CN114927865A - Small-sized PCB antenna manufacturing process and application - Google Patents
Small-sized PCB antenna manufacturing process and application Download PDFInfo
- Publication number
- CN114927865A CN114927865A CN202210575013.6A CN202210575013A CN114927865A CN 114927865 A CN114927865 A CN 114927865A CN 202210575013 A CN202210575013 A CN 202210575013A CN 114927865 A CN114927865 A CN 114927865A
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- pcb
- copper
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000003466 welding Methods 0.000 claims abstract description 19
- 230000008878 coupling Effects 0.000 claims abstract description 6
- 238000010168 coupling process Methods 0.000 claims abstract description 6
- 238000005859 coupling reaction Methods 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 claims description 4
- 235000013405 beer Nutrition 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000005028 tinplate Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Abstract
The invention discloses a manufacturing process and application of a small PCB antenna, which comprises a red line, a blue line, a via hole, a bonding pad, a PCB, a first feeding part and a second feeding part, and is characterized in that: the PCB board is a body, a bonding pad is arranged inside the PCB board, a first feeding portion is arranged below the left side of the bonding pad, a red circuit is arranged on the first feeding portion through a welding spot, a through hole is formed in the red circuit through the welding spot, a blue circuit is arranged on the through hole through the welding spot, a second feeding portion is arranged on the red circuit through the welding spot, the PCB board conducts electromagnetic coupling feeding, a signal is connected by overlapping an upper copper foil part and a lower copper foil part, the other end of the PCB board is grounded, wiring of the upper layer and the lower layer is printed on a copper-clad PCB, each layer of circuit is connected through a through hole mode, and the effect of transmitting wireless signals is achieved through two end electrodes and product connection; the SMT chip mounting structure has the advantages of small size, capability of being directly assembled by SMT chips, small occupied space and low cost.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a manufacturing process and application of a small PCB antenna.
Background
With the development of advanced science and technology of society, people have more and more demands on signal transmission and signal sharing, and the internet of things is generated accordingly. And with the development of the technology of the internet of things, the requirement of the NB-LOT antenna is increased greatly, and under the trend, the requirement of the NB-LOT antenna is increased. The requirement of the miniaturized antenna is more and more strict, the miniaturized antenna can be placed in more areas and used on more devices, the area of the general NB-LOT antenna is larger, the occupied space is larger, and the requirement of antenna miniaturization cannot be met.
In addition, 470MHz antenna used in Digital Television (DTV) and 430MHz antenna used in robot control, smart home, wireless meter reading, etc. are used. Using FRID antenna at 433MHz and CDMA450 for chinese telecommunications. The antenna can meet the requirement of good transmission distance in a severe environment, but the size of the general antenna of the low-frequency antenna is very large, the price is very high, and the antenna is inconvenient to place.
In order to solve the problems in the prior art, the embodiment of the invention provides a manufacturing process and application of a small-sized PCB antenna, and the small-sized PCB antenna has the advantages of small size, direct SMT patch assembly, small occupied space, low cost and the like.
Disclosure of Invention
The invention aims to provide a manufacturing process and application of a small PCB antenna, which have the advantages of small size, direct SMT patch assembly, small occupied space and low cost and solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a manufacturing process of a small PCB antenna is as follows:
1. determining the size of the antenna, calculating the length of the antenna in the specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software;
2. selecting a plate, and calculating the arrangement number of the antennas on one plate;
3. cutting: according to the requirements of the engineering data MI, cutting the large plate meeting the requirements into small pieces to produce a plate;
4. copper deposition: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method;
5. pattern transfer: the pattern transfer is to transfer the image on the production film to a plate;
6. pattern electroplating: the pattern electroplating is to electroplate a copper layer with required thickness and gold nickel and tin layers with required thickness on the exposed copper sheet and the hole wall of the circuit pattern;
7. removing the film: removing the anti-electroplating covering film layer by using NaOH solution to expose the non-circuit copper layer;
8. etching: etching is to etch the copper layer at the non-circuit part by using a chemical reaction method;
9. green oil: the green oil is used for transferring the pattern of a green oil film to the board, and plays a role in protecting the circuit and preventing tin on the circuit when parts are welded;
10. character: characters are marks that provide easy identification;
11. gold plating of fingers: plating a layer of nickel and gold with required thickness on the plug fingers to ensure that the plug fingers have hardness;
12. tin plate plating: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance;
13. molding: the required shape of a customer is formed by die stamping or routing through a numerical control routing machine;
14. and (3) testing: through an electronic 100% test, defects which are difficult to find by eyes and affect functionality such as open circuit, short circuit and the like are detected;
15. final inspection: the appearance defects of the plate are inspected by 100% of eyes, and slight defects are repaired, so that the defective plate is prevented from flowing out;
a small PCB antenna manufacturing process and application are provided, the technical scheme is as follows: the antenna comprises a first feed portion and a second feed portion, the first feed portion is located at the left end of a welding plate, the second feed portion is located at the right end of the welding plate, a welding plate is arranged between the first feed portion and the second feed portion, through holes which are transversely arranged are formed in the welding plate, routing red lines and blue lines are arranged between the through holes, the routing red lines and the blue lines sequentially penetrate through the through holes along the front and back surfaces of the welding plate, the routing red lines and the blue lines are in spiral winding shapes from left to right, the left ends of the routing red lines and the blue lines are connected with the first feed portion, and the right ends of the routing red lines and the blue lines are connected with the second feed portion.
Preferably, the antenna inside the PCB board is fed through electromagnetic coupling, one end of each of the upper copper foil part and the lower copper foil part is overlapped with one end of each of the upper copper foil part and the lower copper foil part, the other end of each of the upper copper foil part and the lower copper foil part is grounded, the antenna is realized through spiral winding, the upper copper foil part and the lower copper foil part are printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, and the wireless signal transmission effect is achieved through connection of electrodes at two ends and a product.
Preferably, the forming method in step 13 includes a mechanical gong, a beer board, a hand gong and a hand cutting.
Preferably, the first feeding portion is attached to the front side, the back side and the left side of the welding plate, the second feeding portion is attached to the front side, the back side and the right side of the welding plate, and the first feeding portion, the wiring portion and the second feeding portion are integrally formed into a small-sized PCB antenna board.
Compared with the prior art, the invention has the following beneficial effects:
1. the utility model provides a small-size PCB antenna manufacture craft and application, adopt the inside antenna of PCB board to pass through the electromagnetic coupling feed, overlap one termination signal to two upper and lower copper foil parts, the other end ground connection is being realized through spiral wire winding, the line of walking of upper and lower layer is printed on covering copper PCB, connect every layer of circuit through the via hole form, connect through both ends electrode and use product, the effect that is favorable to transmitting radio signal, it is big to adopt the antenna bandwidth, it is multiple functional, can use different frequency channels, good antenna efficiency has, can satisfy NB-LOT's Band 5 and Band 8 frequency channel and be used for intelligent control and digital television's 400MHz-500MHz scope frequency channel, the size of antenna has been reduced, reduce the region of antenna, the antenna cost is reduced, can direct SMT paster, simple process, low cost, the welding plate is PCB.
Drawings
FIG. 1 is a schematic structural diagram of a small PCB antenna manufacturing process and application;
the figures are labeled as follows: 1. a red line; 2. a blue line; 3. a via hole; 4. a bonding pad; 5. a PCB board; 6. a first feeding section; 7. a second feeding portion.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Example 1:
referring to the drawings, a manufacturing process and application of a small PCB antenna are shown as follows:
1. determining the size of the antenna, calculating the length of the antenna in the specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software;
2. selecting a plate, and calculating the arrangement number of the antennas on one plate;
3. cutting: according to the requirements of the engineering data MI, cutting the large plate meeting the requirements into small pieces to produce a plate;
4. copper deposition: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method;
5. pattern transfer: the pattern transfer is to transfer the image on the production film to a plate;
6. pattern electroplating: the pattern electroplating is to electroplate a copper layer with required thickness and gold nickel and tin layers with required thickness on the exposed copper sheet and the hole wall of the circuit pattern;
7. removing the film: removing the anti-electroplating covering film layer by using NaOH solution to expose the non-circuit copper layer;
8. etching: etching is to etch the copper layer at the non-circuit part by using a chemical reaction method;
9. green oil: the green oil is used for transferring the pattern of the green oil film to the board, so that the effects of protecting the circuit and preventing tin on the circuit when parts are welded are achieved;
10. character: the characters are marks which are convenient to identify;
11. gold plating of fingers: plating a layer of nickel and gold with required thickness on the plug fingers to ensure that the plug fingers have hardness;
12. tin plate plating: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance;
13. molding: the required shape of a customer is formed by die stamping or routing through a numerical control routing machine;
14. and (3) testing: through an electronic 100% test, defects which are difficult to be found visually and affect functionality such as open circuit, short circuit and the like are detected;
15. final inspection: the appearance defects of the plate are inspected by 100% of eyes, and slight defects are repaired, so that the defective plate is prevented from flowing out;
an application of a micro-miniature patch PCB antenna, the technical scheme is as follows: the antenna comprises a first feed part 5 and a second feed part 7, wherein the first feed part 6 is positioned at the left end of a bonding pad 4, the second feed part 7 is positioned at the right end of the bonding pad 4, the bonding pad 4 is arranged between the first feed part 6 and the second feed part 7, through holes 3 which are transversely arranged are arranged on the bonding pad 4, routing red lines 1 and blue lines 2 are arranged between the through holes 3, the routing red lines 1 and the blue lines 2 sequentially penetrate through the through holes 3 along the front and back surfaces of the bonding pad 4, the routing red lines 1 and the blue lines 2 are in spiral winding shapes from left to right, the left ends of the routing red lines 1 and the blue lines 2 are connected with the first feed part, the right ends of the routing red lines 1 and the blue lines 2 are connected with the second feed part, an electromagnetic coupling feed is used for overlapping the upper copper foil part and the lower copper foil part to be connected with a signal, the other end is grounded through spiral winding, the upper and lower layers of the routing lines are printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, and then the wireless signal is transmitted by connecting the two end electrodes with a product.
Specifically, the antenna has the advantages of being large in bandwidth, complete in function, capable of using different frequency bands, good in antenna efficiency, capable of meeting the Band 5 and Band 8 frequency bands of NB-LOT and used for intelligent control and the 400MHz-500MHz range frequency Band of a digital television, reducing the size of the antenna, reducing the area of the antenna, reducing the antenna cost, being capable of being directly SMT (surface mount technology) mounted, simple in process, low in cost and capable of being used as a PCB (printed circuit board), the forming method comprises a mechanical gong, a beer board, a hand gong and a hand cutting step 13, the first feeding portion is attached to the front side and the left side face of the substrate, the second feeding portion is attached to the front side and the right side face of the substrate, and the first feeding portion, the wiring portion and the second feeding portion are integrally formed small-size PCB antenna board.
The working principle is as follows: the invention adopts the electromagnetic coupling feed mode of the antenna, overlaps one end of the upper copper foil and the lower copper foil to connect with a signal, the other end is grounded, the wiring of the upper layer and the lower layer is printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, and the function of transmitting wireless signals is achieved by connecting two end electrodes and a used product.
While there have been shown and described the fundamental principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (4)
1. A manufacturing process and application of a small PCB antenna are disclosed, wherein the manufacturing process of the small PCB antenna is as follows:
1) determining the size of the antenna, calculating the length of the antenna in the specified size, drawing a circuit diagram, and simulating various performances of the antenna through simulation software;
2) selecting a plate, and calculating the arrangement number of the antennas on one plate;
3) cutting: according to the requirements of the engineering data MI, cutting the large plate meeting the requirements into small pieces to produce a plate;
4) copper deposition: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method;
5) pattern transfer: the pattern transfer is to transfer the image on the production film to a plate;
6) pattern electroplating: the pattern electroplating is to electroplate a copper layer with the required thickness and a gold nickel layer and a tin layer with the required thickness on the exposed copper sheet and the hole wall of the circuit pattern;
7) removing the film: removing the anti-electroplating covering film layer by using NaOH solution to expose the non-circuit copper layer;
8) etching: etching is to etch the copper layer at the non-circuit part by using a chemical reaction method;
9) green oil: the green oil is used for transferring the pattern of the green oil film to the board, so that the effects of protecting the circuit and preventing tin on the circuit when parts are welded are achieved;
10) character: the characters are marks which are convenient to identify;
11) gold plating of fingers: plating a layer of nickel and gold with required thickness on the plug fingers to ensure that the plug fingers have hardness;
12) tin plate plating: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance;
13) molding: the required shape of a customer is formed by die stamping or routing through a numerical control routing machine;
14) and (3) testing: through an electronic 100% test, defects which are difficult to find by eyes and affect functionality such as open circuit, short circuit and the like are detected;
15) final inspection: the appearance defects of the plate are inspected by 100% of eyes, and slight defects are repaired, so that the defective plate is prevented from flowing out;
a manufacturing process and application of a small PCB antenna are disclosed, the technical scheme is as follows: the power supply device comprises a red line (1), a blue line (2), a via hole (3), a bonding pad (4), a PCB (5), a first feeding portion (6) and a second feeding portion (7), and is characterized in that: the PCB (5) is a body, a pad (4) is arranged inside the PCB (5), a first feeding portion (6) is arranged below the left side of the pad (4), the first feeding portion (6) is provided with a red line (1) through a welding point, the red line (1) is provided with a via hole (3) through a welding point, and the via hole (3) is provided with a blue line (2) through a welding point; the red circuit (1) is provided with a second feed portion (7) through a welding spot.
2. The manufacturing process and application of a small PCB antenna as claimed in claim 1, wherein: the antenna in the PCB (5) is characterized in that an upper copper foil part and a lower copper foil part are overlapped to form a signal through electromagnetic coupling feeding, the other end of the upper copper foil part and the lower copper foil part is grounded, the wiring of the upper layer and the lower layer is printed on a copper-clad PCB, each layer of circuit is connected in a via hole mode, and the effect of transmitting wireless signals is achieved through connection of electrodes at two ends and a used product.
3. The manufacturing process and application of a small PCB antenna as claimed in claim 1, wherein: and step 13, the forming method comprises a mechanical gong, a beer board, a hand gong and a hand cutting.
4. The manufacturing process and application of a small PCB antenna as claimed in claim 1, wherein: the first feeding portion (6) is attached to the front side and the right side face of the bonding pad (4), the second feeding portion (7) is attached to the front side and the right side face of the bonding pad (4), and the first feeding portion (6), the wiring red circuit (1), the wiring blue circuit (2) and the second feeding portion (7) are integrally formed into a small PCB antenna board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210575013.6A CN114927865A (en) | 2022-05-25 | 2022-05-25 | Small-sized PCB antenna manufacturing process and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210575013.6A CN114927865A (en) | 2022-05-25 | 2022-05-25 | Small-sized PCB antenna manufacturing process and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114927865A true CN114927865A (en) | 2022-08-19 |
Family
ID=82809903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210575013.6A Pending CN114927865A (en) | 2022-05-25 | 2022-05-25 | Small-sized PCB antenna manufacturing process and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114927865A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660069A (en) * | 2017-09-07 | 2018-02-02 | 江门市君业达电子有限公司 | A kind of PCB plate production method with half bore |
| CN211017381U (en) * | 2019-09-04 | 2020-07-14 | 禾邦电子(苏州)有限公司 | Small patch antenna and PCB antenna |
| CN114361781A (en) * | 2022-01-04 | 2022-04-15 | 刘荣刚 | Manufacturing process and application of micro-miniature patch PCB antenna |
| WO2022100682A1 (en) * | 2020-11-12 | 2022-05-19 | 惠州市金百泽电路科技有限公司 | Processing method for high-speed photoelectric coupling module printed plug pcb |
-
2022
- 2022-05-25 CN CN202210575013.6A patent/CN114927865A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660069A (en) * | 2017-09-07 | 2018-02-02 | 江门市君业达电子有限公司 | A kind of PCB plate production method with half bore |
| CN211017381U (en) * | 2019-09-04 | 2020-07-14 | 禾邦电子(苏州)有限公司 | Small patch antenna and PCB antenna |
| WO2022100682A1 (en) * | 2020-11-12 | 2022-05-19 | 惠州市金百泽电路科技有限公司 | Processing method for high-speed photoelectric coupling module printed plug pcb |
| CN114361781A (en) * | 2022-01-04 | 2022-04-15 | 刘荣刚 | Manufacturing process and application of micro-miniature patch PCB antenna |
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Address after: 518129, Unit 1201, 1202, and 1204, Block B, Building 8, Phase 4, Huaqiang Creative Industry Park, Biyan Community, Guangming District, Shenzhen City, Guangdong Province Applicant after: Hongji wireless communication (Shenzhen) Co.,Ltd. Address before: 211-212, Kushi science and technology innovation center, No. 4006, Wuhe Avenue, xinweizai, Gangtou community, Bantian street, Longgang District, Shenzhen City, Guangdong Province Applicant before: Hongji wireless communication (Shenzhen) Co.,Ltd. |
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Application publication date: 20220819 |