CN104883823A - Processing method of alkaline etching collapser - Google Patents
Processing method of alkaline etching collapser Download PDFInfo
- Publication number
- CN104883823A CN104883823A CN201510264998.0A CN201510264998A CN104883823A CN 104883823 A CN104883823 A CN 104883823A CN 201510264998 A CN201510264998 A CN 201510264998A CN 104883823 A CN104883823 A CN 104883823A
- Authority
- CN
- China
- Prior art keywords
- line plate
- collapser
- processing method
- plasma apparatus
- anomalous line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a processing method of alkaline etching a collapse. The method comprises the following steps of S1, placing circuit boards in an alkaline solution for coating removal; S2, picking out abnormal circuit boards after coating removal; S3, placing the abnormal circuit boards in plasma equipment for glue removal; S4, removing film residues on surfaces of the circuit boards; S5, etching the abnormal circuit boards to remove copper layers galvanized on the surfaces of the abnormal circuit boards; S6, removing tin layers on the surfaces of the abnormal circuit boards to strip the tin layers from the surfaces of the circuit boards; and S7, reworking the abnormal circuit boards. The processing method provided by the invention can effectively improve the reworking yield rate of the abnormal collapse and the examination yield rate/efficiency of the external circuit, reduces the abandonment in the collapser reworking process, and saves the production cost. In addition, the plasma processing is adopted to effectively remove dry films remained on copper surfaces. Compared with a traditional method that sodium hydroxide and a special coating removal liquid are adopted, the processing method is several times better in terms of reworking effect, and can improve the reusable rate of the abnormal collapser.
Description
Technical field
The invention belongs to wiring board production and processing technical field, be specifically related to a kind of processing method of alkali etching collapser.
Background technology
In PCB manufacturing, the outer Making programme of wiring board is: boring → de-smear/inner hole deposition copper → electric plating of whole board → image transfer → graphic plating → circuit etching → anti-welding silk noil print → word silk noil print → surface treatment (gold/silver/tin) → appearance profile processing → last quality control, finally makes qualified wiring board.And in the concrete operation of wiring board image transfer be: plate face processes → pastes dry film → exposure → development → graphic plating → move back film → etch → move back tin, moves back the wiring board after tin and enters in next step circuit etching technique and carry out processing.Because of factor impacts such as graphic plating copper facing inequality and circuit skewness in graphic plating process, part template exists that independent zones/high potential district copper facing is partially thick causes folder film, happen occasionally in wiring board manufacturing enterprise, necessarily improved although can be optimized from copper facing parameter and design, cannot be stopped.At present, wiring board manufacturing enterprise goes in dry film process, first carries out moving back film with NaOH, then chooses in the state according to circuit plate holder film by the wiring board moving back film exception, adopts to repair or move back to wash the mode of doing over again and carry out.The process of these anomalous line plates chosen cannot carry out doing over again striping by NaOH and special striping liquid, and too much there is the impact that tin face is attacked in number of times of doing over again, open circuit/hole is caused to be broken after etching, not only strengthen the input of the resources of production, and cannot effect of doing over again be reached, cause the waste of resource, add production cost.Simultaneously, anomalous line plate needs maintenance person to place under repair in middle inspection technique, owing to adopting manual operation, maintenance is easily caused to scrap, such serious waste manpower and materials, and easily cause the phenomenons such as undetected, cause anomalous line plate current complained to client, have influence on company's External Failure cost and quality image.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is a kind of reduction collapser scrappage, the processing method of the alkali etching collapser saved production cost.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: a kind of processing method of alkali etching collapser, comprises the following steps:
S1. wiring board is put into alkaline solution striping, and anomalous line plate is chosen;
S2. anomalous line plate being put into plasma apparatus carries out except glue;
S3. the residual film of PCB surface is removed;
S4. anomalous line plate is etched, remove the layers of copper of anomalous line plate electroplating surface;
S5. remove the tin layers on anomalous line plate surface, tin layers is peeled off from PCB surface;
S6. anomalous line plate is processed again.
As improvement of the present invention, the concrete steps of step S1 are: wiring board is put into concentration be 3 ~ 8% sodium hydrate aqueous solution soak 10min, and soak time by the temperature of sodium hydrate aqueous solution control be 45 ~ 55 DEG C.
As improvement of the present invention, the concrete steps of step S2 comprise:
S21. the first stage inputs the glued membrane of mist A to anomalous line plate surface be made up of nitrogen and oxygen and carries out fluffy process in plasma apparatus, and it is 20 ~ 25min that the fluffy processing time controls;
S22. second stage inputs the mist B that is made up of nitrogen, oxygen and carbon tetrafluoride and carries out except glued membrane the anomalous line plate surface after fluffy in plasma apparatus, and the time controling except glued membrane is 25 ~ 30min;
S23. the phase III inputs oxygen and carries out removals peculiar odor treatment to except the anomalous line plate after glued membrane and plasma apparatus in plasma apparatus, and the time controling of removal peculiar odor treatment is 3 ~ 5min.
As a further improvement on the present invention, the concrete steps that first stage in step S21 carries out fluffy process are: controlled by the radio-frequency power of plasma apparatus as 4000W, to plasma apparatus inside input mist A, and the temperature of the mist A of input to be controlled be 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; In described mist, the flow control of nitrogen is 180 ~ 220sccm, and the flow control of oxygen is 1600 ~ 2000sccm.
As a further improvement on the present invention, second stage in step S22 is carried out except the concrete steps of glued membrane process are: controlled by the radio-frequency power of plasma apparatus as 4000W, to plasma apparatus inside input mist B, and the temperature of the mist B of input to be controlled be 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; In described mist, the flow control of nitrogen is 140 ~ 180sccm, and the flow control of oxygen is 1000 ~ 1400sccm, and the flow control of carbon tetrafluoride is 220 ~ 260sccm.
Further improve as of the present invention, the concrete steps that phase III in step S23 carries out removing peculiar odor treatment are: controlled by the radio-frequency power of plasma apparatus as 4000W, to plasma apparatus inside input oxygen, and the temperature of the oxygen of input to be controlled be 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; The flow control of described oxygen is 1800 ~ 2200sccm.
As improvement of the present invention, the concrete steps in step S3 comprise washes the anomalous line plate after glue.
Further improve as of the present invention, described washing is spray.
As improvement of the present invention, the copper removal described in step S4 adopts the mixed aqueous solution of ammoniacal liquor and ammonium chloride to carry out copper removal.
As improvement of the present invention, the stripping described in step S5 adopts the tin layers on salpeter solution and anomalous line plate surface to react, by the tin layers on anomalous line plate surface from anomalous line plate surface removal.
Compared with prior art, the present invention adopts plasma apparatus to carry out except glue to anomalous line plate, then the principles of chemistry are utilized to carry out the residual film remained in the line-spacing of copper facing partially thick region to remove, carry out normal alkaline etchant flow again to produce, promote abnormal collapser to do over again yield, and promote outer-layer circuit inspection yield/efficiency, reduce scrapping in collapser process of rework, save production cost; Effectively reduce because collapser bodging or leakage flow to the loss caused of client, reduce External Failure cost, promote company's quality image and competitiveness; Adopt plasma treatment effectively can remove the residual dry film of copper face simultaneously, and will several times be exceeded than traditional use NaOH and special striping liquid effect of doing over again, the survival rate of the abnormal plate of folder film can be improved.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below in conjunction with specific embodiment, the present invention is further elaborated.
A processing method for alkali etching collapser, comprises the following steps:
S1. wiring board is put into concentration be 3 ~ 8% the alkali sodium hydroxide aqueous solution soak 10min, be attached to PCB surface dry film remove, in order to improve the efficiency of dry film, by soak wiring board sodium hydrate aqueous solution temperature control be 45 ~ 55 DEG C.The anomalous line plate simultaneously surface still being removed attachment dry film is chosen, and processes separately.
S2. anomalous line plate put into plasma apparatus and carry out vacuumizing process, making in anomalous line plate process vacuum environment.Start plasma apparatus, removal dry film is carried out to the anomalous line plate putting into plasma apparatus.
When removal is attached to the dry film of PCB surface, point dry film of three phases to PCB surface processes.Concrete steps are as follows:
S21. the first stage inputs the glued membrane of mist A to anomalous line plate surface be made up of nitrogen and oxygen and carries out fluffy process in plasma apparatus.During fluffy process, in plasma apparatus, continue the mist A of input.Be 180 ~ 220sccm by the flow control of the nitrogen of input during input mist A, the flow control of oxygen is 1600 ~ 2000sccm; Wherein the temperature of mist A controls is 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; Radio-frequency power controls as 4000W, and processing time control is 20 ~ 25min.Described flux unit sccm be standard milliliters/minute.
S22. second stage inputs the mist B that is made up of nitrogen, oxygen and carbon tetrafluoride and carries out, except glued membrane, making the dry film being attached to anomalous line plate surface from anomalous line plate surface removal to the anomalous line plate surface after fluffy in plasma apparatus.During except glue, continue input mist B to plasma apparatus inside.Be 140 ~ 180sccm by the flow control of nitrogen during input mist B, the flow control of oxygen is 1000 ~ 1400sccm, and the flow control of carbon tetrafluoride is 220 ~ 260sccm; Wherein the temperature of mist B controls is 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; Radio-frequency power controls as 4000W, and processing time control is 25 ~ 30min.
S23. the phase III inputs oxygen and carries out removal peculiar odor treatment to except the anomalous line plate after glued membrane and plasma apparatus in plasma apparatus.When carrying out removal peculiar odor treatment, in plasma apparatus, continue input oxygen.During input oxygen, be 1800 ~ 2200sccm by the flow control of the oxygen of input; It is 55 ~ 60 DEG C that the temperature of the oxygen wherein inputted controls, Stress control is 0.2Torr/Pa; The time controling carrying out removing peculiar odor treatment is 3 ~ 5min.
After this three phases, the dry film being attached to anomalous line plate surface is removed clean substantially.
S3. adopt spray to clean anomalous line plate, remove the residual film remaining in PCB surface.
S4. anomalous line plate is etched, make the copper face being exposed to anomalous line plate surface etched, leave the layers of copper of the anomalous line plate covered by tin.When removing the layers of copper of anomalous line plate electroplating surface, the mixed aqueous solution of ammoniacal liquor and ammonium chloride is adopted to carry out copper removal.
S5. after the layers of copper on the anomalous line plate surface be exposed to outside tin being removed, then the tin layers being attached to anomalous line plate surface is removed, tin layers is peeled off from PCB surface.During removing, adopt salpeter solution to carry out detin, the tin layers on salpeter solution and anomalous line plate surface is reacted, by the tin layers on anomalous line plate surface from anomalous line plate surface removal.
S6. after the tin layers on anomalous line plate surface being peeled off, production and processing is again carried out to wiring board, reduce the scrappage of anomalous line plate, save production cost, improve the performance of enterprises.
Detin in above embodiment in step S4 in copper removal and step S5 all adopts copper removal of the prior art and processes except solution of tin, is common practise well known to those skilled in the art, is not specifically addressed at this.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (10)
1. a processing method for alkali etching collapser, is characterized in that, comprises the following steps:
S1. wiring board is put into alkaline solution striping, and anomalous line plate is chosen;
S2. anomalous line plate being put into plasma apparatus carries out except glue;
S3. the residual film of PCB surface is removed;
S4. anomalous line plate is etched, remove the layers of copper of anomalous line plate electroplating surface;
S5. remove the tin layers on anomalous line plate surface, tin layers is peeled off from PCB surface;
S6. anomalous line plate is processed again.
2. the processing method of alkali etching collapser according to claim 1, it is characterized in that, the concrete steps of step S1 are: wiring board is put into concentration be 3 ~ 8% sodium hydrate aqueous solution soak 10min, and soak time by the temperature of sodium hydrate aqueous solution control be 45 ~ 55 DEG C.
3. the processing method of alkali etching collapser according to claim 1, is characterized in that, the concrete steps of step S2 comprise:
S21. the first stage inputs the glued membrane of mist A to anomalous line plate surface be made up of nitrogen and oxygen and carries out fluffy process in plasma apparatus, and it is 20 ~ 25min that the fluffy processing time controls;
S22. second stage inputs the mist B that is made up of nitrogen, oxygen and carbon tetrafluoride and carries out except glued membrane the anomalous line plate surface after fluffy in plasma apparatus, and the time controling except glued membrane is 25 ~ 30min;
S23. the phase III inputs oxygen and carries out removals peculiar odor treatment to except the anomalous line plate after glued membrane and plasma apparatus in plasma apparatus, and the time controling of removal peculiar odor treatment is 3 ~ 5min.
4. the processing method of alkali etching collapser according to claim 3, it is characterized in that, the concrete steps that first stage in step S21 carries out fluffy process are: controlled by the radio-frequency power of plasma apparatus as 4000W, to plasma apparatus inside input mist A, and the temperature of the mist A of input to be controlled be 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; In described mist, the flow control of nitrogen is 180 ~ 220sccm, and the flow control of oxygen is 1600 ~ 2000sccm.
5. the processing method of alkali etching collapser according to claim 3, it is characterized in that, second stage in step S22 is carried out except the concrete steps of glued membrane process are: controlled by the radio-frequency power of plasma apparatus as 4000W, to plasma apparatus inside input mist B, and the temperature of the mist B of input to be controlled be 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; In described mist, the flow control of nitrogen is 140 ~ 180sccm, and the flow control of oxygen is 1000 ~ 1400sccm, and the flow control of carbon tetrafluoride is 220 ~ 260sccm.
6. the processing method of alkali etching collapser according to claim 3, it is characterized in that, the concrete steps that phase III in step S23 carries out removing peculiar odor treatment are: controlled by the radio-frequency power of plasma apparatus as 4000W, to plasma apparatus inside input oxygen, and the temperature of the oxygen of input to be controlled be 55 ~ 60 DEG C, Stress control is 0.2Torr/Pa; The flow control of described oxygen is 1800 ~ 2200sccm.
7. the processing method of alkali etching collapser according to claim 1, is characterized in that, the concrete steps in step S3 comprise washes the anomalous line plate after glue.
8. the processing method of alkali etching collapser according to claim 7, is characterized in that, described washing is spray.
9. the processing method of alkali etching collapser according to claim 1, is characterized in that, the copper removal described in step S4 adopts the mixed aqueous solution of ammoniacal liquor and ammonium chloride to carry out copper removal.
10. the processing method of alkali etching collapser according to claim 1, it is characterized in that, stripping described in step S5 adopts the tin layers on salpeter solution and anomalous line plate surface to react, by the tin layers on anomalous line plate surface from anomalous line plate surface removal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510264998.0A CN104883823A (en) | 2015-05-22 | 2015-05-22 | Processing method of alkaline etching collapser |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510264998.0A CN104883823A (en) | 2015-05-22 | 2015-05-22 | Processing method of alkaline etching collapser |
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| CN104883823A true CN104883823A (en) | 2015-09-02 |
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| CN201510264998.0A Pending CN104883823A (en) | 2015-05-22 | 2015-05-22 | Processing method of alkaline etching collapser |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657993A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Improved ladder-shaped circuit board production process |
| CN106993383A (en) * | 2017-04-21 | 2017-07-28 | 广东依顿电子科技股份有限公司 | The circuit board producing method of different plate mixed pressures |
| CN108650802A (en) * | 2018-06-29 | 2018-10-12 | 珠海杰赛科技有限公司 | A kind of reworking method of plating folder film defective products |
| CN109729649A (en) * | 2019-01-17 | 2019-05-07 | 江门崇达电路技术有限公司 | A kind of restorative procedure of PCB plating folder film |
| CN115568106A (en) * | 2022-12-02 | 2023-01-03 | 惠州市金百泽电路科技有限公司 | Circuit board film clamping processing method and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008004720A1 (en) * | 2006-07-04 | 2008-01-10 | Jesagi Hankook Ltd. | Plasma semi-additive process method for manufacturing pcb |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| CN102883541A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Plasma sandwiched film removing method |
| CN103874333A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
-
2015
- 2015-05-22 CN CN201510264998.0A patent/CN104883823A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008004720A1 (en) * | 2006-07-04 | 2008-01-10 | Jesagi Hankook Ltd. | Plasma semi-additive process method for manufacturing pcb |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| CN102883541A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Plasma sandwiched film removing method |
| CN103874333A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
Non-Patent Citations (3)
| Title |
|---|
| 周旭: "《印制电路板设计制造技术》", 31 March 2012 * |
| 张林生: "《机械工业废水处理技术及典型工程》", 31 March 2008 * |
| 程婕: "《电子产品制造工程训练》", 31 July 2008 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657993A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Improved ladder-shaped circuit board production process |
| CN106993383A (en) * | 2017-04-21 | 2017-07-28 | 广东依顿电子科技股份有限公司 | The circuit board producing method of different plate mixed pressures |
| CN108650802A (en) * | 2018-06-29 | 2018-10-12 | 珠海杰赛科技有限公司 | A kind of reworking method of plating folder film defective products |
| CN109729649A (en) * | 2019-01-17 | 2019-05-07 | 江门崇达电路技术有限公司 | A kind of restorative procedure of PCB plating folder film |
| CN115568106A (en) * | 2022-12-02 | 2023-01-03 | 惠州市金百泽电路科技有限公司 | Circuit board film clamping processing method and circuit board |
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Application publication date: 20150902 |
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