CN106332464A - Manufacturing process of plating gold capable of saving gold salt - Google Patents
Manufacturing process of plating gold capable of saving gold salt Download PDFInfo
- Publication number
- CN106332464A CN106332464A CN201610783890.7A CN201610783890A CN106332464A CN 106332464 A CN106332464 A CN 106332464A CN 201610783890 A CN201610783890 A CN 201610783890A CN 106332464 A CN106332464 A CN 106332464A
- Authority
- CN
- China
- Prior art keywords
- gold
- plating
- saving
- plated
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
The invention provides a manufacturing process of plating gold capable of saving gold salt. The process includes specific steps: units discarded in the former process are selected from to-be-plated large gold plates, wrapped by high-temperature-resistant adhesive tapes, and compressed by employing a pressing and sealing machine, gold plating is performed after inspection and confirmation of the wrapping, and the discarded plates without gold plating are selected after the forming process. By employing the process, discard of plating gold can be avoided, the consumption of the gold salt is reduced, and the production cost can be lowered.
Description
Technical field
The present invention relates to the heavy gold-plated process that pcb board manufactures, be specifically related to the processing technology of a kind of heavy gold-plated saving gold salt.
Background technology
Pcb board, also known as printed circuit board (PCB), printed substrate, is called for short printed board, with insulation board as base material, is cut into a scale
Very little, at least with a conductive pattern on it, and cloth is porose, face (PAD) convenient patch components and parts, and realizes between electronic devices and components
Be connected with each other.
Along with market development, by chemical nickel and gold or the side of electronickelling gold on more customer requirement printed circuit board aperture, face
Formula one layer of gold of plating, protects nickel face, meets good upper stannum.In each operation manufacturing process, certain fraction defective can be there is, produce
Life is scrapped.Gold salt is expensive, and in heavy gold-plated batch production, the written-off unit of front operation is left intact can be because reporting
Gold on useless plate, causes waste.
Summary of the invention
The technical problem to be solved is to provide one and avoids scrapping turmeric, saves gold salt consumption, can reduce raw
Produce the processing technology of the heavy gold-plated saving gold salt of cost.
The technical solution adopted for the present invention to solve the technical problems is: the processing technology of a kind of heavy gold-plated saving gold salt,
Concretely comprise the following steps: from after heavy gold-plated big sheet being selected front operation and scraps unit, be first coated with by High temperature-resistanadhesive adhesive tape, then use
Glue pressing machine compresses, and confirms that cladding carries out turmeric after good on inspection, after molding procedure (big sheet is divided into small pieces needed for client),
Non-turmeric is scrapped plate select.
Utilize the present invention can avoid scrapping turmeric, save gold salt consumption, production cost can be reduced.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
Embodiment
The processing technology of the heavy gold-plated saving gold salt of the present embodiment, concretely comprises the following steps: select heavy gold-plated big sheet from treating
After front operation scraps unit, first it is coated with by High temperature-resistanadhesive adhesive tape, then compresses with glue pressing machine, confirm that cladding is carried out after good on inspection
Turmeric, after molding procedure (big sheet is divided into small pieces needed for client), scraps plate by non-turmeric and selects.
Utilize the present invention can avoid scrapping turmeric, save gold salt consumption, production cost can be reduced.
Claims (2)
1. the processing technology of a heavy gold-plated saving gold salt, it is characterised in that concretely comprise the following steps: from treating choosing heavy gold-plated big sheet
Go out after front operation scraps unit, be first coated with by High temperature-resistanadhesive adhesive tape, then compress with glue pressing machine, confirm that cladding is good the most laggard on inspection
Row turmeric, after molding procedure, scraps plate by non-turmeric and selects.
The processing technology of heavy gold-plated saving gold salt the most according to claim 1, it is characterised in that molding procedure refers to greatly
Sheet is divided into small pieces needed for client.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610783890.7A CN106332464A (en) | 2016-08-31 | 2016-08-31 | Manufacturing process of plating gold capable of saving gold salt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610783890.7A CN106332464A (en) | 2016-08-31 | 2016-08-31 | Manufacturing process of plating gold capable of saving gold salt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106332464A true CN106332464A (en) | 2017-01-11 |
Family
ID=57789080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610783890.7A Pending CN106332464A (en) | 2016-08-31 | 2016-08-31 | Manufacturing process of plating gold capable of saving gold salt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106332464A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN113923870A (en) * | 2021-09-18 | 2022-01-11 | 宏华胜精密电子(烟台)有限公司 | Preparation method of circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237506A (en) * | 2000-02-21 | 2001-08-31 | Sanyo Electric Co Ltd | Mounting substrate, and device and method for detecting bad mark |
| CN202738276U (en) * | 2011-06-13 | 2013-02-13 | 松下电器产业株式会社 | Electronic component installation system |
| CN105517350A (en) * | 2015-11-27 | 2016-04-20 | 北大方正集团有限公司 | Manufacturing method for printed circuit board |
-
2016
- 2016-08-31 CN CN201610783890.7A patent/CN106332464A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237506A (en) * | 2000-02-21 | 2001-08-31 | Sanyo Electric Co Ltd | Mounting substrate, and device and method for detecting bad mark |
| CN202738276U (en) * | 2011-06-13 | 2013-02-13 | 松下电器产业株式会社 | Electronic component installation system |
| CN105517350A (en) * | 2015-11-27 | 2016-04-20 | 北大方正集团有限公司 | Manufacturing method for printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN111050491B (en) * | 2019-12-19 | 2021-07-20 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN113923870A (en) * | 2021-09-18 | 2022-01-11 | 宏华胜精密电子(烟台)有限公司 | Preparation method of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170111 |
|
| RJ01 | Rejection of invention patent application after publication |