CN204968249U - Practice thrift film of figure plated metal in circuit board manufacturing process - Google Patents
Practice thrift film of figure plated metal in circuit board manufacturing process Download PDFInfo
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- CN204968249U CN204968249U CN201520801498.1U CN201520801498U CN204968249U CN 204968249 U CN204968249 U CN 204968249U CN 201520801498 U CN201520801498 U CN 201520801498U CN 204968249 U CN204968249 U CN 204968249U
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Abstract
The utility model provides a practice thrift film of figure plated metal in circuit board manufacturing process, includes film body, is equipped with circuit district and technology limit on the film body, the circuit position in the middle part of film body, and set up the technology limit in, the technology edge is equipped with three supplementary limits and a plurality of round PAD, and the setting of a plurality of round PAD sets up in the inboard on the technology limit of and gate district's connection on three supplementary edges, three supplementary limits, and three supplementary limits are the distribution of trilateral confined rectangle, supplementary limit is for feeling light zone, and other regions on circle PAD and the technology limit except that supplementary limit are and hide light zone. The utility model discloses a to the improvement of film body, changed traditional film structural design, reduced the plated metal area of circuit board flange, practice thrift the consumption of plated metal liquid, reduce the waste of plated metal, practice thrift manufacturing cost, improve economic benefits, be applicable to the batch preparation of circuit board.
Description
Technical field
The utility model belongs to wiring board manufacture technology field, is specifically related to the film saving graphic plating metal in a kind of wiring board manufacturing process.
Background technology
In traditional PCB manufacturing process, be protection plank, tools hole, test point/hole identifying parameter, model, kind etc. that it carries out in technique manufacturing process, devise manufacture craft limit, after PCB is shaping, technique edges can process in cut calcellation.But in wiring board production process, owing to needing to arrange technique edges outside the line areas of wiring board, and technique edges is in the process of carrying out graphic plating, and 100% can by plated metal plating on the technique edges of wiring board.The technique edges of wiring board can excise in the later stage process of cancelling, so it is unwanted for electroplating wiring board itself to technique edges, is a kind of waste, increases the consumption of plated metal, increase the production cost of enterprise, be unfavorable for long-term development of enterprise.Therefore, how to reduce the waste of plated metal, save production cost, become wiring board enterprise problem demanding prompt solution.
Summary of the invention
In view of this, the technical problems to be solved in the utility model is a kind of simple for structure, waste of reducing plated metal, saves the film of graphic plating metal in the wiring board manufacturing process that reduces cost of manufacture.
In order to solve the problems of the technologies described above, the utility model adopts following scheme to realize: the film saving graphic plating metal in a kind of wiring board manufacturing process, comprise film body, described film body is provided with line areas and is positioned at the technique edges on four limits of film body, and line areas is positioned at the middle part of film body and arranges technique edges; Described technique edges is provided with three auxiliary limits and multiple round PAD, and described multiple round PAD is arranged on three auxiliary limits, and three described auxiliary limits are arranged on the inner side of the technique edges be connected with line areas, and three auxiliary limits are the rectangular profile that three bandings close; Described auxiliary limit is photosensitive area, and other regions of described round PAD and the technique edges except auxiliary limit are shading region.
Wherein, described multiple round PAD equally linear array on auxiliary limit.
Wherein, described round PAD is arranged on the middle position on auxiliary limit.
Wherein, the width being arranged on the technique edges on four limits of film body is 10mm.
Compared with prior art, the utility model is by the improvement to film body, change traditional film structural design, block to part shading region by establishing on the technique edges of film body, make after exposure, development, dry film stays wiring board plate face, stop and in graphic plating process, plated metal is electroplated in the wiring board plate face being provided with dry film, decrease the plated metal area of wiring board edges of boards, save the consumption of electroplating metal solution, reduce the waste of plated metal, save production cost, increase economic efficiency, be applicable to the batch making of wiring board.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
In order to allow those skilled in the art understand the technical solution of the utility model better, below in conjunction with accompanying drawing, the utility model is further elaborated.
As shown in Figure 1, save the film of graphic plating metal in a kind of wiring board manufacturing process, comprise film body 1.Described film body 1 is provided with line areas 11 and is positioned at the technique edges 12 on four limits of film body, described line areas 11 is positioned at the middle part of film body 1, the outside of line areas 11 is surrounded by four technique edges, makes line areas be positioned at four technique edges 12 inner.The width being arranged on four technique edges on four limits of film body is 10mm.
In order to save plated metal, reducing the consumption of metal in plated metal process, technique edges is provided with
Described film body 1 is provided with line areas 11 and is positioned at the technique edges 12 on four limits of film body, and line areas 11 is positioned at the middle part of film body 1 and arranges technique edges 12; Described technique edges is provided with auxiliary limit 121, and the quantity on this auxiliary limit 121 is three, and three auxiliary limits 121 are separately positioned on three technique edges 122, and auxiliary limit be positioned at technique edges inner side, be connected with line areas.Wherein three auxiliary limits are the rectangular profile that three bandings close openings at one side.Each described auxiliary limit is equipped with multiple round PAD122, and multiple round PAD122 are positioned at the middle position on auxiliary limit.Multiple round PAD122 is equally spaced to be arranged on auxiliary limit and linearly to arrange.The dry film on auxiliary limit can be stayed in exposure imaging process to make the film, stick to wiring board plate face, stop plated metal plating on auxiliary limit, reduce the consumption of plated metal, described auxiliary limit is set to photosensitive area, the round PAD be arranged on auxiliary limit is set to shading region, and other regions on technique edges except auxiliary limit are shading region.The shading region of described line areas and photosensitive area are arranged to be designed according to client's needs and line requirements.
During use, use the film to circuit board to explosure, assist the dry film in the region of limit and the unwanted plating of line areas client to stay wiring board plate face after exposure then to electroplate, during plating, stop plated metal plating in dry film region because wiring board plate face exists dry film, decrease the consumption of electroplating surface sum plated metal, save production cost, dry film is removed by other regions after not having exposure imaging, does not have dry film, so can electroplate one deck plated metal.
The plate face of what above-described technique edges was corresponding is wiring board, other in the corresponding line plate edges of boards of auxiliary limit have the function limit that auxiliary line plate is produced, as being arranged on tooling hole on wiring board edges of boards, test point/hole identify for supplement production to parameter, model, kind etc. that it carries out in technique manufacturing process, for the common practise of those skilled in the art, be not elaborated at this.Described plated metal can be the plated metals such as copper, tin, nickel, does not also enumerate explanation at this.
Above-described embodiment is only wherein specific implementation of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection range of the present utility model.
Claims (4)
1. in a wiring board manufacturing process, save the film of graphic plating metal, comprise film body (1), it is characterized in that, described film body (1) is provided with line areas (11) and is positioned at the technique edges (12) on four limits of film body, and line areas (11) are positioned at the middle part of film body (1) and arrange technique edges (12); Described technique edges is provided with three auxiliary limits (121) and multiple round PAD(122), described multiple round PAD(122) be arranged on three auxiliary limits (121), three described auxiliary limits (121) are arranged on the inner side of the technique edges be connected with line areas, and the rectangular profile that three auxiliary limits (121) are closed in three bandings; Described auxiliary limit (121) is photosensitive area, described round PAD(122) and other regions of technique edges except auxiliary limit (121) be shading region.
2. save the film of graphic plating metal in wiring board manufacturing process according to claim 1, it is characterized in that, described multiple round PAD(122) equally linear array on auxiliary limit (121).
3. save the film of graphic plating metal in wiring board manufacturing process according to claim 2, it is characterized in that, described round PAD(122) be arranged on the middle position of auxiliary limit (121).
4. save the film of graphic plating metal in wiring board manufacturing process according to claim 3, it is characterized in that, the width being arranged on the technique edges (12) on four limits of film body (1) is 10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520801498.1U CN204968249U (en) | 2015-10-16 | 2015-10-16 | Practice thrift film of figure plated metal in circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520801498.1U CN204968249U (en) | 2015-10-16 | 2015-10-16 | Practice thrift film of figure plated metal in circuit board manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204968249U true CN204968249U (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520801498.1U Active CN204968249U (en) | 2015-10-16 | 2015-10-16 | Practice thrift film of figure plated metal in circuit board manufacturing process |
Country Status (1)
| Country | Link |
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| CN (1) | CN204968249U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495476A (en) * | 2018-04-20 | 2018-09-04 | 广东成德电子科技股份有限公司 | A kind of electroplating technology for reducing noble metal dosage in wiring board |
| CN110493963A (en) * | 2019-08-28 | 2019-11-22 | 清远市富盈电子有限公司 | A kind of pcb board intelligence edge sealing setting method |
| CN112485969A (en) * | 2020-11-25 | 2021-03-12 | 广东世运电路科技股份有限公司 | Film and film processing technology |
-
2015
- 2015-10-16 CN CN201520801498.1U patent/CN204968249U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495476A (en) * | 2018-04-20 | 2018-09-04 | 广东成德电子科技股份有限公司 | A kind of electroplating technology for reducing noble metal dosage in wiring board |
| CN110493963A (en) * | 2019-08-28 | 2019-11-22 | 清远市富盈电子有限公司 | A kind of pcb board intelligence edge sealing setting method |
| CN110493963B (en) * | 2019-08-28 | 2022-06-03 | 清远市富盈电子有限公司 | Intelligent edge sealing setting method for PCB |
| CN112485969A (en) * | 2020-11-25 | 2021-03-12 | 广东世运电路科技股份有限公司 | Film and film processing technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210302 Address after: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
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| TR01 | Transfer of patent right |