CN112485969A - Film and film processing technology - Google Patents

Film and film processing technology Download PDF

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Publication number
CN112485969A
CN112485969A CN202011334545.8A CN202011334545A CN112485969A CN 112485969 A CN112485969 A CN 112485969A CN 202011334545 A CN202011334545 A CN 202011334545A CN 112485969 A CN112485969 A CN 112485969A
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China
Prior art keywords
film
image
image area
edge
area
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Pending
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CN202011334545.8A
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Chinese (zh)
Inventor
朱尹峰
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Olympic Circuit Technology Co ltd
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Olympic Circuit Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympic Circuit Technology Co ltd filed Critical Olympic Circuit Technology Co ltd
Priority to CN202011334545.8A priority Critical patent/CN112485969A/en
Publication of CN112485969A publication Critical patent/CN112485969A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a film and a film processing technology. Wherein, the film includes: a line pattern layer; the plate edges are arranged around the circuit pattern layer in a surrounding mode; the process edge surrounds the area arranged between the circuit pattern layer and the plate edge; and the suction hole is arranged at the process edge and/or the gap between the process edge and the circuit pattern layer, and is used for fixing the film. When the film is used, the suction holes for fixing the film are arranged in the process edge and the area in the process edge, so that the subsequent normal process can be executed only by a small edge-remaining distance at the edge of the plate, and normal production is realized. By using the film, the precision and the efficiency of film exposure can be maintained without increasing the size of a circuit board, so that the adaptability of the film is improved, and the production cost is reduced.

Description

Film and film processing technology
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a film and a film processing technology.
Background
In the manufacturing process of the circuit board, an inner layer automatic exposure machine is commonly used for exposing the film, and when the exposure machine is used, a width of 10mm needs to be reserved at the edge of the board for arranging a vacuumizing hole so as to ensure the vacuum degree of exposure. However, when the board edge reserve width of the individual board is insufficient, normal production cannot be performed. At present, the existing solution is to increase the size of the plate, but the utilization rate of the plate and the cost are affected; the production is carried out by using a manual exposure machine or a semi-automatic exposure machine, but the precision and the efficiency can not reach the level of a full-automatic exposure machine.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a film and a film processing technology, which can improve the adaptability of the film and reduce the production cost.
In a first aspect, an embodiment of the present invention provides a film applied to a circuit board, where the film includes: a line pattern layer; the plate edges are arranged around the circuit pattern layer; a process edge surrounding an area disposed between the line pattern layer and the board edge; and the suction holes are arranged at the process edges and/or the gaps between the process edges and the circuit pattern layers and are used for fixing the film.
The film according to the embodiment of the first aspect of the invention has at least the following beneficial effects:
when the film is used, the suction holes for fixing the film are arranged in the process edge and the area in the process edge, so that the subsequent normal process can be executed only by a small edge-remaining distance at the edge of the plate, and normal production is realized. By using the film, the precision and the efficiency of film exposure can be maintained without increasing the size of a circuit board, so that the adaptability of the film is improved, and the production cost is reduced.
According to some embodiments of the first aspect of the present invention, the number of the suction holes is at least two. The arrangement of at least two suction holes can make the vacuum-pumping process of the film more stable, and realize better exposure effect.
According to some embodiments of the first aspect of the present invention, the suction holes are disposed on the same side of the circuit board. The suction hole is arranged on the same side, so that subsequent punching is more convenient.
According to some embodiments of the first aspect of the present invention, the inner layer of the circuit board is provided with a flow blocking block, the flow blocking block is located in the inner layer area of the board edge, and the suction hole is further located at the outer side edge of the flow blocking block. The outer edge of the flow blocking block is provided with the suction hole, the edge retaining requirement of the plate edge can be reduced for the suction hole, the space of the film can be fully utilized under the condition that a line pattern layer is not influenced, the edge retaining requirement of the film is reduced, and the adaptability of the film is improved.
In a second aspect, an embodiment of the present invention provides a film processing process, including:
acquiring a film image, wherein the film image comprises a first image area, a second image area and a third image area, the second image area is an area surrounding the periphery of the first image area, and the third image area is an area of the first image area and the second image area;
marking a preset mark in the third image area and/or the fourth image area, wherein the preset mark is used for marking the position of a suction hole;
modifying the film image according to the preset label;
manufacturing a film with an image according to the modified film image, wherein the film comprises a circuit layer corresponding to the first image area, a plate edge corresponding to the second image area, a process edge corresponding to the third image area, a gap corresponding to the fourth image area and a suction hole position corresponding to the preset label;
punching holes at the positions of the suction holes to generate suction holes for fixing the film.
The film processing technology provided by the embodiment of the second aspect of the invention has at least the following beneficial effects:
when the film processing technology is used, a film image is obtained, then a preset mark corresponding to the position of a suction hole to be generated is marked on the corresponding position of a third image area corresponding to a process edge of the film image and a fourth image area corresponding to a gap between a first image area and the third image area, the film image is modified according to the position of the preset mark, a film with an image is manufactured according to the modified film image, and then the preset mark on the film is punched to generate the suction hole for fixing the film. By using the process, the suction holes of the film are arranged in the process edge and the area in the process edge, and the subsequent normal process can be executed only by a smaller edge-remaining distance of the plate edge, so that the normal production can be realized, the adaptability of the film is improved, and the production cost is reduced.
According to some embodiments of the second aspect of the present invention, the number of the preset numbers is at least two. Through setting up two at least mark numbers of predetermineeing, the quantity of control suction hole is two at least, sets up suction hole and can make the evacuation process of film more stable for two at least, realizes better exposure effect.
According to some embodiments of the second aspect of the present invention, the preset reference mark is disposed on the same side of the film image. Through setting up preset label in the same one side of film image, the control is inhaled the hole and is set up in the same one side of circuit board for follow-up punching a hole is more convenient.
According to some embodiments of the second aspect of the present invention, the film image comprises a fifth image region, the fifth image region being located between the third image region and the second image region;
before the modifying the film image according to the preset label, the film processing technology further comprises:
marking a preset label at the outer edge of the fifth image area;
the producing of the imaged film from the modified film image comprises:
the film further comprises a flow blocking block corresponding to the fifth image area, the flow blocking block is arranged on the inner layer of the circuit board, and the flow blocking block is located in the inner layer area of the board edge.
The outer edge of the flow blocking block is provided with the suction hole, the edge retaining requirement of the plate edge can be reduced for the suction hole, the space of the film can be fully utilized under the condition that a line pattern layer is not influenced, the edge retaining requirement of the film is reduced, and the adaptability of the film is improved.
According to some embodiments of the second aspect of the present invention, said modifying the film image according to the preset label comprises: and modifying the width of the second image area which is positioned on the same side with the preset label according to the position of the preset label.
The preset marks are arranged in the third image area and/or the fourth image area, so that the suction holes are arranged in the technical edge and the area within the technical edge, the edge-remaining requirement of the plate edge is reduced, the width of the second image area which is positioned on the same side with the preset marks is modified, the utilization rate of the plate can be improved, and the production cost is reduced.
In a third aspect, an embodiment of the present invention provides a film, where the film is obtained by the film processing process described in any one of the embodiments of the second aspect.
The film according to the embodiment of the third aspect of the present invention has at least the following beneficial effects:
when the film processing technology is used, the positions of the suction holes of the film are arranged in the technical edge and the area in the technical edge, and the subsequent normal process can be executed only by a small edge-remaining distance of the plate edge, so that normal production can be realized, the adaptability of the film is improved, and the production cost is reduced.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a film according to an embodiment of the first aspect of the present invention;
FIG. 2 is a schematic structural diagram of a film according to another embodiment of the first aspect of the present invention;
FIG. 3 is a schematic structural diagram of a film according to another embodiment of the first aspect of the present invention;
fig. 4 is a flow chart of a film processing process according to an embodiment of the second aspect of the present invention.
Reference numerals:
a line pattern layer 100; a board edge 200; a process edge 300; a suction hole 400; a choke block 500; the void 600.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The embodiments of the present invention will be further explained with reference to the drawings.
In a first aspect, an embodiment of the present invention provides a film.
Referring to fig. 1, in some embodiments, a film is applied to a wiring board, the film comprising: a wiring pattern layer 100, a board edge 200, a process edge 300, and a suction hole 400. The board edge 200 is arranged around the circuit pattern layer 100, the process edge 300 is arranged around an area between the circuit pattern layer 100 and the board edge 200, the suction hole 400 is arranged on the process edge 300 and/or at a gap 600 between the process edge 300 and the circuit pattern layer 100, and the suction hole 400 is used for fixing a film. When using this film, since the suction holes 400 for fixing the film are provided in the process edge 300 and the area inside the process edge 300, the subsequent normal process can be performed with only a small margin distance of the plate edge 200. By using the film, the precision and the efficiency of film exposure can be maintained without increasing the size of a circuit board, so that the adaptability of the film is improved, and the production cost is reduced.
Referring to fig. 1 and 2, in some embodiments, the suction holes 400 are at least two. The film can be better fixed by arranging at least two suction holes 400, so that the vacuumizing process of the film is more stable, and a better exposure effect is realized. It should be noted that the number of the suction holes 400 is usually two or three, and may also be four, five, etc., and the number is not limited in this embodiment. The shape of the suction hole 400 may be circular or square, but the present embodiment is not limited to this.
Referring to fig. 1 and 2, in some embodiments, the suction holes 400 are disposed on the same side of the circuit board. The suction holes 400 are arranged on the same side, so that the device is more suitable for a fixing device of an inner layer automatic exposure machine of a main stream, and the subsequent punching is more convenient. It should be noted that each suction hole 400 may also be disposed on a different side of the circuit board, which may be an adjacent side or an opposite side, and this embodiment does not limit this.
Referring to fig. 3, in some embodiments, the inner layer of the circuit board is provided with a flow blocking block 500, the flow blocking block 500 is located at the inner layer area of the board edge 200, and the suction hole 400 is further provided at the outer edge of the flow blocking block 500. Set up at the outside edge of the piece 500 that blocks current and inhale hole 400, can reduce the requirement of remaining limit of flange 200 under the effect of not influencing under the circuit picture layer 100 condition, also not influencing the leveling of the piece 500 that blocks current yet, make full use of film's space to improve film's adaptability, reduction in production cost.
In a second aspect, the embodiment of the invention also provides a film processing technology.
Referring to fig. 4, in some embodiments, the film processing process includes, but is not limited to, step S100, step S200, step S300, step S400, and step S500.
Step S100: the method comprises the steps of obtaining a film image, wherein the film image comprises a first image area, a second image area, a third image area and a fourth image area, the second image area is an area surrounding the periphery of the first image area, the third image area is an area between the first image area and the second image area, and the fourth image area is an area between the first image area and the third image area.
Step S200: and marking a preset mark in the third image area and/or the fourth image area, wherein the preset mark is used for marking the position of the suction hole.
In this embodiment, the preset label may be marked only in the first image area, only in the third image area, or in both the first image area and the third image area, which is not limited in this embodiment.
Step S300: and modifying the film image according to the preset label.
Step S400: and manufacturing a film with an image according to the modified film image, wherein the film comprises a line layer corresponding to the first image area, a plate edge corresponding to the second image area, a process edge corresponding to the third image area, a gap corresponding to the fourth image area and a suction hole position corresponding to a preset label.
Step S500: punching is carried out at the position of the suction hole to generate the suction hole for fixing the film.
In this embodiment, the width of the third image area on the side corresponding to the position of the preset mark is modified according to the position of the preset mark to obtain a modified film image, an image-containing film is manufactured according to the modified film image, and then a hole is punched at the position of the suction hole of the film to generate a suction hole for fixing the film.
In some embodiments, through the steps S100, S200, S300, S400, and S500, the suction holes of the film are disposed in the process edge and the area inside the process edge, so as to reduce the edge-remaining distance required by the plate edge, achieve normal production without reducing the accuracy and efficiency of film exposure, improve the adaptability of the film, and reduce the production cost.
In some embodiments, the number of preset numbers is at least two. In this embodiment, through setting up two at least preset reference numerals, the quantity of control suction hole is two at least, sets up the suction hole and can make the evacuation process of film more stable for two at least, realizes better exposure effect. It should be noted that the preset reference numbers may also be three, four, etc., and the present embodiment does not limit the preset reference numbers.
In some embodiments, the predetermined reference number is on the same side of the third image area. In this embodiment, the suction holes are controlled to be arranged on the same side of the circuit board by arranging the preset marks on the same side of the film image, so that the subsequent punching is more convenient. It should be noted that the preset reference numbers may also be disposed on the adjacent side and the opposite side of the film image, and the embodiment does not limit the preset reference numbers.
In some embodiments, the film image includes a fifth image region, the fifth image region being located between the third image region and the second image region. The film processing process may include, but is not limited to, the following steps: before step S300, the method further includes: a preset mark is marked at an outer edge of the fifth image area.
With respect to step S500, it includes: the film also comprises a flow blocking block corresponding to the fifth image area, and the flow blocking block is arranged on the inner layer of the circuit board and is positioned in the inner layer area of the board edge.
In this embodiment, set up at the outside edge of the piece that chokes flow and inhale the hole, can reduce the requirement of remaining limit at the flange edge for inhaling the hole, can be under the circuit picture layer condition not influenced, also do not influence the leveling action of the piece that chokes flow under, the space of make full use of film reduces the requirement of remaining limit of film, improves the adaptability of film.
In some embodiments, with respect to step S300, the film processing process may include, but is not limited to, the following steps:
step S310: and modifying the width of the second image area on the same side as the preset label according to the position of the preset label.
In this embodiment, the preset marks are arranged in the third image area and/or the fourth image area, so that the suction holes are arranged in the process edge and the area within the process edge, the edge-remaining requirement of the plate edge is reduced, the width of the second image area which is located on the same side with the preset marks is modified, the area requirement of the plate can be reduced, the utilization rate of the plate is improved, and the production cost is reduced.
In a third aspect, an embodiment of the present invention further provides a film, and the film is processed by the film processing technology in any embodiment of the second aspect.
In this embodiment, when the film processing technology is used, the positions of the suction holes of the film are set in the process edge and the area in the process edge, and the subsequent normal process can be executed only by a small edge-remaining distance of the plate edge, so that the adaptability of the film is improved, and the production cost is reduced.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (10)

1. A film for a circuit board, the film comprising:
a line pattern layer;
the plate edges are arranged around the circuit pattern layer in a surrounding mode;
the process edge surrounds the area arranged between the circuit pattern layer and the plate edge;
and the suction hole is arranged at the process edge and/or the gap between the process edge and the circuit pattern layer, and is used for fixing the film.
2. The film of claim 1, wherein the suction holes are at least two.
3. The film of claim 2, wherein the suction holes are disposed on the same side of the circuit board.
4. The film according to any of claims 1 to 3, wherein the inner layer of the circuit board is provided with a flow blocking block, the flow blocking block is located in the inner layer area of the board edge, and the suction hole is further located at the outer edge of the flow blocking block.
5. A film processing technology is characterized by comprising the following steps:
acquiring a film image, wherein the film image comprises a first image area, a second image area, a third image area and a fourth image area, the second image area is an area surrounding the periphery of the first image area, the third image area is an area between the first image area and the second image area, and the fourth image area is an area between the first image area and the third image area;
marking a preset mark in the third image area and/or the fourth image area, wherein the preset mark is used for marking the position of a suction hole;
modifying the film image according to the preset label;
manufacturing a film with an image according to the modified film image, wherein the film comprises a circuit layer corresponding to the first image area, a plate edge corresponding to the second image area, a process edge corresponding to the third image area, a gap corresponding to the fourth image area and a suction hole position corresponding to the preset label;
punching holes at the positions of the suction holes to generate suction holes for fixing the film.
6. The film processing process according to claim 5, wherein the number of the preset marks is at least two.
7. A film processing process according to claim 6, wherein the preset reference marks are arranged on the same side of the film image.
8. The film processing process of claim 5, wherein the film image comprises a fifth image region, the fifth image region being located between the third image region and the second image region;
before the modifying the film image according to the preset label, the film processing technology further comprises:
marking a preset label at the outer edge of the fifth image area;
the producing of the imaged film from the modified film image comprises:
the film further comprises a flow blocking block corresponding to the fifth image area, the flow blocking block is arranged on the inner layer of the circuit board, and the flow blocking block is located in the inner layer area of the board edge.
9. The film processing process of claim 7, wherein the modifying the film image according to the preset label comprises:
and modifying the width of the second image area which is positioned on the same side with the preset label according to the position of the preset label.
10. A film obtained by the film processing process according to any one of claims 5 to 9.
CN202011334545.8A 2020-11-25 2020-11-25 Film and film processing technology Pending CN112485969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011334545.8A CN112485969A (en) 2020-11-25 2020-11-25 Film and film processing technology

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Application Number Priority Date Filing Date Title
CN202011334545.8A CN112485969A (en) 2020-11-25 2020-11-25 Film and film processing technology

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Publication Number Publication Date
CN112485969A true CN112485969A (en) 2021-03-12

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CN102300411A (en) * 2011-08-05 2011-12-28 深圳统信电路电子有限公司 Drilling Manufacturing process of induction magnet ring plate
CN202153294U (en) * 2011-08-24 2012-02-29 胜华电子（惠阳）有限公司 Circuit board manually-operated counterpoint film
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CN204968249U (en) * 2015-10-16 2016-01-13 胜宏科技（惠州）股份有限公司 Practice thrift film of figure plated metal in circuit board manufacturing process
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CN206039148U (en) * 2016-08-23 2017-03-22 奥士康精密电路（惠州）有限公司 PCB board printing film
CN206237686U (en) * 2016-12-14 2017-06-09 珠海精毅电路有限公司 A kind of one side overlength, ultra-thin internal layer circuit plate positioning device
CN108495476A (en) * 2018-04-20 2018-09-04 广东成德电子科技股份有限公司 A kind of electroplating technology for reducing noble metal dosage in wiring board
CN108811300A (en) * 2018-05-11 2018-11-13 胜华电子（惠阳）有限公司 A kind of wiring board typesetting technology that substrate utilization can be improved
CN109640547A (en) * 2018-12-01 2019-04-16 广东骏亚电子科技股份有限公司 A method of improving multilayer circuit board interlayer alignment precision
CN210518978U (en) * 2019-04-02 2020-05-12 启东盛丽光电科技有限公司 Lamp PCB with technical edge
CN110113885A (en) * 2019-06-05 2019-08-09 景旺电子科技(龙川)有限公司 A kind of FPC method for manufacturing circuit board
CN110996531A (en) * 2020-01-02 2020-04-10 深圳市景旺电子股份有限公司 Processing and manufacturing method for PCB molding

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