CN107770967A - A kind of wiring board locally plates copper technology - Google Patents
A kind of wiring board locally plates copper technology Download PDFInfo
- Publication number
- CN107770967A CN107770967A CN201710969346.6A CN201710969346A CN107770967A CN 107770967 A CN107770967 A CN 107770967A CN 201710969346 A CN201710969346 A CN 201710969346A CN 107770967 A CN107770967 A CN 107770967A
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- CN
- China
- Prior art keywords
- copper
- pcb board
- pit
- dry film
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of wiring board locally to plate copper technology, by sawing sheet, pressing plate, take off brown, removing glue, open pit, heavy copper electroplating processes, so that pit bottom and inwall cover one layer of copper, patch dry film process then is carried out to pcb board, the dry film covering pcb board surface and through hole, the dry film leave corresponding resigning hole in above-mentioned pit position；Carry out subtracting Copper treatment after the completion of above-mentioned steps, pcb board is not carried out subtracting Copper treatment by the position that dry film covers, the speed and amount of copper are subtracted by control, pit side wall can be caused without copper and copper is also left in bottom.Using the technology, normal technique is not influenceed and is carried out, eliminates the copper-plated adverse effect of side wall again, paste dry film at other positions, also eliminate the influence for subtracting copper step to other positions, and the technology is simple, it is convenient to carry out.
Description
Technical field
The present invention relates to PCB manufacture fields, particularly a kind of wiring board locally plates copper technology.
Background technology
At present, in PCB design production, it usually needs sink in pcb board chip, so can both avoid chip from protruding
Pcb board surface, protection chip are hardly damaged, and can be simplified circuit design again and be reduced pcb board thickness.In order to which chip is sunk to
, it is necessary to process a pit in pcb board in pcb board, then normally drill, heavy copper and electroplating processes, such that hole
Required for groove sidewall is plated last layer copper, and the copper of pit side wall is not pcb board, and influence the circuit design and work(of pcb board
Energy.
The content of the invention
It is contemplated that at least solves above-mentioned technical problem to a certain extent.Therefore, the present invention proposes a kind of wiring board
Local plating copper technology, neither influences normal copper-plating technique, can remove the copper of pit side wall again, eliminates the unfavorable shadow that the copper strips comes
Ring.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of wiring board locally plates copper technology, comprises the following steps：
(A), sawing sheet, core material is outputed according to jigsaw size；
(B), pressing plate, the film, development is carried out successively to internal layer core plate surface, etches, take off film process, then again to internal layer core
Plate is drilled, brown, is finally pressed in internal layer core plate surface pad pasting, obtains pcb board；
(C) brown, is taken off, the brown layer formed by surface by brown is removed, exposes copper face；
(D), removing glue, the cull caused by radium-shine removal above-mentioned operation；
(E) pit, is opened, pit is outputed to the pcb board so that expose the copper face of core material in pit bottom；
(F) heavy copper and electroplating processes, are carried out successively to pcb board so that through hole, pit and surface obtain certain thickness
Copper；
(G) patch dry film process, the dry film covering pcb board surface and through hole, are carried out to pcb board, the dry film is above-mentioned
Leave corresponding resigning hole in pit position；
(H), subtract copper, pcb board is not carried out subtracting Copper treatment by the position that dry film covers；
(I) film, is taken off, takes off above-mentioned dry film；
(J), full plate is electroplated, and pattern transfer and graphic plating are carried out successively to the pcb board after plating；
(K), to pcb board take off film successively, etch, take off tin processing.
Further, core material surface copper thickness is 16~20 microns, and the increased copper thickness of the heavy copper of step (F) is 6
~9 microns, the copper thickness that subtracts that step (H) subtracts Copper treatment is 10~13 microns.
Further, the graphic plating described in step (J) includes the plating of figure first and figure second is electroplated, the figure the
One plating is copper plating treatment, and the plating of figure second is the tin plating processing of copper facing.
Further, step (B) drilling includes drilling out edges of boards tooling hole and effective unit endoporus.
Further, after step (F) electroplating processes, pcb board need to wash drying, prevent copper face from aoxidizing.
The beneficial effects of the invention are as follows：By carrying out controlled subtracting copper to realize side wall without copper to pit bottom and side wall
And there be the effect of copper bottom, normal technique is not influenceed and is carried out, the copper-plated adverse effect of side wall is eliminated again, at other positions
Dry film is pasted, also eliminates the influence for subtracting copper step to other positions, the technology is simple, convenient to carry out.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is that the present invention subtracts process for copper schematic diagram.
Embodiment
The present invention is described in detail with reference to the accompanying drawings and examples.
A kind of wiring board of the present invention locally plates copper technology,
(A), sawing sheet, core material is outputed according to jigsaw size；
(B), pressing plate, the film, development is carried out successively to internal layer core plate surface, etches, take off film process, then again to internal layer core
Plate is drilled, and is carried out brown by brown liquid medicine, is finally pressed in internal layer core plate surface pad pasting, obtain pcb board；
(C) brown, is taken off, the brown layer formed by surface by brown is removed, exposes copper face；
(D), removing glue, the cull caused by radium-shine removal above-mentioned operation；
(E) pit 1, is opened, pit 1 is outputed to the pcb board so that expose the copper face of core material in pit bottom 2；
(F) heavy copper and electroplating processes, are carried out successively to pcb board so that through hole, pit and surface obtain certain thickness
Copper；
(G), carry out patch dry film 4 to pcb board to handle, the dry film 4 covers pcb board surface and through hole, and the dry film is upper
State the position of pit 1 and leave corresponding resigning hole, facilitate subsequent technique to carry out to spill pit；
(H), subtract copper, the position that pcb board is not covered by dry film 4 is carried out subtracting Copper treatment, i.e., pit 1 is carried out subtracting copper；
(I) film, is taken off, takes off above-mentioned dry film 4；
(J), full plate is electroplated, and pattern transfer and graphic plating are carried out successively to the pcb board after plating；
(K), to pcb board take off film successively, etch, take off tin processing.
With reference to figure 1, the certain thickness copper of internal layer chip surface is inherently arranged at pit bottom 2, along with the heavy copper of step (F)
Increased copper is handled, and pit side wall 3 only has the increased copper of copper-coating institute of step (F), so the copper thickness of pit bottom 2
Copper thickness inherently than pit side wall 3 is thicker, and by subtracting Copper treatment, control subtracts the amount of copper, can eliminate pit side wall 3
Retain 2 a part of copper of pit bottom while copper.Pit side wall is reached without copper and the purpose of copper is stayed in pit bottom.
In the present embodiment, core material surface copper thickness is 16~20 microns, the increased copper thickness of the heavy copper of step (F)
For 6~9 microns, the copper thickness that subtracts that step (H) subtracts Copper treatment is 10~13 microns.For the ease of understanding this technique to copper thickness
Influence, be described in conjunction with specific embodiments.Embodiment 1：Core material surface copper thickness is 16 microns, and step (F) is heavy
The increased copper thickness of copper is 6 microns, and the copper thickness that subtracts that step (H) subtracts Copper treatment is 13 microns, and the final copper thickness of pit bottom 2 is
9 microns, the copper thickness of pit side wall 3 is subtracted process for copper and is completely eliminated.Embodiment 2：Core material surface copper thickness
For 20 microns, step (F) sinks the increased copper thickness of copper for 9 microns, and the copper thickness that subtracts that step (H) subtracts Copper treatment is 10 microns, most
The whole copper thickness of pit bottom 2 is 19 microns, and the copper thickness of pit side wall 3 is subtracted process for copper and is completely eliminated.Embodiment 3：Institute
Core material surface copper thickness is stated as 18 microns, step (F) sinks the increased copper thickness of copper for 8 microns, and step (H) subtracts Copper treatment
Subtract copper thickness as 12 microns, the final copper thickness of pit bottom 2 is 14 microns, and the copper thickness of pit side wall 3 is subtracted process for copper
It is completely eliminated.
In the present embodiment, the graphic plating described in step (J) includes the plating of figure first and figure second is electroplated, the figure
The plating of shape first is copper plating treatment, and the plating of figure second is the tin plating processing of copper facing.
In the present embodiment, step (B) drilling includes drilling out edges of boards tooling hole and effective unit endoporus.
In the present embodiment, after step (F) electroplating processes, pcb board need to wash drying, prevent copper face from aoxidizing.
The above embodiments are merely illustrative of the technical solutions of the present invention and is not limited, all without departing from the present invention
Any modification of spirit and scope or equivalent substitution, it all should cover in the range of technical solution of the present invention.
Claims (5)
1. a kind of wiring board locally plates copper technology, it is characterised in that comprises the following steps：
(A), sawing sheet, core material is outputed according to jigsaw size；
(B), pressing plate, the film, development is carried out successively to internal layer core plate surface, etches, take off film process, then core material is entered again
Row drilling, brown, are finally pressed in internal layer core plate surface pad pasting, obtain pcb board；
(C) brown, is taken off, the brown layer formed by surface by brown is removed, exposes copper face；
(D), removing glue, cull caused by removing above-mentioned operation with radium-shine mode；
(E) pit, is opened, pit is outputed to the pcb board so that expose the copper face of core material in pit bottom；
(F) heavy copper and electroplating processes, are carried out successively to pcb board so that through hole, pit and surface obtain certain thickness copper；
(G) patch dry film process, the dry film covering pcb board surface and through hole, are carried out to pcb board, the dry film is in above-mentioned pit
Leave corresponding resigning hole in position；
(H), subtract copper, pcb board is not carried out subtracting Copper treatment by the position that dry film covers；
(I) film, is taken off, takes off above-mentioned dry film；
(J), full plate is electroplated, and pattern transfer and graphic plating are carried out successively to the pcb board after plating；
(K), to pcb board take off film successively, etch, take off tin processing.
2. a kind of wiring board according to claim 1 locally plates copper technology, it is characterised in that：
Core material surface copper thickness is 16~20 microns, and the increased copper thickness of the heavy copper of step (F) is 6~9 microns, step
(H) subtract Copper treatment subtracts copper thickness as 10~13 microns.
3. a kind of wiring board according to claim 1 locally plates copper technology, it is characterised in that：
Graphic plating described in step (J) includes the plating of figure first and figure second is electroplated, and the plating of figure first is plating
Copper treatment, the plating of figure second is the tin plating processing of copper facing.
4. a kind of wiring board according to claim 1 locally plates copper technology, it is characterised in that：
Step (B) drilling includes drilling out edges of boards tooling hole and effective unit endoporus.
5. a kind of wiring board according to claim 1 locally plates copper technology, it is characterised in that：
After step (F) electroplating processes, pcb board need to wash drying, prevent copper face from aoxidizing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710969346.6A CN107770967A (en) | 2017-10-18 | 2017-10-18 | A kind of wiring board locally plates copper technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710969346.6A CN107770967A (en) | 2017-10-18 | 2017-10-18 | A kind of wiring board locally plates copper technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107770967A true CN107770967A (en) | 2018-03-06 |
Family
ID=61268137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710969346.6A Pending CN107770967A (en) | 2017-10-18 | 2017-10-18 | A kind of wiring board locally plates copper technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107770967A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035615A (en) * | 2019-04-25 | 2019-07-19 | 生益电子股份有限公司 | PCB production method and PCB containing the non-metallic stepped groove of side wall |
| CN111935913A (en) * | 2020-07-30 | 2020-11-13 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| TWI742947B (en) * | 2020-12-02 | 2021-10-11 | 健鼎科技股份有限公司 | Copper block browning metohd |
| CN113518517A (en) * | 2021-04-20 | 2021-10-19 | 珠海杰赛科技有限公司 | Production method of crossed blind groove plate with metal-free side walls |
| TWI755180B (en) * | 2020-12-02 | 2022-02-11 | 健鼎科技股份有限公司 | Copper block browning fixture and manufacturing method thereof |
| CN114521069A (en) * | 2020-11-19 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Copper block browning jig and manufacturing method thereof |
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| KR20100003026A (en) * | 2008-06-30 | 2010-01-07 | 주식회사 심텍 | Method for creating through hole in printed circuit board |
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN105208794A (en) * | 2015-09-02 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Lead-free HASL (hot air solder leveling) PCB flexible board manufacturing method |
| CN206438195U (en) * | 2017-01-04 | 2017-08-25 | 信丰利裕达电子科技有限公司 | Circuit board electroplating production system |
-
2017
- 2017-10-18 CN CN201710969346.6A patent/CN107770967A/en active Pending
Patent Citations (4)
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| KR20100003026A (en) * | 2008-06-30 | 2010-01-07 | 주식회사 심텍 | Method for creating through hole in printed circuit board |
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN105208794A (en) * | 2015-09-02 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Lead-free HASL (hot air solder leveling) PCB flexible board manufacturing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035615A (en) * | 2019-04-25 | 2019-07-19 | 生益电子股份有限公司 | PCB production method and PCB containing the non-metallic stepped groove of side wall |
| CN110035615B (en) * | 2019-04-25 | 2021-07-23 | 生益电子股份有限公司 | PCB manufacturing method containing side wall non-metalized stepped groove and PCB |
| CN111935913A (en) * | 2020-07-30 | 2020-11-13 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN111935913B (en) * | 2020-07-30 | 2022-02-22 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN114521069A (en) * | 2020-11-19 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Copper block browning jig and manufacturing method thereof |
| CN114521069B (en) * | 2020-11-19 | 2024-02-23 | 健鼎（无锡）电子有限公司 | Copper block browning jig and manufacturing method thereof |
| TWI742947B (en) * | 2020-12-02 | 2021-10-11 | 健鼎科技股份有限公司 | Copper block browning metohd |
| TWI755180B (en) * | 2020-12-02 | 2022-02-11 | 健鼎科技股份有限公司 | Copper block browning fixture and manufacturing method thereof |
| CN113518517A (en) * | 2021-04-20 | 2021-10-19 | 珠海杰赛科技有限公司 | Production method of crossed blind groove plate with metal-free side walls |
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Application publication date: 20180306 |