CN202857133U - HDI PCB laminated structure - Google Patents
HDI PCB laminated structure Download PDFInfo
- Publication number
- CN202857133U CN202857133U CN 201220577998 CN201220577998U CN202857133U CN 202857133 U CN202857133 U CN 202857133U CN 201220577998 CN201220577998 CN 201220577998 CN 201220577998 U CN201220577998 U CN 201220577998U CN 202857133 U CN202857133 U CN 202857133U
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- copper foil
- foil layer
- copper
- layer
- foil layers
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- Expired - Lifetime
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Abstract
The utility model discloses an HDI PCB laminated structure. The HDI PCB laminated structure comprises copper clad laminates, copper foil layers, insulating plates which are located between the copper foil layers, and via holes which are located between the copper foil layers. The number of the copper foil layers is an even number and is greater than or equal to six. An insulating plate is located at the middle portion of the HDI PCB, and the copper clad laminates, the insulating plates and the copper foil layers are symmetrically superimposed onto the upper surface and the lower surface of the middle insulating plate successively, wherein the insulating plates and the copper foil layers are symmetrically and circularly superimposed by taking the middle insulating plate as the central plane as required. The via holes are arranged between the third copper foil layer which is located above the middle insulating plate and the third copper foil layer which is located under the middle insulating plate and between every two neighboring copper foil layers except the middle two copper foil layers. According to the utility model, by changing the laminated structure of the HDI PCB, the number of lamination, drilling, copper deposition and electroplating can be reduced, the production efficiency can be effectively improved, and the production cost can be reduced.
Description
Technical field
The utility model relates to a kind of PCB laminated construction, particularly a kind of HDI PCB laminated construction.
Background technology
Along with electronic product develops to miniaturization, required HDI PCB is that high-density interconnected circuit board develops to multiple stratification.Copper-clad plate of the now general employing of the laminated construction of multi-layer H DI PCB, top and bottom are symmetrical stack insulation board and copper foil layer again, and copper-clad plate is the sheet material of a kind of dielectric in two-layer copper foil layer interval.The shortcoming of general HDI PBC laminated construction is lamination, boring, heavy copper and the plating that will carry out repeatedly, has increased the production cycle of product, and production cost is higher.
Summary of the invention
The technical problems to be solved in the utility model provides a kind of HDI PCB laminated construction, reduces the number of times of lamination, boring, heavy copper and plating, shortens the production cycle of product, reduces production costs.
In order to solve the problems of the technologies described above, the utility model is taked following technical scheme:
A kind of HDI PCB laminated construction comprises insulation board between copper-clad plate, copper foil layer, the copper foil layer and the via hole between the copper foil layer.Described copper foil layer is even level and more than or equal to six layers; The centre of described HDI PCB is insulation board, at the top and bottom of intermediate insulation plate symmetry superpose successively copper-clad plate, insulation board, copper foil layer, and the as required symmetrical circulation stack of face centered by the intermediate insulation plate of insulation board and copper foil layer; Described via hole be arranged at the intermediate insulation plate upwards and downward the 3rd layer of copper foil layer between and between all the adjacent copper foil layers except the two-layer copper foil layer in centre.
Carry out the lamination first time when the described copper foil layer number of plies is superimposed to six layers, the two-layer copper foil layer of every stack carries out lamination one time afterwards, gets out each via hole behind each lamination, and each via hole all sinks copper and electroplating processes.
The utility model has reduced the number of times of lamination, boring, heavy copper and plating by changing the laminated construction of HDI PCB, Effective Raise production efficiency, reduce production costs.
Description of drawings
Fig. 1 is the utility model example structure schematic diagram;
Number in the figure is depicted as: 1-copper-clad plate, 2-insulation board, 3-copper foil layer, 4-via hole.
Embodiment
For the ease of those skilled in the art's understanding, the utility model will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, the utility model has disclosed a kind of HDI PCB laminated construction, comprises insulation board 2 between copper-clad plate 1, copper foil layer 3, the copper foil layer 3 and the via hole 4 between the copper foil layer 3.Present embodiment is the HDI PCB laminated construction of eight layers of copper foil layer 3, and the centre of HDI PCB is insulation board 2, at the top and bottom of intermediate insulation plate 2 symmetry superpose successively copper-clad plate 1, insulation board 2, copper foil layer 3, insulation board 2, copper foil layer 3.Intermediate insulating layer 2 is upwards and between downward the 3rd layer of copper foil layer 3 and be provided with via hole 4 between all adjacent copper foil layers 3 except the two-layer copper foil layer 3 in centre, and each via hole 4 all will sink copper and electroplating processes.
In the manufacturing process of present embodiment, at first produce cabling at four layers of copper foil layer 3 of two copper-clad plates 1, then carry out lamination, carry out lamination when being superimposed to six layers of copper foil layer 3 one time, then get out corresponding via hole 4, sink again copper and electroplating processes.And existing HDI PCB laminated construction adopts a copper-clad plate, at first produce cabling at the two-layer copper foil layer of copper-clad plate, then carry out symmetry stack insulation board and copper foil layer in the top and bottom of copper-clad plate, be superimposed to four layers of copper foil layer and carry out lamination one time, then produce cabling at the two-layer copper foil layer of new stack, then get out each via hole, again via hole is sunk copper, electroplating processes, and then symmetrical stack insulation board and copper foil layer, when being superimposed to six layers, the number of plies carries out again one time lamination, then get out each via hole, again via hole is sunk copper, electroplating processes.By above manufacturing process as seen, present embodiment has reduced lamination, heavy copper and once electroplating once with respect to existing HDI PCB laminated construction.
Above-described embodiment is the better implementation of the utility model, and under the prerequisite that does not break away from inventive concept of the present utility model, the replacement of just the utility model being made direct displacement or being equal to all belongs within the protection range of the present utility model.
Claims (2)
1. HDI PCB laminated construction comprises insulation board (2) between copper-clad plate (1), copper foil layer (3), the copper foil layer (3) and the via hole (4) between the copper foil layer (3), it is characterized in that:
Described copper foil layer (3) is even level and more than or equal to six layers;
The centre of described HDI PCB is insulation board (2), in the top and bottom symmetry of intermediate insulation plate (2) superpose successively copper-clad plate (1), insulation board (2), copper foil layer (3), the as required symmetrical circulation stack of face centered by intermediate insulation plate (2) of insulation board (2) and copper foil layer (3);
Described via hole (4) be arranged at intermediate insulation plate (2) upwards and downward the 3rd layer of copper foil layer (3) between and between all the adjacent copper foil layers (3) except middle two-layer copper foil layer (3).
2. HDI PCB laminated construction according to claim 1, it is characterized in that: carry out the lamination first time when described copper foil layer (3) number of plies is superimposed to six layers, the two-layer copper foil layer of every stack carries out lamination one time afterwards, get out each via hole (4) behind each lamination, each via hole (4) all sinks copper and electroplating processes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220577998 CN202857133U (en) | 2012-11-06 | 2012-11-06 | HDI PCB laminated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220577998 CN202857133U (en) | 2012-11-06 | 2012-11-06 | HDI PCB laminated structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202857133U true CN202857133U (en) | 2013-04-03 |
Family
ID=47988273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220577998 Expired - Lifetime CN202857133U (en) | 2012-11-06 | 2012-11-06 | HDI PCB laminated structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202857133U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533746A (en) * | 2013-10-08 | 2014-01-22 | 上海斐讯数据通信技术有限公司 | High-density interconnection integrated printed circuit board of improved laminated structure and manufacturing method thereof |
| CN104812163A (en) * | 2015-04-07 | 2015-07-29 | 广东欧珀移动通信有限公司 | HDI (high density interconnect) PCB (printed circuit board) laminated structure |
-
2012
- 2012-11-06 CN CN 201220577998 patent/CN202857133U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533746A (en) * | 2013-10-08 | 2014-01-22 | 上海斐讯数据通信技术有限公司 | High-density interconnection integrated printed circuit board of improved laminated structure and manufacturing method thereof |
| CN104812163A (en) * | 2015-04-07 | 2015-07-29 | 广东欧珀移动通信有限公司 | HDI (high density interconnect) PCB (printed circuit board) laminated structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan Town, Guangdong province 523860 usha Beach Road Dongguan City, No. 18 Guangdong Oupo Mobile Communication Co Ltd Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan Town, Guangdong province 523860 usha Beach Road Dongguan City, No. 18 Guangdong Oupo Mobile Communication Co Ltd Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan Town, Guangdong province 523860 usha Beach Road Dongguan City, No. 18 Guangdong Oupo Mobile Communication Co Ltd Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130403 |