CN115955786A - Production process of three-side wrapped Jin Dujin finger - Google Patents
Production process of three-side wrapped Jin Dujin finger Download PDFInfo
- Publication number
- CN115955786A CN115955786A CN202211688349.XA CN202211688349A CN115955786A CN 115955786 A CN115955786 A CN 115955786A CN 202211688349 A CN202211688349 A CN 202211688349A CN 115955786 A CN115955786 A CN 115955786A
- Authority
- CN
- China
- Prior art keywords
- gold
- finger
- film
- plated
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a production process of a Jin Dujin finger with three surfaces, which is characterized in that the finger is connected to the front end of a gold finger in a mode of drawing a lead wire and printing a wet film in a silk screen mode, so that the gold finger is conducted with the whole PCB surface, the production of the gold-plated finger is finished in a nickel-gold electroplating mode, then a dry film is pressed, the lead wire is etched, and then the post-process manufacturing is carried out; the main key points of the process are as follows: the quality of a silk-screen wet film, the temperature and time of pre-drying, the exposure energy, the parameters of gold-plated fingers and the quality of etched leads; the production process is simple and feasible, the production flow of the gold-plated finger with three gold-coated surfaces is optimized, the defects of lead wire residue caused by the traditional lead wire tearing process and diffusion plating and the like caused by the dry film pressing or blue glue pressing process are solved, and the produced gold finger has better operability, higher yield and better quality and can be produced in large batch.
Description
Technical Field
The invention relates to a production process of a golden finger, in particular to a production process of a three-surface-wrapped Jin Dujin finger, and belongs to the field of PCB boards.
Background
With the rapid development of the electronic industry, the demands of leading-edge tips and special products are urgent, a simple single-double-sided circuit board cannot meet the market, and PCB enterprises can make a survival place in the industries of hundreds of flowers with higher research and development precision, thinner circuits and complex diversification. In the manufacturing process of the PCB, fingers need to be plated on the board in a gold plating mode, signals are transmitted through the fingers, the fingers are pads which are inserted into the clamping grooves and are in contact conduction with the metal spring pieces in the clamping grooves and arranged like the fingers, and due to the fact that the design has high requirements on the wear resistance and the conductivity of the surfaces of the pads, a layer of nickel and a layer of gold can be plated on the surfaces of the pads.
With the rise of a large number of electronic products, the demand of the PCB market is also gradually increasing, and the finger part connected with the high-speed signal line in the PCB has higher performance, appearance and quality requirements. Because the existing production process of gold-plated fingers with three gold-coated surfaces usually adopts a mode of producing bevel edges, tearing lead wires by hands, pressing blue glue or pressing dry films, the existing production process has the defects of lead wire residue, diffusion plating, gaps, copper exposure, substrate damage, front end tilting of fingers and the like which cannot be well solved all the time, the manual production efficiency is poor, the cost is greatly increased, the competitiveness is low, especially for long and short gold fingers and segmented gold finger products, therefore, the patent CN107318231A is a manufacturing method of a gold finger and a printed circuit board, the long gold finger, the short gold finger and/or the segmented gold finger can be manufactured by arranging a position supplementing lead wire and carrying out three times of outer layer pattern transfer, the manufacturing method is simple, the quality of the gold finger can be ensured, the industry requirements are met, the manufacturing process of the printed circuit board is simplified, and the manufacturing efficiency of the circuit board is improved; the method for plating gold fingers on the PCB of the patent CN107734876A adopts a simple method to remove the leads of the gold fingers on the PCB, has low process requirement and low cost, is suitable for batch production, and ensures that the manufactured PCB has stable quality; however, the yield of the gold fingers is not optimized in the above patents, and the appearance yield of the gold fingers is low at present and cannot be solved, so a new process and a new method are urgently needed to improve or solve the main abnormality, so that the yield is improved, and the competitiveness is improved.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and provides a production process of a Jin Dujin finger with three-side bags, wherein the production process is simple and easy to implement, and the produced gold finger has higher yield and better quality.
In order to solve the technical problem, the invention provides a production process of a three-surface-wrapped Jin Dujin finger, which specifically comprises the following steps:
s1: the method comprises the steps of carrying out pretreatment from cutting to inner core plates, coating a wet film, exposing, developing and etching to finish pattern transfer of inner circuits, then transferring to inner AOI for maintenance and punching out rivet holes, and then transferring to laminating production;
s2: the inner core plate is browned after pretreatment, PP is cut to complete pre-lamination, then the plates are arranged to carry out laminating production on the outermost layer, and if laminating is required for multiple times, the outer core plate is circularly produced for multiple times among 5 working procedures of laser/drilling → electroplating → circuit → AOI → laminating;
s3: the PCB board pressed out at the last time is transferred to laser or drilling processing, then the hole is subjected to copper deposition processing of metallization conduction, and then filling of the blind hole and whole board electroplating of the through hole are carried out;
s4: and then carrying out pattern transfer processing on the outer layer circuit on the electroplated PCB, wherein the pattern transfer processing flow comprises the following steps: preprocessing, film pressing, exposing, developing, etching and film removing, wherein a golden finger lead of a unit is made during pattern transfer processing, meanwhile, in the pattern transfer processing process, a dry film cannot be deflected during film pressing, copper is required to be left on a plate edge to be larger than 1mm, and the plate after etching is transferred to AOI maintenance processing;
s5: transferring the repaired OK PCB to solder mask production, wherein the solder mask production flow comprises the following steps: pretreatment, silk-screen printing/spraying, pre-baking, exposure and development, and specifically comprises the following steps:
pre-treating a roughened copper surface and a cleaned board surface, uniformly coating solder resist ink on a PCB (printed Circuit Board) by adopting a screen printing or spraying mode, pre-drying, exposing and developing, paying attention to incomplete coverage of false exposure and the solder resist ink on the edge of the PCB, and simultaneously windowing out a gold finger lead in a unit;
s6: the production of characters is carried out after the solder mask production of the PCB is finished, silk-screen characters are adopted during the production of the characters, the thickness of the control characters is less than 30um, and then impedance testing is carried out;
s7: after the characters are produced, removing the solder mask and silk screen printing wet film, wherein the solder mask and silk screen printing wet film comprises the following steps: pretreatment, silk-screen printing, prebaking, exposure, development, air exposure/UV baking and AVI, and specifically comprises the following steps:
the pretreatment is only carried out by pickling, the thickness, the pre-drying temperature and time and the exposure energy of a silk-screen wet film are controlled, the development is carried out by air exposure or UV (ultraviolet) baking, then AVI (automatic voltage indicator) maintenance is carried out, and the residual glue, foreign matters and dirty points on the copper surface of the gold finger are manually scraped after scanning;
s8: the method comprises the following steps that (1) after AVI maintenance, a PCB is rotated to remove an outer-pressed gold-plated dry film, but pretreatment is not carried out, film pressing is directly carried out, then exposure and development are carried out, an area which does not need gold plating is covered, and then surface treatment is rotated to carry out processing of gold finger nickel gold electroplating;
s9: the PCB plated with the golden fingers is subjected to outer layer transfer to remove a dry film and a wet film, then the dry film, exposure, development and etching of the lead are pressed and etched without pretreatment, the lead is completely etched, then the film is removed, then the dry film, exposure and development are directly pressed and selected without pretreatment, the surface treatment is carried out after the development to complete selective gold deposition, then the film is removed, and then the processing of the forming, electrical testing and final inspection processes is carried out.
The technical scheme of the invention is further defined as follows:
further, in the production process of the gold-plated finger with three gold-coated surfaces, when the PP is cut in the step S2, if the PP is high-glue or a plurality of PP or a plurality of core plates are pressed, hot melting and riveting are carried out.
The method has the advantages that when the PP is high-quality glue or a plurality of PP or a plurality of core plates are laminated, hot melting and riveting operations are required to be carried out according to actual specific conditions by adopting the prior art, so that the sliding plate is prevented from causing layer deviation.
In the production process of the gold-plated finger with three gold-coated surfaces, the gold fingers comprise common gold fingers with the same length and parallel and level, long and short gold fingers with different lengths of fingers in a unit, and segmented fingers with 1 or more segments of fingers in the unit.
In the production process of the gold-plated finger with the gold-plated three surfaces, in the step S1, the PCB is subjected to inner layer processing, and 6-8 rivet holes are punched.
In the production process of the gold-plated finger with three gold-coated surfaces, the PCB is laminated, drilled, copper-deposited and electroplated in the step S3, the HDI board needs to be pressed for at least 2 times, the backlight grade of the copper-deposited board is higher than 9 grade, the blind hole is filled and leveled during electroplating, and the control concavity is smaller than 15um.
In the production process of the gold-plated finger with three gold-covered surfaces, etching liquid medicine is sodium persulfate solution during etching in the step S4, all circuits on the outer layer of the PCB are manufactured, and the gold finger containing units is externally pulled to form a common gold finger, a long gold finger and a short gold finger or a sectioned gold finger.
In the production process of the gold-plated finger with three gold-coated surfaces, the uncovered area of the solder resist ink at the plate edge needs to be larger than 2mm in the step S5 of solder resist production.
The method has the advantages that in the step S5, the false exposure and the incomplete covering of the solder resist ink on the edge of the PCB are noticed, otherwise, the quality of the subsequent gold-plated finger is influenced, and meanwhile, the lead of the gold finger in the unit needs to be windowed out so as to facilitate the subsequent lead etching.
In the production process of the gold-plated finger with three gold-coated surfaces, the thickness of a wet film in the production of the solder mask wet film in the step S7 is 40-50um, the screen printing is kept still for 15-20min, the screen printing is pre-dried for 15-35min at the temperature of 70-75 ℃, the exposure energy is 9-10 grids, the expansion and contraction of the exposure film are controlled to +/-0.025mm, and 200mj energy or UV (ultraviolet) baking is added for 1 time after development and air exposure.
The method has the advantages that the pretreatment is only carried out by pickling, the thickness, the pre-drying temperature and time and the exposure energy of the silk-screen wet film are controlled, and the air exposure or the UV baking is needed after the development, so that the silk-screen wet film is better cured, the adhesive force between the wet film and the copper surface is increased, and the risk of diffusion plating during the gold-plated finger is reduced.
In the production process of the gold-plated finger with three gold-covered surfaces, the current in the production process of electroplating nickel and gold in the step S8 is less than 2.5A.
The technical effect is that the Rong Yishao plate with overhigh current is easier to be subjected to diffusion plating and has large risk.
In the production process of the gold-plated finger with three gold-coated surfaces, the de-wetting film and the dry film which are plated with nickel and gold in the step S9 are produced at a linear speed of 0.5-0.8m/min, the etching lead liquid medicine is ammonium chloride solution, and the side etching amount is less than 0.025mm; the liquid medicine for 3 times of film removal is sodium hydroxide solution.
The technical effect is that the production is carried out at the linear speed of 0.5-0.8m/min, dry film and wet film are removed at a lower linear speed, the speed cannot be high, and the condition that the subsequent etching is influenced because the film is removed is not clear is prevented.
The invention has the beneficial effects that:
in the invention S4, the dry film can not be biased in the process of pattern transfer treatment, the bias can cause copper on the edge of the PCB board to be etched, the copper needs to be left on the edge of the board, and the influence on the conductive effect due to insufficient contact area when the gold-plated finger is plated is avoided, so that the quality of the gold-plated finger is influenced.
In step S6, in order to avoid the abnormality that the film is not completely removed due to the film clamping phenomenon after three times of film removal after gold plating of fingers, the appearance quality is influenced, particularly the identification of the two-dimensional code is influenced, so that the method only can be used for silk-screen printing production, cannot be used for spray printing, and needs to reduce the thickness of characters as much as possible on the premise of meeting the requirements of customers.
In the invention, after the development in the step S7, the exposure to the air or the UV baking is needed to be carried out, so that the curing is better, the adhesive force between a wet film and the copper surface is increased, the risk of the diffusion plating during the gold-plating of the fingers is reduced, then the AVI maintenance is carried out, the residual glue, the foreign matters and the dirty points on the copper surface of the gold finger are manually scraped after the scanning, and the bad ratio of the copper exposure of the finger during the gold-plating of the finger is reduced.
On the premise of the existing equipment and process capability, the process is optimized in the early stage according to local conditions, the production is carried out in a mode of solder mask printing wet film, pressing gold-plated dry film and etching lead wires, the outer-layer circuit, AOI inspection and solder mask normal production are carried out, characters need to be produced in a screen printing mode, the phenomenon that the characters are too high and sandwich the film when the gold-plated dry film gold-plated fingers are pressed subsequently is avoided, the subsequent process parameters of screen printing width, wet film thickness, pre-baking temperature, exposure energy, development, gold-plated current and voltage and the like of the wet film have high requirements, the side etching amount of the fingers also needs to be controlled emphatically when the lead wires are etched, the gold hanging OK of the fingers is guaranteed, and the quality abnormal risks such as finger gaps/edge collapse, lead wire residues and the like are reduced, so that on the premise that the whole process is not changed and equipment is not changed, the continuous optimization of production parameters of each process becomes significant, the increasingly strict appearance and the quality of the PCB is met, the DOE production parameters of the key process are compared and tested, the optimal production process parameters are confirmed, the yield is gradually kept at 92% and the straight-through rate of finished products is gradually kept, and the yield is improved;
according to the invention, new automatic equipment is purposefully introduced at the later stage, the qualification rate and the inspection efficiency in the production process are effectively improved and the inspection standardization is effectively improved, for example, an AVI automatic scanner and maintenance are introduced, the residual glue, foreign matters and other dirt on the finger copper surface before gold plating can be effectively removed, and the process reject ratio is reduced by at least 5%;
after the invention is effectively improved by people, machines, materials, methods and rings, the final yield of the product with three surfaces covered with gold is improved to 90-97% from 80-85% in the prior art, and the samples are gradually advanced to small batches and large batches, so that the requirements of customers are met, the production efficiency is obviously improved, and the competitiveness is greatly improved.
Drawings
FIG. 1 is a flow chart of a production process of a gold-plated finger with three gold-coated surfaces in an embodiment of the invention;
FIG. 2 is a diagram of a finished product of a common gold finger produced by a production process of wrapping Jin Dujin fingers on three sides according to an embodiment of the present invention;
FIG. 3 is a diagram of a finished product of a long and short golden finger produced by a production process of wrapping Jin Dujin fingers on three sides according to an embodiment of the present invention;
FIG. 4 is a diagram of a segmented gold finger produced by the production process of the embodiment of the present invention using a three-sided bag Jin Dujin finger;
Detailed Description
Example 1
The production process of the three-side wrapped Jin Dujin finger provided by the embodiment specifically includes the following steps as shown in fig. 1:
s1: the method comprises the steps of carrying out pretreatment from cutting to an inner layer core plate, coating a wet film, exposing, developing and etching to finish pattern transfer of an inner layer circuit, then transferring to inner layer AOI for overhauling and 6-8 punched rivet holes, and then transferring to press-fitting production;
the inner layer pretreatment process specifically comprises the following steps: plate entering → degreasing → water washing → micro-etching → water washing → acid washing → water washing → drying → plate discharging, inner layer pretreatment: cleaning the plate surface, removing copper surface oxidation, increasing the micro roughness of the copper surface, and enhancing the binding force between the copper surface and a dry film or a wet film;
s2: browning the inner core plate through pretreatment, then cutting PP to complete pre-stacking, then arranging plates to perform outermost layer pressing production, and if pressing needs to be performed for multiple times, performing multiple cycle production among 5 working procedures of laser/drilling → electroplating → circuit → AOI → pressing;
the lamination pretreatment process specifically comprises the following steps: plate entering → acid washing → water washing → alkali washing → water washing → presoaking → brown oxidation → water washing → drying → plate discharging, pre-pressing treatment: removing oxides and oil stains on the copper surface, roughening the copper surface, and forming an organic metal film with the copper surface to enhance the bonding force with PP;
s3: transferring the PCB pressed at the last time to laser or drilling processing (the HDI board needs laser and drilling processing), then carrying out copper deposition processing on the holes for metallization conduction, and then carrying out filling and leveling of blind holes and whole board electroplating of through holes;
s4: and then carrying out pattern transfer processing on the outer layer circuit on the electroplated PCB, wherein the pattern transfer processing flow comprises the following steps: preprocessing, film pressing, exposing, developing, etching and film removing, wherein a golden finger lead of a unit is made during pattern transfer processing, meanwhile, in the pattern transfer processing process, a dry film cannot be deflected during film pressing, copper is required to be left on a plate edge to be larger than 1mm, and the plate after etching is transferred to AOI maintenance processing;
the outer layer pretreatment process specifically comprises the following steps: plate entering → acid washing → water washing → plate grinding → water washing + ultrasonic wave soaking → super coarsening → water washing → acid washing → water washing → drying → plate discharging, outer layer pretreatment: cleaning the plate surface, removing oxides, oil stains and other dirt on the copper surface, and roughening the copper surface to enhance the binding force between the copper surface and a dry film;
s5: transferring the repaired OK PCB to solder mask production, wherein the solder mask production flow is as follows: pretreatment (which is not the same as that of an outer layer circuit), silk-screen printing/spraying, pre-baking, exposure and development, and specifically comprises the following steps:
pre-treating a roughened copper surface and a cleaned board surface, uniformly coating solder resist ink on a PCB (printed Circuit Board) by adopting a screen printing or spraying mode, pre-drying, exposing and developing, paying attention to false exposure and incomplete coverage of the solder resist ink on the edges of the PCB, wherein the uncovered area of the solder resist ink on the edges of the board needs to be more than 2mm, and simultaneously windowing out a gold finger lead in a unit;
the solder resist pretreatment process specifically comprises the following steps: plate entering → acid washing → water washing → plate grinding → volcanic ash → water washing + ultrasonic wave soaking → water washing → drying → plate discharging, pre-treatment effect of resistance welding: removing oxides, oil and impurities on the board surface, thoroughly cleaning and roughening the board surface to ensure that the board surface has good bonding force with the solder resist ink;
s6: the PCB board which is subjected to solder mask production is produced, characters are produced, silk screen printing is adopted during the production of the characters, the thickness of the control characters is less than 30um, and then impedance testing is carried out;
s7: after the characters are produced, removing the solder mask and silk screen wet film, wherein the solder mask and silk screen wet film process comprises the following steps: pretreatment (only acid cleaning, guan Moshua and volcanic ash), silk screen printing, prebaking, exposure, development, air exposure/UV baking and AVI, and the method specifically comprises the following steps:
the pretreatment is only acid washing, the thickness of a silk-screen wet film is controlled to be 40-50 mu m, the silk-screen is kept still for 15-20min after finishing silk-screen printing, the pre-drying temperature is 70-75 ℃, the pre-drying is 15-35min, the exposure energy is 9-10 grids, the expansion and contraction of the exposure film is controlled to be +/-0.025mm, 200mj energy or UV baking is added for 1 time after development and air exposure, then AVI maintenance is removed, and the residual glue, foreign matters and dirty points on the copper surface of the golden finger are manually scraped after scanning;
s8: the method comprises the following steps that (1) after AVI maintenance, a PCB is subjected to external pressure gold-plated dry film removing, pretreatment is not carried out, film pressing is directly carried out, then exposure and development are carried out, an area which does not need gold plating is covered, then surface treatment is carried out, gold finger nickel and gold electroplating processing is carried out, and the current in the nickel and gold electroplating production process is less than 2.5A;
s9: the PCB plated with the golden finger is produced at a linear speed of 0.5-0.8m/min by removing the outer layer, a dry film and a wet film are removed, then the lead is subjected to press etching on a dry film, exposure, development and etching after pretreatment, the lead is completely etched, no lead residue is allowed, film stripping is performed, then the pretreatment is not performed, the dry film is directly pressed and selected, the exposure and the development are performed, the surface treatment is removed after the development to complete selective gold deposition, then the film stripping is performed, then the processing of the molding, electrical measurement and final inspection processes is performed, and the finally produced golden finger is shown in a figure 2-4;
the film removing process for the third time is not allowed to be completed, the liquid medicine for etching the lead is ammonium chloride solution, the lead is not allowed to remain, the lateral etching amount is less than 0.025mm, and the liquid medicine for removing the film for the 3 times is sodium hydroxide solution.
In this embodiment, when cutting the PP in step S2, if the PP is high-glue or has multiple PPs or multiple core boards in lamination, hot melting and riveting are performed.
In this embodiment, the golden fingers include common golden fingers with the same length and the same level, long and short golden fingers with different lengths of fingers in the unit, and segmented fingers with 1 segment or multiple segments of fingers in the unit.
In this embodiment, in step S3, the PCB is laminated, drilled, copper-deposited and electroplated, the HDI board needs to be pressed at least 2 times, the backlight level of copper deposition is greater than 9, the blind holes need to be filled as far as possible during electroplating, and the controlled dishing degree diamond is less than 15um.
In this embodiment, the etching solution used in the etching in step S4 is a sodium persulfate solution, and all the circuits on the outer layer of the PCB are manufactured, and the gold finger including the unit is pulled out to form a common gold finger, a long gold finger, a short gold finger, or a segmented gold finger as shown in fig. 2-4.
In the step S7, after the characters are produced, removing the solder mask and silk screen wet film, and carrying out DOE comparison test on production parameters of the silk screen wet film according to the prior art, wherein the specific data are shown in Table 1;
table 1DOE comparative test data
As can be seen from Table 1, the present invention performs DOE comparison test on production parameters of a silk-screen wet film process, so that in the production of a solder mask wet film, the wet film thickness is 40 μm, the screen printing needs to be kept still for 15-20min, the pre-baking is performed at 75 ℃ for 15-35min, the exposure energy is 9-10 grids, the expansion and contraction of the exposure film is controlled to +/-0.025mm, and after the development, the empty exposure is performed and then 200mj energy or UV baking is performed for 1 time, such technological parameters promote the through rate in the production process, and the yield of finished products is more than 92% or even up to 97%, and is gradually improved and kept stable.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.
Claims (10)
1. The production process of the Jin Dujin finger with three surfaces is characterized by comprising the following steps:
s1: the method comprises the steps of carrying out pretreatment from cutting to inner core plates, coating a wet film, exposing, developing and etching to finish pattern transfer of inner circuits, then transferring to inner AOI for maintenance and punching out rivet holes, and then transferring to laminating production;
s2: the inner core plate is browned after pretreatment, PP is cut to complete pre-lamination, then the plates are arranged to carry out laminating production on the outermost layer, and if laminating is required for multiple times, the outer core plate is circularly produced for multiple times among 5 working procedures of laser/drilling → electroplating → circuit → AOI → laminating;
s3: the PCB pressed out at the last time is transferred to laser or drilling processing，Then carrying out copper deposition treatment on the holes for metallization conduction, and then carrying out filling and leveling of blind holes and whole-plate electroplating of through holes;
s4: and then carrying out pattern transfer processing on the outer layer circuit on the electroplated PCB, wherein the pattern transfer processing flow comprises the following steps: pretreatment, film pressing, exposure, development, etching and film removal, wherein a golden finger lead of a unit is made during pattern transfer treatment, and meanwhile, in the pattern transfer treatment process, attention is paid to the fact that a dry film cannot be biased during film pressing, and copper needs to be left at the edge of a plate＞1mmThe plate after etching is transferred to AOI maintenance treatment;
s5: transferring the repaired OK PCB to solder resist production, wherein the solder resist production flow comprises the following steps: pretreatment, silk-screen printing/spraying, pre-baking, exposure and development, which specifically comprises the following steps:
pre-treating a roughened copper surface and a cleaned board surface, uniformly coating solder resist ink on a PCB (printed Circuit Board) by adopting a screen printing or spraying mode, pre-drying, exposing and developing, paying attention to false exposure and incomplete coverage of the solder resist ink on the edge of the PCB, and windowing out a gold finger lead in a unit;
s6: the PCB board which is subjected to solder mask production is produced, characters are produced, silk screen printing is adopted during the production of the characters, the thickness of the control characters is less than 30um, and then impedance testing is carried out;
s7: after the characters are produced, removing the solder mask and silk screen printing wet film, wherein the solder mask and silk screen printing wet film comprises the following steps: pretreatment, silk-screen printing, prebaking, exposure, development, air exposure/UV baking and AVI, and specifically comprises the following steps:
the pretreatment is only carried out by pickling, the thickness, the pre-drying temperature and time and the exposure energy of a silk-screen wet film are controlled, the development is carried out by air exposure or UV baking, then AVI maintenance is carried out, and the residual glue, the foreign matters and dirty spots on the copper surface of the golden finger are manually scraped after scanning;
s8: the method comprises the following steps that (1) after AVI maintenance, a PCB is subjected to outer-layer pressure gold-plated dry film transfer, but pretreatment is not carried out, film pressing is directly carried out, then exposure and development are carried out, an area which does not need gold plating is covered, and then surface treatment is carried out to carry out processing of gold finger nickel gold electroplating;
s9: the PCB plated with the golden fingers is subjected to outer layer transfer to remove a dry film and a wet film, then the dry film, exposure, development and etching of the lead are pressed and etched without pretreatment, the lead is completely etched, then the film is removed, then the dry film, exposure and development are directly pressed and selected without pretreatment, the surface treatment is carried out after the development to complete selective gold deposition, then the film is removed, and then the processing of the forming, electrical testing and final inspection processes is carried out.
2. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: and when cutting the PP in the step S2, carrying out hot melting and riveting operation if the PP is high-gum or a plurality of PP or a plurality of core plates are laminated.
3. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: the golden finger comprises a common golden finger with the same length and parallel level, a long golden finger with different lengths of fingers in the unit, and a segmented finger with 1 segment or multiple segments of fingers in the unit.
4. The process for producing gold-plated fingers with three-side gold-coating according to claim 1, wherein the process comprises the following steps: in the step S1, inner layer processing is performed on the PCB, and 6-8 rivet holes are punched.
5. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: and in the step S3, laminating, drilling, copper deposition and electroplating are carried out on the PCB, the HDI board needs to be pressed for at least 2 times, the backlight grade of the copper deposition is more than 9 grade, the blind hole is filled and leveled during electroplating, and the control concavity Dimple is less than 15 mu m.
6. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: and in the step S4, etching liquid medicine is sodium persulfate solution during etching, all circuits on the outer layer of the PCB are manufactured, and the golden finger comprising the unit is pulled out to form a common golden finger, a long golden finger or a short golden finger or a sectioned golden finger.
7. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: and S5, the uncovered area of the solder resist ink at the edge of the board during solder resist production needs to be larger than 2mm.
8. The process for producing gold-plated fingers with three-side gold-coating according to claim 1, wherein the process comprises the following steps: in the step S7, the thickness of the wet film in the solder mask wet film production is 40-50 mu m, the screen printing needs to be kept still for 15-20min, the screen printing is pre-dried for 15-35min at the temperature of 70-75 ℃, the exposure energy is 9-10 grids, the expansion and contraction of the exposure film is controlled to +/-0.025mm, and the screen printing is carried out after the development and then 200mj energy or UV baking is carried out for 1 time.
9. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: and in the step S8, the current in the production process of the electroplated nickel and gold is less than 2.5A.
10. The process for producing gold-plated finger covered with gold on three sides according to claim 1, wherein: the de-wetting film and the dry film after nickel and gold electroplating in the step S9 are produced at a linear speed of 0.5-0.8m/min, the lead etching liquid medicine is an ammonium chloride solution, the lead is not allowed to remain, the side etching amount is less than 0.025mm, and the film removing liquid medicine for 3 times is a sodium hydroxide solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211688349.XA CN115955786A (en) | 2022-12-27 | 2022-12-27 | Production process of three-side wrapped Jin Dujin finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211688349.XA CN115955786A (en) | 2022-12-27 | 2022-12-27 | Production process of three-side wrapped Jin Dujin finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115955786A true CN115955786A (en) | 2023-04-11 |
Family
ID=87291000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211688349.XA Pending CN115955786A (en) | 2022-12-27 | 2022-12-27 | Production process of three-side wrapped Jin Dujin finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115955786A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116940002A (en) * | 2023-06-13 | 2023-10-24 | 湖北龙腾电子科技股份有限公司 | Manufacturing method of circuit board |
-
2022
- 2022-12-27 CN CN202211688349.XA patent/CN115955786A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116940002A (en) * | 2023-06-13 | 2023-10-24 | 湖北龙腾电子科技股份有限公司 | Manufacturing method of circuit board |
| CN116940002B (en) * | 2023-06-13 | 2024-03-29 | 湖北龙腾电子科技股份有限公司 | Manufacturing method of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111405759B (en) | Method for preparing high-precision communication optical module printed circuit board | |
| CN101951728B (en) | Production method for replacing flexible circuit board with rigid circuit board | |
| CN104284520B (en) | A kind of PCB surface processing method | |
| CN108200734B (en) | method for producing positive concave etching printed circuit board | |
| CN102638945A (en) | Method for producing goldfinger via twice electroplating | |
| CN112739069B (en) | Method for improving incomplete stripping of electroplated copper layer | |
| CN115955786A (en) | Production process of three-side wrapped Jin Dujin finger | |
| CN111511120A (en) | Raided Pad manufacturing method | |
| CN112020237A (en) | Solder mask manufacturing process method for high-power thick copper circuit board | |
| CN106793578A (en) | A kind of PCB preparation methods in electric thick gold hole | |
| CN108650802A (en) | A kind of reworking method of plating folder film defective products | |
| CN105120600B (en) | A kind of nickel surface processing method | |
| CN108366497B (en) | Manufacturing method of precise circuit board with tin spraying surface treatment | |
| CN111372390A (en) | Gold plating process | |
| CN104394655B (en) | A kind of method for manufacturing gold finger for reducing golden finger oxidation | |
| CN111246676A (en) | Method for removing electric gold lead wire for preventing formation of secondary drilling burr | |
| CN109661117B (en) | Reworking method for PCB (printed circuit board) electric copper nodules | |
| CN108770219B (en) | Method for manufacturing PCB (printed circuit board) without lead plate surface gold plating and OSP (organic solderability preservative) surface treatment | |
| CN111479400A (en) | Chemical gold-depositing plate plating-missing treatment method for circuit board | |
| CN112218437B (en) | Method for removing electroplating connection line of thin film circuit pattern | |
| CN112672543B (en) | Method for separating electroplated copper layer | |
| CN113543520B (en) | Electroplating processing method for removing gold finger lead of circuit board | |
| CN114361781A (en) | Manufacturing process and application of micro-miniature patch PCB antenna | |
| CN112654169A (en) | Manufacturing method of flexible circuit board with bending requirement | |
| CN110996566A (en) | Manufacturing method of high-precision multilayer circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |