CN107231753A - A kind of golden method of the heavy nickel for improving plating leakage - Google Patents
A kind of golden method of the heavy nickel for improving plating leakage Download PDFInfo
- Publication number
- CN107231753A CN107231753A CN201710485686.1A CN201710485686A CN107231753A CN 107231753 A CN107231753 A CN 107231753A CN 201710485686 A CN201710485686 A CN 201710485686A CN 107231753 A CN107231753 A CN 107231753A
- Authority
- CN
- China
- Prior art keywords
- heavy nickel
- nickel
- consent
- plating leakage
- layer sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Abstract
The present invention relates to plating of printed circuit board nickel golden collar domain, specially a kind of golden method of the heavy nickel for improving plating leakage, because consent typically uses solder mask consent, this method takes off film process by being carried out after being handled before heavy nickel gold to multi-layer sheet, so that NaOH solution is chemically reacted with remaining micro-corrosion liquid in consent hole, coordinate the mode of spray again, NaOH solution can be made to smoothly enter radius-thickness ratio more than 8：1 consent, eliminate the micro-corrosion liquid of the residual in consent hole, greatly improve the problem of consent hole built-in potential is poor, got ready for follow-up heavy nickel processing, the heavy nickel golden plate plating leakage fraction defective of solder mask consent is set to drop to 2% from 95% before, manufacturing scrap is greatly reduced, production cost is reduced.
Description
Technical field
The present invention relates to plating of printed circuit board nickel golden collar domain, more particularly to a kind of golden method of heavy nickel for improving plating leakage.
Background technology
Heavy nickel gold, is a kind of technique that solderability coating is coated on PCB naked coppers surface, its principle is in naked copper face
Nickel plating is learned, chemistry leaching gold is then carried out again.Heavy nickel gold process can meet increasingly complicated PCB assemblings, the requirement of welding, compare again
The cost of electronickelling gold is low, while can also be effectively protected to the side of wire, prevents from producing in use bad
Phenomenon, therefore be widely adopted in the PCB manufacturing.
But, usually occur the situation of heavy nickel golden plate plating leakage in actual production process, the origin cause of formation of plating leakage is nickel cylinder
Activity can not meet the reaction potential energy of PAD (pad) position, cause heavy nickel chemical reaction midway to stop or basic non-deposited metal
Nickel.Such as：The heavy nickel golden plate of welding resistance consent, is frequently resulted in hole because welding resistance consent is not full or develops, bake the reason such as bad afterwards
Welding resistance can not be filled up entirely, cause to form slit or cavity in hole, will be residual in consent hole then after microetch nog plate process
Part micro-corrosion liquid is stayed, hole built-in potential is thereby resulted in poor so that palladium can not be gone up during activation, and then can not sink nickel gold, but also meeting
Causing all can plating leakage with plating leakage all PAD for being connected of position and hole.
At present, it is general to improve the heavy nickel golden plate leakage of welding resistance consent using microetch cylinder is skipped plus the method for extension soak time
The problem of plating, this method process is as follows：Pre-treatment (microetch, brushing and sandblasting) → acid deoiling agent → bis- washings → preimpregnation (sulphur
Acid) → activation (extension soak time 1-2 minutes) → pure water washes → and pickling (sulfuric acid) → pure water washes → chemical nickel (Ni/P) → pure
Washing → chemistry gold → recovery washing → pure water is washed → is post-processed.It is this to improve the method for the heavy nickel golden plate plating leakage of welding resistance consent, change
It has been apt to the plating leakage problem of the less heavy nickel golden plate of aspect ratio, but has been more than 8 for radius-thickness ratio：The heavy nickel gold of 1 multilayer welding resistance consent
Plate, this method, which does not have but, prevents the effect of plating leakage, still causes substantial amounts of defective work, causes high-volume to be scrapped, and produces
Cost increases suddenly.
The content of the invention
The present invention is more than 8 for radius-thickness ratio：The problem of 1 heavy nickel golden plate plating leakage, is there is provided one kind by being handled before heavy nickel gold
To take off film process big and have the golden method of the heavy nickel of the immersion gold plate plating leakage of welding resistance consent to solve aspect ratio for increase afterwards.
To achieve the above object, the present invention uses following technical scheme：
A kind of golden method of the heavy nickel for improving plating leakage, including will complete to locate before the multi-layer sheet after welding resistance technique carries out heavy nickel gold
Reason, the activation process of Catalytic Layer for forming heavy nickel reactant, the heavy nickel for the deposited nickel layer in multi-layer sheet plate face handle with
And on the nickel dam deposition thereof leaching gold processing, the multi-layer sheet provided with least one piece be used for sink nickel gold naked copper surface
And at least one consent for being clogged by solder mask, after handling before heavy nickel gold, multi-layer sheet is carried out to take off film process, it is described to take off
What film process was performed such：Volume ratio is used to carry out spray process to multi-layer sheet for 3~5% NaOH solution.
Further, it is described to take off in film process, the mode of the aperture of consent upward is placed multi-layer sheet.
Further, wherein the time of spray process is 1~2 minute.
Further, wherein the temperature of NaOH solution is 50 ± 2 DEG C.
Further, after carrying out taking off film process, ultrasonic wave cleaning is carried out to multi-layer sheet using ultrasonic cleaning apparatus.
Further, wherein ultrasonic wave cleans what is be performed such：The aperture mode directed downwardly of consent is set to place multi-layer sheet, will
The power setting of ultrasonic cleaning apparatus is the 20~60% of the maximum power value of ultrasonic cleaning apparatus.
Further, the scavenging period of ultrasonic wave cleaning is 1~2 minute.
Further, the heavy golden method of nickel before activation must be without for being roughened on multi-layer sheet at the microetch on naked copper surface
Manage cylinder.
Further, the time of the activation process is 3~4 minutes.
Compared with prior art, the beneficial effects of the invention are as follows：This golden method of heavy nickel for improving plating leakage, because consent is general
Using solder mask consent, by carrying out taking off film process to multi-layer sheet after handling before heavy nickel gold so that NaOH solution and consent
Micro-corrosion liquid is remained in hole to be chemically reacted, then coordinates the mode of spray, NaOH solution can be made to smoothly enter radius-thickness ratio big
In 8：1 consent, eliminates the residual micro-corrosion liquid in consent hole, greatly improves asking for solder mask consent hole built-in potential difference
Topic, is that subsequently heavy nickel processing is got ready, makes the heavy nickel golden plate plating leakage fraction defective of solder mask consent under 95% before
2% is down to, manufacturing scrap is greatly reduced, production cost is reduced.
Embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment
The present invention provides a kind of heavy nickel for improving plating leakage golden method, and using this method, on multiple-plate naked copper surface, coating can
Weldering property coating, the multi-layer sheet provided with least one piece be used for sink nickel gold naked copper surface and at least one filled out by solder mask
The consent of plug, the specific procedure of processing for coating solderability coating is as follows：
S1, the golden pre-treatment of heavy nickel
What the heavy golden pre-treatment of nickel was performed such：Enter plate (multi-layer sheet) → microetch and (use NaS2O8And H2SO4Solution is carried out
Microetch) → overflow washing twice → nog plate (carrying out nog plate processing using the soft brush of 1000 mesh) → sandblasting (uses 280-320 mesh Buddha's warrior attendants
Sand carries out blasting treatment) → dirt removal water → overflow washing → ultrasonic wave embathes → water column type is rinsed → and waves high-pressure washing → DI water
Wash → drying → and cool down → ejecting plate
S2, take off film process：The mode of the aperture of consent upward is placed multi-layer sheet, use volume ratio for 3~5% NaOH
Solution carries out spray process to multi-layer sheet, and the wherein temperature of NaOH solution is 50 ± 2 DEG C, and the time of spray process is 1~2 point
Clock.
S3, ultrasonic wave cleaning：The aperture mode directed downwardly of consent is set to place multi-layer sheet, using ultrasonic cleaning apparatus to many
Laminate carries out ultrasonic wave cleaning.It is the 20 of the maximum power value of ultrasonic cleaning apparatus by the power setting of ultrasonic cleaning apparatus
~60%, the scavenging period of ultrasonic wave cleaning is 1~2 minute.
S4, heavy nickel gold
What heavy nickel gold was performed such：Upper plate → exchange groove → acid deoiling (50 ± 5 DEG C of temperature is soaked 4 minutes) → heat
(27 ± 3 DEG C of temperature soaks 3~4 points for washing → one-stage water wash → bis- grade washing → pre- pickling (room temperature is soaked 60 seconds) → activation
Clock) → activation after leaching → one-stage water wash → bis- grade washing → chemical sinking nickel (82 ± 3 DEG C of temperature, soak 22 minutes, nickel thickness 3-5um)
→ one-stage water wash → bis- grade washing → chemistry turmeric (85 ± 5 DEG C of temperature is soaked 10 minutes, golden thickness >=0.05um) → reclaim washing
→ one-stage water wash → bis- grade washing → lower plate, wherein the microetch eliminated for being roughened naked copper surface on multi-layer sheet handles cylinder, and
The time of activation process was increased to 3~4 minutes by original 2 minutes.
S5, heavy nickel gold post processing
What heavy nickel gold post processing was performed such：Enter plate → pickling (room temperature is soaked 60 seconds) → washing → ultrasonic wave cleaning
→ drying → ejecting plate.
S6, quality testing is carried out to heavy nickel golden plate.
This golden method of heavy nickel for improving plating leakage, by carrying out taking off film process to multi-layer sheet after handling before heavy nickel gold so that
NaOH solution is chemically reacted with remaining micro-corrosion liquid in consent hole, then coordinates the mode of spray, NaOH solution can be made smooth
Ground enters radius-thickness ratio and is more than 8：1 consent, eliminates the residual micro-corrosion liquid in consent hole, greatly improves electricity in welding resistance consent hole
The problem of potential difference, it is that subsequently heavy nickel processing is got ready, makes the heavy nickel golden plate plating leakage fraction defective of solder mask consent from before
95% drop to 2%, manufacturing scrap is greatly reduced, production cost is reduced.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, and any technology done according to the present invention extends or recreated, and is sent out by this
Bright protection.
Claims (9)
1. a kind of golden method of the heavy nickel for improving plating leakage, including will complete the multi-layer sheet after welding resistance technique carry out the golden pre-treatment of heavy nickel,
Activation process for the Catalytic Layer that forms heavy nickel reactant, for the heavy nickel processing of deposited nickel layer in multi-layer sheet plate face and
The leaching gold processing of deposition thereof on the nickel dam, the multi-layer sheet is used to sinking the naked copper surface and extremely of nickel gold provided with least one piece
Lack a consent clogged by solder mask, it is characterised in that：
After handling before heavy nickel gold, multi-layer sheet is carried out to take off film process, the film process that takes off is：Volume ratio is used for 3~5%
NaOH solution carries out spray process to multi-layer sheet.
2. the golden method of the heavy nickel for improving plating leakage according to claim 1, it is characterised in that：It is described to take off in film process, make plug
The mode of the aperture in hole upward places multi-layer sheet.
3. the golden method of the heavy nickel for improving plating leakage according to claim 2, it is characterised in that：The time of wherein spray process is
1~2 minute.
4. the golden method of the heavy nickel for improving plating leakage according to claim 3, it is characterised in that：The temperature of wherein NaOH solution is
50±2℃。
5. the golden method of the heavy nickel for improving plating leakage as claimed in any of claims 1 to 4, it is characterised in that：Carrying out
Take off after film process, ultrasonic wave cleaning is carried out to multi-layer sheet using ultrasonic cleaning apparatus.
6. the golden method of the heavy nickel for improving plating leakage according to claim 5, it is characterised in that：Wherein ultrasonic wave cleaning is so
Carry out：Make the aperture mode directed downwardly of consent place multi-layer sheet to clean the power setting of ultrasonic cleaning apparatus for ultrasonic wave
The 20~60% of the maximum power value of equipment.
7. the golden method of the heavy nickel for improving plating leakage according to claim 6, it is characterised in that：The scavenging period of ultrasonic wave cleaning
For 1~2 minute.
8. the golden method of the heavy nickel for improving plating leakage as claimed in any of claims 1 to 4, it is characterised in that：The heavy nickel
Golden method must handle cylinder before activation process without the microetch for being roughened naked copper surface on multi-layer sheet.
9. the golden method of the heavy nickel for improving plating leakage as claimed in any of claims 1 to 4, it is characterised in that：The work
The time for changing processing is 3~4 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485686.1A CN107231753B (en) | 2017-06-23 | 2017-06-23 | A kind of heavy nickel gold method improving plating leakage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485686.1A CN107231753B (en) | 2017-06-23 | 2017-06-23 | A kind of heavy nickel gold method improving plating leakage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107231753A true CN107231753A (en) | 2017-10-03 |
| CN107231753B CN107231753B (en) | 2019-08-16 |
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ID=59936495
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710485686.1A Active CN107231753B (en) | 2017-06-23 | 2017-06-23 | A kind of heavy nickel gold method improving plating leakage |
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| Country | Link |
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| CN (1) | CN107231753B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815669A (en) * | 2017-11-02 | 2018-03-20 | 广州市天承化工有限公司 | A kind of method of PCB chemical nickel and golds |
| CN113645770A (en) * | 2021-08-17 | 2021-11-12 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
| CN114630496A (en) * | 2020-12-02 | 2022-06-14 | 黄信翔 | Electroless nickel-gold process capable of reducing chemical treatment steps and system thereof |
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| CN103763869A (en) * | 2013-12-20 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Method for preparing immersion gold printed circuit board |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN104470236A (en) * | 2013-09-16 | 2015-03-25 | 深圳市兴经纬科技开发有限公司 | Post-immersing liquid of circuit board electroless nickel immersion gold and post-immersing method |
| CN105163509A (en) * | 2015-08-26 | 2015-12-16 | 江门崇达电路技术有限公司 | Surface processing method for nickel-gold deposition on whole printed circuit board (PCB) |
| CN105208797A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Manufacture method of semi-plugged nickel and gold immersion |
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2017
- 2017-06-23 CN CN201710485686.1A patent/CN107231753B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470236A (en) * | 2013-09-16 | 2015-03-25 | 深圳市兴经纬科技开发有限公司 | Post-immersing liquid of circuit board electroless nickel immersion gold and post-immersing method |
| CN103763869A (en) * | 2013-12-20 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Method for preparing immersion gold printed circuit board |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN105208797A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Manufacture method of semi-plugged nickel and gold immersion |
| CN105163509A (en) * | 2015-08-26 | 2015-12-16 | 江门崇达电路技术有限公司 | Surface processing method for nickel-gold deposition on whole printed circuit board (PCB) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815669A (en) * | 2017-11-02 | 2018-03-20 | 广州市天承化工有限公司 | A kind of method of PCB chemical nickel and golds |
| CN114630496A (en) * | 2020-12-02 | 2022-06-14 | 黄信翔 | Electroless nickel-gold process capable of reducing chemical treatment steps and system thereof |
| CN113645770A (en) * | 2021-08-17 | 2021-11-12 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
| CN113645770B (en) * | 2021-08-17 | 2022-09-06 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107231753B (en) | 2019-08-16 |
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