CN108650802A - A kind of reworking method of plating folder film defective products - Google Patents

A kind of reworking method of plating folder film defective products Download PDF

Info

Publication number
CN108650802A
CN108650802A CN201810698275.5A CN201810698275A CN108650802A CN 108650802 A CN108650802 A CN 108650802A CN 201810698275 A CN201810698275 A CN 201810698275A CN 108650802 A CN108650802 A CN 108650802A
Authority
CN
China
Prior art keywords
plating
defective products
folder film
board
reworking method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810698275.5A
Other languages
Chinese (zh)
Inventor
覃立
宁武珍
张良昌
范木兰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHUHAI SMART TECHNOLOGY Co Ltd
GCI Science and Technology Co Ltd
Original Assignee
ZHUHAI SMART TECHNOLOGY Co Ltd
GCI Science and Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHUHAI SMART TECHNOLOGY Co Ltd, GCI Science and Technology Co Ltd filed Critical ZHUHAI SMART TECHNOLOGY Co Ltd
Priority to CN201810698275.5A priority Critical patent/CN108650802A/en
Publication of CN108650802A publication Critical patent/CN108650802A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A kind of reworking method of plating folder film defective products, including:When carrying out pattern transfer after the heavy copper of wiring board or electric plating of whole board, the problem of graphic plating goes wrong plate is checked;Problem board is moved back into film process;Using plasma removing glue mode to problem board removing glue;The oxide layer of removal problem plate surface;Etching, obtains satisfactory line pattern;AOI is checked.Using plasma removing glue mode, the film slag between being clipped in circuit can be removed, it is ensured that etching quality, reduce scrap cost, printed wiring board production efficiency is improved, is impregnated by ammonium hydroxide after the completion of removing glue or ammonium hydroxide cleaning removes surface oxide layer, so that it is guaranteed that tin coating is not corroded.The present invention thoroughly solves plating folder film and leads to scrapping for quality abnormal, improves quality of doing over again, reduces abnormal scrap, improve operationpiston delivery rate, the scrap cost caused by exception is reduced, reduces process and mends throwing rate, improve the synthesized competitiveness of enterprise.

Description

A kind of reworking method of plating folder film defective products
Technical field
The present invention relates to PCB manufacturing technology fields, more particularly to a kind of reworking method of plating folder film defective products.
Background technology
As electronic product constantly develops towards light, thin, short, small High Density Integration direction, PCB manufactures are proposed more Height, tighter requirement.And as the graphic plating of manufacturing process, it is the important work of thickening line layer and hole coating after outer light imaging Sequence.Because of personnel's misoperation, the problems such as electroplating device failure, Customer design, inevitably there are problems that plating folder film quality. After problem occurs at that time, because that can not do over again, most of enterprise is all that the method scrapped is handled.If multi-layer board, because of outer layer Circuit quality is extremely existing to be scrapped, loss from spoilage bigger caused by for enterprise.Therefore, it is necessary to design a kind of more preferable Reworking method, to solve the above problems.
Invention content
In view of the problems of the existing technology, the present invention provides a kind of reworking method of plating folder film defective products, is checking When, it after finding quality abnormal, does over again to problem board, product is made to reach client's quality requirements, reduce loss from spoilage.
To achieve the goals above, the present invention adopts the following technical scheme that:
A kind of reworking method of plating folder film defective products, including:
Step 1:When carrying out pattern transfer after the heavy copper of assist side or electric plating of whole board, check that graphic plating goes wrong The problem of plate;
Step 2:Described problem plate is moved back into film process;
Step 3:Using plasma removing glue mode to described problem plate removing glue;
Step 4:Remove the oxide layer of described problem plate surface;
Step 5:Etching, obtains satisfactory line pattern;
Step 6:AOI is checked, is checked whether problem board is qualified, subsequent processing is entered if qualified, if unqualified return Step 1 is done over again.
Further, in step 3, using plasma machine and glue removing to described problem plate removing glue, the plasma machine and glue removing setting 90 DEG C of furnace temperature heats up 3 minutes, 30 minutes processing times, ash disposal 3 minutes.
Further, in step 3, removing glue is carried out to the folder diaphragm area of described problem plate.
Further, in step 4, the described problem plate of removing glue qualification is impregnated by ammonium hydroxide or ammonium hydroxide cleaning removal Surface Oxygen Change layer.
Further, described problem plate impregnates 30-60 seconds in the ammonia vessel that volume ratio is 50%.
Further, described problem plate crosses machine in the ammonium hydroxide that volume ratio is 50% and handles oxide layer.
Beneficial effects of the present invention:
Using plasma removing glue mode, the film slag between being clipped in circuit can be removed, it is ensured that etching quality, reduction are scrapped into This, improves printed wiring board production efficiency, is impregnated by ammonium hydroxide after the completion of removing glue or ammonium hydroxide cleans removal surface oxide layer, to Ensure that tin coating is not corroded.The present invention thoroughly solves plating folder film and leads to scrapping for quality abnormal, improves reworks Matter reduces exception and scraps, improves operationpiston delivery rate, reduce the scrap cost caused by exception, reduces process benefit Throwing rate improves the synthesized competitiveness of enterprise.
Description of the drawings
Fig. 1 is the implementing procedure figure for the reworking method that film defective products is pressed from both sides in present invention plating.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Base Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its His embodiment, shall fall within the protection scope of the present invention.
If Fig. 1 first drills in normal production procedure, heavy copper or electric plating of whole board are then carried out, pattern transfer is then carried out. It is graphic plating in pattern transfer about subsequent process, when graphic plating because employee inputs electric current by mistake manually, electroplating rectifier failure, or Other designs of person are abnormal, and figure area layers of copper to be plated thickens, and when being more than thickness of dry film, it is bad to will produce plating folder film.Therefore it needs It to do over again to the plating folder undesirable product of film.
The present invention provides a kind of reworking method of plating folder film defective products, includes the following steps:
Step 1:When carrying out pattern transfer after the heavy copper of assist side or electric plating of whole board, check that graphic plating goes wrong The problem of plate.Inspection confirmation is carried out to problem board, then all problems plate is classified.
Step 2:Problem board is moved back into film process.
Step 3:Using plasma removing glue mode to problem board removing glue.Using plasma machine and glue removing to problem board removing glue, etc. Ion machine and glue removing sets 90 DEG C of furnace temperature, heats up 3 minutes, 30 minutes processing times, ash disposal 3 minutes.In the present embodiment, use Plasma machine and glue removing is the plasma machine and glue removing of the model P15V-MAX of Baofeng hall Electronic Science and Technology Co., Ltd. production.It is preferred that , removing glue region is the folder diaphragm area of problem board in the present invention, can remove the film slag between being clipped in circuit, it is ensured that etching quality, Scrap cost is reduced, printed wiring board production efficiency is improved.
Step 4:The oxide layer of removal problem plate surface.The problem plate of removing glue qualification is impregnated by ammonium hydroxide or ammonium hydroxide is clear It washes away and removes surface oxide layer, particularly, problem board is placed in the ammonia vessel that volume ratio is 50% and is impregnated 30-60 seconds, removed Copper face oxide layer, or problem board is crossed into machine in the ammonium hydroxide that volume ratio is 50% and handles oxide layer.Surface is removed using ammonium hydroxide Oxide layer, it is ensured that internal tin coating is not corroded
Step 5:Etching, obtains satisfactory line pattern.It is etched, is etched using etching machine when etching Line pattern meets the requirements of the customers.
Step 6:AOI is checked, is checked whether problem board is qualified, subsequent processing is entered if qualified, if unqualified return Step 1 is done over again.
Compared with prior art, the present invention has the following advantages:
(1) problem board is done over again move back film after, using plasma removing glue mode to folder diaphragm area carry out removing glue, can remove and be clipped in Film slag between circuit, it is ensured that the etching quality of printed wiring board improves quality of doing over again, and improves printed wiring board production efficiency, And operationpiston delivery rate;
(2) after the completion of removing glue, surface oxide layer is removed using ammonium hydroxide, it is ensured that internal tin coating is not corroded;
(3) reworking method of the present invention thoroughly solves scrapping for the product for leading to quality abnormal because of plating folder film, reduces The scrap cost caused by exception reduces process and mends throwing rate, and the synthesis that improves enterprise strives power unexpectedly;
(4) present invention does not increase other equipment, and on the basis of original equipment, reduce causes quality to be scrapped because of exception, is Solve a kind of good method of plating folder film.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferred embodiment to this hair It is bright to be described in detail, it will be appreciated by those skilled in the art that can technical scheme of the present invention be modified or be waited With replacing, without departing from the objective and range of the technical program, should all cover in scope of the presently claimed invention.

Claims (6)

1. a kind of reworking method of plating folder film defective products, which is characterized in that including:
Step 1:Assist side is sunk when carrying out pattern transfer after copper or electric plating of whole board, checks that graphic plating went wrong asks Inscribe plate;
Step 2:Described problem plate is moved back into film process;
Step 3:Using plasma removing glue mode to described problem plate removing glue;
Step 4:Remove the oxide layer of described problem plate surface;
Step 5:Etching, obtains satisfactory line pattern;
Step 6:AOI is checked, is checked whether problem board is qualified, subsequent processing is entered if qualified, if unqualified return to step One does over again.
2. the reworking method of plating folder film defective products according to claim 1, it is characterised in that:In step 3, using etc. Ion machine and glue removing sets 90 DEG C of furnace temperature to described problem plate removing glue, the plasma machine and glue removing, heats up 3 minutes, processing time 30 Minute, ash disposal 3 minutes.
3. the reworking method of plating folder film defective products according to claim 1, it is characterised in that:In step 3, to described The folder diaphragm area of problem board carries out removing glue.
4. the reworking method of plating folder film defective products according to claim 1, it is characterised in that:In step 4, except gluing The described problem plate of lattice is impregnated by ammonium hydroxide or ammonium hydroxide cleaning removal surface oxide layer.
5. the reworking method of plating folder film defective products according to claim 4, it is characterised in that:Described problem plate is in volume Than being impregnated 30-60 seconds in the ammonia vessel for 50%.
6. the reworking method of plating folder film defective products according to claim 4, it is characterised in that:Described problem plate is in volume Oxide layer is handled than crossing machine in the ammonium hydroxide for 50%.
CN201810698275.5A 2018-06-29 2018-06-29 A kind of reworking method of plating folder film defective products Pending CN108650802A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810698275.5A CN108650802A (en) 2018-06-29 2018-06-29 A kind of reworking method of plating folder film defective products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810698275.5A CN108650802A (en) 2018-06-29 2018-06-29 A kind of reworking method of plating folder film defective products

Publications (1)

Publication Number Publication Date
CN108650802A true CN108650802A (en) 2018-10-12

Family

ID=63749942

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810698275.5A Pending CN108650802A (en) 2018-06-29 2018-06-29 A kind of reworking method of plating folder film defective products

Country Status (1)

Country Link
CN (1) CN108650802A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109729649A (en) * 2019-01-17 2019-05-07 江门崇达电路技术有限公司 A kind of restorative procedure of PCB plating folder film
CN112449495A (en) * 2019-08-27 2021-03-05 南通深南电路有限公司 Drilling detection method and drilling detection equipment
CN115207161A (en) * 2022-07-14 2022-10-18 通威太阳能(安徽)有限公司 Backwashing equipment
CN115568106A (en) * 2022-12-02 2023-01-03 惠州市金百泽电路科技有限公司 Circuit board film clamping processing method and circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658738A (en) * 2005-01-10 2005-08-24 安捷利(番禺)电子实业有限公司 Wet filming method of flexible printed circuit
JP2008101258A (en) * 2006-10-20 2008-05-01 Mitsubishi Materials Corp Manufacturing method of laminated base material and manufacturing apparatus for laminated base material
CN104883823A (en) * 2015-05-22 2015-09-02 胜宏科技(惠州)股份有限公司 Processing method of alkaline etching collapser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658738A (en) * 2005-01-10 2005-08-24 安捷利(番禺)电子实业有限公司 Wet filming method of flexible printed circuit
JP2008101258A (en) * 2006-10-20 2008-05-01 Mitsubishi Materials Corp Manufacturing method of laminated base material and manufacturing apparatus for laminated base material
CN104883823A (en) * 2015-05-22 2015-09-02 胜宏科技(惠州)股份有限公司 Processing method of alkaline etching collapser

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109729649A (en) * 2019-01-17 2019-05-07 江门崇达电路技术有限公司 A kind of restorative procedure of PCB plating folder film
CN112449495A (en) * 2019-08-27 2021-03-05 南通深南电路有限公司 Drilling detection method and drilling detection equipment
CN112449495B (en) * 2019-08-27 2021-11-30 南通深南电路有限公司 Drilling detection method and drilling detection equipment
CN115207161A (en) * 2022-07-14 2022-10-18 通威太阳能(安徽)有限公司 Backwashing equipment
CN115207161B (en) * 2022-07-14 2024-05-14 通威太阳能(安徽)有限公司 Backwashing equipment
CN115568106A (en) * 2022-12-02 2023-01-03 惠州市金百泽电路科技有限公司 Circuit board film clamping processing method and circuit board

Similar Documents

Publication Publication Date Title
CN108650802A (en) A kind of reworking method of plating folder film defective products
JP6779187B2 (en) Copper foil with carrier and its manufacturing method, and coreless support with wiring layer and printed wiring board manufacturing method
WO2017150284A1 (en) Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
CN111405759A (en) Method for preparing high-precision communication optical module printed circuit board
CN104582319A (en) Metallized semi-hole forming method and printed circuit board manufacturing method
CN110324980B (en) Processing method for PCB with gold immersion and tin spraying fingers through two different surface treatments
CN108521724B (en) Manufacturing method of high-flexibility high-density flexible printed circuit board
CN110856364A (en) Immersion gold plating method for manufacturing rigid-flex board
CN109661117B (en) Reworking method for PCB (printed circuit board) electric copper nodules
CN102291952A (en) Method for preparing multi-layer PCB (printed circuit board)
CN110049625A (en) It is a kind of with gold-plated and immersion process PCB plate production method
CN108323040B (en) Manufacturing method of PCB with stepped groove and PCB
TW201702766A (en) Method for forming mask, and method for manufacturing printed wiring board, method for manufacturing electroformed component, and method for manufacturing screen printing plate using same
CN104378921A (en) Manufacturing method for gold-plated circuit board
CN105430925B (en) Thick copper circuit board manufacturing method
CN115955786A (en) Production process of three-side wrapped Jin Dujin finger
CN111385972A (en) PCB dry film laminating hole plugging method
CN112672525B (en) Treatment method for incomplete etching in PCB negative film process
CN107135608B (en) Method for etching laminate and method for manufacturing printed wiring board using same
CN114449765A (en) HDI board manufacturing method for manufacturing blind hole instead of laser
US10785878B2 (en) Circuit board and method of forming same
JP4803473B2 (en) Manufacturing method of electronic parts using dry film resist, electronic parts and suspension for hard disk
JP2011254082A (en) Production method of electronic parts that adopts wet etching, electronic part and hard disk suspension
CN112074091A (en) Method for processing 8-shaped hole PCB
CN111385982A (en) Method for improving laminated structure of multilayer PCB

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20181012

RJ01 Rejection of invention patent application after publication