KR101121024B1 - Substrate comprising via holl and manufacturing the same - Google Patents

Abstract

The present invention provides a via hole formed in an insulating substrate; And a filling layer formed on at least part of an inner wall of the via hole. Thereby, the board | substrate with which the precise hole was formed in the ceramic substrate can be manufactured, without increasing time and cost.

Description

Hole-forming substrate and its manufacturing method {SUBSTRATE COMPRISING VIA HOLL AND MANUFACTURING THE SAME}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a hole forming substrate and a method of manufacturing the same, and more particularly, to a hole forming substrate and a method of manufacturing the same precisely processed expensive ceramic (Ceramic) material at a lower price.

BACKGROUND ART Ceramic substrates are in the spotlight as insulating substrates used in semiconductor packages, LED packages, and the like. However, the conventional ceramic processing technique is to use the hole processing before firing.

1 is a process chart showing a conventional method for processing a ceramic substrate.

Referring to FIG. 1, holes are formed on a substrate before firing of a ceramic base material using a mold, a mechanical punch, a laser, and the like. These holes are processed to be larger than the size of the desired hole at the desired position of the hole in consideration of shrinkage after firing. Thereafter, it is fired at a temperature of several hundreds to thousands of degrees. For example, LTCC fires at less than 1,000 degrees and HTCC at more than 1000 degrees. On the other hand, the firing shrinks the ceramic substrate, and even if the hole before firing is largely formed in consideration of the shrinkage, a variation in the position of the hole occurs due to a slight deviation of the shrinkage rate.

In order to eliminate such a deviation, hole processing may be performed by laser or the like after firing, but the fired ceramic substrate has excellent strength and hardness, and laser processing and time increase several times to several tens of times compared to the process before firing.

Therefore, there is a need for a substrate and a method of manufacturing the same in which holes are formed in a ceramic substrate without increasing time and cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a hole forming substrate and a method of manufacturing the same, which can reduce the processing cost and time while maintaining the precision when manufacturing a ceramic substrate.

The structure of the hole forming substrate according to the present invention, the via hole formed in the insulating substrate; And

It is characterized in that it comprises a filling layer formed on at least part of the inner wall of the via hole, to provide a highly accurate hole forming substrate.

Herein, the material of the insulating substrate is preferably ceramic, or the material of the filling layer is preferably epoxy or glass.

In particular, the filling layer is preferably characterized in that the softer than the insulating substrate.

In addition, the method of manufacturing a hole forming substrate according to the present invention, (a) forming a via hole in the insulating substrate; (b) firing the insulating substrate; (c) filling the fired insulating substrate with via holes to form a filling layer; And (d) forming via holes in at least a portion of the filling layer, thereby manufacturing a highly accurate hole forming substrate with a short process time and low cost.

Here, the material of the insulating substrate of step (a) is preferably ceramic, or the material of the filling layer of step (c) is preferably epoxy or glass.

In particular, in the step (d), via holes may be formed using a laser to form more precise holes.

In addition, the filling layer is preferably softer than the insulating substrate.

According to the present invention, a substrate in which precise holes are formed in a ceramic substrate can be manufactured without increasing time and cost.

1 is a process chart showing a conventional method for processing a ceramic substrate.
2A is a block diagram of a hole forming substrate manufacturing method according to one embodiment of the present invention.
FIG. 2B is a top view and cross-sectional view of a hole forming substrate manufacturing process corresponding to each step of FIG. 2A. FIG.
3 is a cross-sectional view of a hole forming substrate manufactured according to the hole processing method according to the present invention.
4 is a cross-sectional view of an embodiment in which the hole forming substrate of the present invention is used as an LED substrate.

Hereinafter, a hole forming substrate and a method of manufacturing the same will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

In addition, the size of each component in the drawings may be exaggerated for the sake of explanation and does not mean a size actually applied.

2A is a block diagram of a hole forming substrate manufacturing method according to an embodiment of the present invention, and FIG. 2B is a top view and a cross-sectional view of a hole forming substrate manufacturing process corresponding to each step of FIG. 2A.

2A and 2B, via holes 20 are formed in the insulating substrate (S1). In this case, it is processed larger than the via hole to be used in consideration of shrinkage and deviation. That is, the diameter of the via hole 20 is large in view of the tolerance of the via hole 60 to be finally formed. The pre-firing via hole 20 process may be performed at low cost by using a mold, a mechanical punch, a laser, or the like.

 Thereafter, the insulating substrate 110 is fired (S2). Firing is carried out at temperatures of hundreds to thousands of degrees and is a common process. For example, LTCC runs below 1000 degrees and HTCC runs above 1000 degrees. Through the firing process, shrinkage occurs to form a substrate 110a and a via hole 20a having a smaller size than the substrate 110 before firing. Next, the filled via hole 20a is filled to form the filling layer 40 (S3). The material of the filling layer is preferably softer than the insulating substrate. That is, for precision processing such as a laser, the via hole 20a is filled with a material that is softer than the fired ceramic substrate 110a. Here, the material filling the via hole 20a is epoxy or glass, which is easier to laser, and is filled with a via fill method. The via fill process can be accomplished in a variety of ways, including commonly conceivable printing. Thereafter, the via hole 60 is finally formed in the filling layer 40 (S4). For example, the precision via hole 60 is processed using a laser.

As described above, in the manufacture of the substrate on which the via hole is formed according to the present invention, the via hole 60 may be processed in parallel to the via layer 20 before firing and the filling layer 40 filled after firing, thereby increasing the accuracy thereof and lowering the processing ratio.

3 shows a cross-sectional view of a hole forming substrate manufactured according to the hole processing method according to the present invention. Referring to FIG. 3, the hole forming substrate according to the present invention includes an insulating substrate 110a, a via hole 60, and a filling layer 40a. Specifically, the material of the insulating substrate 110a is preferably ceramic. In addition, the filling layer 40a may form part of the inner wall of the via hole 60 or may form the entire inner wall of the via hole 60. The via hole 60 is smaller than or equal to the size of the via hole 20 before firing, and is processed in the filling layer 40 that is much softer than the strength of the insulating substrate 110a after firing, so that the precision is excellent and the processing thereof is performed. The time can be shortened.

4 is a sectional view of an embodiment in which the hole forming substrate of the present invention is used as an LED substrate. Referring to FIG. 4, the LED package includes an LED substrate 110a, an LED wafer 120, and a conductive layer 130. More specifically, the substrate 110a of the present invention used as the LED substrate 110a has a conductive layer 130 formed through the hole 60 surrounded by the filling layer 40a to electrically connect the LED wafer 120. Connect. The LED package here requires a precise conductive layer thickness. Since the thickness of the conductive layer depends on the precision of the via hole 60, the precision of the conductive layer can also be improved by improving the precision of the via hole according to the present invention.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

20: Via hole before firing 20a: Via hole after firing
40: filling layer 40a: filling layer in which via holes are formed
60: final via hole after firing 110: insulating substrate
110a: predetermined insulating substrate 120: LED wafer
130: conductive layer

Claims (9)

An insulating substrate fired after the hole is formed; And
A via hole formed by a filling layer forming at least part of an inner wall of the hole,
The insulating substrate shrinks according to the firing,
And the hole of the insulating substrate is larger than the via hole at a different position from the via hole.
The method of claim 1,
The material of the insulating substrate is a hole forming substrate, characterized in that the ceramic (Ceramic).
The method of claim 1,
The material of the filling layer is a hole-forming substrate, characterized in that the epoxy (epoxy) or glass (Glass).
4. The method according to any one of claims 1 to 3,
And the filling layer is softer than the insulating substrate.
(a) forming a hole in the insulating substrate;
(b) firing the insulating substrate;
(c) filling the holes of the fired insulating substrate to form a filling layer; And
(d) forming a via hole by the filling layer forming at least a portion of the inner wall of the hole by processing the filling layer,
The insulating substrate shrinks according to the firing,
And the hole of the insulating substrate is formed larger than the via hole at a position different from that of the via hole.
6. The method of claim 5,
And the material of the insulating substrate of step (a) is ceramic.
6. The method of claim 5,
The method of manufacturing a hole forming substrate, characterized in that the material of the filling layer of step (c) is epoxy or glass.
6. The method of claim 5,
The step (d) is a method for manufacturing a hole forming substrate, characterized in that for forming via holes using a laser.
The method according to any one of claims 5 to 8,
And the filling layer is softer than the insulating substrate.

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