CN117320320A - Processing method of high-speed signal micro-structure PCB - Google Patents
Processing method of high-speed signal micro-structure PCB Download PDFInfo
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- CN117320320A CN117320320A CN202311273451.8A CN202311273451A CN117320320A CN 117320320 A CN117320320 A CN 117320320A CN 202311273451 A CN202311273451 A CN 202311273451A CN 117320320 A CN117320320 A CN 117320320A
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- copper
- laser
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Links
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 31
- 238000009713 electroplating Methods 0.000 claims abstract description 30
- 230000008021 deposition Effects 0.000 claims abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 14
- 238000005553 drilling Methods 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000012958 reprocessing Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 239000011229 interlayer Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 34
- 238000003475 lamination Methods 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a processing method of a high-speed signal micro-structure PCB, which belongs to the technical field of circuit boards, and comprises the following steps: and (3) laser grooves are formed in the copper-clad plate, copper deposition electroplating treatment is carried out on the sub-plate with the laser grooves, tinning treatment is carried out on the sub-plate after copper deposition electroplating, a tin surface which does not need to be conducted is removed through laser, a copper body at the bottom of the tin surface is removed, then alkaline etching is used for removing the exposed copper body, and finally the circuit board of the vertical lead circuit is obtained. The invention can be applied to high-speed signal lines, and the lines in the vertical direction are obtained through laser and etching processes, so that the interlayer conduction effect is realized, and meanwhile, the invention occupies a smaller area and plays a better shielding role.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method for processing a high-speed signal micro-structure PCB.
Background
At present, the manufacturing process of the PCB multi-layer board is that inner layer circuits are manufactured on CCL (copper clad laminate), each inner layer CCL (copper clad laminate) +PP (prepreg) +copper foil are pressed into a whole, holes are drilled on a pressed body or laser holes are drilled on the pressed body, copper deposition electroplating is performed on the copper foil of the pressed body, and circuits are manufactured again, and the inner layer and the outer layer are conducted basically through the drilling or laser drilling+copper deposition electroplating process.
But is limited by the process influences such as the diameter of a drilling needle, and the like, holes with smaller occupied areas (the minimum diameter is 0.15-0.2 mm, usually 0.25mm at present) cannot be obtained when the inner layer and the outer layer of the traditional PCB are conducted, and because the chip design needs, the pad spacing tends to be tiny, so that the occupied area of the holes is larger, and the CAF (conductive anode wire) is poor due to the too small hole spacing, so that the limitation on the use of the chip tends to be more obvious by using the traditional mechanical drilling or laser drilling.
For a high-speed circuit, since the traditional process needs to add shielding holes around the high-speed signal holes, more area is required, obvious shielding effect cannot be achieved, and since the impedance of the holes is influenced by various factors, the impedance of the via holes is always a pain point of the high-speed signal circuit, so how to design a micro-structure PCB circuit board applied to high-speed signals is an urgent technical problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a processing method of a high-speed signal micro-structure PCB, which obtains a circuit in a vertical direction through laser and etching processes, realizes interlayer conduction and occupies a smaller area.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the processing method of the PCB with the high-speed signal microstructure is characterized by comprising the following steps of:
a laser groove is formed on the copper-clad plate by laser to obtain a sub-plate with the laser groove,
carrying out copper deposition electroplating treatment on the daughter board with the laser groove to obtain a daughter board subjected to copper deposition electroplating;
and (3) reprocessing the copper-plated sub-board according to design requirements, and then carrying out laser and etching treatment to obtain the copper-clad plate of the vertical lead circuit.
Optionally, the processing is performed again according to the design requirement, and then the laser and etching treatment is performed, and the method comprises the following steps:
carrying out tinning treatment on the copper-plated daughter board, removing a tin surface which does not need to be conducted by laser to obtain a copper body with the bottom of the tin surface removed, and then removing the exposed copper body by alkaline etching;
or filling the processing area of the sub-board after copper deposition electroplating with a wet film, covering the board surface with a dry film, and etching an area which does not need to be conducted by laser, or exposing the position which needs to be reserved with a copper body, developing the position which does not need to be reserved with the copper body, and then removing the exposed copper body by acid etching;
or, filling resin in the laser groove of the sub-board after copper deposition electroplating, then carrying out dry film pressing treatment and full-board exposure, and carrying out laser removal on the resin on the surfaces of the dry film areas and the copper bodies which do not need to be conducted at the positions, and removing the exposed copper bodies by acid etching.
Optionally, after the exposing treatment is performed on the copper body position to be retained, the exposed copper body is removed by acid etching after the developing treatment is performed on the copper body position not to be retained, and the wet film and the dry film are also required to be removed.
Optionally, the method for laser cutting the laser groove on the copper-clad plate includes:
manufacturing an inner layer circuit on a copper foil of the copper-clad plate according to design requirements to obtain a plurality of inner layer substrates;
semi-curing and pressing the inner layer substrates to obtain a copper foil pressed body;
punching a positioning hole on the copper foil pressed body, and then respectively carrying out compression molding, exposure, development and etching treatment on the copper foil pressed body to obtain a position to be processed;
and removing the glue from the position to be processed, and processing the window area to the required design depth in a laser or mechanical mode to obtain the laser groove.
Optionally, after the vertical wire circuit copper-clad plate is obtained, the method further comprises:
carrying out resin plugging on the laser groove or the burnt resin area in the vertical lead circuit copper-clad plate;
further drilling holes on the vertical lead circuit copper-clad plate after hole plugging, and carrying out copper deposition electroplating treatment;
manufacturing an outer layer circuit for the copper-clad plate of the vertical lead circuit subjected to copper precipitation electroplating treatment;
scanning the outer layer circuit according to the AOI, and judging whether the outer layer circuit has an open/short circuit or not;
printing a layer of green oil on the outer layer circuit;
and carrying out surface treatment on the outer layer circuit according to design requirements.
Optionally, the method for manufacturing an outer layer circuit on the copper-clad plate of the vertical lead circuit after copper deposition electroplating treatment includes:
and sticking a photosensitive dry film to the copper-clad plate of the vertical lead circuit after copper deposition electroplating treatment, and respectively carrying out exposure, development and etching treatment to obtain the outer layer circuit.
Optionally, before the resin plugging is performed on the laser groove or the burned resin area in the vertical wire circuit copper-clad plate, the method further comprises the steps of browning and baking the vertical wire circuit copper-clad plate.
Optionally, the tin surface at the position which does not need to be conducted is removed through laser, and the laser is UV laser.
Optionally, the window area is processed to a required design depth by a laser or mechanical method, and the laser adopts CO 2 And (5) laser.
Compared with the prior art, the invention has the beneficial effects that:
the conducting circuit in the vertical direction is obtained by adopting the laser and etching process, so that the interlayer conduction effect is realized, meanwhile, the smaller area is occupied, the cost is saved to a certain extent, and the effect of more circuits can be realized on the same area;
when the invention is applied to a high-speed signal line, the conductive line in the vertical direction is designed, and the groove wall opposite to the vertical line is a continuous copper wall, so that a better shielding effect can be achieved;
compared with the traditional blind hole lamination, the laser type blind hole lamination machine can achieve any depth in a laser mode, so that the lamination layer number is increased.
Drawings
FIG. 1 is a flow chart of a method for processing a high-speed signal microstructure PCB according to an embodiment of the invention;
FIG. 2 is a schematic flow chart of laser trench (through trench/blind trench) fabrication in an embodiment of the invention;
FIG. 3 is a schematic flow chart of the vertical conductive circuit fabrication in an embodiment of the invention;
FIG. 4 is a schematic flow chart of an alternative first embodiment of the present invention for manufacturing a vertical conductive circuit;
FIG. 5 is a schematic flow chart of an alternative second method for manufacturing a vertical conductive circuit according to an embodiment of the present invention;
FIG. 6 is a schematic diagram showing another process of the method for processing a high-speed signal microstructure PCB according to an embodiment of the invention;
fig. 7 is a three-dimensional view of a PCB board with vertical conductive traces according to one embodiment of the invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
The technical conception of the invention is as follows: considering that the conduction of the inner layer and the outer layer of the traditional PCB is usually completed through a drilling and copper deposition electroplating process, but is limited by the influence of the diameter of a drill needle, a hole with smaller occupied area cannot be obtained, and when the traditional PCB is applied to a high-speed signal line, shielding holes are added around the high-speed signal hole, more area is required to be occupied by the traditional process, an obvious shielding effect cannot be achieved, and the impedance of the hole is always a pain point of the high-speed signal line due to the influence of various factors. Therefore, the invention provides a processing method of a high-speed signal micro-structure PCB, which adopts a laser and etching process to obtain a conductor in the vertical direction so as to realize the conduction of an inner layer and an outer layer.
Example 1
Referring to fig. 1, the present embodiment describes a method for processing a high-speed signal microstructure PCB, which includes the following steps:
a laser groove is formed on the copper-clad plate by laser to obtain a sub-plate with the laser groove,
carrying out copper deposition electroplating treatment on the daughter board with the laser groove to obtain a daughter board subjected to copper deposition electroplating;
and (3) reprocessing the copper-plated sub-board according to design requirements, and then carrying out laser and etching treatment to obtain the copper-clad plate of the vertical lead circuit.
According to the embodiment of the invention, the conducting circuit in the vertical direction is obtained by adopting the laser and etching process, so that the interlayer conduction effect is realized, meanwhile, the smaller area is occupied, the cost is saved to a certain extent, and the effect of more circuits can be realized on the same area.
Example 2
Referring to fig. 1, 2, 3 and 6, this embodiment is also designed as follows on the basis of embodiment 1.
The embodiment of the invention introduces a processing method of a high-speed signal micro-structure PCB, which comprises the following steps:
step 1: manufacturing a laser groove;
step 2: manufacturing a vertical conductive line;
step 3: and further processing according to the design requirement, and carrying out subsequent processing flow.
In step 1, the laser groove manufacturing specifically includes:
manufacturing an inner layer circuit on a copper foil of the copper-clad plate according to design requirements to obtain a plurality of inner layer substrates;
semi-curing and pressing the inner layer substrates to obtain a copper foil pressed body;
punching a positioning hole on the copper foil pressed body, and then respectively carrying out compression molding, exposure, development and etching treatment on the copper foil pressed body to obtain a position to be processed;
removing the glue from the position to be processed, and then using CO to form a window area 2 And (5) processing the groove to the required design depth by a laser light or mechanical mode to obtain the laser groove.
In step 2, the manufacturing of the vertical conductive line specifically includes:
carrying out copper deposition electroplating treatment on the daughter board with the laser groove obtained in the step 1 to obtain a daughter board after copper deposition electroplating;
carrying out tinning treatment on the copper-plated daughter board, removing a tin surface which does not need to be conducted by laser to obtain a copper body with the bottom of the tin surface removed, and then removing the exposed copper body by alkaline etching to obtain a copper-clad plate of the vertical lead circuit;
further, the laser is UV laser.
In step 3, the further processing according to the design requirement specifically includes:
carrying out browning and baking on the copper-clad plate of the vertical lead circuit obtained in the step 2; then, plugging the laser groove or the burnt resin area with resin;
further drilling holes on the vertical lead circuit copper-clad plate after hole plugging, and carrying out copper deposition electroplating treatment;
and sticking a photosensitive dry film to the copper-clad plate of the vertical lead circuit after copper deposition electroplating treatment, and respectively carrying out exposure, development and etching treatment to obtain the outer layer circuit.
Scanning the outer layer circuit according to the AOI, and judging whether the outer layer circuit has an open/short circuit or not;
printing a layer of green oil on the outer layer circuit;
and carrying out surface treatment on the outer layer circuit according to design requirements.
Example 3
Referring to fig. 4, on the basis of example 2, the following alternatives are presented in the examples of the present invention:
the embodiment of the invention introduces a processing method of a high-speed signal micro-structure PCB, which comprises the following steps:
step 1: the same as in example 2, step 1;
step 2: manufacturing a vertical conductive line;
further, the manufacturing of the vertical conductive line specifically includes:
carrying out copper deposition electroplating treatment on the daughter board with the laser groove obtained in the step 1 to obtain a daughter board after copper deposition electroplating;
filling a processing area of the copper-deposited electroplated daughter board with a wet film, covering a board surface with a dry film, and etching an area which does not need to be conducted by laser, or exposing a position which needs to be reserved with a copper body, developing the position which does not need to be reserved with the copper body, and then removing the exposed copper body by acid etching;
finally, removing the wet film and the dry film;
further, the laser adopts CO 2 And (5) laser.
Step 3: the procedure is as in step 3 of example 2.
Example 4
Referring to fig. 5, on the basis of example 3, there is a second alternative to the embodiment of the present invention:
the embodiment of the invention introduces a processing method of a high-speed signal micro-structure PCB, which comprises the following steps:
step 1: the same as in example 2, step 1;
step 2: manufacturing a vertical conductive line;
further, the manufacturing of the vertical conductive line specifically includes:
carrying out copper deposition electroplating treatment on the daughter board with the laser groove obtained in the step 1 to obtain a daughter board after copper deposition electroplating;
and filling resin in the laser groove of the copper-plated daughter board, performing dry film pressing treatment, performing full-board exposure, performing laser removal of the resin on the surfaces of the dry film areas and the copper bodies which do not need to be conducted at the positions, and removing the exposed copper bodies by acid etching.
Finally, removing the dry film;
the dry film thickness used in the press-drying film treatment is set according to the specific situation, and in the embodiment of the invention, the set dry film thickness is 1.5mil.
Step 3: the procedure is as in step 3 of example 2.
It should be noted that, in the above embodiment, referring to fig. 7, the vertical conductive line in the embodiment of the present invention specifically includes: two groove walls of the laser groove can be processed into vertical lines on one side, continuous groove walls are arranged on the other side, and the lines can be surrounded by the continuous groove walls, so that the laser groove can play a good shielding role when being applied to high-speed lines.
In summary, the embodiment of the invention breaks through the traditional PCB drilling process flow by providing the processing method of the high-speed signal micro-structure PCB, adopts the laser and etching process to generate the wires in the vertical direction, realizes the conduction of the inner layer and the outer layer, and reduces the production cost by reducing the occupied area of the holes.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are all within the protection of the present invention.
Claims (9)
1. The processing method of the PCB with the high-speed signal microstructure is characterized by comprising the following steps of:
a laser groove is formed on the copper-clad plate by laser to obtain a sub-plate with the laser groove,
carrying out copper deposition electroplating treatment on the daughter board with the laser groove to obtain a daughter board subjected to copper deposition electroplating;
and (3) reprocessing the copper-plated sub-board according to design requirements, and then carrying out laser and etching treatment to obtain the copper-clad plate of the vertical lead circuit.
2. The method for processing the high-speed signal microstructure PCB according to claim 1, wherein the method further comprises the steps of:
carrying out tinning treatment on the copper-plated daughter board, removing a tin surface which does not need to be conducted by laser to obtain a copper body with the bottom of the tin surface removed, and then removing the exposed copper body by alkaline etching;
or filling the processing area of the sub-board after copper deposition electroplating with a wet film, covering the board surface with a dry film, and etching an area which does not need to be conducted by laser, or exposing the position which needs to be reserved with a copper body, developing the position which does not need to be reserved with the copper body, and then removing the exposed copper body by acid etching;
or, filling resin in the laser groove of the sub-board after copper deposition electroplating, then carrying out dry film pressing treatment and full-board exposure, and carrying out laser removal on the resin on the surfaces of the dry film areas and the copper bodies which do not need to be conducted at the positions, and removing the exposed copper bodies by acid etching.
3. The method of claim 2, wherein the wet film and dry film are removed after the exposing process is performed to the copper body position to be preserved, the developing process is performed to the copper body position not to be preserved, and then the exposed copper body is removed by acid etching.
4. The method for processing the high-speed signal microstructure PCB according to claim 1, wherein the method comprises the steps of:
manufacturing an inner layer circuit on a copper foil of the copper-clad plate according to design requirements to obtain a plurality of inner layer substrates;
semi-curing and pressing the inner layer substrates to obtain a copper foil pressed body;
punching a positioning hole on the copper foil pressed body, and then respectively performing film pressing, exposure, development and etching treatment on the copper foil pressed body to obtain a position to be processed;
and removing the glue from the position to be processed, and processing the window area to the required design depth in a laser or mechanical mode to obtain the laser groove.
5. The method for processing the high-speed signal microstructure PCB of claim 1, further comprising, after the vertical wire circuit copper clad laminate is obtained:
carrying out resin plugging on the laser groove or the burnt resin area in the vertical lead circuit copper-clad plate;
further drilling holes on the vertical lead circuit copper-clad plate after hole plugging, and carrying out copper deposition electroplating treatment;
manufacturing an outer layer circuit for the copper-clad plate of the vertical lead circuit subjected to copper precipitation electroplating treatment;
scanning the outer layer circuit according to the AOI, and judging whether the outer layer circuit has an open/short circuit or not;
printing a layer of green oil on the outer layer circuit;
and carrying out surface treatment on the outer layer circuit according to design requirements.
6. The method for processing the high-speed signal microstructure PCB of claim 5, wherein the manufacturing the outer layer circuit of the copper clad laminate of the vertical wire circuit after the copper deposition plating process comprises:
and sticking a photosensitive dry film to the copper-clad plate of the vertical lead circuit after copper deposition electroplating treatment, and respectively carrying out exposure, development and etching treatment to obtain the outer layer circuit.
7. The method of claim 5, further comprising browning and baking the vertical wire circuit copper-clad plate before resin plugging the laser grooves or burned-out resin areas in the vertical wire circuit copper-clad plate.
8. The method for processing the high-speed signal microstructure PCB according to claim 2, wherein the laser is a UV laser, and the tin surface at the position where conduction is not needed is removed by laser.
9. The method of claim 4, wherein the window area is laser or mechanically processedMechanically processing to required design depth, wherein the laser adopts CO 2 And (5) laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311273451.8A CN117320320A (en) | 2023-09-28 | 2023-09-28 | Processing method of high-speed signal micro-structure PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311273451.8A CN117320320A (en) | 2023-09-28 | 2023-09-28 | Processing method of high-speed signal micro-structure PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117320320A true CN117320320A (en) | 2023-12-29 |
Family
ID=89284382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311273451.8A Pending CN117320320A (en) | 2023-09-28 | 2023-09-28 | Processing method of high-speed signal micro-structure PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117320320A (en) |
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2023
- 2023-09-28 CN CN202311273451.8A patent/CN117320320A/en active Pending
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