CN113518517A - Production method of crossed blind groove plate with metal-free side walls - Google Patents
Production method of crossed blind groove plate with metal-free side walls Download PDFInfo
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- CN113518517A CN113518517A CN202110425448.8A CN202110425448A CN113518517A CN 113518517 A CN113518517 A CN 113518517A CN 202110425448 A CN202110425448 A CN 202110425448A CN 113518517 A CN113518517 A CN 113518517A
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- blind groove
- blind
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- side wall
- plate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 claims abstract description 60
- 239000010949 copper Substances 0.000 claims abstract description 60
- 239000011241 protective layer Substances 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000008719 thickening Effects 0.000 claims description 3
- 238000009499 grossing Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 14
- 239000003365 glass fiber Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 2
- 238000005137 deposition process Methods 0.000 abstract description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 241000054828 Lycaena xanthoides Species 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a production method of a metal-free side wall crossed blind groove plate, which comprises the steps of drilling a through hole in a blind groove after the blind groove is machined, realizing the metallization of the blind groove and the through hole in the blind groove by adopting an electroplating copper deposition process, covering a part needing to keep the metal side wall and the metal surface with a protective layer, and removing the protective layer after copper wire reduction to realize the non-metallization of the side wall of the blind groove. The invention overcomes the technical problem that the side wall of the blind groove can not be subjected to non-metallization when the blind groove contains the metallized hole, eliminates the defect that the side wall of the blind groove in the glass fiber material generates copper nodules due to metallization, improves the assembly property of the blind groove and subsequent components, also eliminates the hidden trouble of non-uniform copper plating thickness caused by metallization of the side wall, and obviously improves the dimensional precision of the blind groove.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a production method of a metal-side-wall-free crossed blind slot board.
Background
In the current printed circuit board industry, blind slots in blind slot plates penetrate through the inner core board. When the metallized hole exists in the blind slot, referring to fig. 1, the conventional method is to drill the metallized hole in the blind slot after the blind slot is drilled by laser, and then to realize the metallization in the hole by copper deposition and full-plate electroplating, so that the side wall of the blind slot is inevitably metallized together with the inner hole of the blind slot. When using the core plate material that contains glass fibre class, because the fine absorbance of glass is less than the resin in the core plate material, blind groove lateral wall can have slight glass fibre protrusion, and follow-up heavy copper can have point discharge when carrying out the full-plate again and electroplate, leads to the blind groove lateral wall to appear great copper tumour protrudingly, influences the roughness of blind groove lateral wall, finally leads to cell body and device assembly effect relatively poor.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a production method of a crossed blind slot plate with metal-free side walls, which can realize the non-metallization of the side walls of the blind slots and avoid the problem of side wall copper nodules caused by glass fiber-containing materials.
The production method of the crossed blind slot plate with metal-free side walls according to the embodiment of the first aspect of the invention comprises the following production steps: step a, manufacturing a pattern route on at least two double-sided copper-clad plates, and pressing and bonding the double-sided copper-clad plates through bonding sheets to form a multilayer plate after the route is etched; b, manufacturing blind grooves on the multilayer board; c, drilling through holes in the outer layer of the multilayer board and the formed blind grooves, carrying out copper deposition and full-board electroplating, and forming metallized holes penetrating through the whole board and formed in the blind grooves on the multilayer board; d, paving protective layers at the bottom of the blind groove and on the side walls of all the metallized holes; e, removing the copper layer plated on the side wall of the blind groove by passing the multilayer board containing the protective layer through a copper reduction wire; and f, removing the protective layer, and removing the protective layer on the bottom of the blind groove and the side wall of the metallized hole to form a crossed blind groove plate.
The production method of the crossed blind groove plate with the metal-free side wall provided by the embodiment of the invention has at least the following beneficial effects: the technical problem that the side wall of the blind groove cannot be subjected to non-metallization when the blind groove contains the metallized hole is solved, the defect that the side wall of the blind groove generates copper nodules due to metallization in a glass fiber material is overcome, the assembly performance of the blind groove and subsequent components is improved, the hidden danger that the copper plating thickness is uneven due to metallization of the side wall is eliminated, and the size precision of the blind groove is obviously improved.
According to some embodiments of the invention, in step d, the protective layer is solder resist ink, and the solder resist ink covers all the metalized holes and the bottom of the blind groove.
According to some embodiments of the invention, in step d, the solder mask ink coverage of the bottom of the blind via is spaced apart from the bottom edge of the blind via by 2 mils, and the solder mask ink coverage of the metallized via is 5 mils larger than the opening area at the opening location of the outer layer of the multiwall sheet.
According to some embodiments of the invention, in step f, the solder mask removing is performed on the copper-reduced blind slot board, and the solder mask ink at the bottom of the blind slot and in the metallized hole is removed.
According to some embodiments of the invention, in step d, the protective layer is a wet film, and the wet film covers all the metallized holes and the bottom of the blind groove.
According to some embodiments of the present invention, in step c, the thickness of the formed metal copper layer is controlled to be 5 μm by copper deposition, and in step e, the copper reduction thickness of the over-reduced copper line is controlled to be 5 μm, and the copper layer plated on the side wall of the blind groove is removed.
According to some embodiments of the present invention, in step b, a laser milling blind groove process is used to fabricate the blind groove: firstly, etching copper at the position of a blind groove of a first metal layer in an upper double-sided copper-clad plate by adopting negative film photo-imaging, and milling the blind groove by laser after leaking a core plate medium.
According to some embodiments of the invention, the method further comprises step g of polishing the plate surface of the crossed blind groove plate to be flat.
According to some embodiments of the invention, the method further comprises a step h of thickening the metal layer by full plate electroplating.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an original crossed blind slot plate;
FIG. 2 is a schematic view of the process of step a in the embodiment of the present invention;
FIG. 3 is a schematic view of the process of step b in the embodiment of the present invention;
FIG. 4 is a schematic view of the process of step c in the embodiment of the present invention;
FIG. 5 is a schematic view of the process of step d in the embodiment of the present invention;
FIG. 6 is a schematic view of the process of step e in the embodiment of the present invention;
FIG. 7 is a schematic view of the process of step f in the embodiment of the present invention.
The attached drawings are marked as follows:
the double-sided copper-clad plate comprises a double-sided copper-clad plate 100, an adhesive sheet 200, a blind groove 300, a metalized hole 400, a metal copper layer 500 and a protective layer 600.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and larger, smaller, larger, etc. are understood as excluding the present number, and larger, smaller, inner, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The following describes a method for producing a cross blind groove plate according to an embodiment of the present invention.
The blind groove realizes the manufacture of the blind groove plate with the non-metallized side wall, the through hole in the blind groove is drilled after the blind groove is processed, the metallization of the blind groove and the through hole in the groove is realized by adopting an electroplating copper deposition process, the part needing to keep the metal side wall and the metal surface is covered with a protective layer, and the protective layer is removed after copper reduction, so that the non-metallization of the side wall of the blind groove is realized.
The production process comprises the following steps:
manufacturing a double-sided copper-clad plate, pressing and bonding to form a circuit board → slotting and drilling of the circuit board → copper deposition → covering the protective layer on the bottom of the slot and the metalized hole → copper reduction → protective layer removal → surface polishing.
With reference to fig. 2 to 7, through the above process, the specific production embodiment is as follows:
step a, manufacturing a pattern route on at least two double-sided copper-clad plates 100, and laminating by using a bonding sheet 200 after etching the route to form a multilayer plate, wherein the multilayer plate can be formed by laminating two, three or more than three double-sided copper-clad plates 100, and the multilayer plate is manufactured by two double-sided copper-clad plates 100 in the embodiment;
b, manufacturing a blind groove 300 on the multilayer board, punching through the outermost copper layer and the dielectric layer in the upper double-sided copper-clad plate 100 by utilizing a groove milling process, wherein the second copper layer forms the bottom of the blind groove 300, and the depth of the blind groove 300 can be reasonably designed according to the design requirement of the blind groove of the multilayer board;
c, drilling a through hole in the outer layer of the multilayer board and the formed blind groove 300, performing copper deposition and full-board electroplating, plating a metal copper layer 500 on the side wall of the through hole and the blind groove 300, and forming a metallized hole 400 penetrating through the whole board and the blind groove 300 on the multilayer board, wherein the metallized hole 400 is a side wall metallized through hole, and the metallized hole 400 penetrating through the whole board and the blind groove 300 can be reasonably designed according to requirements;
d, paving an anti-protection layer 600 at the bottom of the blind groove 300 and on the side walls of all the metallized holes 400, wherein the anti-protection layer 600 protects the part of the metal layer to be reserved, so that the side walls of the blind groove 300 needing to be demetalized are exposed, and the groove ground of the blind groove 300 and the side walls of the metallized holes 400 are protected;
e, passing the multilayer board containing the protective layer 600 through a copper reduction line, removing the metal copper layer 500 plated on the side wall of the blind groove 300 by the copper reduction line, and showing the side wall of the original milling groove again to realize the non-metallization of the side wall of the blind groove 300;
and f, removing the protective layer 600 on the bottom of the blind groove 300 and the side wall of the metallized hole 400, and reappearing the metal copper layer 500 on the bottom of the blind groove 300 and the side wall of the metallized hole 400 on the multilayer board to form a crossed blind groove board, thereby producing the blind groove board without the metal side wall blind groove 300.
It should be noted that, when the copper reduction is performed, the copper reduction depth corresponds to the plating thickness, in this embodiment, the metal copper layer formed by the copper deposition plating in step c is about 5 μm, and the copper reduction thickness corresponding to the copper reduction in step e is controlled according to 5 μm, so as to remove the copper layer plated on the side wall of the blind slot, and the thickness of the copper layer formed by plating should be the same as the copper reduction depth of the copper reduction line.
The steps e to f are the process of removing the copper layer on the side wall of the blind groove in the production method, and can be divided into two different modes according to the arrangement of the protective layer, which are as follows:
the first method is as follows: covering solder resist ink on the bottoms of all the metallized holes and the blind grooves to reduce copper, wherein the solder resist ink is a good protective agent, has good chemical resistance, solvent resistance, heat resistance and insulativity, can prevent a copper reduction solvent from influencing a metal copper layer, and can be removed by other NaOH and other solvents after copper reduction is finished;
the second method comprises the following steps: and the wet film is adopted to replace solder resist ink to serve as a protective layer at the bottom positions of the metallized holes and the blind groove, and the wet film is taken out after copper reduction is finished, so that the demetalization of the side walls of the blind groove can be realized.
The two methods can overcome the technical problem that the cross blind slot plate with the blind slot containing the metallized hole can not realize the metallization of the side wall.
In some preferred embodiments of the present invention, in step d, the solder resist ink coverage surface of the bottom of the blind groove and the edge of the bottom of the blind groove are spaced by 2 mils, so that poor circulation of a liquid medicine is avoided when the metal copper layer on the side wall of the blind groove is removed in the next step, the solder resist ink coverage surface of the plated hole at the position of the hole opening of the outer layer of the multilayer board is 5 mils larger than the hole opening surface, the hole opening of the plated hole can be completely covered, and the metal layer is prevented from being disconnected from the surface layer or the metal copper layer on the bottom of the blind groove in the next copper reduction process.
In the step b, in order to better match the production process of the metal-free side wall blind groove, the blind groove is manufactured by using the following laser blind groove process: firstly, copper at the same position of the blind groove of the first metal layer in the upper double-sided copper-clad plate is etched by negative light imaging, and the blind groove is milled by laser after the core plate medium leaks, so that the inner layer copper on the inner plate in the upper double-sided copper-clad plate is exposed to form the groove bottom of the blind groove.
In the subsequent steps, step g and step h may also be included. B, polishing and flattening the plate surface of the crossed blind groove plate to form a crossed blind groove plate with good flatness; and h, thickening the metal layer by adopting full-plate electroplating, and then conventionally manufacturing a circuit on the outer layer to finish the manufacture of the whole crossed blind slot plate.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (9)
1. A method for producing a cross blind groove plate with metal-free side walls, comprising the following production steps:
step a, manufacturing a pattern route on at least two double-sided copper-clad plates, and pressing and bonding the double-sided copper-clad plates through bonding sheets to form a multilayer plate after the route is etched;
b, manufacturing blind grooves on the multilayer board;
c, drilling through holes in the outer layer of the multilayer board and the formed blind grooves, carrying out copper deposition and full-board electroplating, and forming metallized holes penetrating through the whole board and formed in the blind grooves on the multilayer board;
d, paving protective layers at the bottom of the blind groove and on the side walls of all the metallized holes;
e, removing the copper layer plated on the side wall of the blind groove by passing the multilayer board containing the protective layer through a copper reduction wire;
and f, removing the protective layer, and removing the protective layer on the bottom of the blind groove and the side wall of the metallized hole to form a crossed blind groove plate.
2. The method of claim 1 wherein in step d the protective layer is solder mask ink and the solder mask ink covers all the metallized holes and the bottom of the blind via.
3. The method of claim 2 wherein in step d the solder mask ink coverage of the bottom of the blind via is spaced 2 mils from the bottom edge of the blind via, and the metallized holes have a solder mask ink coverage that is 5 mils larger than the via area at the location of the vias in the outer layer of the multiwall sheet.
4. The method of claim 2 wherein in step f, the decohered blind via is de-solder-plated to remove solder resist ink from the bottom of the blind via and from the metallized via.
5. The method of claim 1 wherein in step d the protective layer is a wet film and the wet film covers all the metallized holes and the bottom of the blind slot.
6. The method of claim 1 wherein in step c, the thickness of the copper layer is controlled to 5 μm, and in step e, the copper thickness of the copper line is controlled to 5 μm, and the copper layer on the side wall of the blind groove is removed.
7. The method for producing a cross blind groove plate with metal-free side walls according to claim 1, wherein in the step b, the blind groove is produced by using a laser blind groove milling process: firstly, etching copper at the position of a blind groove of a first metal layer in an upper double-sided copper-clad plate by adopting negative film photo-imaging, and milling the blind groove by laser after leaking a core plate medium.
8. The method of claim 1 further comprising step g of smoothing the face of the blind intersecting channel plate.
9. The method of claim 8 further comprising step h of thickening the metal layer by full plate plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110425448.8A CN113518517A (en) | 2021-04-20 | 2021-04-20 | Production method of crossed blind groove plate with metal-free side walls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110425448.8A CN113518517A (en) | 2021-04-20 | 2021-04-20 | Production method of crossed blind groove plate with metal-free side walls |
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| Publication Number | Publication Date |
|---|---|
| CN113518517A true CN113518517A (en) | 2021-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110425448.8A Pending CN113518517A (en) | 2021-04-20 | 2021-04-20 | Production method of crossed blind groove plate with metal-free side walls |
Country Status (1)
| Country | Link |
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| CN (1) | CN113518517A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN107770967A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board locally plates copper technology |
| CN108601217A (en) * | 2018-05-04 | 2018-09-28 | 生益电子股份有限公司 | A kind of preparation method and PCB of PCB |
| CN109246935A (en) * | 2018-10-30 | 2019-01-18 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove that side wall is non-metallic |
-
2021
- 2021-04-20 CN CN202110425448.8A patent/CN113518517A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN107770967A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board locally plates copper technology |
| CN108601217A (en) * | 2018-05-04 | 2018-09-28 | 生益电子股份有限公司 | A kind of preparation method and PCB of PCB |
| CN109246935A (en) * | 2018-10-30 | 2019-01-18 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove that side wall is non-metallic |
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Application publication date: 20211019 |
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