CN115734505A - Solder resist ink thickness control method, manufacturing method and rigid-flex printed circuit board - Google Patents
Solder resist ink thickness control method, manufacturing method and rigid-flex printed circuit board Download PDFInfo
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- CN115734505A CN115734505A CN202211444366.9A CN202211444366A CN115734505A CN 115734505 A CN115734505 A CN 115734505A CN 202211444366 A CN202211444366 A CN 202211444366A CN 115734505 A CN115734505 A CN 115734505A
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Abstract
The invention discloses a thick copper surface solder resist ink thickness control method, and discloses a manufacturing method of a printed circuit board comprising the thick copper surface solder resist ink thickness control method and the thick copper surface solder resist ink thickness control method, which comprises the following processing steps: the method comprises the following steps: performing solder mask spraying for the first time, printing a layer of solder mask ink on the surface of the circuit board, and then performing exposure; step two: the covering line is arranged on two sides of the outer edge and the inner edge of the line position; and a third step: and (4) performing solder mask spraying for the second time, printing a layer of solder mask ink on the surface of the circuit board obtained in the second step, and then performing exposure according to the preset solder mask windowing requirement. By the thick copper surface solder resist ink thickness control method, the solder resist thickness of the line position can be met, and meanwhile, the solder resist thickness of the substrate position and the large copper surface can be guaranteed to meet the production requirement.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a thick copper surface solder resist ink thickness control method, a manufacturing method and a rigid-flex printed circuit board.
Background
In the solder mask production process of the printed circuit board, the copper thickness and the height difference of the base material position, the large copper surface, the circuit position and the like on the surface of the circuit board are different, so the solder mask thickness requirement of each position is different in each solder mask printing process.
The existing circuit board requires the solder mask thickness of the substrate surface to be controlled below 100 microns, and the rigid-flex board usually adopts two to three times of solder mask production modes aiming at the thick copper surface. Under the production effect of the method, the thickness of the solder mask at the positions of a large copper surface, a substrate surface and the like is often over-standard, and the requirement that the thickness of the solder mask at the positions of the substrate surface and the like is controlled to be less than 100 micrometers cannot be met.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a thick copper surface solder mask ink thickness control method, which can meet the requirement of the solder mask thickness of a line and ensure the appropriate thickness of the solder mask of a substrate.
The invention further provides a manufacturing method of the printed circuit board comprising the thick copper surface solder resist ink thickness control method.
The invention also provides a rigid-flex printed circuit board processed by the method for manufacturing the printed circuit board.
According to the embodiment of the first aspect of the invention, the method for managing the thickness of the thick copper surface solder resist ink comprises the following processing steps:
the method comprises the following steps: performing solder mask spraying for the first time, printing a layer of solder mask ink on the surface of the circuit board, and then performing exposure;
step two: covering lines on two sides of the outer edge and the inner edge of the line position; and
step three: and c, performing solder mask spraying for the second time, printing a layer of solder mask ink on the surface of the circuit board obtained in the step two, and then performing exposure according to the preset solder mask windowing requirement.
The thick copper surface solder resist ink thickness control method provided by the embodiment of the invention at least has the following beneficial effects: the method for controlling the thickness of the solder resist ink on the thick copper surface adopts a method of repeatedly and separately solder resist to solder resist the rigid-flex circuit board, firstly solder resist is carried out on the edge of a line position, and then solder resist of the rigid-flex circuit board is carried out by adopting an integral solder resist method. By the thick copper surface solder resist ink thickness control method, the solder resist thickness of a line position can be met, and meanwhile, the solder resist thickness of a base material position and the solder resist thickness of a large copper surface can be guaranteed to meet the production requirement.
According to some embodiments of the invention, the method for managing the thickness of the thick copper surface solder resist ink further comprises the fourth step of: and solder mask spraying is carried out for the third time, after a layer of solder mask ink is printed on the surface of the circuit board obtained in the third step, exposure is carried out according to the preset solder mask windowing requirement.
According to some embodiments of the present invention, in the second step, the outer edge of the line position is covered by using a single-side 10mil method, and the inner edge of the line position is covered by using a 3mil method.
According to some embodiments of the invention, in the first step, after printing a layer of solder resist ink on the surface of the circuit board, pre-baking is performed.
According to some embodiments of the invention, in the second step, after the wire covering process is completed, the developing and the baking are performed again.
According to some embodiments of the invention, the step one and the step three are exposed by using a solder resist DI machine.
According to the manufacturing method of the printed wiring board of the second aspect embodiment of the invention, the manufacturing method of the printed wiring board comprises the thick copper surface solder resist ink thickness control method of the first aspect embodiment.
The method for manufacturing the printed circuit board provided by the embodiment of the invention at least has the following beneficial effects: the method for controlling the thickness of the solder resist ink on the thick copper surface comprises any one embodiment of the first aspect, so that the solder resist thickness of the rigid-flex printed circuit board manufactured by the method for manufacturing the printed circuit board can meet the requirement of a product.
According to the rigid-flexible printed wiring board of the embodiment of the third aspect of the invention, the rigid-flexible printed wiring board is manufactured by the manufacturing method of the printed wiring board provided by the embodiment of the second aspect.
The rigid-flexible printed circuit board provided by the embodiment of the invention at least has the following beneficial effects: the method for manufacturing the printed wiring board in the second aspect includes the method for controlling the thickness of the solder resist ink on the thick copper surface in any embodiment of the first aspect, so that the solder resist thickness of the rigid-flex printed wiring board manufactured by the method for manufacturing the printed wiring board can meet the requirement of a product.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic flow chart of a thick copper surface solder resist ink thickness control method according to an embodiment of the first aspect of the present invention;
fig. 2 is a schematic diagram of a circuit board surface in a second state of a rigid-flex printed circuit board according to a third aspect of the present invention;
fig. 3 is a schematic view of a board surface of the rigid-flex printed wiring board shown in fig. 2 in a state of step three.
Reference numerals are as follows:
line bit 1; a first lid line 2; and a second lid line 3.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explanation and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The embodiment of the first aspect of the invention provides a thick copper surface solder mask ink thickness control method which can meet the requirement of line solder mask thickness and meanwhile guarantee the appropriate solder mask thickness of a base material position.
The invention further provides a manufacturing method of the printed circuit board comprising the thick copper surface solder resist ink thickness control method.
The invention also provides a rigid-flex printed circuit board processed by the method for manufacturing the printed circuit board.
According to the thick copper surface solder resist ink thickness control method disclosed by the embodiment of the first aspect of the invention, the thick copper surface solder resist ink thickness control method comprises the following processing steps:
the method comprises the following steps: performing solder mask spraying for the first time, printing a layer of solder mask ink on the surface of the circuit board, and then exposing;
step two: covering lines are arranged on two sides of the outer edge and the inner edge of the circuit position 1; and
step three: and c, performing solder mask spraying for the second time, printing a layer of solder mask ink on the surface of the circuit board obtained in the step two, and then performing exposure according to the preset solder mask windowing requirement.
Specifically, performing first solder mask spraying on a semi-finished product of the rigid-flex printed circuit board, printing a layer of solder mask ink on the board surface of the circuit board by using a solder mask spraying machine, and then exposing; then, a second covering line 3 is carried out on the outer edge of the line position 1 of the circuit board in a single-side 10mil mode, and meanwhile, a first covering line 2 is carried out on the inner edge of the line position 1 in a single-side 3mil mode. And then finishing development and baking to obtain a product after the first solder mask spraying, wherein the solder mask ink with enough thickness at the line position 1 and the line corner can be printed according to the covered line at the edge of the line position 1. And then, performing secondary solder mask spraying, printing a layer of solder mask ink on the surface of the circuit board, performing integral solder mask windowing of the circuit board according to preset solder mask windowing data, and then performing exposure.
It should be noted that, in the second step, the size of the cover line at the edge of the line location 1 may not be specifically limited, and the size of the cover line may be adjusted according to the size of the line location 1, so as to meet the requirement of the thickness of the solder resist ink with sufficient thickness at the line location 1 and the line corner. It should be noted that the preset resistance-opening window data can be edited by different production requirements, and the data thereof is not limited specifically.
The method for controlling the thickness of the solder resist ink with the thick copper surface adopts a method of repeatedly and separately solder resist to solder resist the rigid-flex circuit board, firstly, the edge of the circuit position 1 is solder-resist firstly, so that the circuit position 1 and the circuit corner have enough solder resist ink thickness, and then, the rigid-flex circuit board is solder-resist by adopting an integral solder resist method. Therefore, the solder resist ink thickness control method for the thick copper surface can meet the solder resist thickness of the circuit position 1 and ensure that the solder resist thickness of the base material position and the large copper surface can meet the production requirements.
In some embodiments of the present invention, if the thickness of the copper of the rigid-flex printed wiring board obtained after the second solder mask spraying is performed does not meet the thickness requirement, the solder mask spraying may be performed again, that is, the thick-copper-surface solder mask ink thickness control method further includes the fourth step: and solder mask spraying is carried out for the third time, after a layer of solder mask ink is printed on the surface of the circuit board obtained in the third step, exposure is carried out according to the preset solder mask windowing requirement. The thickness of the assembly welding ink can meet the requirement.
In some embodiments of the present invention, in the first step, after a layer of solder resist ink is printed on the surface of the circuit board, pre-baking is performed. And (4) pre-baking the circuit board. And in the second step, after the wire covering process is finished, developing and baking again are carried out. And in the first step and the third step, exposing by using a solder resist DI machine.
According to the method for manufacturing the printed wiring board of the second aspect of the present invention, the method for manufacturing the printed wiring board includes the method for regulating the thickness of the thick copper surface solder resist ink of the first aspect of the present invention. The method for managing and controlling the thickness of the solder resist ink on the thick copper surface comprises any one embodiment of the first aspect, so that the solder resist thickness of the rigid-flex printed circuit board manufactured by the method for manufacturing the printed circuit board can meet the requirement of a product.
According to the rigid-flex printed wiring board of the embodiment of the third aspect of the invention, the rigid-flex printed wiring board is manufactured by the manufacturing method of the printed wiring board provided by the embodiment of the second aspect. The method for manufacturing the printed wiring board in the second aspect includes the method for controlling the thickness of the solder resist ink on the thick copper surface in any embodiment of the first aspect, so that the solder resist thickness of the rigid-flex printed wiring board manufactured by the method for manufacturing the printed wiring board can meet the requirement of a product.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (8)
1. A thick copper surface solder resist ink thickness control method is characterized by comprising the following processing steps:
the method comprises the following steps: performing solder mask spraying for the first time, printing a layer of solder mask ink on the surface of the circuit board, and then exposing;
step two: the covering line is arranged on two sides of the outer edge and the inner edge of the line position; and
step three: and c, performing solder mask spraying for the second time, printing a layer of solder mask ink on the surface of the circuit board obtained in the step two, and then performing exposure according to the preset solder mask windowing requirement.
2. The method for managing and controlling the thickness of the solder resist ink with the thick copper surface according to claim 1, further comprising the fourth step of: and solder mask spraying is carried out for the third time, after a layer of solder mask ink is printed on the surface of the circuit board obtained in the third step, the solder mask DI machine is used for exposure according to the preset solder mask windowing requirement.
3. The method for managing the thickness of the thick copper surface solder resist ink as claimed in claim 1, wherein in the second step, the outer edge of the line position is covered by adopting a single-side 10mil method, and the inner edge of the line position is covered by adopting a 3mil method.
4. The method for managing the thickness of the solder resist ink with the thick copper surface as claimed in claim 1, wherein in the first step, after a layer of solder resist ink is printed on the surface of the circuit board, pre-baking is performed.
5. The method for managing the thickness of the solder resist ink with the thick copper surface as claimed in claim 1, wherein in the second step, after the wire covering process is completed, development and re-baking are performed.
6. The method for controlling the thickness of the solder resist ink with the thick copper surface as claimed in claim 1, wherein in the first step and the third step, exposure is performed by using a solder resist DI machine.
7. The method for manufacturing the printed circuit board is characterized by comprising the method for controlling the thickness of the solder resist ink with the thick copper surface according to any one of claims 1 to 6.
8. A rigid-flex printed wiring board characterized by being produced by the method for processing a printed wiring board according to claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211444366.9A CN115734505A (en) | 2022-11-18 | 2022-11-18 | Solder resist ink thickness control method, manufacturing method and rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211444366.9A CN115734505A (en) | 2022-11-18 | 2022-11-18 | Solder resist ink thickness control method, manufacturing method and rigid-flex printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115734505A true CN115734505A (en) | 2023-03-03 |
Family
ID=85296425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211444366.9A Pending CN115734505A (en) | 2022-11-18 | 2022-11-18 | Solder resist ink thickness control method, manufacturing method and rigid-flex printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115734505A (en) |
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2022
- 2022-11-18 CN CN202211444366.9A patent/CN115734505A/en active Pending
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