CN116234181A

CN116234181A - Special single-panel manufacturing process and single-panel

Info

Publication number: CN116234181A
Application number: CN202310176643.0A
Authority: CN
Inventors: 谭懋; 王铭钏
Original assignee: Huizhou Xinglian Electronic Technology Co ltd
Current assignee: Huizhou Xinglian Electronic Technology Co ltd
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2023-06-06

Abstract

The invention relates to a special single-sided board manufacturing process and a single-sided board, wherein the special single-sided board manufacturing process comprises the following steps: s1, cutting a single-sided copper-clad plate to obtain a plate body for manufacturing a PCB, wherein one side of the plate body, which is covered with copper, is an L1 layer, and the other side of the plate body is an L2 layer; s2, drilling for one time, and forming a tool hole on the process side of the plate body; s3, film pressing is carried out on the surface of the L1 layer, the L1 layer is subjected to graph film alignment and exposure through the tool hole, film pressing is not carried out on the surface of the L2 layer, and the graph film is not aligned and is not exposed; s4, etching the plate body; s5, manufacturing a solder mask layer of the L1 layer and the L2 layer, wherein the solder mask film of the L1 layer is aligned and exposed, and the solder mask film of the L2 layer is empty; s6, performing secondary drilling, and forming a copper-free hole in the plate body; s7, manufacturing characters; s8, manufacturing in a later process. The invention can simplify the production flow of special single panel, reduce the production cost and is convenient for batch and automatic production.

Description

Special single-panel manufacturing process and single-panel

Technical Field

The invention relates to the technical field of production of PCB boards, in particular to a special single-sided board manufacturing process and a single-sided board.

Background

The existing processing technology of the PCB single panel generally comprises the following steps: the method comprises the steps of material cutting, drilling, circuit etching, solder resist, characters, appearance, surface treatment, testing and FQC packaging, wherein tool holes required by the production of the later working procedures and copper-free holes in a PCB (printed circuit board) are often drilled simultaneously in a single drilling working procedure, for a single-sided board with a special structure, for example, a single-sided board with a double-sided printed solder resist layer and a character layer is required, as the copper-free holes are formed in the drilling working procedure, when the solder resist layer is manufactured later, solder resist films corresponding to the windowing of the copper-free holes are required to be manufactured on two sides of the PCB, the films are required to be aligned and exposed manually, and only an old parallel light exposure machine is used for production, so that the flow is complex, and the production cost is increased.

Disclosure of Invention

The invention aims to provide a special single-panel manufacturing process and a single-panel, which can simplify the production flow of the special single-panel, reduce the production cost and facilitate batch and automatic production.

In one aspect, the present application provides a special single panel manufacturing process, including the steps of:

s1, cutting a single-sided copper-clad plate to obtain a plate body for manufacturing a PCB, wherein one side of the plate body, which is covered with copper, is an L1 layer, and the other side of the plate body is an L2 layer;

s2, drilling for one time, and forming a tool hole on the process side of the plate body;

s3, film pressing is carried out on the surface of the L1 layer, the L1 layer is subjected to graph film alignment and exposure through the tool hole, film pressing is not carried out on the surface of the L2 layer, and the graph film is not aligned and is not exposed;

s4, etching the plate body;

s5, manufacturing a solder mask layer of the L1 layer and the L2 layer, wherein the solder mask film of the L1 layer is aligned and exposed, and the solder mask film of the L2 layer is empty;

s6, performing secondary drilling, and forming a copper-free hole in the plate body;

s7, manufacturing characters;

s8, manufacturing in a later process.

In the technical scheme, the traditional drilling process is divided into primary drilling and secondary drilling, wherein the primary drilling only processes tool holes so as to meet the alignment requirements during line exposure and solder resist manufacture, and secondary drilling is performed after solder resist is completed so as to form copper-free holes, so that in the solder resist process, a solder resist film of an L2 layer is not required to be manufactured, film alignment and exposure are not required to be performed on the L2 layer, and therefore the production flow is simplified, and the production cost is reduced. Because the L2 layer does not need to be subjected to film alignment and exposure, the solder mask process only needs to be subjected to one-time exposure by using a CCD exposure machine, and batch and automatic production is facilitated.

Further, the pattern film and the solder resist film of the L1 layer window the copper-free hole.

In the technical scheme, the pattern film and the solder resist film of the L1 layer window the copper-free holes, so that the corresponding copper-free holes can be conveniently processed during secondary drilling.

Further, in the step S6, the direction of the secondary drilling is from the L1 layer to the L2 layer.

In the technical scheme, the direction of secondary drilling is from L1 layer to L2 layer drilling, and the welding resistance blushing during drilling can be prevented, so that the appearance of the circuit board is good.

Further, in the step S7, the characters of the L2 layer are aligned and manufactured through the tool hole.

In the technical scheme, the characters of the L2 layer are aligned and manufactured through the tool holes, so that an alignment PAD and character corner lines of a manufacturing process side are not needed, an empty graphic film can be used in the process of manufacturing the circuit by the L2 layer, and then alignment and exposure of the graphic film are not needed, the production flow is further simplified, and the production efficiency is improved.

Further, in the step S3, the graphic film is exposed by using a CCD.

Further, in the step S5, the solder resist film is exposed by using a CCD.

In the technical scheme, the pattern film and the solder resist film of the L2 layer do not need to be aligned and exposed, so that the CCD machine can be adopted for one-time exposure manufacture, and batch automatic production is facilitated.

Further, in the step S8, the post-process manufacturing includes: surface treatment, testing, and shipment detection.

On the other hand, the application provides a single-sided board which is manufactured by adopting the special single-sided board manufacturing process.

Compared with the prior art, the invention has the beneficial effects that: the traditional drilling process is divided into primary drilling and secondary drilling, wherein the primary drilling only processes tool holes so as to meet the alignment requirements during line exposure and solder mask manufacturing, and secondary drilling is performed after solder mask is completed so as to form copper-free holes, so that in the solder mask process, a solder mask film of an L2 layer is not required to be manufactured, film alignment and exposure are not required to be performed on the L2 layer, the production flow is simplified, and the production cost is reduced. Because the L2 layer does not need to be subjected to film alignment and exposure, the solder mask process only needs to be subjected to one-time exposure by using a CCD exposure machine, and batch and automatic production is facilitated.

Drawings

Fig. 1 is a schematic flow chart of an embodiment of the present invention.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

As shown in fig. 1, in one aspect, the present invention provides a special single panel manufacturing process, which includes the following steps:

in this embodiment, the drilling process data is split, so that the tool holes on the process sides are drilled preferentially, thereby meeting the requirement of line alignment exposure and facilitating the subsequent completion of line manufacture.

S3, film pressing is carried out on the surface of the L1 layer, the L1 layer is subjected to pattern film alignment and exposure through the tool hole, film pressing is not carried out on the surface of the L2 layer, and the pattern film is not aligned and is not exposed;

in this embodiment, the pattern film of the L1 layer is exposed to the alignment to ensure the accuracy of the circuit pattern. The L1 layer of pattern film is windowed at the position corresponding to the position without copper holes, so that burrs are avoided from being generated on the copper layer during subsequent drilling.

It can be understood that the L2 layer has no copper foil and no film pressing, and the pattern film is set to be not aligned and exposed, so that the circuit layer can be automatically exposed and manufactured through a CCD exposure machine, and the manufacturing efficiency is improved.

S4, etching the plate body;

in this embodiment, the etching may refer to the conventional etching method, and the line is formed on the L1 layer by etching.

S5, manufacturing a solder mask layer of the L1 layer and a solder mask layer of the L2 layer, wherein the solder mask film of the L1 layer is aligned and exposed, and the solder mask film of the L2 layer is empty;

in this embodiment, the solder resist film of the L1 layer is normally manufactured, where the position of the solder resist film corresponding to the copper-free hole is windowed, so that the corresponding copper-free hole is conveniently processed during secondary drilling. The L2 layer has no pattern, the solder resist film is empty, and the solder resist film is set to be not aligned and exposed, so that the CCD machine can be adopted for one-time exposure manufacture, and batch automatic production is facilitated.

S6, performing secondary drilling, and forming copper-free holes in the plate body;

the direction of secondary drilling is from L1 layer to L2 layer drilling, and the welding resistance blushing during drilling can be prevented, so that the appearance of the circuit board is good.

S7, manufacturing characters;

in this embodiment, the characters of the L1 layer are normally manufactured in the existing manner, the characters of the L2 layer are manufactured in an alignment manner through the tool holes, and the L2 layer does not need to manufacture an alignment PAD and character corner lines of the process side, so that an empty graphic film can be used in the process of manufacturing the circuit of the L2 layer, and further alignment and exposure of the graphic film are not needed, the production flow is further simplified, and the production efficiency is improved.

S8, manufacturing in a later process.

Wherein, the post-process manufacturing includes: surface treatment, testing, and shipment detection.

On the other hand, the application provides a single-sided board which is manufactured by adopting the special single-sided board manufacturing process. The copper-clad side of the single-sided board is an L1 layer, the other side of the single-sided board is an L2 layer, the L1 layer is provided with a circuit layer, the circuit layer of the L2 layer is an empty layer, and both sides of the single-sided board are provided with a solder mask layer and a character layer.

According to the technical scheme, the traditional drilling process is divided into primary drilling and secondary drilling, wherein the primary drilling is used for machining only tool holes so as to meet the alignment requirements during line exposure and solder resist manufacture, and after solder resist is completed, secondary drilling is carried out so as to form copper-free holes, so that in the solder resist process, a solder resist film of an L2 layer is not required to be manufactured, film alignment and exposure are not required to be carried out on the L2 layer, the production flow is simplified, and the production cost is reduced. Because the L2 layer does not need to be subjected to film alignment and exposure, the solder mask process only needs to be subjected to one-time exposure by using a CCD exposure machine, and batch and automatic production is facilitated.

In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A special single-sided board manufacturing process is characterized by comprising the following steps:

s4, etching the plate body;

s7, manufacturing characters;

s8, manufacturing in a later process.

2. The special single-panel manufacturing process according to claim 1, wherein the pattern film and the solder resist film of the L1 layer window the copper-free hole.

3. The special single panel manufacturing process according to claim 1, wherein in the step S6, the direction of the secondary drilling is from the L1 layer to the L2 layer.

4. The special single-panel manufacturing process according to claim 1, wherein in the step S7, the characters of the L2 layer are aligned through the tool hole.

5. The special single-panel manufacturing process according to claim 1, wherein in the step S3, the pattern film is exposed by using a CCD.

6. The special single-panel manufacturing process according to claim 1, wherein in the step S5, the solder resist film is exposed by using a CCD.

7. The special single-panel manufacturing process according to claim 1, wherein in the step S8, the post-process manufacturing includes: surface treatment, testing, and shipment detection.

8. A single panel produced by the special single panel production process according to any one of claims 1 to 7.