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Application filed by Procoat Technology Co LtdfiledCriticalProcoat Technology Co Ltd
Priority to TW093127530ApriorityCriticalpatent/TW200609388A/en
Publication of TW200609388ApublicationCriticalpatent/TW200609388A/en
Disclosed is an electroplating apparatus able of forming a plated film having a uniform thickness on a flat high-electric-resistive substrate to be treated. In an apparatus using face down method in which current is applied in contact with an edge portion of a substrate to be treated, the distance between cathode and anode surface is continuously adjusted according to the location from the electric contact and the plated metal thickness on the substrate during plating.
TW093127530A2004-09-102004-09-10Flat substrate plating apparatus and its anode
TW200609388A
(en)
Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as dielectric substrate