CN105163509A - Surface processing method for nickel-gold deposition on whole printed circuit board (PCB) - Google Patents
Surface processing method for nickel-gold deposition on whole printed circuit board (PCB) Download PDFInfo
- Publication number
- CN105163509A CN105163509A CN201510531326.1A CN201510531326A CN105163509A CN 105163509 A CN105163509 A CN 105163509A CN 201510531326 A CN201510531326 A CN 201510531326A CN 105163509 A CN105163509 A CN 105163509A
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- CN
- China
- Prior art keywords
- nickel
- plate
- gold
- pcb
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Abstract
The invention relates to the technical filed of the production of a printed circuit board (PCB), in particular to a surface processing method for nickel-gold deposition on the whole PCB. According to the method, an ink layer is firstly fabricated on a region with circuit distance less than 0.12 millimeter on a production board, ink is filled in the whole gap between circuits with the diffusion of the ink, thus, the ink layer is formed on the region with compact circuits, nickel-gold plating can be prevented from being deposited on the gap between the circuits, and the ink layer is removed after nickel-gold deposition on the circuit board. By the method, the nickel-gold deposition is carried out on the whole production board, and a gold leakage phenomenon is prevented when the circuit distance on the production board is 0.08 millimeter.
Description
Technical field
The present invention relates to board production technical field, particularly relate to a kind of on PCB whole plate sink the surface treatment method of nickel gold.
Background technology
Wiring board (PrintedCircuitBoard, PCB) is important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Last key link that wiring board is produced is surface treatment, and surface treatment generally comprises following several mode: heavy nickel gold, heavy silver, heavy nickel, electronickelling gold, have plumbous spray tin, lead-free tin spray, anti-oxidant, light copper.Prior art is done whole plate in the circuit board and is sunk the process of nickel gold surface and there is limitation, and on etching rear board, the minimum spacing of circuit need be more than or equal to 0.12mm, if the minimum spacing of circuit is less than 0.12mm, there will be and oozes golden problem, affect the quality of wiring board.
Summary of the invention
The present invention is directed to existing whole plate and sink the problem that to there will be when the process of nickel gold surface is carried out on the wiring board that minimum spacing is less than 0.12mm and ooze gold, providing a kind of can sink the method for nickel gold surface process in minimum line apart from for the wiring board of 0.08mm do whole plate.
For achieving the above object, the present invention by the following technical solutions.
On PCB, whole plate sinks a surface treatment method for nickel gold, comprises the following steps:
S1 oil spout ink: on the production plate having made outer-layer circuit and line pitch is less than the region oil spout ink of 0.12mm.
Preferably, on production plate, the width of institute's oil spout ink is 0.03mm.
S2 baking sheet: toast 40-50min at production plate is placed in 145-155 DEG C, make the ink solidification on production plate, forms ink layer.
Preferably, 45min is toasted at production plate being placed in 150 DEG C.
S3 sinks nickel gold: first on production plate, form one deck nickel dam in the mode of chemical sinking nickel, and then on production plate, forms one deck layer gold in the mode of chemical turmeric.
Preferably, the thickness of described nickel dam is 3-5 μm.Preferably, the thickness of described layer gold is more than or equal to 0.076 μm.
S4 moves back film: remove ink layer with akaline liquid.
Preferably, described akaline liquid to be mass percentage concentration be 5% sodium hydroxide solution.Preferably, sodium hydroxide solution production plate being placed in 60 DEG C soaks 15min.
Compared with prior art, the invention has the beneficial effects as follows: the region that the present invention is less than 0.12mm by elder generation's line pitch on production plate makes ink layer, utilize the diffusion of ink, ink is made to fill whole gap between the lines, thus form one deck ink layer in the region that circuit is intensive, can prevent gap between circuit heavy on nickel gold, sunk in the circuit board after nickel gold and returned ink layer again.Sink nickel gold by the inventive method whole plate on production plate, the spacing of producing circuit on plate is that 0.08mm also there will not be and oozes golden phenomenon.
Embodiment
In order to understand technology contents of the present invention more fully, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment
The present embodiment provides the preparation method of a kind of PCB, especially does whole plate and sinks the preparation method of PCB of nickel gold surface process.
The specification of prepared PCB is as follows:
Core material: the 1.1mmH/H number of plies: 4L
The outer live width spacing of internal layer live width spacing: Min3/3miL: Min4/4miL
Plate Tg:150 DEG C outer copper foil: HOZ
Hole copper thickness: Min25 μm welding resistance: nothing
Surface treatment: whole plate sinks nickel gold
Complete thickness of slab: 1.4mm+0.1mmSET size: 112.01mm × 95.00mm
Do whole plate and sink the preparation method of PCB of nickel gold surface process, specifically comprise the following steps:
(1) there is the production plate of outer-layer circuit
According to prior art, make internal layer circuit → pressing → boring → heavy copper → electric plating of whole board → positive blade technolgy through sawing sheet → negative film technique successively and make outer-layer circuit, base material is made into the production plate with outer-layer circuit.Specific as follows:
A, sawing sheet: output central layer by jigsaw size 520mm × 620mm, core thickness 0.5mmH/H.
B, internal layer circuit (negative film technique): produce with vertical application machine, film thickness monitoring 8 μm, adopts Full-automatic exposure machine, completes internal layer circuit exposure with 5-6 lattice exposure guide rule (21 lattice exposure guide rule), development after etching goes out line pattern, and internal layer live width measures as 3miL.What then check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, and defectiveness scraps process, and flawless product goes out to downstream.
C, pressing: can not cross brown flow process, after lamination, select suitable lamination to carry out pressing according to plate Tg, thickness 1.3mm after pressing.
D, boring: utilize borehole data to carry out Drilling operation.
E, heavy copper: make the hole metallization on production plate, backlight tests 10 grades.
F, electric plating of whole board: with the current density electric plating of whole board 20min of 18ASF, hole copper thickness MIN5 μm.
G, outer-layer circuit (positive blade technolgy): adopt Full-automatic exposure machine, complete outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), through development, production plate forms outer-layer circuit figure; Then respectively copper facing and zinc-plated on production plate, the electroplating parameter of copper facing parameter: 1.8ASD × 60min, zinc-plated electroplating parameter: 1.2ASD × 10min, tin is thick is 3-5 μm; And then move back film successively, etch and move back tin, production plate etches outer-layer circuit.
(2) oil spout ink
Above-mentioned production plate is less than the region oil spout ink of 0.12mm in line pitch, the width controlling institute's oil spout ink is 0.03mm.
(3) baking sheet
Toast 45min at production plate is placed in 150 DEG C, make the ink solidification on production plate, form ink layer.(in other embodiments, toast 40-50min at also production plate can being placed in 145-155 DEG C, make the ink solidification on production plate.)
(4) heavy nickel gold
First on production plate, form one deck nickel dam in the mode of chemical sinking nickel, the thickness controlling nickel dam is 3-5 μm.And then on production plate, forming one deck layer gold in the mode of chemical turmeric, the thickness controlling layer gold is more than or equal to 0.076 μm.
(5) film is moved back
Being 15min in the sodium hydroxide solution of 5% by producing the mass percentage concentration that plate is soaked in 60 DEG C, returning with this ink layer produced on plate.
(6) detect with shaping
Produce the electric property of plate according to prior art test, then gong profile and again take a sample test the outward appearance of plate, obtained whole plate sinks the PCB of nickel gold process, obtains whole finished product.Specific as follows:
A, electrical measurement: the electric property of test-based examination production board.
B, shaping: gong external form, external form tolerance +/-0.05mm.
C, FQA: again take a sample test outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thick etc.
D, packaging: by customer requirement, pack PCB, and put drier and humidity card.
Sink nickel gold by the present embodiment method whole plate on production plate, the spacing of producing circuit on plate is that 0.08mm also there will not be and oozes golden phenomenon.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (7)
1. on PCB, whole plate sinks a surface treatment method for nickel gold, it is characterized in that, comprises the following steps:
S1 oil spout ink: on the production plate having made outer-layer circuit and line pitch is less than the region oil spout ink of 0.12mm;
S2 baking sheet: toast 40-50min at production plate is placed in 145-155 DEG C, make the ink solidification on production plate, forms ink layer;
S3 sinks nickel gold: first on production plate, form one deck nickel dam in the mode of chemical sinking nickel, and then on production plate, forms one deck layer gold in the mode of chemical turmeric;
S4 moves back film: remove ink layer with akaline liquid.
2. according to claim 1 a kind of on PCB whole plate sink the surface treatment method of nickel gold, it is characterized in that, in described step S1, be 0.03mm at the width producing institute's oil spout ink on plate.
3. according to claim 1 a kind of on PCB whole plate sink the surface treatment method of nickel gold, it is characterized in that, in described step S3, the thickness of described nickel dam is 3-5 μm.
4. according to claim 3 a kind of on PCB whole plate sink the surface treatment method of nickel gold, it is characterized in that, in described step S3, the thickness of described layer gold is more than or equal to 0.076 μm.
5. according to claim 1 a kind of on PCB whole plate sink the surface treatment method of nickel gold, it is characterized in that, in described step S2, at production plate is placed in 150 DEG C, toast 45min.
6. according to claim 1 a kind of on PCB whole plate sink the surface treatment method of nickel gold, it is characterized in that, in described step S4, described akaline liquid to be mass percentage concentration be 5% sodium hydroxide solution.
7. according to claim 6 a kind of on PCB whole plate sink the surface treatment method of nickel gold, it is characterized in that, in described step S4, the sodium hydroxide solution producing plate and be placed in 60 DEG C is soaked 15min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510531326.1A CN105163509B (en) | 2015-08-26 | 2015-08-26 | A kind of whole plate on PCB sinks the surface treatment method of nickel gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510531326.1A CN105163509B (en) | 2015-08-26 | 2015-08-26 | A kind of whole plate on PCB sinks the surface treatment method of nickel gold |
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| Publication Number | Publication Date |
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| CN105163509A true CN105163509A (en) | 2015-12-16 |
| CN105163509B CN105163509B (en) | 2018-05-01 |
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| CN201510531326.1A Active CN105163509B (en) | 2015-08-26 | 2015-08-26 | A kind of whole plate on PCB sinks the surface treatment method of nickel gold |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072062A (en) * | 2017-05-04 | 2017-08-18 | 东莞市黄江大顺电子有限公司 | A kind of surface treatment method of circuit board |
| CN107231753A (en) * | 2017-06-23 | 2017-10-03 | 深圳崇达多层线路板有限公司 | A kind of golden method of the heavy nickel for improving plating leakage |
| CN107815669A (en) * | 2017-11-02 | 2018-03-20 | 广州市天承化工有限公司 | A kind of method of PCB chemical nickel and golds |
| CN107995802A (en) * | 2017-12-11 | 2018-05-04 | 江西鑫力华数码科技有限公司 | A kind of preparation method of the immersion Ni/Au of printed circuit board (PCB) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04267597A (en) * | 1991-02-22 | 1992-09-24 | Sumitomo Electric Ind Ltd | Manufacture of flexible printed wiring board |
| CN102045951A (en) * | 2010-11-29 | 2011-05-04 | 上海申和热磁电子有限公司 | Metal surface plated nickel/gold treatment method of ceramic metalized substrate and manufactured ceramic metalized substrate |
| CN101562943B (en) * | 2008-04-15 | 2013-03-06 | 珠海方正科技多层电路板有限公司 | Method for melting nickel alloy by selective ink instead of dry film |
| CN104684259A (en) * | 2006-08-07 | 2015-06-03 | 太阳化学公司 | Etching or plating process and resist ink |
-
2015
- 2015-08-26 CN CN201510531326.1A patent/CN105163509B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04267597A (en) * | 1991-02-22 | 1992-09-24 | Sumitomo Electric Ind Ltd | Manufacture of flexible printed wiring board |
| CN104684259A (en) * | 2006-08-07 | 2015-06-03 | 太阳化学公司 | Etching or plating process and resist ink |
| CN101562943B (en) * | 2008-04-15 | 2013-03-06 | 珠海方正科技多层电路板有限公司 | Method for melting nickel alloy by selective ink instead of dry film |
| CN102045951A (en) * | 2010-11-29 | 2011-05-04 | 上海申和热磁电子有限公司 | Metal surface plated nickel/gold treatment method of ceramic metalized substrate and manufactured ceramic metalized substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072062A (en) * | 2017-05-04 | 2017-08-18 | 东莞市黄江大顺电子有限公司 | A kind of surface treatment method of circuit board |
| CN107231753A (en) * | 2017-06-23 | 2017-10-03 | 深圳崇达多层线路板有限公司 | A kind of golden method of the heavy nickel for improving plating leakage |
| CN107231753B (en) * | 2017-06-23 | 2019-08-16 | 深圳崇达多层线路板有限公司 | A kind of heavy nickel gold method improving plating leakage |
| CN107815669A (en) * | 2017-11-02 | 2018-03-20 | 广州市天承化工有限公司 | A kind of method of PCB chemical nickel and golds |
| CN107995802A (en) * | 2017-12-11 | 2018-05-04 | 江西鑫力华数码科技有限公司 | A kind of preparation method of the immersion Ni/Au of printed circuit board (PCB) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105163509B (en) | 2018-05-01 |
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