KR20120023238A - A boat to transfer substrate - Google Patents

A boat to transfer substrate Download PDF

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Publication number
KR20120023238A
KR20120023238A KR1020100085416A KR20100085416A KR20120023238A KR 20120023238 A KR20120023238 A KR 20120023238A KR 1020100085416 A KR1020100085416 A KR 1020100085416A KR 20100085416 A KR20100085416 A KR 20100085416A KR 20120023238 A KR20120023238 A KR 20120023238A
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KR
South Korea
Prior art keywords
plate
flow path
path forming
substrate
plates
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Application number
KR1020100085416A
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Korean (ko)
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KR101181222B1 (en
Inventor
김선희
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주식회사 테스
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Priority to KR20100085416A priority Critical patent/KR101181222B1/en
Publication of KR20120023238A publication Critical patent/KR20120023238A/en
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Publication of KR101181222B1 publication Critical patent/KR101181222B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electromagnetism (AREA)

Abstract

The present invention relates to a substrate transport boat having an improved structure so that plasma can be uniformly formed by smoothing process gas flow between plates, and as a result, a uniform antireflection film can be formed on the substrate. It is for carrying in / out of the substrate into the process chamber to which the process gas for processing the substrate according to the present invention is supplied. The substrate is formed in a flat shape, and is disposed to face each other, and a plurality of substrates are mounted therebetween. A plate and a coupling part for coupling the plurality of plates to each other, wherein at least some of the plates are formed to extend from one end portion, and a flow path forming part is provided to guide the flow of the process gas and introduce the process gas into the substrate. have.

Description

A boat to transfer substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer boat for importing / exporting substrates into a process chamber, and more particularly, to importing / exporting substrates into a batch type plasma chemical vapor phase process chamber capable of processing a plurality of substrates at one time. It relates to a substrate transfer boat for.

Anti-reflection film deposition apparatuses used in solar cells are largely classified into two types.

One of the two is inline type deposition in which a substrate is mounted in a horizontal flat tray in a horizontal direction, transferred to a process chamber through a loading chamber, and taken out through an unloading chamber after the process is completed in the process chamber. Device. This inline type deposition apparatus has an advantage that the continuous process is possible, but it has a disadvantage in that the processing efficiency of the apparatus is limited because it is difficult to process a plurality of substrates at one time.

The other is a batch type deposition apparatus capable of treating a large number of substrates at once by treating a plurality of substrates in a vertical / horizontal state.

Meanwhile, in the case of a batch type deposition apparatus, a plurality of substrates are loaded / exported into the deposition apparatus by using a boat having a plurality of plates, wherein the plurality of plates are densely arranged at regular intervals, and the substrate is disposed between the plurality of plates. Mounted in between.

However, in the conventional boat structure, since the process gas does not flow smoothly between the plates, plasma is not uniformly formed, and as a result, the antireflection film is not uniformly deposited.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to form a plasma uniformly by smoothing the process gas flow between the plates, and to form a uniform antireflection film on the substrate. To provide an improved substrate transfer boat.

In order to achieve the above object, the substrate transport boat according to the present invention is for carrying in / out the substrate into a process chamber to which a process gas for processing of the substrate is supplied, and is formed in a flat shape and spaced apart from each other to face each other. A plurality of plates on which the substrate is mounted, and a coupling part configured to couple the plurality of plates to each other, wherein at least some of the plurality of plates extend from one end portion, and the process gas The flow path forming portion for introducing the process gas to the substrate to guide the flow of the is characterized in that it is provided.

According to the present invention, the plurality of plates may include a plurality of first plates provided with the flow path forming part and a plurality of second plates disposed between the first plates and provided with the flow path forming part. The direction in which the flow path forming portion of the first plate extends and the direction in which the flow path forming portion of the second plate extends are preferably different from each other.

In addition, according to the present invention, the first plate and the second plate may be made of a conductive material, and the flow path forming unit may be insulated.

Further, according to the present invention, an area of the flow path forming portion of the first plate and the flow path forming portion of the second plate are equal to each other, the area of the remaining area excluding the flow path forming portion of the first plate, and the second plate. In this case, the areas of the remaining areas except for the flow path forming unit are preferably the same.

According to the present invention having the above-described configuration, the process gas flows smoothly between the plates, and the plasma is uniformly formed. As a result, a uniform antireflection film can be formed on the substrate.

1 is a schematic perspective view of a substrate transport boat according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a substrate transport boat according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the substrate transport boat according to a preferred embodiment of the present invention.

1 is a schematic perspective view of a substrate transport boat according to an embodiment of the present invention, Figure 2 is a schematic cross-sectional view of the substrate transport boat according to an embodiment of the present invention.

1 and 2, the substrate transport boat 100 according to the present embodiment includes a plurality of plates and a coupling part.

The plate is for mounting the substrate w therebetween and is composed of a plurality of first plates 10 and a plurality of second plates 20.

Each first plate 10 is formed in a flat plate shape. Each first plate 10 is disposed in a vertical direction and spaced apart from each other facing each other. In addition, seating pins 11 for seating the substrate are protruded on each of the first plates 10. In addition, the flow path forming part 12 is further provided in the first plate 10. The flow path forming unit 12 partially blocks and guides the flow of the process gas injected for the treatment process on the substrate w, and flows it into the substrate mounted between the plates. In the present embodiment, the flow path forming portion 12 extends upward from the upper end of the first plate 10. In this case, the flow path forming unit 12 is insulated, and the reason for insulating the flow path forming unit will be described later.

The second plate 20 is formed in a flat plate shape. The second plate 20 is disposed vertically one by one between the first plate 10, so as to face the first plate 10. In addition, a seating pin 21 for protruding the substrate is formed on the second plate 20. The flow path forming portion 22 is also formed in the second plate 20. The flow path forming portion 22 of the second plate extends in a direction different from that of the flow path forming portion 12 of the first plate, and extends downward from the lower end of the second plate 20 as shown in FIG. 3. . The area of the flow path forming part 22 of the second plate is the same as the area 12 of the flow path forming part of the first plate. In addition, the area (hereinafter, the electrode area) of the remaining area excluding the flow path forming part in the second plate, that is, the electrode, is the same as the area of the remaining area excluding the flow path forming part in the first plate, that is, the electrode area.

On the other hand, the first plate 10 and the second plate 20 described above are made of a conductive material, for example graphite. However, as described above, the flow path forming portions 12 and 22 are insulated, and the reason thereof will be described below.

When the substrate transfer boat 100 is loaded into the process chamber in a state where the substrate is mounted, a voltage for forming plasma is applied to the first plate 10 and the second plate 20 as described below. That is, for example, a positive voltage (+) is applied to the first plate 10 and a negative voltage (-) is applied to the second plate 20, so that the first plate 10 and the second plate 20 are applied. Is used as an electrode for the formation of plasma.

In this case, in order for the plasma to be uniformly formed between the first plate 10 and the second plate 20, an electric field must be uniformly formed between two plates (that is, two electrodes). It is desirable to have the same and exactly face each other. In the present embodiment, by insulating the flow path forming portion 12 of the first plate and the flow path forming portion 22 of the second plate, as shown in FIG. 3, the first plate 10 and the second plate 20. The electrode areas of the same) are arranged to face each other accurately, and as a result, a uniform plasma can be formed. In addition, by making the same area of the flow path forming portion 12 of the first plate and the flow path forming portion 22 of the second plate, the two plates have a completely symmetrical structure, and as a result, problems such as arching during plasma formation Is prevented from occurring.

Meanwhile, the flow path forming parts 12 and 22 may be configured in such a manner that the insulating material is coupled to the upper end of the first plate, and as shown in FIG. 3, a cap made of an insulating material is inserted into the flow path forming part. It can also be configured.

The coupling part is for coupling the first plate 10 and the second plate 20 to be maintained at regular intervals, and for applying power to the first plate and the second plate. At this time, the interval between the first plate 10 and the second plate 20 is the magnitude of the voltage applied to the first plate 10 and the second plate 20 and the atmosphere (temperature, Pressure, type of process gas) is determined at the interval at which the plasma is optimized.

In the present embodiment, the coupling part includes a first coupling member 30 and a second coupling member 31.

The first coupling member 30 is coupled to the lower end of the plate. In this case, the first coupling member is electrically connected to any one of the first plate 10 and the second plate 20. In the present embodiment, the first coupling member 30 is electrically connected to the first plate 10. In addition, the first coupling member 30 is provided with a power applying groove 301 to which the power terminal is coupled.

The second coupling member 31 is coupled to the middle portion of the plate. At this time, the second coupling member 31 is electrically connected to the second plate 20. The second coupling member 31 is provided with a power applying groove 311 to which the power terminal is coupled.

In the coupling unit configured as described above, the positive voltage (+) electrode is coupled to the power supply groove 301 of the first coupling member, and the negative voltage (-) electrode is coupled to the power supply groove 311 of the second coupling member. (Or vice versa), since the first plate 10 is charged with the positive voltage and the second plate with the negative voltage 20, plasma is formed between the first plate and the second plate.

In the substrate transfer boat configured as described above, when the substrate transfer boat is loaded into the process chamber while the substrate is mounted, the process gas is injected from the gas injector provided in the process chamber. The injected process gas flows above the substrate transfer boat 100, and after a part of the flow is changed (guided) by the flow path forming unit as shown in FIG. 3, the first plate 10 and the second plate. It flows smoothly between the 20.

At this time, when the flow path forming portion is formed as in this embodiment, the reason why the process gas flows more smoothly between the plates is as follows.

In the prior art, plates of the same size were continuously arranged at narrow intervals, so that the amount of process gas introduced between the plates was very small (ie, not smooth). However, in the case of simply increasing the spacing between the plates, the density of the plasma is reduced, the plasma is not generated, a problem arises in that a high voltage must be applied.

However, in the present embodiment, while maintaining the gap between the plates as it is, by forming the flow path forming portion 12, the arrangement form of the upper end of the plate is a straight line rather than a straight line, thus relatively smoother than the conventional plate Process gas flows in between.

As described above, when the process gas is smoothly supplied between the plates, the plasma is more stable and uniformly formed, and as a result, the thin film may be uniformly formed on the substrate.

In addition, by insulating the flow path forming portion as mentioned above, the flow of the process gas between the plates is smooth, and the area of the first plate and the second plate used as the electrode is the same, and as a result, a uniform plasma is generated. To form a uniform thin film.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific preferred embodiments described above, and the present invention belongs to the present invention without departing from the gist of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such changes are within the scope of the claims.

100 ... Boat for transporting substrate 10 ... 1st plate
11 ... sitting pin 12 ... euro forming part
20.2nd plate 21 ... sitting pin
22. Euro-forming part 30 ... First coupling member
301.Power supply groove 31.Second coupling member
311.Powered groove

Claims (4)

It is for importing / exporting the substrate into the process chamber to which the process gas for processing the substrate is supplied.
A plurality of plates formed in a flat plate shape and spaced apart from each other to face each other, and on which the substrate is mounted;
It includes a coupling unit for coupling the plurality of plates,
At least a portion of the plurality of plates, the plate transport boat is formed extending from one end, the flow path forming portion for introducing the process gas to the substrate to guide the flow of the process gas is provided. The method of claim 1,
The plurality of plates,
A plurality of first plates provided with the flow path forming portion,
It is disposed between the first plate, and includes a plurality of second plates provided with the flow path forming portion,
And a direction in which the flow path forming portion of the first plate extends and a direction in which the flow path forming portion of the second plate extends are different from each other. The method according to claim 1 or 2,
The first plate and the second plate is made of a conductive material, the flow path forming portion is insulated. The method of claim 3,
Areas of the flow path forming portion of the first plate and the flow path forming portion of the second plate are the same,
The area of the remaining area excluding the flow path forming part in the first plate and the area of the remaining area excluding the flow path forming part in the second plate are the same.
KR20100085416A 2010-09-01 2010-09-01 A boat to transfer substrate KR101181222B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20100085416A KR101181222B1 (en) 2010-09-01 2010-09-01 A boat to transfer substrate

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Application Number Priority Date Filing Date Title
KR20100085416A KR101181222B1 (en) 2010-09-01 2010-09-01 A boat to transfer substrate

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KR20120023238A true KR20120023238A (en) 2012-03-13
KR101181222B1 KR101181222B1 (en) 2012-09-10

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002978A1 (en) * 2014-06-30 2016-01-07 주식회사 테라세미콘 Boat
KR102251672B1 (en) * 2020-10-26 2021-05-13 주식회사 한화 Boat Apparatus with Enhanced Rigidity
KR102275905B1 (en) * 2020-10-26 2021-07-12 주식회사 한화 Boat Apparatus with Seperated Electrode Plate
WO2022149840A1 (en) * 2021-01-06 2022-07-14 한화솔루션 주식회사 Wafer boat and plate for wafer boat
KR102586968B1 (en) * 2023-01-02 2023-10-10 (주)한화 Boat apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102006435B1 (en) * 2017-09-01 2019-08-01 주식회사 한화 Boat device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002978A1 (en) * 2014-06-30 2016-01-07 주식회사 테라세미콘 Boat
CN106458433A (en) * 2014-06-30 2017-02-22 泰拉半导体株式会社 Boat
JP2017519689A (en) * 2014-06-30 2017-07-20 テラセミコン コーポレイション boat
CN106458433B (en) * 2014-06-30 2018-10-23 泰拉半导体株式会社 Cassette
KR102251672B1 (en) * 2020-10-26 2021-05-13 주식회사 한화 Boat Apparatus with Enhanced Rigidity
KR102275905B1 (en) * 2020-10-26 2021-07-12 주식회사 한화 Boat Apparatus with Seperated Electrode Plate
WO2022149840A1 (en) * 2021-01-06 2022-07-14 한화솔루션 주식회사 Wafer boat and plate for wafer boat
KR102586968B1 (en) * 2023-01-02 2023-10-10 (주)한화 Boat apparatus

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