KR20100003026A - Method for creating through hole in printed circuit board - Google Patents

Method for creating through hole in printed circuit board Download PDF

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Publication number
KR20100003026A
KR20100003026A KR1020080063118A KR20080063118A KR20100003026A KR 20100003026 A KR20100003026 A KR 20100003026A KR 1020080063118 A KR1020080063118 A KR 1020080063118A KR 20080063118 A KR20080063118 A KR 20080063118A KR 20100003026 A KR20100003026 A KR 20100003026A
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South Korea
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copper foil
insulator
hole
copper
circuit board
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KR1020080063118A
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Korean (ko)
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KR100964150B1 (en
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신승호
오춘환
정창보
전명길
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주식회사 심텍
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE: A method for forming a through hole of a printed circuit board is provided to prevent break of a bit regardless of a diameter of a through hole using a laser drill process. CONSTITUTION: A CCL(Copper Clad Laminate)(100) is formed by stacking a copper foil(112) on both sides of an insulator(110). A part of one side of the insulator is removed using a laser mask. The insulator and a part of the copper foil in the other side of the insulator are removed by the laser drill process. The copper foil remaining on the other side of the insulator is removed by half etching. The copper foil on both sides of the insulator is electrically conducted with the electroless copper plating and the electrolytic copper plating.

Description

인쇄회로기판의 도통홀 형성방법{Method for creating through hole in Printed Circuit Board}Method for creating through hole in printed circuit board

본 발명은 인쇄회로기판의 도통홀 형성방법에 관한 것으로서, 보다 상세하게는 레이저드릴가공을 통해 우수한 양산성 및 신뢰성을 갖는 인쇄회로기판의 도통홀을 형성하는 방법에 관한 것이다.The present invention relates to a method of forming a through hole of a printed circuit board, and more particularly, to a method of forming a through hole of a printed circuit board having excellent mass productivity and reliability through laser drilling.

일반적으로 인쇄회로기판에는 절연기판의 한쪽면에만 배선을 형성한 단면 PCB, 양쪽면에 배선을 형성한 양면PCB 및 다층으로 배선한 MLB(다층 인쇄회로기판; Multi Layered Board) 가 있다.In general, a printed circuit board includes a single-sided PCB having wiring formed only on one side of an insulated substrate, a double-sided PCB having wiring formed on both sides, and a multi-layered multi-layered printed circuit board (MLB).

과거에는 부품 소자들이 단순하고 회로패턴도 간단하여 단면 PCB를 사용하였으나, 최근에는 회로의 복잡도 증가하고 고밀도 및 소형화 회로에 대한 요구가 증가하여 대부분 양면PCB 또는 MLB를 사용하는 것이 일반적이다.In the past, single-sided PCBs were used because of simple components and simple circuit patterns. However, in recent years, due to increased complexity of circuits and increasing demand for high density and miniaturized circuits, it is common to use double-sided PCBs or MLBs.

이러한 양면PCB의 제조방식은 먼저, 동박이 적층되어 있는 동박적층필름을 일정 작업 사이즈로 재단하고, 이를 고가의 NC드릴을 사용하여 기계적 드릴작업을 통하여 도통홀(Through Hole)을 만들고, 이후 기존의 로봇 방식으로 무전해 도금 및 전해 도금 공정을 거쳐 도통홀에 도전성을 부여함으로써, 상하면을 전기적으로 연결신 후 드라이필름 라미네이팅, 노광, 형상 및 에칭 공정을 통하여 회로 패턴을 형성하는 방식이었다.In the manufacturing method of the double-sided PCB, first, the copper foil laminated film on which copper foil is laminated is cut to a certain working size, and through this, an expensive NC drill is used to make a through hole through mechanical drilling, and then By providing electroconductivity to the through hole through the electroless plating and electrolytic plating process by the robot method, the circuit pattern was formed by electrically connecting the upper and lower surfaces and then performing dry film laminating, exposure, shape, and etching processes.

종래의 인쇄회로기판의 제조공정에 의하면, 도통홀의 형성시 기계적인 드릴방법을 사용함에 따라 홀의 직경이 100um이하로 작아지는 경우 드릴 비트의 강도문제로 그 비용이 고가이고, 비트 부러짐으로 인한 불량이 많이 발생하는 문제가 있었다.According to the conventional manufacturing process of the printed circuit board, when the diameter of the hole is reduced to less than 100um by using a mechanical drill method when forming the through-hole, the cost is expensive due to the strength of the drill bit, and the defect due to the broken bit There was a problem that occurred a lot.

이로 인해 비용 상승 및 불량 발생률이 상승하는 문제점을 지닌다.As a result, there is a problem that the cost increase and the failure rate rises.

따라서, 이를 개선할 필요성이 요청된다.Therefore, there is a need for improvement.

본 발명은 상기와 같은 필요성에 의해 창출된 것으로서, 인쇄회로기판의 도통홀 형성 시 레이저 드릴을 사용하고, 하부 동박의 일부가 제거되게 한 후 에칭에 의해 도통홀을 형성하므로 미세 비트의 부러짐을 방지하여, 비용상승 및 불량발생을 줄이는 인쇄회로기판의 도통홀 형성방법을 제공하는데 그 목적이 있다.The present invention is created by the necessity as described above, by using a laser drill in the formation of the through-hole of the printed circuit board, to form a through-hole by etching after removing a portion of the lower copper foil to prevent the break of the fine bit. Accordingly, an object of the present invention is to provide a method for forming a through hole of a printed circuit board, which reduces cost and defects.

본 발명에 따른 인쇄회로기판의 도통홀 형성방법은 절연체의 양면에 동박이 적층되어 있는 동박적층필름을 마련하고, 레이저 마스크를 통해 상기 동박적층필름의 일면에 동박의 일부 영역을 제거해 주는 단계와, 상기 제거된 동박을 통해 노출되는 절연체와 상기 절연체와 접해 있는 절연체의 타면에 형성된 동박의 일부를 레이저 드릴 가공을 통해 제거해 주는 단계와, 상기 절연체가 제거된 일부영역에 잔류하는 동박을 하프 에칭을 통해 제거해주는 단계 및 상기 단계를 거친 동박적층필름에 무전해 도금을 실시하여 일면의 동박과 타면의 동박을 전기적으로 통전시켜주는 단계를 포함하여 이루어진다.The conductive hole forming method of the printed circuit board according to the present invention comprises the steps of providing a copper foil laminated film in which copper foil is laminated on both sides of the insulator, and removing a portion of copper foil on one surface of the copper foil laminated film through a laser mask; Removing a portion of the copper foil formed on the insulator exposed through the removed copper foil and the other surface of the insulator in contact with the insulator by laser drilling, and half-etching the copper foil remaining in the partial region from which the insulator is removed. And electroless plating the copper foil laminated film which has been subjected to the above step and electrically conducting the copper foil on one side and the copper foil on the other side.

그리고, 상기 레이저 드릴 가공에 의해 제거된 부위는 역테이퍼 형상을 갖는 것을 특징으로 한다.And the part removed by the said laser drill process is characterized by having a reverse taper shape.

또한, 상기 하프 에칭에 의해 상기 절연체의 타면 일부영역에 잔류하는 동박 제거시 절연체의 일부도 더 제거되는 것을 특징으로 한다.In addition, a part of the insulator may be further removed by removing the copper foil remaining in the partial region of the other surface of the insulator by the half etching.

이상에서 설명한 바와 같이, 본 발명에 따른 인쇄회로기판의 도통홀 형성방법은 종래의 기계적 드릴을 사용하지 않고 레이저드릴에 의해 도통홀을 형성함에 따라 도통홀의 직경이 작아지더라도 드릴 비트의 강도 문제로 그 비용이 증가하는 문제점을 해소하고, 비트 부러짐으로 인한 불량률을 줄이는 효과가 있다.As described above, the method of forming the through-hole of the printed circuit board according to the present invention is a problem of strength of the drill bit even if the diameter of the through-hole is reduced as the through-hole is formed by a laser drill without using a conventional mechanical drill. There is an effect to solve the problem that the cost is increased, and reduce the defective rate due to broken bits.

또한, 기존 설치 장비인 레이저 드릴을 그대로 사용하고 별도의 추가적인 설비가 요구되지 않으며, 기계적인 드릴이 아닌 레이저 드릴을 사용하므로 홀 위치 공차를 2배 가량 개선할 수 있는 효과가 있다.In addition, the laser drill, which is an existing installation equipment, is used as it is, and no additional facility is required, and the laser drill is used instead of the mechanical drill, thereby improving the hole position tolerance by about 2 times.

이하, 첨부된 도면들을 참조하여 본 발명에 따른 인쇄회로기판의 도통홀 형성방법의 바람직한 일 실시예를 설명한다. 이 과정에서 도면에 도시된 선들의 두께나 구성요소의 크기 등은 설명의 명료성과 편의상 과장되게 도시되어 있을 수 있다. 또한, 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있다. 그러므로, 이러한 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, a preferred embodiment of a method of forming a through hole of a printed circuit board according to the present invention will be described with reference to the accompanying drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or convention of a user or an operator. Therefore, definitions of these terms should be made based on the contents throughout the specification.

도 1a~1e은 본 발명에 따른 인쇄회로기판의 도통홀 형성방법을 보인 도면이고, 도 2는 본 발명에 따른 인쇄회로기판의 도통홀 형성방법을 나타낸 순서도이다.1A to 1E are views illustrating a method of forming a through hole of a printed circuit board according to the present invention, and FIG. 2 is a flowchart illustrating a method of forming a through hole in a printed circuit board according to the present invention.

도 1a는 가공되기 전의 동박적층필름(CCL; Copper Clad Laminate)의 단면도이다.1A is a cross-sectional view of a copper clad laminate (CCL) before processing.

일반적으로 동박적층필름(110)이라 함은 인쇄회로기판의 제조되는 원판으로서 절연체(110)에 얇게 구리를 입힌 얇은 적층판을 말한다.In general, the copper-clad laminate film 110 refers to a thin laminated plate coated with a thin copper on the insulator 110 as an original plate of a printed circuit board.

동박적층필름의 종류에는 그 용도에 따라, 유리/에폭시 동박적층필름, 내열수지 동박적층필름, 종이/페놀 동박적층필름, 고주파용 동박적층필름, 플렉시블 동박적층필름(폴리이미드 필름) 및 복합 동박적층필름 등 여러 가지가 있으나, 양면PCB 및 다층PCB 제작에는 주로 유리/에폭시 동박적층필름이 사용된다.Types of copper foil laminated films include glass / epoxy copper laminated films, heat-resistant resin copper laminated films, paper / phenolic copper laminated films, high frequency copper laminated films, flexible copper laminated films (polyimide films), and composite copper laminated films depending on their use. Although there are various kinds of films, glass / epoxy copper clad laminated film is mainly used for manufacturing double-sided PCB and multilayer PCB.

유리/에폭시 동박적층필름은 유리 섬유에 에폭시 수지(Epoxy Resin:수지와 경화제의 배합물)를 침투시킨 보강기재와 동박으로 만들어진다.Glass / epoxy copper clad laminated film is made of copper foil and reinforcement base that infiltrates epoxy resin (Epoxy Resin) in glass fiber.

유리/에폭시 동박적층필름은 보강기재에 따라 구분되는데, 일반적으로 FR-1~FR-5와 같이 NEMA(National Electrical Manufacturers Association: 국제전기공업협회)에서 정한 규격에 의해 보강기재와 내열성에 따라 등급이 정해져 있다. 이들 등급 중에서 FR-4가 가장 많이 사용되고 있으나, 최근에는 수지의 Tg(유리전이 온도)특성 등을 향상시킨 FR-5의 수요도 증가하고 있다.Glass / epoxy copper clad laminated films are classified according to reinforcement materials. Generally, the grades are graded according to reinforcement materials and heat resistance according to the standards set by the National Electrical Manufacturers Association (NEMA) such as FR-1 ~ FR-5. It is decided. Among the grades, FR-4 is the most widely used, but in recent years, the demand for FR-5, which improves the Tg (glass transition temperature) characteristics of resins, is also increasing.

도 1b에서 나타난 바와 같이 동박적층필름(100)에 레이저 마스크를 통해 동박적층필름(100)의 일면에 형성된 동박(112)의 일부 영역을 제거한다(S10).As shown in FIG. 1B, a portion of the copper foil 112 formed on one surface of the copper foil laminated film 100 is removed through the laser mask on the copper foil laminated film 100 (S10).

그리고, 도 1c에서 나타난 바와 같이 제거된 동박(112) 즉 일측의 동박(112)이 제거되어 노출되는 절연체(110)에 레이저 드릴에 의해 절연체(110)를 제거한다(S20).Then, as shown in FIG. 1C, the insulator 110 is removed by a laser drill on the insulator 110 that is removed by exposing the removed copper foil 112, that is, one side of the copper foil 112 (S20).

이때, 기존과 달리 절연체(110)와 접해 있는 절연체(110)의 타면에 형성된 동박(112)의 일부가 제거되도록 과다가공을 하는 것이 바람직하다.At this time, unlike the conventional one, it is preferable to overprocess so that a part of the copper foil 112 formed on the other surface of the insulator 110 in contact with the insulator 110 is removed.

동박(112)의 일부까지 제거되도록 가공하기 때문에 하프 에칭 단계에서 반대면의 동박(112)이 완전히 제거되고 레진 잔사까지도 제거될 수 있다.Since a part of the copper foil 112 is processed to be removed, the copper foil 112 on the opposite side may be completely removed in the half etching step, and even the resin residue may be removed.

그리고, 레이저 드릴 가공에 의해 동박적층필름(100)의 도통홀(120) 형상은 역테이퍼 형성을 지니게 된다.In addition, the shape of the through-hole 120 of the copper-clad laminated film 100 by the laser drilling process has a reverse taper formation.

CO2 레이저의 경우 레이저 빔의 에너지가 중심부에 집중된 가우시안 분포를 갖게 되므로 중심부의 레진이 주변부보다 빠르게 제거되어 결과적인 홀 형상이 역테이퍼 형상을 갖게 된다.In the case of CO2 lasers, the energy of the laser beam has a Gaussian distribution centered on the center, so that the resin at the center is removed faster than the periphery, resulting in a reverse taper shape.

따라서, 역테이퍼 형상의 홀의 경우 동도금시 도금액의 흐름이 원할하여 도 금 신뢰성이 일반 원통형의 홀보다 향상되는 장점이 있다.Accordingly, in the case of the reverse tapered hole, the plating solution flows smoothly during copper plating, so that the plating reliability is improved than that of the general cylindrical hole.

레이저 드릴 가공에 의해 도통홀(120)을 가공할 때는 정밀한 가공을 요하므로 CO2 레이저를 이용하는 것이 바람직하다.When machining the through hole 120 by laser drilling, precise machining is required, so CO 2 It is preferable to use a laser.

CO2 레이저를 이용함으로써, 기계적 드릴링에 비해서 미세한 도통홀의 가공도 가능하며, 홀의 위치 공차를 개선할 수 있다. CO 2 By using a laser, it is possible to process fine conductive holes as compared to mechanical drilling, and improve the positional tolerance of the holes.

CO2 레이저 가공 조건은 원자재 및 홀 직경 등과 같은 요소에 의해 변경될 수 있다.CO 2 Laser processing conditions can be changed by factors such as raw materials and hole diameters.

그리고, 도 1d에서 도시한 바와 같이 레이저 드릴 가공에 의해 과다가공된 타면의 동박(112)은 하프에칭을 통해 제거된다(S30).Then, as shown in FIG. 1D, the copper foil 112 of the other surface overprocessed by laser drilling is removed through half etching (S30).

하프에칭에 의해 도통홀(120)을 형성하고자 하는 일부영역에 잔류하는 동박(112)이 제거됨과 동시에 일부영역 외의 동박(112)도 제거된 분량만큼 얇아진다.Half-etching removes the copper foil 112 remaining in the partial region where the conductive hole 120 is to be formed, and at the same time, the copper foil 112 outside the partial region is also thinned by the removed amount.

이는 에칭액에 동박적층필름(100)의 전면을 담궈줌으로써, 동박(112)의 일정높이가 제거됨으로써, 레이저 드릴 가공 시 일부영역에 잔류하던 동박(112)이 제거되어 도통홀(120)을 형성하게 되는 것이다.This is soaking the entire surface of the copper-clad laminated film 100 in the etching solution, the predetermined height of the copper foil 112 is removed, thereby removing the copper foil 112 remaining in a partial region during the laser drilling process to form the through hole 120. Will be.

하프에칭(Half Etching)시 인쇄회로기판의 상부와 하부를 뒤집어서 도통홀(120)의 열린 부분이 아래쪽으로 향하도록 가공하여, 설비의 아래쪽으로부터 분출되는 에칭액이 효과적으로 홀의 잔류 동박(112) 부분을 제거할 수 있도록 한다.During half etching, the upper and lower parts of the printed circuit board are turned upside down so that the open part of the through hole 120 is directed downward, so that the etching liquid ejected from the bottom of the facility effectively removes the remaining copper foil 112 part of the hole. Do it.

에칭액은 일반 에칭에서 사용하는 것과 유사하며 다만, 공정조건에 따라 액농도 및 그 밖의 액성분에 차이를 두기도 한다.The etching solution is similar to that used in general etching, but the liquid concentration and other liquid components may be different depending on the process conditions.

에칭량은 레이저에 의하여 과다 가공되고 남은 동박(112)이 완전히 제거될 수 있을 정도의 높이로 하는데, 통상 원자재의 12um 동박을 기준으로 할 경우 4.5~6um의 두께가 될 정도까지 가공한다.The etching amount is such that the remaining copper foil 112 is over-processed by a laser so that the remaining copper foil 112 can be completely removed. In general, the etching amount is processed to a thickness of 4.5 to 6 um based on the 12 um copper foil of the raw material.

이때, 도통홀(120)의 내측면의 절연체(110) 일부도 더 제거된다.At this time, a part of the insulator 110 on the inner surface of the through hole 120 is further removed.

이후, 상기와 같이 동박적층필름(100)에 도통홀(120)을 형성되면, 동박적층필름(100)에 무전해 동도금 및 전해 동도금을 실시하여 절연체의 일면의 동박과 타면의 동박이 전기적으로 통전되도록 한다(S40).Then, when the through-hole 120 is formed in the copper-clad laminated film 100 as described above, the copper foil laminated film 100 is subjected to electroless copper plating and electrolytic copper plating to electrically conduct the copper foil on one surface of the insulator and the copper foil on the other surface. To be made (S40).

상기와 같은 단계를 순차적으로 수행함으로써, 인쇄회로기판에 도통홀(120)을 형성할 수 있는 것이다.By sequentially performing the above steps, it is possible to form the through hole 120 in the printed circuit board.

본 발명은 도면에 도시된 실시예를 참고로 하여 설명되었으나, 이는 예시적인 것에 불과하며, 당해 기술이 속하는 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art to which the art belongs can make various modifications and other equivalent embodiments therefrom. Will understand.

따라서, 본 발명의 진정한 기술적 보호범위는 특허청구범위에 의해서 정하여져야 할 것이다.Therefore, the true technical protection scope of the present invention will be defined by the claims.

도 1a~1e은 본 발명에 따른 인쇄회로기판의 도통홀 형성방법을 보인 도면.1A to 1E illustrate a method of forming a through hole of a printed circuit board according to the present invention.

도 2는 본 발명에 따른 인쇄회로기판의 도통홀 형성방법을 나타낸 순서도.2 is a flow chart showing a method for forming a through hole of a printed circuit board according to the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

100 : 동박적층필름 110 : 절연체100: copper foil laminated film 110: insulator

112 : 동박 120 : 도통홀112: copper foil 120: through hole

130 : 동도금130: copper plating

Claims (3)

절연체의 양면에 동박이 적층되어 있는 동박적층필름을 마련하고, 레이저 마스크를 통해 상기 동박적층필름의 일면에 동박의 일부 영역을 제거해 주는 단계;Providing a copper foil laminated film having copper foil laminated on both sides of the insulator, and removing a portion of the copper foil on one surface of the copper foil laminated film through a laser mask; 상기 제거된 동박을 통해 노출되는 절연체와 상기 절연체와 접해 있는 절연체의 타면에 형성된 동박의 일부를 레이저 드릴 가공을 통해 제거해 주는 단계;Removing a portion of the copper foil formed on the insulator exposed through the removed copper foil and the other surface of the insulator in contact with the insulator by laser drilling; 상기 절연체가 제거된 일부영역에 잔류하는 동박을 하프 에칭을 통해 제거해주는 단계; 및Removing the copper foil remaining in the partial region from which the insulator is removed through half etching; And 상기 단계를 거친 동박적층필름에 무전해 동도금 및 전해 동도금을 실시하여 일면의 동박과 타면의 동박을 전기적으로 통전시켜주는 단계를 포함하는 인쇄회로기판의 도통홀 형성방법. And conducting electroless copper plating and electrolytic copper plating on the copper foil laminated film having the above steps to electrically conduct copper foil on one surface and copper foil on the other surface. 제 1항에 있어서,The method of claim 1, 상기 레이저 드릴 가공에 의해 제거된 부위는 역테이퍼 형상을 갖는 것을 특징으로 하는 인쇄회로기판의 도통홀 형성방법.And a portion removed by the laser drill process has a reverse taper shape. 제 1항에 있어서,The method of claim 1, 상기 하프 에칭에 의해 상기 절연체의 타면 일부영역에 잔류하는 동박 제거 시 절연체의 일부도 더 제거되는 것을 특징으로 하는 인쇄회로기판의 도통홀 형성방법.And a part of the insulator is further removed when the copper foil remaining in the partial area of the other surface of the insulator is removed by the half etching.
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