CN219876228U - Signal shielding type film-coated printed circuit board and electronic equipment - Google Patents
Signal shielding type film-coated printed circuit board and electronic equipment Download PDFInfo
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- CN219876228U CN219876228U CN202223347367.XU CN202223347367U CN219876228U CN 219876228 U CN219876228 U CN 219876228U CN 202223347367 U CN202223347367 U CN 202223347367U CN 219876228 U CN219876228 U CN 219876228U
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- signal shielding
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- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 34
- 229920001721 polyimide Polymers 0.000 claims abstract description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 28
- 230000004888 barrier function Effects 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000012545 processing Methods 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 63
- 239000010410 layer Substances 0.000 description 60
- 238000000034 method Methods 0.000 description 34
- 239000013039 cover film Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 23
- 239000012790 adhesive layer Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 238000010030 laminating Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model discloses a signal shielding type film-covered printed circuit board and electronic equipment, belonging to the technical field of printed circuits; the signal shielding type film-coated printed circuit board comprises: printed circuit boards, thermoplastic polyimide films, barrier electrical layers, and thermoset polyimide films; the thermoplastic polyimide film is arranged on the printed circuit board in a covering manner, the shielding electrical layer is arranged on the thermoplastic polyimide film, the shielding electrical layer is connected with the grounding pad of the printed circuit, and the thermosetting polyimide film is arranged on the shielding electrical layer in a covering manner. The signal shielding type film-coated printed circuit board and the electronic equipment provided by the utility model can simplify the structure complexity, improve the processing efficiency and reduce the production cost on the premise of considering the signal shielding function.
Description
Technical Field
The utility model belongs to the technical field of printed circuits, and particularly relates to a signal shielding type film-covered printed circuit board and electronic equipment.
Background
In conventional printed circuit board products, referring to fig. 1, an adhesive layer and a thermosetting polyimide film are sequentially disposed on a printed circuit board through a solder mask process to meet the conventional solder mask requirements, and thus, the effects of protecting circuits and inhibiting oxidation are achieved. In some application scenarios, a printed circuit board product is required to have a signal shielding function, and for this purpose, a material layer for signal shielding, i.e. a shielding electrical layer, needs to be stacked in the product.
In order to add a shielding electrical layer on the basis of a printed circuit board product, besides the molding of a shielding material and the processing of various functional structures and process structures, an anisotropic conductive adhesion layer and a thermosetting polyimide layer for auxiliary electrical connection and protection are also needed, and when the auxiliary material layer and the structure are processed, an electrical connection structure and an insulation structure between layers of the printed circuit board are needed to be constructed; specifically, as shown in fig. 1 and 2, a printed circuit board with a signal shielding structure in the prior art includes a printed circuit board, an adhesive layer, a thermosetting polyimide film, an anisotropic conductive adhesive layer, a shielding electrical layer, and another thermosetting polyimide film that are sequentially disposed, and the adhesive layer and the thermosetting polyimide film form a cover film, and the anisotropic conductive adhesive layer, the shielding electrical layer, and the other thermosetting polyimide film form an EMI shielding film, and the cover film and the EMI shielding film are sequentially disposed on the printed circuit board, which results in a complex structure of the printed circuit board and multiple structural layers.
The processing flow of the printed circuit board with the signal shielding structure in the prior art mainly comprises the following steps: the method comprises the steps of opening windows at circuit pads of a printed circuit board, pseudo-pasting cover films, opening windows at the positions of the cover films, pressing the cover films after the opening windows at the positions of the cover films, baking, plasma cleaning, aligning the EMI shielding films with plates, pseudo-pasting the EMI shielding films, opening windows at the positions of the EMI shielding films, pressing the EMI shielding films after the opening windows at the positions of the cover films, and secondary baking. Therefore, the printed circuit board product has complex structure, multiple working procedures and long process flow, and the processing complexity is increased to a certain extent.
The fake paste is also called pre-paste, firstly, windows are formed at the circuit bonding pads of the printed circuit board, and the fake paste cover film is used for pre-pasting the cover film on the printed circuit board; secondly, covering film counterpoint windowing, laminating the covering film after counterpoint windowing, wherein the process has passed through twice windowing: the grounding pad is windowed and the covering film is windowed, and one-time alignment is carried out: the windowing pair of the covering film is positioned at the windowing position of the grounding pad, and aims to ensure the electric connection structure and circuit protection between all layers of the printed circuit board; then, after the baking and ion cleaning operation is completed, the EMI shielding film is aligned with the plate, the EMI shielding film is pre-pasted, and the EMI shielding film is aligned and windowed, and once windowing and alignment are performed here: and then, laminating the EMI shielding film subjected to windowing and secondary baking, and the aim of the method is to ensure the insulation structure among all layers of the printed circuit board and also ensure the electric connection among all layers of the printed circuit board. So the whole processing flow is subjected to three times of windowing and two times of alignment.
Wherein, EMI, all referred to as: electromagnetic Interference, electromagnetic interference, refers to electromagnetic waves generated by electronic equipment during the working process of the electronic equipment, and the electromagnetic waves are emitted outwards and interfere with other parts of the equipment or other external equipment.
Disclosure of Invention
The utility model provides a signal shielding type film-covered printed circuit board and electronic equipment, and aims to at least solve the technical problems of complex structure, long processing process flow and high complexity of the printed circuit board with a signal shielding structure to a certain extent. For this purpose,
the embodiment of the utility model provides a signal shielding type coated printed circuit board, which comprises: printed circuit boards, thermoplastic polyimide films, barrier electrical layers, and thermoset polyimide films;
the thermoplastic polyimide film is arranged on the printed circuit board in a covering manner, the shielding electrical layer is arranged on the thermoplastic polyimide film, the shielding electrical layer is connected with the grounding pad of the printed circuit, and the thermosetting polyimide film is arranged on the shielding electrical layer in a covering manner.
Further, the thermoplastic polyimide film, the shielding electrical layer and the thermosetting polyimide film are laminated to form a new shielding cover film, and the shielding cover film is laminated to the printed circuit board.
Further, a window for selecting plating of the grounding pad is partially formed in the grounding pad of the printed circuit, and the shielding electrical layer is connected with the grounding pad after selecting plating.
Further, the window diameter is greater than 0.5mm.
Further, the plating thickness of the grounding pad is larger than 8um.
Further, the grounding pad is selectively plated by adopting a chemical nickel palladium gold process.
Further, in the electroless nickel palladium gold process, the thickness of gold and palladium is greater than 0.05um, and the thickness range of nickel is 5-10um.
Further, the thermoplastic polyimide film is provided with a window for connecting the shielding electrical layer with the selected plated grounding pad, and the window is opposite to the window for selecting plating of the grounding pad.
Further, the laminating time of the shielding cover film is greater than or equal to 120 seconds, the laminating pressure is greater than or equal to 20kg, and the laminating temperature is greater than or equal to 180 degrees.
The embodiment of the utility model also provides electronic equipment, which comprises: the signal shielding type film-covered printed circuit board.
The embodiment of the utility model has at least the following beneficial effects:
according to the signal shielding type film-covered printed circuit board and the electronic equipment provided by the embodiment of the utility model, the shielding electric layer is clamped between the thermoplastic polyimide film and the thermosetting polyimide film by utilizing the bonding capability of the thermoplastic polyimide film, so that the shielding type film with the signal shielding function is realized; and the thermoplastic polyimide film is contacted and combined on the printed circuit board, so that the complete printed circuit board with signal shielding performance is formed. It is worth noting that the thermoplastic polyimide film can also protect the wiring on the printed circuit board and insulate it from the shielding electrical layer; meanwhile, the thermosetting polyimide film can stabilize the protective shielding electrical layer; on the whole, on the premise of meeting the functional requirement, the complexity of the structure is greatly simplified, the number of coating layers of the signal shielding type coated printed circuit board is simplified, the frequency of the working procedures of windowing, baking, aligning and the like on the coating layers is correspondingly reduced, the production process flow is also simplified to a certain extent, and the processing efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic diagram of a prior art printed circuit with a signal shielding structure;
FIG. 2 shows a schematic diagram of a three-pass, two-pass alignment of a prior art printed circuit with a signal shielding structure;
FIG. 3 is a schematic diagram showing the structure of a signal shielding type film-coated printed circuit board according to the present utility model;
fig. 4 shows a schematic diagram of two-time windowing and one-time alignment of a signal shielding type film-coated printed circuit board in the utility model.
Reference numerals:
10-printed circuit board, 20-shielding cover film, 21-thermoplastic polyimide film, 22-shielding electrical layer, 23-thermosetting polyimide film.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The utility model is described below with reference to specific embodiments in conjunction with the accompanying drawings:
generally, a printed circuit board generally has a single-layer or multi-layer circuit board according to the complexity, and various processes and structures such as circuit connection, adhesion, insulation, circuit protection and the like are involved between each layer board, and although a frame looks concise, the actual structural design and processing are relatively complex; in particular, in products with certain specific applications, or in order to realize certain specific functions, such as signal shielding, a signal shielding structural layer is further superimposed on a formed printed circuit board, which tends to further increase various processes and structures of interlayer circuit connection, adhesion, insulation, circuit protection, and the like, so that the complexity of the overall structure and the processing complexity are greatly increased, the processing efficiency is greatly reduced, and the cost is also greatly increased.
Referring to fig. 3 and 4, in order to solve the technical problems of complex structure, long processing flow and high complexity of the printed circuit board with the signal shielding function in the prior art, the embodiment of the utility model provides a signal shielding type laminated printed circuit board, which is based on a printed circuit board provided with a basic circuit, and combines a laminated structure with the signal shielding function, so that the structure is simplified to a certain extent, the processing operation is simplified, and the operation efficiency is improved on the premise of ensuring the circuit function and the signal shielding function of the printed circuit board.
Specifically, the signal shielding type film-coated printed circuit board includes: a printed circuit board 10, a thermoplastic polyimide film 21, a shielding electrical layer 22, and a thermosetting polyimide film 23.
The printed circuit board 10 is a printed circuit board having a basic circuit, and the surface layer circuit thereof needs to be subjected to an anti-soldering and anti-oxidation treatment.
In order to realize the signal shielding function, it is necessary to further arrange a signal shielding structure on the printed circuit board 10 after processing, and perform windowing operation between each structural layer of the printed circuit board 10 to realize electrical connection, and the alignment between each structural layer after windowing operation is fixed, and each structural layer is set and related processing is performed by insulation and other structures. The processing flow of the printed circuit board with the signal shielding structure in the prior art mainly comprises the following steps: the method comprises the steps of opening windows at circuit pads of a printed circuit board, pseudo-pasting cover films, opening windows at the positions of the cover films, pressing the cover films after the opening windows at the positions of the cover films, baking, plasma cleaning, aligning the EMI shielding films with plates, pseudo-pasting the EMI shielding films, opening windows at the positions of the EMI shielding films, pressing the EMI shielding films after the opening windows at the positions of the cover films, and secondary baking. The processing flow has a plurality of working procedures and long process flow, and the processing complexity is increased to a certain extent.
Therefore, the thermoplastic polyimide film 21 can be covered and arranged on the printed circuit board 10, and is stably combined on the printed circuit board 10, so that the anti-welding and anti-oxidation treatment of the circuit is realized, and the circuit is protected; the shielding electrical layer 22 is directly arranged on the thermoplastic polyimide film 21 by further utilizing the characteristics of good bonding capability and insulation of the thermoplastic polyimide film 21, and the shielding electrical layer 22 is connected with the grounding pad of the printed circuit board 10, so that the signal shielding functional structure of the printed circuit board 10 is established, the printed circuit board 10 and the shielding electrical layer 22 are insulated, and the electrical connection between the structural layers of the printed circuit board 10 can be realized by windowing at the position of the grounding pad of the printed circuit board 10.
In order to protect the shielding electrical layer 22, the thermosetting polyimide film 23 may be directly disposed on the shielding electrical layer 22, and the thermosetting polyimide film 23 and the thermoplastic polyimide film 21 may be completely and stably combined, thereby protecting the shielding electrical layer 22.
Therefore, the protection and insulation of the printed circuit 10 and the shielding electric layer 22 are realized through the interlayer connection of the thermoplastic polyimide film 21 with good bonding capability, insulating capability and material thermal stability, and the shielding electric layer 22 is connected with the grounding pad of the printed circuit 10, so that the signal shielding function of the printed circuit board 10 is realized, and the electric connection of the printed circuit board 10 and the shielding electric layer 22 is also realized.
In some embodiments, the thermoplastic polyimide film 21, the shielding electrical layer 22, and the thermosetting polyimide film 23 may be laminated to form a shielding cover film 20, the shielding cover film 20 is laminated to the printed circuit board 10 as a whole, and the thermoplastic polyimide film 21 in the shielding cover film 20 is laminated to the printed circuit board 10 through side contact, insulated from the circuit on the printed circuit board 10, and protecting the circuit, compared with the printed circuit board product in the prior art, the printed circuit board product has a signal shielding function, and needs to add an anisotropic conductive adhesive layer and a thermosetting polyimide layer for auxiliary electrical connection and protection, which sequentially provide a printed circuit board, a glue layer, a thermosetting polyimide film, an anisotropic conductive adhesive layer, a shielding electrical layer, and another thermosetting polyimide film, and the glue layer and the thermosetting polyimide film form a cover film, the anisotropic conductive adhesive layer, the shielding electrical layer, and the other thermosetting polyimide film form a shielding film, and the cover film are sequentially provided on the printed circuit board, and the printed circuit board has a complex EMI shielding structure by implementing the shielding cover film 20 and the printed circuit board having such a complex and insulating structure.
In some embodiments, in order to establish the electrical connection between the shielding electrical layer 22 and the printed circuit board 10 to realize signal shielding, the grounding pad of the printed circuit board 10 is partially opened with a window for plating the grounding pad, that is, the position of the grounding pad of the printed circuit board 10 is windowed, and then, a copper plating process is performed at the windowed position of the grounding pad of the printed circuit board 10, so that the shielding electrical layer 22 is directly connected with the grounding pad of the printed circuit board 10, that is, the electrical connection and signal shielding between the shielding electrical layer 22 and the printed circuit board 10 are realized. Instead of the prior art, in order to realize the electrical connection and signal shielding of the shielding electrical layer and the printed circuit board, three windowing operations and two counterpoints are required to be performed on the cover film and the EMI shielding film to avoid the errors of the electrical connection and the signal shielding, the utility model realizes the electrical connection and the signal shielding of the shielding electrical layer 22 and the printed circuit board 10 directly through the windowing operation at the position of the grounding pad of the printed circuit board 10 and the copper plating process at the windowing position, thereby simplifying the windowing and counterpoint process procedures and shortening the processing flow.
Generally, the diameter of the window may be greater than 0.5mm, and the plating thickness of the ground pad is controlled to be greater than 8um, so as to enhance the structural stability of the whole signal shielding type film-covered printed circuit board.
Further, the grounding pad may be selectively plated by a electroless nickel-palladium-gold process, in which the thicknesses of gold and palladium may be greater than 0.05um and the thickness range of nickel may be 5-10um, and the connection between the shielding electrical layer 22 and the grounding pad after selective plating may be better completed by the electroless nickel-palladium-gold process of the printed circuit board 10. The electroless nickel palladium gold is an important surface treatment process in the printed circuit board industry, namely, a layer of nickel, palladium and gold is deposited on the surface of a copper layer of the printed circuit board by adopting a chemical method.
On the other hand, the thermoplastic polyimide film 21 is also provided with a window for connecting the shielding electrical layer 22 with the ground pad after the selective plating, and the window is opposite to the window of the ground pad on the printed circuit board 10, so that the shielding electrical layer 22 is conveniently connected with the ground pad after the selective plating. In practice, the window formed in the thermoplastic polyimide film 21 is opposite to the window formed in the printed circuit board 10 and selectively plated with the ground pad.
The process flow of the signal shielding type film-covered printed circuit board comprises the following steps: the purpose of the circuit ground pad partial window plating on the printed circuit board 10 is to allow the ground pad to contact and connect with the shielding electrical layer-the pseudo-press shielding cover film 20-the shielding cover film 20 window-the alignment-the press bonding of the shielding cover film 20-the baking. The method comprises the following steps: firstly, the above-mentioned printed circuit board 10 is windowed by the grounding pad, secondly, the thermoplastic polyimide film 21 is pre-attached to the printed circuit board 10, namely, the shielding cover film 20 is pre-attached to the printed circuit board 10, then, the thermoplastic polyimide film 21 is windowed and aligned, namely, the shielding cover film 20 is windowed and aligned, so that the windowed position of the shielding cover film 20 corresponds to the windowed position of the grounding pad of the printed circuit board 10, and then, the shielding cover film 20 is pressed and baked. Thus, the process flow of the signal shielding type coated printed circuit board performs two window opening and one alignment operation, and compared with the prior art, the process flow reduces window opening and alignment procedures.
That is, compared with the existing signal shielding type coated printed circuit board, in the processing flow of the signal shielding type coated printed circuit board provided by the embodiment, the windowing, aligning and baking processes on the shielding type coated film are reduced once, so that the processing complexity of the signal shielding type coated printed circuit board is greatly simplified, the processing flow is shortened, and the offset risk caused by multiple windowing and aligning is avoided.
Typically, the laminating time of the shielding cover film 20 is 120 seconds or longer, the laminating pressure is 20kg or more, and the laminating temperature is 180 degrees or more for stable lamination.
The embodiment of the utility model also provides electronic equipment, and particularly the signal shielding type film-covered printed circuit board can be adopted. The electronic device provided in this embodiment, for example, a camera module, a mobile phone, a tablet computer, and the like. For example, the signal shielding type film-covered printed circuit board is applied to the camera module, and is used as a circuit board for connecting and bearing chips, and the chips are arranged on the signal shielding type film-covered printed circuit board, so that the signal shielding function of the circuit board of the camera module can be realized.
The embodiment of the utility model has at least the following beneficial effects:
according to the signal shielding type film-covered printed circuit board and the electronic equipment provided by the embodiment of the utility model, the shielding electric layer is clamped between the thermoplastic polyimide film and the thermosetting polyimide film by utilizing the combination capability of the thermoplastic polyimide film, so that the shielding type film with the signal shielding function is realized; and the thermoplastic polyimide film is contacted and combined on the printed circuit board, so that the complete printed circuit board with signal shielding performance is formed. It is worth noting that the thermoplastic polyimide film can also protect the wiring on the printed circuit board and insulate it from the shielding electrical layer; meanwhile, the thermosetting polyimide film can stabilize the protective shielding electrical layer; therefore, on the premise of meeting the functional requirement, the complexity of the structure is greatly simplified, the number of coating layers of the signal shielding type coated printed circuit board is simplified, the frequency of the procedures of windowing, baking, aligning and the like on the shielding type coating layer is correspondingly reduced, the production process flow is also simplified to a certain extent, and the processing efficiency is improved.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
It should be noted that all the directional indicators in the embodiments of the present utility model are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.
In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A signal shielding type coated printed circuit board, characterized in that the signal shielding type coated printed circuit board comprises: printed circuit boards, thermoplastic polyimide films, barrier electrical layers, and thermoset polyimide films;
the thermoplastic polyimide film is arranged on the printed circuit board in a covering manner, the shielding electrical layer is arranged on the thermoplastic polyimide film, the shielding electrical layer is connected with the grounding pad of the printed circuit, and the thermosetting polyimide film is arranged on the shielding electrical layer in a covering manner.
2. The signal shielding type coated printed circuit board of claim 1, wherein the thermoplastic polyimide film, the shielding electrical layer, and the thermosetting polyimide film are laminated with a new shielding type coating film, and the shielding type coating film is laminated on the printed circuit board.
3. The signal shielding type coated printed circuit board according to claim 2, wherein a window for selectively plating the ground pad is partially opened on the ground pad of the printed circuit, and the shielding electrical layer is connected with the selectively plated ground pad.
4. A signal shielding type film coated printed circuit board as claimed in claim 3, wherein the window diameter is greater than 0.5mm.
5. The signal shielding type coated printed circuit board of claim 3, wherein the plating thickness of the ground pad is greater than 8um.
6. The signal shielding type coated printed circuit board of claim 3, wherein the thermoplastic polyimide film is provided with a window for connecting the shielding electrical layer with the selected plated grounding pad, and the window is opposite to the window for selecting plating of the grounding pad.
7. An electronic device, comprising: the signal shielding type film-coated printed circuit board according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223347367.XU CN219876228U (en) | 2022-12-13 | 2022-12-13 | Signal shielding type film-coated printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223347367.XU CN219876228U (en) | 2022-12-13 | 2022-12-13 | Signal shielding type film-coated printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876228U true CN219876228U (en) | 2023-10-20 |
Family
ID=88324269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223347367.XU Active CN219876228U (en) | 2022-12-13 | 2022-12-13 | Signal shielding type film-coated printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876228U (en) |
-
2022
- 2022-12-13 CN CN202223347367.XU patent/CN219876228U/en active Active
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