CN100518444C - Method for forming through-hole that utilizes lazer drill - Google Patents
Method for forming through-hole that utilizes lazer drill Download PDFInfo
- Publication number
- CN100518444C CN100518444C CNB2006101397076A CN200610139707A CN100518444C CN 100518444 C CN100518444 C CN 100518444C CN B2006101397076 A CNB2006101397076 A CN B2006101397076A CN 200610139707 A CN200610139707 A CN 200610139707A CN 100518444 C CN100518444 C CN 100518444C
- Authority
- CN
- China
- Prior art keywords
- via hole
- circuit
- drilling machine
- laser drilling
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Abstract
The invention provides a method for forming via holes by using a laser driller, the method comprises: (a) preparing to form a first circuit substrate having circuits on two sides of an insulative layer; (b) preparing to drill a plurality of prepregs having holes by automatically drilling on positions at which via holes are to be formed; (c) cumulating the prepregs on the two sides on which the first circuit substrate is formed; and (d) machining the via hole postions filled with resins flowed out from the prepregs in the step (c) by the laser driller so as to form the via holes.
Description
Technical field
The present invention relates to a kind of via hole (via hole) formation method of utilizing laser drilling machine, in particular, the present invention relates to a kind of on the two sides that is formed with the circuit substrate circuit a plurality of prepregs of lamination, afterwards, utilize laser drilling machine to the hole site of crossing of being filled by the resin that flows out from prepreg being processed when the lamination, thereby form the method for via hole, wherein, a plurality of prepregs are drilled with the hole in the position of via hole to be formed by machine drilling.
Background technology
In recent years, along with electronic industry digitlization and networking rapidly, require electronic equipment to realize miniaturization, lightness, thin typeization and high performance, electronic equipment part has been realized highly integrated and ultra-thinization too thus.
Thus, printed circuit board (PCB)s highly integrated and ultra-thinization parts are installed, that is, slimming becomes problem.For head it off, be necessary to increase the design freedom of substrate circuit,, attempt by adopting minitype channel, lamination new technologies and methods such as (build up) to solve for this reason.
Particularly, along with the raising gradually of the integrated level of semiconductor element, as corresponding to the highly integrated and small method that spacing requires that is provided with, miniature via hole is gazed at by the people.
Especially, (multi layer board: multilayer circuit board) substrate is made of the through hole (through hole) via whole layer MLB, but, lamination printed circuit board (PCB) (PCB) further requires highdensity distribution, therefore, blind (blind) via hole that can carry out the conducting of interlayer selectivity is gazed at by the people.
Now, form that the method for blind via hole of above-mentioned printed circuit board (PCB) is known mechanical boring method, plasma etching method, port channel (port via) method and a laser method etc.
And, above-mentioned laser method is the present method of the blind via hole that is used to form printed circuit board (PCB) commonly used the most, the known method that the laser drill of utilizing excite state atom (excimer), Nd:YAG and C02 type is arranged, and be applicable to usually working depth below the 150 μ m, the miniature blind via hole of diameter below 250 μ m.
Figure 1A to Fig. 1 D is the embodiment who utilizes laser drill formation printed circuit board (PCB) via hole according to prior art, is shown schematically in its forming process.
Shown in Figure 1A to Fig. 1 D, the method for utilizing existing laser drill to form the printed circuit board (PCB) via hole comprises laser drill manufacturing procedure-scrubbing operation and copper facing operation-formation circuit operation.
That is to say,, on the Copper Foil laminated board 101 shown in Figure 1A, at first get out the two-layer via hole 102 of perforation shown in Figure 1B in order to form the via hole of printed circuit board (PCB).
In addition, shown in Fig. 1 C, carry out the scrubbing operation, and utilize conductor such as copper that the inner edge in hole is electroplated, form copper plate 103, and make it have conductivity.Afterwards, form circuit pattern, thereby form printed circuit board (PCB).
At this moment, in above-mentioned Copper Foil laminated board, in the past, to use RCC (resincoating copper) material of resin as insulating barrier, but, have the mechanical strength deficiency, and vary with temperature the change in size (coefficient of thermal expansion) that causes 10 times problem greater than metal, thereby in order to address these problems, prepreg (prepreg) product of use glass fibre as reinforcement material appearred adopting successively now in insulating barrier.
Owing to use above-mentioned reinforcement material, (for example, X, Y direction) intensity reduces the change in size that comes from temperature so strengthened the direction in length and breadth of resin.
But, when using laser drill to form via hole, adopt the Copper Foil laminated board of above-mentioned prepreg to compare, while the glass fibre that will burn is processed with the existing RCC product that does not adopt compensative material, thereby increased the difficulty of processing, and had the problem of long processing time.
In addition, while because the glass fibre that burns is processed, and the side surface of the via hole of formation is inhomogeneous, thereby the poor plating problem takes place.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of via hole formation method that process time can significantly be shortened, utilize laser drilling machine, its method is: the prepreg that is drilled with the hole in the two sides lamination that is formed with the circuit substrate circuit in the position of via hole to be formed by machine drilling, in above-mentioned lamination step, fill the position that is drilled with the hole by machine drilling by the resin that flows out from prepreg, the hole site excessively that utilizes the laser drill machine work to be filled by resin forms via hole.
And, another object of the present invention is to provide a kind of via hole formation method of utilizing laser drilling machine, it utilizes mechanical drilling machine to remove in the glass fibre of prepreg in advance, utilize laser drilling machine that the resin that is filled in this is processed, thereby formation via hole, because hole shape is even, has reduced the poor plating phenomenon.
To achieve these goals, the present invention utilizes the method for laser drilling machine formation via hole to comprise: first circuit substrate of (a) preparing to be formed with on the two sides of insulating barrier circuit; (b) preparation is drilled with a plurality of prepregs in hole by machine drilling in the position of via hole to be formed; (c) at the above-mentioned above-mentioned prepreg of two sides lamination that is formed with the first circuit substrate circuit; And (d) when carrying out above-mentioned (c) step, cross the hole site what the resin that flows out from prepreg was filled, utilize laser drill machine work via hole.
According to foregoing description, the present invention is owing to be drilled with the prepreg in hole by machine drilling in the position of via hole to be formed in the two sides lamination that is formed with the circuit substrate circuit, when carrying out this lamination step, flow out resin from prepreg, and fill the position that is drilled with the hole by machine drilling, utilize laser drilling machine that via hole processing is carried out in the hole site of crossing of being filled by resin, can significantly shorten process time thus.
In addition,, utilize mechanical drilling machine to remove the glass fibre of prepreg in advance, utilize laser drilling machine to process, thereby form via hole, can guarantee the homogenizing in hole thus, reduced the poor plating phenomenon the resin that is filled in this according to the present invention.
Description of drawings
Figure 1A to Fig. 1 D is the flow chart according to the formation method of the printed circuit board (PCB) via hole that utilizes the laser drill machine work of prior art.
Fig. 2 A to Fig. 2 J is the flow chart that utilizes the via hole formation method of laser drilling machine according to an embodiment of the invention.
Fig. 3 is the shape figure of the prepreg that uses in one embodiment of the invention.
Embodiment
Followingly specify the preferred embodiments of the present invention with reference to accompanying drawing.
Fig. 2 A to Fig. 2 J is the flow chart that utilizes the via hole formation method of laser drilling machine according to an embodiment of the invention.
At first, shown in Fig. 2 A, prepare to be formed with first circuit substrate 200 of circuit 202 on the two sides of insulating barrier 201.At this moment, above-mentioned insulating barrier 201 can use any one in prepreg or the resin, and foregoing circuit 202 uses common electrolytic copper foil.
Secondly, shown in Fig. 2 B, prepare to be drilled with a plurality of prepregs 210 in hole by machine drilling in the position of via hole 211 to be formed.Above-mentioned prepreg 210 is osmotic heat hardening resins in the basic material of glass fibre etc., be hardened to the laminar raw material (with reference to Fig. 3) of B stage (the B stage is meant the semi-harden state of resin), use as the basic raw material of Copper Foil laminated board and the interlayer bonding agent of multi-layer PCB.
At this moment, in order when forming via hole, to remove glass fibre 212 neatly, carry out machine drilling (for example, utilizing the boring of CNC drilling machine) in the position of via hole 211 to be formed.
Shown in Fig. 2 C, on the two sides of the circuit 202 that is formed with above-mentioned first circuit substrate 200, above-mentioned prepreg 210 is carried out lamination.Make at the above-mentioned prepreg 210 of the position of via hole 211 to be formed boring and the via hole 211 of first circuit substrate 200 and form position consistency, and pressurize.
Above-mentioned pressurization is the hot pressing of pressurizeing when externally heating.At this moment, because the heat energy that above-mentioned operation produced makes the thermmohardening layer in above-mentioned B stage softening, and because softening, the resin flow of prepreg 210 forms the position to the via hole 211 that carried out machine drilling, thereby via hole 211 is filled.
Shown in Fig. 2 D, have in lamination on first circuit substrate 200 of above-mentioned prepreg 210, form through hole 220 by machine drilling.Above-mentioned through hole 220 preferably forms by machine drilling (for example, utilizing the boring of CNC drilling machine).
Shown in Fig. 2 E, form above-mentioned through hole 220 after, utilize laser drilling machine to form via hole 211 in the position of via hole 211, the position of this via hole is filled by the resin that flows out from prepreg 210.Above-mentioned laser drilling machine (for example can use existing all laser drilling machines, the laser drilling machines of excite state atom, Nd:YAG and CO2 type etc.), and with the surface from the position of via hole 211 of being filled by resin to be formed is that the degree of depth is processed to the position that is formed with circuit 202.
Shown in Fig. 2 F, form electroless plating copper layer 230 on the whole surface of the circuit substrate that is formed with above-mentioned through hole 220 and via hole 211.At this moment, preferably, before forming above-mentioned electroless plating copper layer 230, remove various pollutions and heterogeneous deburring (Deburring) and scrubbing (Desmear).
In addition, above-mentioned electroless plating copper layer 230 is the electro-plating methods that adopt for the surface that makes prepreg 210 has conductivity, realize by evolution reaction, and this evolution reaction is promoted by catalyst.The above-mentioned electroless plating copper layer 230 that generates by above-mentioned method plays the effect of liner (seed) when forming the circuit layer of second circuit substrate described later.
Shown in Fig. 2 G,,, form circuit pattern by image formation process on the surface that is formed with above-mentioned electroless plating copper layer 230.After the lamination photosensitive material, order by exposure, development is carried out above-mentioned image formation process, wherein, above-mentioned photosensitive material in order to ensure certain thickness circuit layer height, is compared preferred use dry film 240 with the liquid phase photosensitive material that scumbling is applied during by electrolytic copper plating forming circuit layer described later.
Shown in Fig. 2 H, carry out electrolytic copper plating on the above-mentioned whole surface that is formed with circuit pattern.Above-mentioned electrolytic copper plating uses method by electrolysis with metal ionization, and separate out to the plating mode on the surface of the conductive material that is placed on negative electrode, especially, apply negative electrode to substrate respectively and apply anode to the anode bead (anode ball) of the supply source of copper, and by the oxidation/reduction reaction between the copper ion of copper sulphate in the electroplate liquid and the supply of anode bead, separate out to the substrate that is applied with negative electrode, form electroplating copper film, electroplate thus.
At this moment, above-mentioned electroplate liquid uses at inorganic medicine copper sulphate (CuSO
4, 5H
2O), sulfuric acid (H
2SO
4), add the solution of organic principle polishing material in the hydrochloric acid (HCl).
Fill above-mentioned through hole 220 and carry out above-mentioned electrolytic copper plating on the whole surface that is formed with circuit pattern by electrolytic copper plating layer 250 simultaneously, still, consider the engineering time, preferred copper-plated height is lower than the height of above-mentioned dry film 240.
Shown in Fig. 2 I, then, peel off the dry film 240 in the above-mentioned electrolytic copper plating layer 250.Owing to peeled off above-mentioned dry film 240, the remaining electrolytic copper plating layer 250 of not being stripped from has the shape of circuit layer described later.
Shown in Fig. 2 J, the electroless plating copper layer 230 that does not form electrolytic copper plating layer 250 on the top after peeling off carries out etching, forms circuit layer, forms second circuit substrate 260 thus.
At this moment, do not have etched electroless plating copper layer 230 liner, thereby together form circuit layer with electrolytic copper plating layer 250 as electrolytic copper plating layer 250.
And, the example of the circuit substrate of 3 layers of laminations has been shown in Fig. 2 J, still, the present invention is not limited thereto, also be applicable to the formation of the circuit substrate of lamination more than 3 layers.
By above preferred embodiment, describe technical scheme of the present invention in detail, still, the foregoing description just is used to illustrate the present invention, is not to be used to limit the present invention.And, be understandable that to those skilled in the art, be no more than under the situation of technical scope of the present invention, the present invention can have various distortion.
Description of reference numerals
200 first circuit substrates, 210 prepregs
212 glass fibres, 211 via holes
220 through holes
230 electroless plating copper layers, 250 electrolytic copper plating layer
260 second circuit substrates
Claims (5)
1. a via hole formation method of utilizing laser drilling machine is characterized in that, comprising:
(a) preparation is formed with first circuit substrate of circuit on the two sides of insulating barrier;
(b) preparation is drilled with a plurality of prepregs in hole by machine drilling in the position of via hole to be formed;
(c) be formed with the described prepreg of two sides lamination of the described first circuit substrate circuit; And,
(d) utilize laser drilling machine that the hole site of crossing of being filled by the resin that flows out from described prepreg when carrying out described (c) step is processed, thereby form via hole.
2. the via hole formation method of utilizing laser drilling machine according to claim 1 is characterized in that,
After described (d) step, also comprise:
(e) on having the circuit substrate of described prepreg, lamination utilize machine drilling to form through hole.
3. the via hole formation method of utilizing laser drilling machine according to claim 1 is characterized in that,
After described (d) step, also comprise:
(f) on the whole surface of the circuit substrate that forms by described (d) step, form electroless plating copper layer.
4. the via hole formation method of utilizing laser drilling machine according to claim 3 is characterized in that,
After described (f) step, also comprise:
(g) form step by image, at the circuit forming surface pattern that is formed with described electroless plating copper layer;
(h) carry out electrolytic copper plating being formed with on the whole surface of described circuit pattern;
(i) peel off residual dry film in the described electrolytic copper plating layer; And,
(j) carry out described peeling off after, the electroless plating copper layer that does not form electrolytic copper plating on the top is carried out etching, and forms circuit layer, thereby form the second circuit substrate.
5. the via hole formation method of utilizing laser drilling machine according to claim 4 is characterized in that,
After described (j) step, also comprise:
(k) on the surface that is formed with described second circuit substrate circuit that forms by described (j) step, a plurality of prepregs are carried out lamination, wherein, described a plurality of prepregs are a plurality of prepregs of holing by machine drilling in the position that forms via hole; Simultaneously, utilize laser drilling machine respectively the hole site of crossing that the resin that flows out from prepreg when the described lamination is filled to be processed, form via hole, and this is electroplated, thereby form the multilayer circuit layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050113415A KR100674316B1 (en) | 2005-11-25 | 2005-11-25 | Method forming via hole that utilizes lazer drill |
| KR1020050113415 | 2005-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1972564A CN1972564A (en) | 2007-05-30 |
| CN100518444C true CN100518444C (en) | 2009-07-22 |
Family
ID=38014878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101397076A Expired - Fee Related CN100518444C (en) | 2005-11-25 | 2006-09-18 | Method for forming through-hole that utilizes lazer drill |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100674316B1 (en) |
| CN (1) | CN100518444C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678137B (en) * | 2018-08-17 | 2019-11-21 | 健鼎科技股份有限公司 | Circuit board structure and drilling method thereof |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101121024B1 (en) | 2010-02-12 | 2012-03-20 | 엘지이노텍 주식회사 | Substrate comprising via holl and manufacturing the same |
| CN102380892B (en) * | 2010-09-03 | 2014-04-02 | 北京航天新风机械设备有限责任公司 | Hole machining method of reinforced resin matrix composite prepreg of fiber fabric |
| CN103730436B (en) * | 2012-10-15 | 2016-11-16 | 景硕科技股份有限公司 | The layer reinforced structure of line carrier plate |
| CN103522031B (en) * | 2013-09-30 | 2016-06-29 | 苏州德龙激光股份有限公司 | Strengthening glass punching method |
| KR101648199B1 (en) | 2014-10-10 | 2016-08-12 | 주식회사 에스에프에이반도체 | Method for manufacturing stacked semiconductor package |
| KR101697643B1 (en) | 2015-06-09 | 2017-01-18 | 주식회사 에스에프에이반도체 | Semiconductor package comprising release film and the method of manufactruing thereof |
| KR101708870B1 (en) | 2015-07-15 | 2017-02-21 | 주식회사 에스에프에이반도체 | Stacked semiconductor package and method for manufacturing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203450A (en) | 2000-01-21 | 2001-07-27 | Ngk Spark Plug Co Ltd | Method of manufacturing wiring board |
| KR100666374B1 (en) * | 2001-01-10 | 2007-01-09 | 삼성전자주식회사 | Method for forming and encapsulating of via hole |
| KR100499004B1 (en) * | 2002-12-18 | 2005-07-01 | 삼성전기주식회사 | A printed circuit board with opto-via holes, and a process for forming them |
| KR20050001029A (en) * | 2003-06-26 | 2005-01-06 | 영풍전자 주식회사 | Method for manufacturing double side a flexible printed circuit board |
-
2005
- 2005-11-25 KR KR1020050113415A patent/KR100674316B1/en not_active IP Right Cessation
-
2006
- 2006-09-18 CN CNB2006101397076A patent/CN100518444C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678137B (en) * | 2018-08-17 | 2019-11-21 | 健鼎科技股份有限公司 | Circuit board structure and drilling method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1972564A (en) | 2007-05-30 |
| KR100674316B1 (en) | 2007-01-24 |
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Granted publication date: 20090722 Termination date: 20130918 |