between the anode plate 21 and the sidewall 41, and two second adjusting plates 222 are located on the side of the anode plate 21 away from the sidewall 41, so that the cathode-anode distance is a third distance D3; although not shown in fig. 7, since the thickness of one first regulation plate 221 is equal to the thickness of two second regulation plates 222 in the present embodiment, when two second regulation plates 222 are located between the anode plate 21 and the side wall 41, one first regulation plate 221 is located on the side of the anode plate 21 away from the side wall 41, and the cathode-anode distance is also the third distance D3.

As shown in fig. 8, a second adjusting plate 222 is located between the anode plate 21 and the sidewall 41, and a first adjusting plate 221 and a further second adjusting plate 222 are located on the side of the anode plate 21 away from the sidewall 41, so that the anode-cathode distance is a fourth distance D4;

as shown in fig. 9, if one first adjusting plate 22 and two second adjusting plates 222 are located on the side of the anode plate 21 away from the sidewall 41, the anode-cathode distance is a fifth distance D5.

As shown in fig. 5 to 9, the first distance D1 is smaller than the second distance D2, the second distance D2 is smaller than the third distance D3, the third distance D3 is smaller than the fourth distance D4, and the fourth distance D4 is smaller than the fifth distance D5. Assuming that the first distance D1 is 150mm, the second distance D2 is 155mm, the third distance D3 is 160mm, the fourth distance D4 is 165mm, and the fifth distance D5 is 170mm.

As shown in fig. 1 to 10, in the anode assembly provided in this embodiment, at least one adjusting plate 22 is an insulating adjusting plate 22, and the insulating adjusting plate 22 is located at an edge region of the anode plate 21.

Specifically, as shown in fig. 10, the insulating adjustment plate 22 is in a strip shape, and is located at the edge region of the anode plate 21, and only plays a role in adjusting the cathode-anode distance.

Alternatively, as shown in fig. 1 to 10, in the anode assembly provided in this embodiment, at least one adjusting plate 22 may be a conductive adjusting plate, where the conductivity of the conductive adjusting plate is greater than that of the anode plate 21 and the activity of the conductive adjusting plate is less than that of the anode plate 21; the conductive adjustment plate is electrically connected to the anode plate 21. Specifically, the conductive adjusting plate not only can play a role in adjusting the distance between the anode and the cathode, but also can play a role in enhancing the conductive performance of the anode because the conductivity of the conductive adjusting plate is larger than that of the anode plate, and can not participate in chemical reaction in the electroplating process because the activity of the conductive adjusting plate is smaller than that of the anode plate 21.

Specifically, as shown in fig. 10, the anode plate 21 includes an electrode body 211 and an electrode frame 212 for supporting the electrode body 211, the electrode frame 212 includes a plurality of cross bars 2121 and a plurality of vertical bars 2122, and in one specific embodiment, three cross bars 2121 and three vertical bars 2122 form a "delta-shaped" electrode frame, although the number of the cross bars 2121 and the vertical bars 2122 may be more or less depending on the size of the electrode body. For example, when the electrode body 211 is small in size, the electrode frame 212 may employ only two rails 2121 and two upright bars 2122 to form a "zig-zag" electrode frame; when the electrode body 211 is larger in size, the electrode frame may also include more cross bars 2121 and vertical bars 2122 to form a grid-shaped electrode frame.

In a specific embodiment, the conductive adjusting plate may be overlapped with the positions of the horizontal bar and the vertical bar in at least part of the electrode frame 212, or replace the positions of the horizontal bar and the vertical bar in the electrode frame 212, at this time, the conductive adjusting plate may also improve the voltage uniformity at different positions of the electrode main body 211, so as to improve the electric field uniformity in the area where the substrate 5 to be plated is located, and improve the film forming uniformity.

Based on the same inventive concept, the embodiment of the present application further provides an electrochemical deposition apparatus, as shown in fig. 11, where the electrochemical deposition apparatus provided in this embodiment includes the anode assembly in the foregoing embodiment, and has the beneficial effects of the anode assembly in the foregoing embodiment, which is not described herein again.

Specifically, as shown in fig. 11, the electrochemical deposition apparatus provided in this embodiment further includes a plating tank 4 and a carrier 6, wherein the plating tank 4 is used for containing a plating solution, and the carrier 6 is used for clamping the substrate 5 to be plated so that the substrate 5 to be plated is opposite to the anode plate 21.

Specifically, as shown in fig. 11, in the electrochemical deposition apparatus provided in this embodiment, two anode assemblies are respectively fixed on the side walls 41 of the plating tank 4 opposite to each other, and the substrate 5 to be plated is located between the two anode assemblies. In a specific embodiment, the substrate 5 to be plated is equidistant from the two anode assemblies, such that the current density on both sides of the substrate 5 to be plated is substantially the same.

Specifically, the substrate to be plated 5 after plating includes a substrate 51 and a plating film 52 deposited on the substrate 51, and when anode assemblies are provided on both sides of the substrate to be plated 5, the thickness of the plating film 52 on both sides of the substrate 51 is substantially the same.

Specifically, as shown in fig. 11 and 12, the electrochemical deposition apparatus provided in this embodiment further includes a circulation system 7, where the circulation system 7 includes a liquid inlet 71, a spray tray 72, a circulation pipe 73, a motor 74, and a filter 75, where the filter 75 is connected between the liquid outlet (not shown in fig. 11 and 12) and the liquid inlet 71 through the circulation pipe 73, and the filter 75 filters the plating solution flowing out of the liquid outlet under the driving of the motor 74 and re-enters the plating bath 4 from the liquid inlet 71 and the spray tray 72 after the treatment.

Specifically, as shown in fig. 11 and 12, the circulation line 73 includes a first branch 731 and a second branch 732, wherein the first branch 731 is disposed in parallel outside the sidewall of the plating tank 4, the second branch 732 extends in a horizontal direction, and the second branch 732 is located below the plating tank 4. The first branch 731 is connected to the inlet 71 of the plating tank, and the outlet of the second branch 732 is connected to the filtering inlet of the filter 75, so as to circularly filter the plating solution in the plating tank 4.

Specifically, as shown in fig. 11 and 12, the electrochemical deposition apparatus provided in the present embodiment further includes a monitor 9, and the monitor 9 is configured to monitor at least one of a temperature, a liquid level, and an ion concentration of the plating solution in the plating tank 4. Optionally, the monitor 9 monitors at least one of temperature, liquid level, and ion concentration in real time or at a predetermined frequency as it monitors.

For example, in the electrochemical deposition apparatus shown in fig. 12, the monitor 9 includes a first monitor 91 and a second monitor 92, the first monitor 91 being a thermometer, and the second monitor 92 being a level gauge. The thermometer is used for monitoring the temperature of the plating solution in the plating tank 4 in real time, and the level gauge is used for monitoring the level of the plating solution in the plating tank 4.

In addition, in the electrochemical deposition apparatus provided in the present embodiment, the monitor 9 further includes an ion concentration detector (not shown in fig. 12) for detecting the concentration of at least part of ions in the plating liquid. Based on this, the electrochemical deposition apparatus provided in this embodiment further includes an ion replenishment system for replenishing the plating solution with corresponding ions, and since the ions deposited on the substrate 5 to be plated during the plating process are metal ions, most of the ions to be replenished into the plating solution are metal ions.

Specifically, as shown in fig. 12, in the electrochemical deposition apparatus provided in this embodiment, the controller 8 is configured to control the plating tank 4 according to the data monitored by the monitor 9. For example, the controller may control the heating element to heat the plating solution according to the temperature detected by the thermometer, and may control the ion replenishment system to replenish metal ions for plating in the plating tank 4 according to the liquid level detected by the liquid level meter to replenish the plating solution in the plating tank 4, and according to the ion concentration detected by the concentration detection device.

The process of electrochemical deposition (i.e. electroplating) of the substrate 5 to be plated includes:

step one: determining the cathode-anode distance according to the parameters of the substrate 5 to be plated and the parameters of the electroplating solution, and adjusting the number of the adjusting plates 22 between the groove wall and the anode plate 21 according to the cathode-anode distance;

step two: loading the substrate 5 to be plated on a carrier 6;

step three: pickling the substrate 5 to be plated;

step four: the carrier 6 moves the substrate into the electroplating bath 4 to perform electrochemical deposition on the substrate 5 to be plated;

step five: removing the substrate 5 to be plated from the electroplating bath 4, and washing the substrate 5 to be plated with water;

step six: performing an antioxidation treatment on the substrate 5 to be plated, such as coating an organic solder mask or copper-protecting agent, so as to ensure that a film layer deposited on the substrate is not oxidized;

step seven: the substrate 5 to be plated is cleaned with pure water and dried by an air knife. In the electrochemical deposition of the substrate, a general chemical (plating solution) or a rapid deposition chemical may be used, and the deposition of various chemical may be achieved by controlling the current density.

In the working process of the electrochemical deposition equipment, the cathode-anode distance is one of key factors for obtaining high-quality coating films, so that before electrochemical deposition, the cathode-anode distance is adjusted to be beneficial to improving the quality of the coating films, thereby improving the quality of the substrate.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

according to the anode component for electrochemical deposition and the electrochemical deposition equipment, the anode-cathode distance can be adjusted by adjusting the position of the adjusting plate, so that the anode-cathode distance is in a range required by an electroplating process, and the quality of an electroplating film layer is improved.

Those of skill in the art will appreciate that the various operations, methods, steps in the flow, actions, schemes, and alternatives discussed in the present application may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed in this application may be alternated, altered, rearranged, split, combined, or eliminated. Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present application may also be alternated, altered, rearranged, decomposed, combined, or deleted.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.

The foregoing is only a partial embodiment of the present application and it should be noted that, for a person skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.

Claims (8)

1. An anode assembly for electrochemical deposition, comprising:

the bracket is fixed on the side wall of the electroplating bath;

the anode structure comprises an anode plate and a plurality of regulating plates, wherein the thickness of each regulating plate is 1-20 mm, and each regulating plate comprises a first regulating plate and a second regulating plate with different thicknesses;

the connecting piece is used for fixing the anode structure on the bracket and enabling the anode plate to be parallel to the side wall fixed by the bracket;

any adjusting plate is located between the anode plate and the side wall fixed by the support, or located on one side of the anode plate away from the side wall fixed by the support, and the distances between the anode plate and the substrate to be plated serving as a cathode are different when the number of the adjusting plates located between the anode plate and the side wall fixed by the support is different.

2. The anode assembly of claim 1, wherein at least one conditioning plate is an insulating conditioning plate located at an edge region of the anode plate.

3. The anode assembly of claim 1, wherein at least one of the conditioning plates is an electrically conductive conditioning plate having a conductivity greater than the anode plate and a reactivity less than the anode plate;

the conductive adjusting plate is electrically connected with the anode plate.

4. An anode assembly according to any one of claims 1 to 3, wherein the anode plate is formed of titanium metal having a mesh structure.

5. An anode assembly according to any one of claims 1 to 3 wherein the connection member is a bolt.

6. An anode assembly according to any one of claims 1 to 3, wherein the support comprises a cross member and a frame connected to the cross member, the cross member being secured to a side wall of the plating cell, the anode assembly being secured to the frame by the connector.

7. An electrochemical deposition apparatus, comprising:

plating bath;

the anode assembly of any one of claims 1-6;

and the carrier is used for clamping the substrate to be plated so that the substrate to be plated is opposite to the anode plate.

8. The electrochemical deposition apparatus of claim 7, wherein,

the anode assemblies are respectively fixed on the side walls of the electroplating tank which are oppositely arranged;

the substrate to be plated is positioned between the two anode assemblies.

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