CN114361781A - Manufacturing process and application of micro-miniature patch PCB antenna - Google Patents
Manufacturing process and application of micro-miniature patch PCB antenna Download PDFInfo
- Publication number
- CN114361781A CN114361781A CN202210001211.1A CN202210001211A CN114361781A CN 114361781 A CN114361781 A CN 114361781A CN 202210001211 A CN202210001211 A CN 202210001211A CN 114361781 A CN114361781 A CN 114361781A
- Authority
- CN
- China
- Prior art keywords
- plate
- antenna
- follows
- copper
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing process and application of a micro patch PCB antenna, wherein the manufacturing process of the micro patch PCB antenna is as follows: determining the size of the antenna, calculating the length of the antenna in the specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software; selecting a plate, and calculating the arrangement number of the antennas on one plate; cutting: according to the requirements of the engineering data MI, cutting the large plate meeting the requirements into small pieces to produce a plate; drilling; copper deposition; transferring the graph; electroplating the pattern; removing the film; etching; green oil; a character; gold plating the fingers; plating tin plate; molding; testing; final inspection; braiding; the width of the antenna is increased by the idea of coupling feed, and a winding mode is ingeniously applied, so that the structure of the antenna is realized, and the defect that the sintered ceramic antenna is fragile is overcome; the TWS bluetooth receives a transmitted 2.42GHZ omnidirectional, high efficiency, low frequency antenna.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a manufacturing process and application of a micro-miniature patch PCB antenna.
Background
The antenna has various forms, different antenna structures and sizes, and in the production process, in order to ensure that different antennas meet the structural requirements of products, the size and the circuit of the antenna are modified, the common microminiature patch antenna adopts a ceramic laminated sintering mode, so that the produced antenna has the following defects: the process is complex, the reject ratio is high, a large amount of material resources and manpower are required to be invested, the manufacturing cost is high, and the ceramic is fragile.
Therefore, a manufacturing process and application of a high-efficiency and low-frequency micro-miniature patch PCB antenna become a problem to be solved urgently.
Disclosure of Invention
The invention aims to solve the technical problems that the existing micro patch antenna has complex process, high reject ratio, high manufacturing cost and fragile ceramic, and needs to invest a large amount of material resources and manpower.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: a manufacturing process and application of a micro patch PCB antenna are disclosed, wherein the manufacturing process of the micro patch PCB antenna is as follows:
step 1, determining the size of an antenna, calculating the length of the antenna in a specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software;
the working flow of cutting is as follows:
large plate → cutting plate according to MI requirement → curium plate → round corner of beer, edging → discharging plate;
the drilling workflow is as follows:
the pin of the laminated plate → the upper plate → the drill hole → the lower plate → the inspection and repair;
step 5, copper deposition: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method;
step 6, pattern transfer: the pattern transfer is to transfer the image on the production film to a plate;
the work flow of blue oil is as follows:
grinding the plate → printing the first side → drying → printing the second side → drying → blasting → developing → checking;
the dry film procedure is as follows:
hemp board → pressed film → standing → alignment → exposure → standing → shadow → inspection;
step 7, pattern electroplating: the pattern electroplating is to electroplate a copper layer with required thickness and gold nickel and tin layers with required thickness on the exposed copper sheet and the hole wall of the circuit pattern;
the work flow of pattern plating is as follows:
upper plate → degreasing → washing twice → microetching → washing → acid washing → copper plating → washing → pickling → tin plating → washing → lower plate;
step 8, removing the film: removing the anti-electroplating covering film layer by using NaOH solution to expose the non-circuit copper layer;
the workflow of the water film is as follows:
inserting frame → alkali soaking → washing → scrubbing → machine passing;
the dry film procedure is as follows:
placing the plate → passing the machine;
step 9, etching: etching is to etch the copper layer at the non-circuit part by using a chemical reaction method;
step 10, green oil: the green oil is used for transferring the pattern of the green oil film to the board, so that the effects of protecting the circuit and preventing tin on the circuit when parts are welded are achieved;
the green oil workflow is as follows:
grinding plate → printing photosensitive green oil → cramping plate → exposing → developing; grinding the plate → printing the first face → baking the plate → printing the second face → baking the plate;
step 11, character: the characters are marks which are convenient to identify;
the workflow of the character is as follows:
after the final curium of the green oil → cooling and standing → screen adjustment → character printing → post curium;
step 12, gold plating of fingers: plating a layer of nickel and gold with required thickness on the plug fingers to ensure that the plug fingers have hardness;
the workflow of the gold plated finger is as follows:
upper plate → degreasing → twice washing → microetching → twice washing → acid washing → copper plating → washing → nickel plating → washing → gold plating;
step 13, tin plate plating: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance;
the working flow of the tin plate is as follows:
micro-etching → air drying → preheating → rosin coating → solder coating → hot air smoothing → air cooling → washing and air drying;
step 14, forming: the required shape of a customer is formed by die stamping or routing through a numerical control routing machine;
step 15, testing: through an electronic 100% test, defects which are difficult to find by eyes and affect functionality such as open circuit, short circuit and the like are detected;
the workflow of the test is as follows:
top mold → plate release → test → pass → FQC visual inspection → fail → repair → return test → OK → REJ → scrap;
step 16, final inspection: the appearance defects of the plate are inspected by 100% of eyes, and slight defects are repaired, so that the defective plate is prevented from flowing out;
the workflow of the final inspection is as follows:
incoming material → view data → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → processing → inspection OK;
step 17, braiding: and weaving the tested finished products into a disc of products which can be pasted by an SMT machine.
Further, the application of the micro patch PCB antenna is as follows: a. through coupling feed, one end of the upper copper foil and the lower copper foil are overlapped, and is connected with a signal, and the other end of the upper copper foil and the lower copper foil is grounded; b. the wire winding is achieved through spiral wire winding, the upper layer and the lower layer of wiring are printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, the effect of transmitting wireless signals is achieved through two end electrodes and product connection, and the TWS Bluetooth is used for receiving and transmitting 2.42GHZ omnidirectional.
Further, the forming method in step 14 includes a mechanical gong, a beer board, a hand gong and a hand cutting.
Compared with the prior art, the invention has the advantages that: the width of the antenna is increased by the idea of coupling feed, and a winding mode is ingeniously applied, so that the structure of the antenna is realized, and the defect that the sintered ceramic antenna is fragile is overcome; the TWS Bluetooth receives the transmitted omnidirectional, high-efficiency and low-frequency antenna with 2.42 GHZ; the invention has simple structure, easy realization, short research and development time and low production cost; the invention has reasonable design and is worth popularizing.
Drawings
Fig. 1 is a schematic structural diagram of a micro-miniature patch PCB antenna.
Fig. 2 is a schematic structural diagram of a cubic multi-layer board, wherein the circuits are distributed on different layers and are conducted through blind buried holes.
Fig. 3 is a schematic structural diagram of the motherboard connected by two side pads of the copper foil coupling frequency of the upper and lower layers.
As shown in the figure: 1. red line, 2, blue line, 3, via, 4, pad.
Detailed Description
The following will explain the manufacturing process and application of a micro patch PCB antenna of the present invention in detail with reference to the accompanying drawings.
The present invention will be described in detail with reference to the accompanying fig. 1 to 3.
A manufacturing process of a micro patch PCB antenna and a manufacturing process applying the micro patch PCB antenna are as follows:
step 1, determining the size of an antenna, calculating the length of the antenna in a specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software;
the working flow of cutting is as follows:
large plate → cutting plate according to MI requirement → curium plate → round corner of beer, edging → discharging plate;
the drilling workflow is as follows:
the pin of the laminated plate → the upper plate → the drill hole → the lower plate → the inspection and repair;
step 5, copper deposition: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method;
step 6, pattern transfer: the pattern transfer is to transfer the image on the production film to a plate;
the work flow of blue oil is as follows:
grinding the plate → printing the first side → drying → printing the second side → drying → blasting → developing → checking;
the dry film procedure is as follows:
hemp board → pressed film → standing → alignment → exposure → standing → shadow → inspection;
step 7, pattern electroplating: the pattern electroplating is to electroplate a copper layer with required thickness and gold nickel and tin layers with required thickness on the exposed copper sheet and the hole wall of the circuit pattern;
the work flow of pattern plating is as follows:
upper plate → degreasing → washing twice → microetching → washing → acid washing → copper plating → washing → pickling → tin plating → washing → lower plate;
step 8, removing the film: removing the anti-electroplating covering film layer by using NaOH solution to expose the non-circuit copper layer;
the workflow of the water film is as follows:
inserting frame → alkali soaking → washing → scrubbing → machine passing;
the dry film procedure is as follows:
placing the plate → passing the machine;
step 9, etching: etching is to etch the copper layer at the non-circuit part by using a chemical reaction method;
step 10, green oil: the green oil is used for transferring the pattern of the green oil film to the board, so that the effects of protecting the circuit and preventing tin on the circuit when parts are welded are achieved;
the green oil workflow is as follows:
grinding plate → printing photosensitive green oil → cramping plate → exposing → developing; grinding the plate → printing the first face → baking the plate → printing the second face → baking the plate;
step 11, character: the characters are marks which are convenient to identify;
the workflow of the character is as follows:
after the final curium of the green oil → cooling and standing → screen adjustment → character printing → post curium;
step 12, gold plating of fingers: plating a layer of nickel and gold with required thickness on the plug fingers to ensure that the plug fingers have hardness;
the workflow of the gold plated finger is as follows:
upper plate → degreasing → twice washing → microetching → twice washing → acid washing → copper plating → washing → nickel plating → washing → gold plating;
step 13, tin plate plating: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance;
the working flow of the tin plate is as follows:
micro-etching → air drying → preheating → rosin coating → solder coating → hot air smoothing → air cooling → washing and air drying;
step 14, forming: the required shape of a customer is formed by die stamping or routing through a numerical control routing machine;
step 15, testing: through an electronic 100% test, defects which are difficult to find by eyes and affect functionality such as open circuit, short circuit and the like are detected;
the workflow of the test is as follows:
top mold → plate release → test → pass → FQC visual inspection → fail → repair → return test → OK → REJ → scrap;
step 16, final inspection: the appearance defects of the plate are inspected by 100% of eyes, and slight defects are repaired, so that the defective plate is prevented from flowing out;
the workflow of the final inspection is as follows:
incoming material → view data → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → processing → inspection OK;
step 17, braiding: and weaving the tested finished products into a disc of products which can be pasted by an SMT machine.
The application of the micro-miniature patch PCB antenna is as follows: a. through coupling feed, one end of the upper copper foil and the lower copper foil are overlapped, and is connected with a signal, and the other end of the upper copper foil and the lower copper foil is grounded; b. the wire winding is achieved through spiral wire winding, the upper layer and the lower layer of wiring are printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, the effect of transmitting wireless signals is achieved through two end electrodes and product connection, and the TWS Bluetooth is used for receiving and transmitting 2.42GHZ omnidirectional.
And the forming method in the step 14 comprises a mechanical gong, a beer board, a hand gong and a hand cutting.
The specific implementation process of the manufacturing process and the application of the micro-miniature patch PCB antenna comprises the following steps:
in the first embodiment, the upper copper foil and the lower copper foil are partially overlapped by coupling feed, one end of the upper copper foil and the lower copper foil is connected with a signal, and the other end of the upper copper foil and the lower copper foil is connected with the ground.
The second embodiment is realized by spiral winding, the wiring of the upper layer and the lower layer is printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, the wireless signal transmission effect is achieved by connecting two end electrodes and a product, and the TWS Bluetooth is used for receiving and transmitting 2.42GHZ omnidirectional.
The width of the antenna is increased by the idea of coupling feed, and a winding mode is ingeniously applied, so that the structure of the antenna is realized, and the defect that the sintered ceramic antenna is fragile is overcome; the TWS Bluetooth receives the transmitted omnidirectional, high-efficiency and low-frequency antenna with 2.42 GHZ; the invention has simple structure, easy realization, short research and development time and low production cost; the invention has reasonable design and is worth popularizing.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (3)
1. A manufacturing process and application of a micro-miniature patch PCB antenna are characterized in that: the manufacturing process of the micro-miniature patch PCB antenna is as follows:
step 1, determining the size of an antenna, calculating the length of the antenna in a specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software;
step 2, selecting a plate, and calculating the arrangement number of the antennas on one plate;
step 3, cutting: according to the requirements of the engineering data MI, cutting the large plate meeting the requirements into small pieces to produce a plate;
the working flow of cutting is as follows:
large plate → cutting plate according to MI requirement → curium plate → round corner of beer, edging → discharging plate;
step 4, drilling: drilling a required hole diameter at a corresponding position on the plate material which meets the required size according to engineering data;
the drilling workflow is as follows:
the pin of the laminated plate → the upper plate → the drill hole → the lower plate → the inspection and repair;
step 5, copper deposition: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method;
step 6, pattern transfer: the pattern transfer is to transfer the image on the production film to a plate;
the work flow of blue oil is as follows:
grinding the plate → printing the first side → drying → printing the second side → drying → blasting → developing → checking;
the dry film procedure is as follows:
hemp board → pressed film → standing → alignment → exposure → standing → shadow → inspection;
step 7, pattern electroplating: the pattern electroplating is to electroplate a copper layer with required thickness and gold nickel and tin layers with required thickness on the exposed copper sheet and the hole wall of the circuit pattern;
the work flow of pattern plating is as follows:
upper plate → degreasing → washing twice → microetching → washing → acid washing → copper plating → washing → pickling → tin plating → washing → lower plate;
step 8, removing the film: removing the anti-electroplating covering film layer by using NaOH solution to expose the non-circuit copper layer;
the workflow of the water film is as follows:
inserting frame → alkali soaking → washing → scrubbing → machine passing;
the dry film procedure is as follows:
placing the plate → passing the machine;
step 9, etching: etching is to etch the copper layer at the non-circuit part by using a chemical reaction method;
step 10, green oil: the green oil is used for transferring the pattern of the green oil film to the board, so that the effects of protecting the circuit and preventing tin on the circuit when parts are welded are achieved;
the green oil workflow is as follows:
grinding plate → printing photosensitive green oil → cramping plate → exposing → developing; grinding the plate → printing the first face → baking the plate → printing the second face → baking the plate;
step 11, character: the characters are marks which are convenient to identify;
the workflow of the character is as follows:
after the final curium of the green oil → cooling and standing → screen adjustment → character printing → post curium;
step 12, gold plating of fingers: plating a layer of nickel and gold with required thickness on the plug fingers to ensure that the plug fingers have hardness;
the workflow of the gold plated finger is as follows:
upper plate → degreasing → twice washing → microetching → twice washing → acid washing → copper plating → washing → nickel plating → washing → gold plating;
step 13, tin plate plating: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance;
the working flow of the tin plate is as follows:
micro-etching → air drying → preheating → rosin coating → solder coating → hot air smoothing → air cooling → washing and air drying;
step 14, forming: the required shape of a customer is formed by die stamping or routing through a numerical control routing machine;
step 15, testing: through an electronic 100% test, defects which are difficult to find by eyes and affect functionality such as open circuit, short circuit and the like are detected;
the workflow of the test is as follows:
top mold → plate release → test → pass → FQC visual inspection → fail → repair → return test → OK → REJ → scrap;
step 16, final inspection: the appearance defects of the plate are inspected by 100% of eyes, and slight defects are repaired, so that the defective plate is prevented from flowing out;
the workflow of the final inspection is as follows:
incoming material → view data → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → processing → inspection OK;
step 17, braiding: and weaving the tested finished products into a disc of products which can be pasted by an SMT machine.
2. The manufacturing process and application of the micro-miniature patch PCB antenna as claimed in claim 1, wherein: the application of the micro-miniature patch PCB antenna is as follows: a. through coupling feed, one end of the upper copper foil and the lower copper foil are overlapped, and is connected with a signal, and the other end of the upper copper foil and the lower copper foil is grounded; b. the wire winding is achieved through spiral wire winding, the upper layer and the lower layer of wiring are printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, the effect of transmitting wireless signals is achieved through two end electrodes and product connection, and the TWS Bluetooth is used for receiving and transmitting 2.42GHZ omnidirectional.
3. The manufacturing process and application of the micro-miniature patch PCB antenna as claimed in claim 1, wherein: and the forming method in the step 14 comprises a mechanical gong, a beer board, a hand gong and a hand cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210001211.1A CN114361781A (en) | 2022-01-04 | 2022-01-04 | Manufacturing process and application of micro-miniature patch PCB antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210001211.1A CN114361781A (en) | 2022-01-04 | 2022-01-04 | Manufacturing process and application of micro-miniature patch PCB antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114361781A true CN114361781A (en) | 2022-04-15 |
Family
ID=81105918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210001211.1A Pending CN114361781A (en) | 2022-01-04 | 2022-01-04 | Manufacturing process and application of micro-miniature patch PCB antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114361781A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114927865A (en) * | 2022-05-25 | 2022-08-19 | 鸿基无线通信(深圳)有限公司 | Small-sized PCB antenna manufacturing process and application |
-
2022
- 2022-01-04 CN CN202210001211.1A patent/CN114361781A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114927865A (en) * | 2022-05-25 | 2022-08-19 | 鸿基无线通信(深圳)有限公司 | Small-sized PCB antenna manufacturing process and application |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108990279B (en) | Manufacturing method of PCB back drilling hole | |
| CN104363720A (en) | Method of forming deep blind groove in printed circuit board (PCB) | |
| CN113163609B (en) | Production method of 5G mainboard circuit board | |
| CN106993378A (en) | A kind of pcb board selective surface handling process | |
| CN106973514A (en) | PAD preparation method in a kind of PCB | |
| CN111511120B (en) | Raided Pad manufacturing method | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| TWI609612B (en) | Stencil printing method for manufacturing printed circuit board | |
| CN111787698B (en) | Z-shaped slot hole machining method | |
| CN110248473A (en) | A method of it is small to solve VIA-IN-PAD filling holes with resin PCB printed board crimping hole | |
| CN109511214A (en) | A kind of LED circuit board and preparation method thereof of black FR4 substrate | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| CN114361781A (en) | Manufacturing process and application of micro-miniature patch PCB antenna | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN112739022A (en) | Process for applying printed circuit board by HDI technology | |
| TWI609613B (en) | Silkscreen printing method for manufacturing printed circuit board | |
| CN106793578A (en) | A kind of PCB preparation methods in electric thick gold hole | |
| CN110839319A (en) | Method for manufacturing high-precision impedance circuit | |
| CN113891557A (en) | Printed circuit board manufacturing method | |
| CN108401381A (en) | A kind of production method of disconnecting golden finger class printed circuit board | |
| CN108712819B (en) | Printed circuit board scrapping method | |
| CN115955786A (en) | Production process of three-side wrapped Jin Dujin finger | |
| CN105682380A (en) | Manufacturing method for PCB electroplated with thick-gold partially | |
| CN202262100U (en) | Ultrahigh frequency (UHF) multi-layer printed circuit board production system | |
| CN109982511A (en) | A kind of production method convenient for detecting the PCB for whether leaking brill without copper hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |