CN202323066U - Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology - Google Patents
Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology Download PDFInfo
- Publication number
- CN202323066U CN202323066U CN 201120470056 CN201120470056U CN202323066U CN 202323066 U CN202323066 U CN 202323066U CN 201120470056 CN201120470056 CN 201120470056 CN 201120470056 U CN201120470056 U CN 201120470056U CN 202323066 U CN202323066 U CN 202323066U
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- plate
- outer frame
- edge
- housing
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a shielding plate with adjustable edge copper plating for the high-density interconnection circuit board electroplating technology. The shielding plate comprises an outer frame and mesh cloth; a rectangular opening is arranged in the outer frame; the mesh cloth is embedded in the rectangular opening; a PP (propene polymer) plate is mounted on at least one inner side of the rectangular opening; through holes are arranged on the PP plate from top to bottom; and the density of the through holes close to the outer frame is less than that of the through holes away from the outer frame. According to the utility model, the four sides of the rectangular opening on the outer frame are all provided with a PP plate, multiple through holes are arranged on the PP plate from top to bottom, and the density of the through holes close to the outer frame is less than that of the through holes away from the outer frame; the path of a power line is adjusted by use of the density change of the through holes so that the plating layer of the circuit board closed to the edge is relatively thin and the plating layer of the circuit board on the edge is relatively thick; and thus, the copper is greatly saved, the production cost is lowered, the adjustment effect is good, and the shielding plat is applicable to the electroplating of the circuit boards with different area sizes.
Description
Technical field
The utility model belongs to high density interconnected circuit plate manufacturing technology field, and especially a kind of high density interconnected circuit plate electroplating technology is with the adjustable masking shield of edge copper facing.
Background technology
When circuit card is electroplated; As shown in Figure 1; The leftmost side and the rightmost side be anode 1, intermediary is a circuit card 3, between circuit card and two anodes a masking shield 2 (PP screen frame) is set all; Two masking shields can change the trend of power line, and point effect is to the influence of board edge electroplating thickness when regulating plating.The structure of masking shield is: comprise housing 4, screen cloth 7 and support 8, screen cloth is inlaid in the rectangle opening in the housing, on the housing in the screen cloth outside, is uniformly distributed with and makes a plurality of open holes 6, and support is connected across on the screen cloth to increase the overall mechanical strength of masking shield.The size of masking shield and form have determined board edge galvanized thick, thin, but regulating power is relatively poor, can't regulate more uniformly.
The utility model content
The purpose of the utility model is to overcome the deficiency of prior art, provides a kind of high density interconnected circuit plate electroplating technology rational in infrastructure, easy to use with the adjustable masking shield of edge copper facing.
The technical scheme that the utility model is taked is:
A kind of high density interconnected circuit plate electroplating technology is with the adjustable masking shield of edge copper facing; Comprise housing and screen cloth; In housing, make a rectangle opening, setting-in screen cloth in this rectangle opening is characterized in that: a PP plate is installed at least one inner side edge of said rectangle opening; Be shaped on through hole from top to bottom on this PP plate, near the via densities of housing less than via densities away from housing.
And four inner side edges of said rectangle opening are all installed the PP plate.
And, said PP plate near the edge of housing to away from the length between the edge of housing smaller or equal to 15 centimetres.
The advantage and the positively effect of the utility model are:
In the utility model, the four edges of made rectangle opening is all installed a PP plate (polypropylene board) on the housing, is shaped on a plurality of through holes from top to bottom on this PP plate; Less than the via densities away from housing, it mainly acts on is the variable density of utilizing through hole near the via densities of housing, regulates the path of power line; Make circuit card keep to the side the place coating thinner; Coating away from the board edge place is thicker, has saved a large amount of copper thus, has reduced production cost; Regulating effect is good, adapts to the galvanized use of different area size circuit card.
Description of drawings
Fig. 1 is the galvanized structural representation of circuit card;
Fig. 2 is the structural representation of masking shield;
Fig. 3 is the I portion enlarged view of Fig. 2.
Embodiment
Below in conjunction with embodiment, the utility model is further specified, following embodiment is illustrative, is not determinate, can not limit the protection domain of the utility model with following embodiment.
A kind of high density interconnected circuit plate electroplating technology is with the adjustable masking shield of edge copper facing; Shown in Fig. 1～3, comprise housing 4, screen cloth 7 and support 8, screen cloth is inlaid in the rectangle opening in the housing; On the housing in the screen cloth outside, be uniformly distributed with and make a plurality of open holes 6; Three supports are connected across on the screen cloth to increase the overall mechanical strength of masking shield, are symmetrically installed with two grip 5 in the upper end of housing, and the innovation of the utility model is: a PP plate 9 is installed at least one inner side edge of rectangle opening; Be shaped on through hole 10 from top to bottom on this PP plate, near the via densities of housing less than via densities away from housing.
In the present embodiment; Rectangle opening upper side edge, left side and right edge in the housing installed PP plate 9 and vertical PP plate 11 respectively; All be shaped on through hole on these three blocks of PP plates; The vertical PP plate that the arrangement regulation of through hole is installed with the rectangle opening right edge is the example explanation, near the via densities of housing (right side of Fig. 3) less than via densities away from housing (left side of Fig. 3).In the plating of some circuit card, four inner side edges in the upper and lower, left and right of rectangle opening also can all be equipped with the PP plate.
Because the PP plate just is used for the thickness of coating at regulating circuit panel edges place, thus the PP plate near the edge of housing to away from the length between the edge of housing smaller or equal to 15 centimetres.
In the utility model, the four edges of made rectangle opening is all installed a PP plate (polypropylene board) on the housing, is shaped on a plurality of through holes from top to bottom on this PP plate; Less than the via densities away from housing, it mainly acts on is the variable density of utilizing through hole near the via densities of housing, and via densities is more little, quantity is few more; Less through power line, make circuit card keep to the side the place coating thinner, via densities is bigger, quantity is many more; More through power line, make away from the coating at board edge place thicklyer, saved a large amount of copper thus; Reduced production cost, regulating effect is good, adapts to the galvanized use of different area size circuit card.
Claims (3)
1. a high density interconnected circuit plate electroplating technology is with the adjustable masking shield of edge copper facing; Comprise housing and screen cloth; In housing, make a rectangle opening, setting-in screen cloth in this rectangle opening is characterized in that: a PP plate is installed at least one inner side edge of said rectangle opening; Be shaped on through hole from top to bottom on this PP plate, near the via densities of housing less than via densities away from housing.
2. high density interconnected circuit plate electroplating technology according to claim 1 is characterized in that with the adjustable masking shield of edge copper facing: four inner side edges of said rectangle opening are all installed the PP plate.
3. high density interconnected circuit plate electroplating technology according to claim 1 and 2 is characterized in that with the adjustable masking shield of edge copper facing: said PP plate near the edge of housing to away from the length between the edge of housing smaller or equal to 15 centimetres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120470056 CN202323066U (en) | 2011-11-23 | 2011-11-23 | Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120470056 CN202323066U (en) | 2011-11-23 | 2011-11-23 | Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202323066U true CN202323066U (en) | 2012-07-11 |
Family
ID=46435053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120470056 Expired - Fee Related CN202323066U (en) | 2011-11-23 | 2011-11-23 | Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202323066U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149019A (en) * | 2016-08-24 | 2016-11-23 | 奥士康精密电路（惠州）有限公司 | A kind of mixing electro-plating method |
| CN110914482A (en) * | 2017-07-11 | 2020-03-24 | 株式会社荏原制作所 | Adjustment plate, anode holder, and substrate holder |
| US11096277B2 (en) | 2019-09-12 | 2021-08-17 | International Business Machines Corporation | Printed circuit board shielding and power distribution via edge plating |
-
2011
- 2011-11-23 CN CN 201120470056 patent/CN202323066U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149019A (en) * | 2016-08-24 | 2016-11-23 | 奥士康精密电路（惠州）有限公司 | A kind of mixing electro-plating method |
| CN110914482A (en) * | 2017-07-11 | 2020-03-24 | 株式会社荏原制作所 | Adjustment plate, anode holder, and substrate holder |
| CN110914482B (en) * | 2017-07-11 | 2022-02-22 | 株式会社荏原制作所 | Adjustment plate, anode holder, and substrate holder |
| US11268207B2 (en) | 2017-07-11 | 2022-03-08 | Ebara Corporation | Regulation plate, anode holder, and substrate holder |
| US11686009B2 (en) | 2017-07-11 | 2023-06-27 | Ebara Corporation | Regulation plate, anode holder, and substrate holder |
| US11096277B2 (en) | 2019-09-12 | 2021-08-17 | International Business Machines Corporation | Printed circuit board shielding and power distribution via edge plating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20141123 |
|
| EXPY | Termination of patent right or utility model |