CN108650802A - A kind of reworking method of plating folder film defective products - Google Patents
A kind of reworking method of plating folder film defective products Download PDFInfo
- Publication number
- CN108650802A CN108650802A CN201810698275.5A CN201810698275A CN108650802A CN 108650802 A CN108650802 A CN 108650802A CN 201810698275 A CN201810698275 A CN 201810698275A CN 108650802 A CN108650802 A CN 108650802A
- Authority
- CN
- China
- Prior art keywords
- plating
- defective products
- folder film
- board
- reworking method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of reworking method of plating folder film defective products, including：When carrying out pattern transfer after the heavy copper of wiring board or electric plating of whole board, the problem of graphic plating goes wrong plate is checked；Problem board is moved back into film process；Using plasma removing glue mode to problem board removing glue；The oxide layer of removal problem plate surface；Etching, obtains satisfactory line pattern；AOI is checked.Using plasma removing glue mode, the film slag between being clipped in circuit can be removed, it is ensured that etching quality, reduce scrap cost, printed wiring board production efficiency is improved, is impregnated by ammonium hydroxide after the completion of removing glue or ammonium hydroxide cleaning removes surface oxide layer, so that it is guaranteed that tin coating is not corroded.The present invention thoroughly solves plating folder film and leads to scrapping for quality abnormal, improves quality of doing over again, reduces abnormal scrap, improve operationpiston delivery rate, the scrap cost caused by exception is reduced, reduces process and mends throwing rate, improve the synthesized competitiveness of enterprise.
Description
Technical field
The present invention relates to PCB manufacturing technology fields, more particularly to a kind of reworking method of plating folder film defective products.
Background technology
As electronic product constantly develops towards light, thin, short, small High Density Integration direction, PCB manufactures are proposed more
Height, tighter requirement.And as the graphic plating of manufacturing process, it is the important work of thickening line layer and hole coating after outer light imaging
Sequence.Because of personnel's misoperation, the problems such as electroplating device failure, Customer design, inevitably there are problems that plating folder film quality.
After problem occurs at that time, because that can not do over again, most of enterprise is all that the method scrapped is handled.If multi-layer board, because of outer layer
Circuit quality is extremely existing to be scrapped, loss from spoilage bigger caused by for enterprise.Therefore, it is necessary to design a kind of more preferable
Reworking method, to solve the above problems.
Invention content
In view of the problems of the existing technology, the present invention provides a kind of reworking method of plating folder film defective products, is checking
When, it after finding quality abnormal, does over again to problem board, product is made to reach client's quality requirements, reduce loss from spoilage.
To achieve the goals above, the present invention adopts the following technical scheme that：
A kind of reworking method of plating folder film defective products, including：
Step 1：When carrying out pattern transfer after the heavy copper of assist side or electric plating of whole board, check that graphic plating goes wrong
The problem of plate；
Step 2：Described problem plate is moved back into film process；
Step 3：Using plasma removing glue mode to described problem plate removing glue；
Step 4：Remove the oxide layer of described problem plate surface；
Step 5：Etching, obtains satisfactory line pattern；
Step 6：AOI is checked, is checked whether problem board is qualified, subsequent processing is entered if qualified, if unqualified return
Step 1 is done over again.
Further, in step 3, using plasma machine and glue removing to described problem plate removing glue, the plasma machine and glue removing setting
90 DEG C of furnace temperature heats up 3 minutes, 30 minutes processing times, ash disposal 3 minutes.
Further, in step 3, removing glue is carried out to the folder diaphragm area of described problem plate.
Further, in step 4, the described problem plate of removing glue qualification is impregnated by ammonium hydroxide or ammonium hydroxide cleaning removal Surface Oxygen
Change layer.
Further, described problem plate impregnates 30-60 seconds in the ammonia vessel that volume ratio is 50%.
Further, described problem plate crosses machine in the ammonium hydroxide that volume ratio is 50% and handles oxide layer.
Beneficial effects of the present invention：
Using plasma removing glue mode, the film slag between being clipped in circuit can be removed, it is ensured that etching quality, reduction are scrapped into
This, improves printed wiring board production efficiency, is impregnated by ammonium hydroxide after the completion of removing glue or ammonium hydroxide cleans removal surface oxide layer, to
Ensure that tin coating is not corroded.The present invention thoroughly solves plating folder film and leads to scrapping for quality abnormal, improves reworks
Matter reduces exception and scraps, improves operationpiston delivery rate, reduce the scrap cost caused by exception, reduces process benefit
Throwing rate improves the synthesized competitiveness of enterprise.
Description of the drawings
Fig. 1 is the implementing procedure figure for the reworking method that film defective products is pressed from both sides in present invention plating.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
If Fig. 1 first drills in normal production procedure, heavy copper or electric plating of whole board are then carried out, pattern transfer is then carried out.
It is graphic plating in pattern transfer about subsequent process, when graphic plating because employee inputs electric current by mistake manually, electroplating rectifier failure, or
Other designs of person are abnormal, and figure area layers of copper to be plated thickens, and when being more than thickness of dry film, it is bad to will produce plating folder film.Therefore it needs
It to do over again to the plating folder undesirable product of film.
The present invention provides a kind of reworking method of plating folder film defective products, includes the following steps：
Step 1：When carrying out pattern transfer after the heavy copper of assist side or electric plating of whole board, check that graphic plating goes wrong
The problem of plate.Inspection confirmation is carried out to problem board, then all problems plate is classified.
Step 2：Problem board is moved back into film process.
Step 3：Using plasma removing glue mode to problem board removing glue.Using plasma machine and glue removing to problem board removing glue, etc.
Ion machine and glue removing sets 90 DEG C of furnace temperature, heats up 3 minutes, 30 minutes processing times, ash disposal 3 minutes.In the present embodiment, use
Plasma machine and glue removing is the plasma machine and glue removing of the model P15V-MAX of Baofeng hall Electronic Science and Technology Co., Ltd. production.It is preferred that
, removing glue region is the folder diaphragm area of problem board in the present invention, can remove the film slag between being clipped in circuit, it is ensured that etching quality,
Scrap cost is reduced, printed wiring board production efficiency is improved.
Step 4：The oxide layer of removal problem plate surface.The problem plate of removing glue qualification is impregnated by ammonium hydroxide or ammonium hydroxide is clear
It washes away and removes surface oxide layer, particularly, problem board is placed in the ammonia vessel that volume ratio is 50% and is impregnated 30-60 seconds, removed
Copper face oxide layer, or problem board is crossed into machine in the ammonium hydroxide that volume ratio is 50% and handles oxide layer.Surface is removed using ammonium hydroxide
Oxide layer, it is ensured that internal tin coating is not corroded
Step 5：Etching, obtains satisfactory line pattern.It is etched, is etched using etching machine when etching
Line pattern meets the requirements of the customers.
Step 6：AOI is checked, is checked whether problem board is qualified, subsequent processing is entered if qualified, if unqualified return
Step 1 is done over again.
Compared with prior art, the present invention has the following advantages：
(1) problem board is done over again move back film after, using plasma removing glue mode to folder diaphragm area carry out removing glue, can remove and be clipped in
Film slag between circuit, it is ensured that the etching quality of printed wiring board improves quality of doing over again, and improves printed wiring board production efficiency,
And operationpiston delivery rate；
(2) after the completion of removing glue, surface oxide layer is removed using ammonium hydroxide, it is ensured that internal tin coating is not corroded；
(3) reworking method of the present invention thoroughly solves scrapping for the product for leading to quality abnormal because of plating folder film, reduces
The scrap cost caused by exception reduces process and mends throwing rate, and the synthesis that improves enterprise strives power unexpectedly；
(4) present invention does not increase other equipment, and on the basis of original equipment, reduce causes quality to be scrapped because of exception, is
Solve a kind of good method of plating folder film.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferred embodiment to this hair
It is bright to be described in detail, it will be appreciated by those skilled in the art that can technical scheme of the present invention be modified or be waited
With replacing, without departing from the objective and range of the technical program, should all cover in scope of the presently claimed invention.
Claims (6)
1. a kind of reworking method of plating folder film defective products, which is characterized in that including：
Step 1：Assist side is sunk when carrying out pattern transfer after copper or electric plating of whole board, checks that graphic plating went wrong asks
Inscribe plate；
Step 2：Described problem plate is moved back into film process；
Step 3：Using plasma removing glue mode to described problem plate removing glue；
Step 4：Remove the oxide layer of described problem plate surface；
Step 5：Etching, obtains satisfactory line pattern；
Step 6：AOI is checked, is checked whether problem board is qualified, subsequent processing is entered if qualified, if unqualified return to step
One does over again.
2. the reworking method of plating folder film defective products according to claim 1, it is characterised in that：In step 3, using etc.
Ion machine and glue removing sets 90 DEG C of furnace temperature to described problem plate removing glue, the plasma machine and glue removing, heats up 3 minutes, processing time 30
Minute, ash disposal 3 minutes.
3. the reworking method of plating folder film defective products according to claim 1, it is characterised in that：In step 3, to described
The folder diaphragm area of problem board carries out removing glue.
4. the reworking method of plating folder film defective products according to claim 1, it is characterised in that：In step 4, except gluing
The described problem plate of lattice is impregnated by ammonium hydroxide or ammonium hydroxide cleaning removal surface oxide layer.
5. the reworking method of plating folder film defective products according to claim 4, it is characterised in that：Described problem plate is in volume
Than being impregnated 30-60 seconds in the ammonia vessel for 50%.
6. the reworking method of plating folder film defective products according to claim 4, it is characterised in that：Described problem plate is in volume
Oxide layer is handled than crossing machine in the ammonium hydroxide for 50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810698275.5A CN108650802A (en) | 2018-06-29 | 2018-06-29 | A kind of reworking method of plating folder film defective products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810698275.5A CN108650802A (en) | 2018-06-29 | 2018-06-29 | A kind of reworking method of plating folder film defective products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108650802A true CN108650802A (en) | 2018-10-12 |
Family
ID=63749942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810698275.5A Pending CN108650802A (en) | 2018-06-29 | 2018-06-29 | A kind of reworking method of plating folder film defective products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108650802A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729649A (en) * | 2019-01-17 | 2019-05-07 | 江门崇达电路技术有限公司 | A kind of restorative procedure of PCB plating folder film |
| CN112449495A (en) * | 2019-08-27 | 2021-03-05 | 南通深南电路有限公司 | Drilling detection method and drilling detection equipment |
| CN115207161A (en) * | 2022-07-14 | 2022-10-18 | 通威太阳能（安徽）有限公司 | Backwashing equipment |
| CN115568106A (en) * | 2022-12-02 | 2023-01-03 | 惠州市金百泽电路科技有限公司 | Circuit board film clamping processing method and circuit board |
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| CN1658738A (en) * | 2005-01-10 | 2005-08-24 | 安捷利（番禺）电子实业有限公司 | Wet filming method of flexible printed circuit |
| JP2008101258A (en) * | 2006-10-20 | 2008-05-01 | Mitsubishi Materials Corp | Manufacturing method of laminated base material and manufacturing apparatus for laminated base material |
| CN104883823A (en) * | 2015-05-22 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | Processing method of alkaline etching collapser |
-
2018
- 2018-06-29 CN CN201810698275.5A patent/CN108650802A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1658738A (en) * | 2005-01-10 | 2005-08-24 | 安捷利（番禺）电子实业有限公司 | Wet filming method of flexible printed circuit |
| JP2008101258A (en) * | 2006-10-20 | 2008-05-01 | Mitsubishi Materials Corp | Manufacturing method of laminated base material and manufacturing apparatus for laminated base material |
| CN104883823A (en) * | 2015-05-22 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | Processing method of alkaline etching collapser |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729649A (en) * | 2019-01-17 | 2019-05-07 | 江门崇达电路技术有限公司 | A kind of restorative procedure of PCB plating folder film |
| CN112449495A (en) * | 2019-08-27 | 2021-03-05 | 南通深南电路有限公司 | Drilling detection method and drilling detection equipment |
| CN112449495B (en) * | 2019-08-27 | 2021-11-30 | 南通深南电路有限公司 | Drilling detection method and drilling detection equipment |
| CN115207161A (en) * | 2022-07-14 | 2022-10-18 | 通威太阳能（安徽）有限公司 | Backwashing equipment |
| CN115207161B (en) * | 2022-07-14 | 2024-05-14 | 通威太阳能（安徽）有限公司 | Backwashing equipment |
| CN115568106A (en) * | 2022-12-02 | 2023-01-03 | 惠州市金百泽电路科技有限公司 | Circuit board film clamping processing method and circuit board |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181012 |
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| RJ01 | Rejection of invention patent application after publication |