TWI742947B - Copper block browning metohd - Google Patents
Copper block browning metohd Download PDFInfo
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- TWI742947B TWI742947B TW109142388A TW109142388A TWI742947B TW I742947 B TWI742947 B TW I742947B TW 109142388 A TW109142388 A TW 109142388A TW 109142388 A TW109142388 A TW 109142388A TW I742947 B TWI742947 B TW I742947B
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本發明涉及一種棕化方法,特別是涉及一種銅塊棕化方法。 The invention relates to a browning method, in particular to a copper block browning method.
於現有的技術中,在將銅塊進行棕化處理時,通常是將多個銅塊放置撈網中並且共同浸泡於棕化藥液中進行棕化作業。然而,以上述方法進行棕化作業時,不僅無法同時對大量的銅塊進行棕化作業,並且在棕化作業的過程中,還會因為銅塊互相交疊而使得銅塊無法完整地被棕化。 In the prior art, when the copper block is subjected to browning treatment, usually a plurality of copper blocks are placed in a fishing net and jointly immersed in a browning chemical solution for the browning operation. However, when the above-mentioned method is used for the browning operation, not only a large number of copper blocks cannot be browned at the same time, but also because the copper blocks overlap each other during the browning operation, the copper blocks cannot be completely browned. change.
故,如何提供一種銅塊棕化方法,來克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。 Therefore, how to provide a copper block browning method to overcome the above-mentioned shortcomings has become one of the important issues to be solved by this business.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種銅塊棕化方法,其能同時對大量的銅塊進行棕化作業,還能避免因銅塊互相交疊而導致銅塊無法完整地被棕化的問題。 The technical problem to be solved by the present invention is to provide a copper block browning method in view of the deficiencies of the prior art, which can simultaneously perform browning operations on a large number of copper blocks, and can also prevent the copper blocks from being incomplete due to overlapping of the copper blocks. The problem of ground being browned.
為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種銅塊棕化方法,其包括:一準備步驟,提供一銅塊棕化治具,所述銅塊棕化治具包含有一基板及多個容置結構;其中,所述基板定義有位於相反兩側的一第一板面及一第二板面,並且多個所述容置結構彼此間隔地設置且貫穿所述基板;其中,每個所述容置結構包含有凹設於所述第一板面的一 第一凹槽及凹設於所述第二板面的一第二凹槽,所述第一凹槽在空間上連通於所述第二凹槽,並且所述第一凹槽的一第一開口寬度是小於所述第二凹槽的一第二開口寬度;一銅塊置入步驟,將多個銅塊分別置入多個所述容置結構中,以使得每個所述容置結構的所述第一凹槽及所述第二凹槽共同容置有一個所述銅塊;其中,於每個所述容置結構中,所述第一開口寬度是小於所述銅塊的一最大寬度;以及一棕化步驟,將承載有多個所述銅塊的所述銅塊棕化治具浸泡於一棕化藥液中以進行一棕化作業。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a copper block browning method, which includes: a preparation step, providing a copper block browning jig, the copper block browning jig includes There is a substrate and a plurality of accommodating structures; wherein the substrate is defined with a first plate surface and a second plate surface on opposite sides, and the plurality of accommodating structures are spaced apart from each other and pass through the substrate ; Wherein, each of the accommodating structure includes a concave set on the first plate surface A first groove and a second groove recessed on the second plate surface, the first groove is spatially connected to the second groove, and a first groove of the first groove The opening width is smaller than a second opening width of the second groove; a copper block placement step is to place a plurality of copper blocks into a plurality of the accommodating structures, so that each of the accommodating structures The first groove and the second groove together contain a copper block; wherein, in each of the accommodating structures, the first opening width is less than a width of the copper block Maximum width; and a browning step of immersing the copper block browning fixture carrying a plurality of the copper blocks in a browning liquid to perform a browning operation.
本發明的其中一有益效果在於,本發明所提供的銅塊棕化方法,其能通過“所述銅塊棕化方法包含所述準備步驟、所述銅塊置入步驟、及所述棕化步驟”、“每個所述容置結構包含有凹設於所述第一板面的一第一凹槽及凹設於所述第二板面的一第二凹槽,所述第一凹槽在空間上連通於所述第二凹槽,並且所述第一凹槽的一第一開口寬度是小於所述第二凹槽的一第二開口寬度”、以及“於每個所述容置結構中,所述第一開口寬度是小於所述銅塊的一最大寬度”的技術方案,以能同時對大量的銅塊進行棕化作業,還能避免因銅塊互相交疊而導致銅塊無法完整地被棕化的問題。 One of the beneficial effects of the present invention is that the copper block browning method provided by the present invention can be achieved by "the copper block browning method includes the preparation step, the copper block placing step, and the browning Step", "Each of the accommodating structures includes a first groove recessed on the first plate surface and a second groove recessed on the second plate surface, the first recess The groove is spatially connected to the second groove, and a first opening width of the first groove is smaller than a second opening width of the second groove" and "in each of the receptacles In the arrangement structure, the first opening width is smaller than a maximum width of the copper block" technical solution, so that a large number of copper blocks can be browned at the same time, and it can also avoid copper blocks caused by overlapping copper blocks. The problem that the block cannot be completely browned.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.
100:銅塊棕化治具 100: Copper block browning fixture
1:基板 1: substrate
1a:第一板面 1a: The first board
1b:第二板面 1b: second board surface
2:容置結構 2: Housing structure
2a:抵頂部 2a: Reach the top
21:第一凹槽 21: The first groove
211:第一環側壁 211: First ring side wall
22:第二凹槽 22: second groove
221:第二環側壁 221: Second Ring Side Wall
C:銅塊 C: Copper block
C1:基部 C1: Base
C2:凸部 C2: Convex
D1:第一深度 D1: first depth
D2:第二深度 D2: second depth
G1:第一間隙 G1: first gap
G2:第二間隙 G2: second gap
T1:基板厚度 T1: substrate thickness
T2:銅塊厚度 T2: Copper block thickness
W1:第一開口寬度 W1: first opening width
W2:第二開口寬度 W2: second opening width
W3:最大寬度 W3: Maximum width
S110:準備步驟 S110: Preparation steps
S120:銅塊置入步驟 S120: Copper block placement steps
S130:棕化步驟 S130: Browning step
圖1為本發明實施例的銅塊棕化方法的步驟流程圖。 Fig. 1 is a flow chart of the steps of a copper block browning method according to an embodiment of the present invention.
圖2為本發明實施例的銅塊棕化方法的準備步驟的示意圖。 2 is a schematic diagram of the preparation steps of the copper block browning method according to the embodiment of the present invention.
圖3為本發明另一實施例的銅塊棕化方法的準備步驟的示意 圖。 Fig. 3 is a schematic diagram of the preparation steps of a copper block browning method according to another embodiment of the present invention picture.
圖4為圖2沿剖線IV-IV的剖視示意圖。 4 is a schematic cross-sectional view of FIG. 2 along the line IV-IV.
圖5為本發明實施例的銅塊棕化方法的銅塊置入步驟的示意圖。 FIG. 5 is a schematic diagram of the copper block placement step of the copper block browning method according to the embodiment of the present invention.
圖6為本發明另一實施例的銅塊棕化方法的銅塊置入步驟的示意圖。 6 is a schematic diagram of the copper block placement step of the copper block browning method according to another embodiment of the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“銅塊棕化方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following are specific examples to illustrate the implementation of the "copper block browning method" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
請參閱圖1所示,圖1為本發明實施例的銅塊棕化方法的步驟流程圖。本發明提供一種銅塊棕化方法,所述銅塊棕化方法包含有一準備步驟S110、一銅塊置入步驟S120、以及一棕化步驟S130。 Please refer to FIG. 1, which is a flowchart of the steps of a copper block browning method according to an embodiment of the present invention. The present invention provides a copper block browning method. The copper block browning method includes a preparation step S110, a copper block placement step S120, and a browning step S130.
請參閱圖2至圖4,圖2為本發明實施例的銅塊棕化方法的準備
步驟的示意圖,圖3為本發明另一實施例的銅塊棕化方法的準備步驟的示意圖,圖4為圖2沿剖線IV-IV的剖視示意圖。於所述準備步驟S110中,提供一銅塊棕化治具100,所述銅塊棕化治具100包含有一基板1及多個容置結構2。所述基板1定義有位於相反兩側的一第一板面1a及一第二板面1b。如圖4所示,於實際應用時,所述第一板面1a是朝向下方設置,並且所述第二板面1b是朝向上方設置。
Please refer to Figures 2 to 4, Figure 2 is the preparation of the copper block browning method according to the embodiment of the present invention
A schematic diagram of the steps. FIG. 3 is a schematic diagram of the preparation steps of a copper block browning method according to another embodiment of the present invention, and FIG. 4 is a schematic cross-sectional view taken along the section line IV-IV in FIG. 2. In the preparation step S110, a copper
多個所述容置結構2彼此間隔地設置且貫穿所述基板1。每個所述容置結構2包含有凹設於所述第一板面1a的一第一凹槽21及凹設於所述第二板面1b的一第二凹槽22,所述第一凹槽21在空間上連通於所述第二凹槽22,並且所述第一凹槽21的一第一開口寬度W1是小於所述第二凹槽22的一第二開口寬度W2。
A plurality of the
較佳地,於每個所述容置結構2中,所述第一凹槽21的所述第一開口寬度W1為介於所述第二凹槽22的所述第二開口寬度W2的40%至60%之間,並且所述第一凹槽21的一第一深度D1是介於所述第二凹槽22的一第二深度D2的30%至50%之間,但本發明不受限於此。
Preferably, in each
需要說明的是,於本實施例的每個所述容置結構2中,是以所述第一凹槽21及所述第二凹槽22於一水平面上的外形呈正方形為例,但所述第一凹槽21及所述第二凹槽22的外形皆可以依據需求或對應於所述銅塊C的外形而變化,本發明於此不加以限制。舉例來說,所述第一凹槽21及所述第二凹槽22於所述水平面上的外形也可以為長方形。
It should be noted that in each of the
值得一提的是,所述銅塊棕化治具100所包含的所述容置結構2的較佳的數量為介於30個至60個之間,更佳的數量為介於40個至50個之間。於本實施例中,多個所述容置結構2於所述銅塊棕化治具100上呈交錯排列,並且任一個所述容置結構2和與其相距最近的一個所述容置結構2
之間的距離為介於所述第二開口寬度W2的160%至180%之間。需要說明的是,本發明不對所述容置結構2的排列方式加以限制,請參閱圖3所示,舉例來說,於本發明的另一實施例中,所述容置結構2於所述銅塊棕化治具100上也可以是呈矩陣排列或是其他排列方式。
It is worth mentioning that the preferred number of the
請參閱圖5所示,圖5為本發明實施例的銅塊棕化方法的銅塊置入步驟的示意圖。於所述銅塊置入步驟S120中,將多個銅塊C分別置入多個所述容置結構2中,以使得每個所述容置結構2的所述第一凹槽21及所述第二凹槽22共同容置有一個所述銅塊C。此外,於每個所述容置結構2中,所述第一開口寬度W1是小於所述銅塊C的一最大寬度W3,並且所述第二開口寬度W2是大於所述銅塊C的所述最大寬度W3,以使得所述容置結構2能有效地容置所述銅塊C,並且所述銅塊C不會自所述的第一凹槽21而脫離所述容置結構2。
Please refer to FIG. 5, which is a schematic diagram of the copper block placement step of the copper block browning method according to the embodiment of the present invention. In the copper block placement step S120, a plurality of copper blocks C are respectively placed into the plurality of
於每個所述容置結構2中,所述第一凹槽21具有一第一環側壁211,所述第二凹槽22具有一第二環側壁221,並且當每個所述容置結構2容置所述銅塊C時,所述第一環側壁211與所述銅塊C之間的一第一間隙G1不大於所述第二環側壁221與所述銅塊C之間的一第二間隙G2。較佳地,所述第一間隙G1為介於0.25毫米至0.75毫米之間,並且所述第二間隙G2為介於0.75毫米至1.25毫米之間。
In each
於每個所述容置結構中,所述第一凹槽21及所述第二凹槽22共同形成一階梯狀結構,並且所述階梯狀結構中平行於所述第一板面1a或所述第二板面1b的部位定義一抵頂部2a。所述抵頂部2a位於所述第一凹槽21及所述第二凹槽22之間,並且當每個所述容置結構2容置所述銅塊C時,所述容置結構2是通過所述抵頂部2a而抵頂所述銅塊C。
In each of the accommodating structures, the
於本實施例中,每個所述銅塊C定義有一基部C1及突出於所
述基部C1的一凸部C2。當每個所述容置結構2容置所述銅塊C時,所述第一凹槽21能容置所述銅塊C的所述凸部C2,並且所述第二凹槽22能容置所述銅塊C的所述基部C1。
In this embodiment, each of the copper blocks C defines a base C1 and protrudes from the
A convex portion C2 of the base portion C1. When each
換個角度說,由於所述容置結構2是貫穿所述基板1,因此當每個所述容置結構2容置所述銅塊C時,所述銅塊C的所述凸部C2是暴露自所述第一凹槽21,並且所述銅塊C的所述基部C1是暴露自所述第二凹槽22。
To put it another way, since the
於本實施例中,所述銅塊C的所述基部C1及所述凸部C2皆呈立方體,並且所述基部C1的體積大於所述凸部C2的體積,但所述銅塊C的外形可以依據需求變化。請參閱圖6所示,圖6為本發明另一實施例的銅塊棕化方法的銅塊置入步驟的示意圖。舉例來說,於本發明的另一實施例中,所述銅塊C也可以是不具有所凸部C2,並且所述銅塊C的外形大致為一長方體,但本發明於不受限於此。 In this embodiment, the base portion C1 and the convex portion C2 of the copper block C are both cubic, and the volume of the base portion C1 is greater than the volume of the convex portion C2, but the shape of the copper block C Can be changed according to demand. Please refer to FIG. 6, which is a schematic diagram of the copper block placement step of the copper block browning method according to another embodiment of the present invention. For example, in another embodiment of the present invention, the copper block C may not have the convex portion C2, and the shape of the copper block C is approximately a rectangular parallelepiped, but the present invention is not limited to this.
此外,當各個所述容置結構2用以容置所述銅塊C時,各個所述容置結構2是以所述抵頂部2a抵頂所述銅塊C的所述基部C1,並且當承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於所述棕化藥液而進行所述棕化作業時,各個所述銅塊C會在對應的所述容置結構2中而於一水平面上微微晃動,以使得各個所述銅塊C能較為完整地浸泡於所述棕化藥液。
In addition, when each of the
進一步來說,由於所述第一環側壁211與所述銅塊C之間的所述第一間隙G1不大於所述第二環側壁221與所述銅塊C之間的所述第二間隙G2,當承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於所述棕化藥液而進行所述棕化作業時,所述銅塊C的所述基部C1較不容易因接觸於所述第二凹槽22的所述第二環側壁221而導致棕化不完整的問題。
Furthermore, since the first gap G1 between the first
所述基板1具有一基板厚度T1,每個所述銅塊C具有一銅塊
厚度T2,所述基板厚度T1大於所述銅塊厚度T2,並且所述基板厚度T1與所述銅塊厚度T2的差值的絕對值為介於0.75毫米至1.25毫米之間。通過所述基板厚度T1大於所述銅塊厚度T2的設計,當各個所述容置結構2容置所述銅塊C時,所述銅塊C較不容易自所述第二凹槽22而離開所述容置結構2。
The
由於所述基板厚度T1是大於所述銅塊厚度T2,因此當各個所述容置結構2容置所述銅塊C時,所述銅塊C的所述凸部C2是不凸出自所述容置結構2的所述第一凹槽21,並且所述銅塊C的所述基部C1是不凸出自所述容置結構2的所述第二凹槽22。據此,所述銅塊C於所述銅塊棕化方法中因碰撞而受損的機會能被有效地降低。
Since the substrate thickness T1 is greater than the copper block thickness T2, when each of the
於所述棕化步驟S130中,將承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於一棕化藥液中以進行一棕化作業。需要說明的是,由於在所述棕化步驟S130中,多個所述銅塊C是分別位於多個所述容置結構2中,因此多個所述銅塊C不會因為彼此互相交疊而導致棕化不完整的問題。也就是說,在所述棕化步驟S130中,任一個所述銅塊C不會與另一個其他的所述銅塊C接觸。相對地,任何會使得銅塊彼此接觸的銅塊棕化方法則難以對比至本案的銅塊棕化方法。
In the browning step S130, the copper
於所述棕化步驟S130中,在所述棕化作業前,還可以先將承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於一酸洗藥液中以進行一酸洗作業,並且將承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於一鹼洗藥液中以進行一鹼洗作業。於本實施例中,所述酸洗作業的作業時間及所述鹼洗作業的作業時間是不大於所述棕化作業的作業時間,所述酸洗作業的作業時間為介於20秒至30秒之間,所述鹼洗作業的作業時間為介於25秒至35秒之間,並且所述棕化作業的作業時間為介於55秒至65秒之
間,但本發明不受限於此。
In the browning step S130, before the browning operation, the copper
需要說明的是,在執行所述酸洗作業後且在所述鹼洗作業前,還可以將承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於水中以進行一第一水洗作業。在所述鹼洗作業後且在所述棕化作業前,還可以將承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於水中以進行一第二水洗作業。在所述棕化作業後,還可以將承載有多個所述銅塊C的所述銅塊棕化治具100浸泡於水中以進行一第三水洗作業。於本實施例中,所述第一水洗作業、所述第二水洗作業、及所述第三水洗作業的作業時間皆介於25秒至35秒之間,但本發明不受限於此。
It should be noted that, after performing the pickling operation and before the alkaline washing operation, the copper
此外,在完成所述棕化作業後,可以將多個所述銅塊C自所述銅塊棕化治具100上取下,並且對多個所述銅塊C執行一烘烤作業,以將每個所述銅塊C的表面烘乾。於本實施例中,所述烘烤作業的作業時間為介於90秒至100秒之間,但本發明不受限於此。
In addition, after the browning operation is completed, a plurality of the copper blocks C may be removed from the copper
本發明的其中一有益效果在於,本發明所提供的銅塊棕化方法,其能通過“所述銅塊棕化方法包含所述準備步驟、所述銅塊置入步驟、及所述棕化步驟”、“每個所述容置結構包含有凹設於所述第一板面的一第一凹槽及凹設於所述第二板面的一第二凹槽,所述第一凹槽在空間上連通於所述第二凹槽,並且所述第一凹槽的一第一開口寬度是小於所述第二凹槽的一第二開口寬度”、以及“於每個所述容置結構中,所述第一開口寬度是小於所述銅塊的一最大寬度”的技術方案,以能同時對大量的銅塊進行棕化作業,還能避免因銅塊互相交疊而導致銅塊無法完整地被棕化的問題。 One of the beneficial effects of the present invention is that the copper block browning method provided by the present invention can be achieved by "the copper block browning method includes the preparation step, the copper block placing step, and the browning Step", "Each of the accommodating structures includes a first groove recessed on the first plate surface and a second groove recessed on the second plate surface, the first recess The groove is spatially connected to the second groove, and a first opening width of the first groove is smaller than a second opening width of the second groove" and "in each of the receptacles In the arrangement structure, the first opening width is smaller than a maximum width of the copper block" technical solution, so that a large number of copper blocks can be browned at the same time, and it can also avoid copper blocks caused by overlapping copper blocks. The problem that the block cannot be completely browned.
更進一步來說,本發明所提供的銅塊棕化方法,其能通過“於 每個所述容置結構中,所述第一凹槽及所述第二凹槽共同形成一階梯狀結構,並且所述階梯狀結構中平行於所述第一板面或所述第二板面的部位定義一抵頂部”及“所述抵頂部位於所述第一凹槽及所述第二凹槽之間,並且當每個所述容置結構容置所述銅塊時,所述容置結構是通過所述抵頂部而抵頂所述銅塊”的技術方案,以使得所述銅塊棕化治具能較佳地容置所述銅塊,並且在所述棕化作業的過程中,所述銅塊能更完整地浸泡於所述棕化藥液中。 Furthermore, the copper block browning method provided by the present invention can be achieved by In each accommodating structure, the first groove and the second groove jointly form a stepped structure, and the stepped structure is parallel to the first plate surface or the second plate The position of the surface defines an abutting top" and "the abutting top is located between the first groove and the second groove, and when each of the accommodating structures accommodates the copper block, the The accommodating structure is a technical solution that pushes against the copper block through the top part, so that the copper block browning jig can better accommodate the copper block, and during the browning operation During the process, the copper block can be more completely immersed in the browning liquid.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.
S110:準備步驟 S110: Preparation steps
S120:銅塊置入步驟 S120: Copper block placement steps
S130:棕化步驟 S130: Browning step
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CN107770967A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board locally plates copper technology |
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CN107770967A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board locally plates copper technology |
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