CN206237686U - A kind of one side overlength, ultra-thin internal layer circuit plate positioning device - Google Patents
A kind of one side overlength, ultra-thin internal layer circuit plate positioning device Download PDFInfo
- Publication number
- CN206237686U CN206237686U CN201621374122.8U CN201621374122U CN206237686U CN 206237686 U CN206237686 U CN 206237686U CN 201621374122 U CN201621374122 U CN 201621374122U CN 206237686 U CN206237686 U CN 206237686U
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- Prior art keywords
- ultra
- internal layer
- layer circuit
- circuit plate
- wiring board
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Abstract
The utility model is related to a kind of one side overlength, ultra-thin internal layer circuit plate positioning device, and it includes film positioning unit and the wiring board unit being located on film positioning unit；The wiring board unit includes containing unit and the edges of boards around unit in the plate in one side overlength, the plate of ultra-thin internal layer circuit plate body；The film positioning unit includes the film, and multiple PIN holes are provided with each side of the film around the edges of boards of the wiring board unit, and PIN nails are provided with the PIN holes.The utility model respectively sets multiple PIN holes by film short side long, and installation PIN screw tops live wiring board on PIN holes, to realize one side overlength, the positioning of ultra-thin internal layer circuit plate, bottom lamp exposure production can be carried out using big table top exposure machine, positioning, exposure only need one man operation, substantially increase quality and efficiency in one side overlength, ultra-thin wiring board manufacturing process.
Description
Technical field
The utility model is related to positioner field, and in particular to a kind of one side overlength, ultra-thin internal layer circuit plate positioning dress
Put.
Background technology
Wiring board is the basic components of electronic industry, and wherein overlength, ultra-thin wiring board are extensive due to its size advantage
It is applied to the fields such as space flight, communication.Overlength, ultra-thin wiring board are related to multiple programs and step in manufacturing process, wherein making
When internal layer needs contraposition, present technology generally needs two people simultaneously manually operated at plate two, positions and glues in the way of estimating
Rubberizing paper is fixed, and does not have more preferable alignment method, and this greatly reduces making quality and efficiency of the wiring board in this stage.
Utility model content
Originally the technical problem of new solution is：A kind of one side overlength, ultra-thin internal layer circuit plate positioning device are provided, overcome existing
Have in technology assist side manufacturing process and manually align that of poor quality, speed is slow, the problem of high cost.
In order to solve the above technical problems, the technical solution of the utility model is：
A kind of one side overlength, ultra-thin internal layer circuit plate positioning device are provided, it includes film positioning unit and is located at the film
Wiring board unit on positioning unit；The wiring board unit includes the plate containing one side overlength, ultra-thin internal layer circuit plate body
Interior unit and the edges of boards around unit in the plate；The film positioning unit includes the film, in the wiring board list
Multiple PIN holes are provided with each side of the film around the edges of boards of unit, PIN nails are installed on the PIN holes.
Wherein, the sideline of unit is the form wire sideline of unit in plate in the plate, and the sideline of the edges of boards is wiring board
Sawing sheet size sideline, the sideline of the film cuts sideline for the wiring board correspondence film.
Preferably, the PIN holes are arranged in a linear on each side of the film, line and the edges of boards at PIN holes center
Sideline it is parallel, and the PIN holes are tangent with the sideline of the edges of boards.
Preferably, the aperture in the PIN holes is 3.0mm.
Preferably, the PIN holes are got by target-shooting machine.
Preferably, the adjacent PIN pitchs of holes in each side are 100mm.Distalmost end PIN holes center spacing can be additionally used in measurement
Whether harmomegathus deforms the film.
Preferably, the PIN nail dimensions are 5.0mm × 1.2mm × 3.0mm.
Preferably, the wiring board thickness range is 0.15-1.6mm, and width range is 200-800mm, and length range is
200-2000mm。
Preferably, the one side overlength, ultra-thin internal layer circuit plate positioning device carry out bottom lamp using big table top exposure machine
Exposure operation.
It is of the present utility model to have the technical effect that：By on the long and short side of the film, multiple PIN holes, assist side exposure are respectively set
Each wiring board edges of boards are lived for installing PIN screw tops in manufacturing process, to realize one side overlength, the positioning of ultra-thin internal layer circuit plate,
Using big table top exposure machine carry out bottom lamp exposure production, positioning, exposure only need one man operation, substantially increase one side overlength,
Quality and efficiency in ultra-thin wiring board manufacturing process.
Brief description of the drawings
Fig. 1 is a kind of one side overlength, the structural representation of ultra-thin internal layer circuit plate positioning device in the utility model embodiment
Figure.
Specific embodiment
With reference to specific implementation, technical solutions of the utility model are further illustrated.
A kind of one side overlength, ultra-thin internal layer circuit plate positioning device as shown in Figure 1, it includes film positioning unit and sets
Wiring board unit on film positioning unit；The wiring board unit includes containing one side overlength, ultra-thin internal layer circuit plate sheet
Unit 1 and the edges of boards 2 around unit 1 in the plate in the plate of body；The film positioning unit includes the film 3, in institute
State and be provided with multiple PIN holes 4 on each side of the film 3 around the edges of boards 2 of wiring board unit, PIN is installed on the PIN holes 4
Nail.Wherein, the sideline of unit 1 is the form wire sideline of unit in plate, sideline the opening for wiring board of the edges of boards 2 in the plate
Material size sideline, described 3 sideline cuts sideline for the wiring board correspondence film.The PIN holes 4 are on each side of the film 3
It is arranged in a linear, the line at the center of PIN holes 4 is parallel with the sideline of the edges of boards 2, and the PIN holes 4 and the edges of boards 2
Sideline it is tangent.
In order to prepare and a kind of one side overlength, ultra-thin internal layer circuit plate positioning device using the present embodiment is, it is necessary to prepare：
PIN nails, the film, wiring board, high accuracy target-shooting machine, one side glue, big table top exposure machine.Specific implementation process is：According to wiring board
Size determine the position in PIN holes, to get PIN holes using high accuracy target-shooting machine；PIN nails are attached to the film from front
On PIN holes, and fixed with one side glue；Face down one side glue after the film cleaning of PIN nails will be installed, and to be fixed on cleaning dry
Net exposure frame glass table top；After completing above-mentioned steps, the one side internal layer circuit plate after press mold is faced down with dry film and is laid in
On the film, edges of boards are close to each PIN nails and realize positioning, and the lower exposure frame of lid completes that after vacuumizing gas normal exposure need not be caught up with, exposed
Wiring board is taken out into after realizing pattern transfer, so circulation carries out batch making.
What the present embodiment can be obtained has the technical effect that：By on the long and short side of the film, multiple PIN holes, assist side are respectively set
Live each wiring board edges of boards to realize that one side overlength, ultra-thin internal layer circuit plate are determined for installing PIN screw tops in exposure manufacturing process
Position, bottom lamp exposure production is carried out using big table top exposure machine, and positioning, exposure only need one man operation, substantially increase one side and surpass
Quality and efficiency and cost of labor is reduced in long, ultra-thin wiring board manufacturing process.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the ordinary skill of the utility model art
For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, should all regarded
To belong to protection domain of the present utility model.
Claims (7)
1. a kind of one side overlength, ultra-thin internal layer circuit plate positioning device, it is characterised in that including film positioning unit and be located at phenanthrene
Wiring board unit on woods positioning unit；The wiring board unit includes unit (1) and position in the plate containing wiring board body
Edges of boards (2) around unit (1) in the plate；The film positioning unit includes the film (3), in the wiring board unit
Multiple PIN holes (4) are provided with the film (3) each side around edges of boards (2), PIN nails are installed on the PIN holes (4).
2. one side overlength according to claim 1, ultra-thin internal layer circuit plate positioning device, it is characterised in that the PIN holes
(4) it is arranged in a linear on the film (3) each side, the line at PIN holes (4) center is parallel with the sideline of the edges of boards (2), and
The PIN holes (4) are tangent with the sideline of the edges of boards (2).
3. one side overlength according to claim 1, ultra-thin internal layer circuit plate positioning device, it is characterised in that the PIN holes
Aperture be 3.0mm.
4. one side overlength according to claim 2, ultra-thin internal layer circuit plate positioning device, it is characterised in that each side
Adjacent PIN pitchs of holes are 100mm.
5. one side overlength according to claim 1, ultra-thin internal layer circuit plate positioning device, it is characterised in that the PIN nails
Size is 5.0mm × 1.2mm × 3.0mm.
6. one side overlength according to claim any one of 1-5, ultra-thin internal layer circuit plate positioning device, it is characterised in that institute
Wiring board thickness range is stated for 0.15-1.6mm, width range is 200-800mm, and length range is 200-2000mm.
7. one side overlength according to claim 1, ultra-thin internal layer circuit plate positioning device, it is characterised in that the one side surpasses
Long, ultra-thin internal layer circuit plate positioning device carries out lamp exposure operation of going to the bottom using big table top exposure machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621374122.8U CN206237686U (en) | 2016-12-14 | 2016-12-14 | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621374122.8U CN206237686U (en) | 2016-12-14 | 2016-12-14 | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206237686U true CN206237686U (en) | 2017-06-09 |
Family
ID=58992003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621374122.8U Active CN206237686U (en) | 2016-12-14 | 2016-12-14 | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206237686U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107257602A (en) * | 2017-08-11 | 2017-10-17 | 珠海精毅电路有限公司 | A kind of circuit inner cord preparation method for communication antenna component carrier |
| CN108513444A (en) * | 2018-06-29 | 2018-09-07 | 深圳市金百泽电子科技股份有限公司 | A kind of overlength plate pattern-producing method |
| CN112947017A (en) * | 2021-01-29 | 2021-06-11 | 珠海杰赛科技有限公司 | Circuit alignment method suitable for manual exposure machine |
-
2016
- 2016-12-14 CN CN201621374122.8U patent/CN206237686U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107257602A (en) * | 2017-08-11 | 2017-10-17 | 珠海精毅电路有限公司 | A kind of circuit inner cord preparation method for communication antenna component carrier |
| CN108513444A (en) * | 2018-06-29 | 2018-09-07 | 深圳市金百泽电子科技股份有限公司 | A kind of overlength plate pattern-producing method |
| CN112947017A (en) * | 2021-01-29 | 2021-06-11 | 珠海杰赛科技有限公司 | Circuit alignment method suitable for manual exposure machine |
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