CN114501854B - Method for manufacturing circuit board with embedded element and circuit board with embedded element - Google Patents
Method for manufacturing circuit board with embedded element and circuit board with embedded element Download PDFInfo
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- CN114501854B CN114501854B CN202011166218.6A CN202011166218A CN114501854B CN 114501854 B CN114501854 B CN 114501854B CN 202011166218 A CN202011166218 A CN 202011166218A CN 114501854 B CN114501854 B CN 114501854B
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- circuit board
- layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims abstract description 150
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 148
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 13
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A manufacturing method of a circuit board comprises the following steps: providing a first circuit substrate, wherein the first circuit substrate comprises a first connecting pad and a second connecting pad; providing a second circuit substrate, wherein the second circuit substrate comprises a third connecting pad and a through hole; providing an insulating layer, wherein the insulating layer comprises a first opening and a second opening, the first opening corresponds to the first connecting pad and the third connecting pad, and the second opening corresponds to the second connecting pad and the through hole; sequentially pressing the first circuit substrate, the insulating layer and the second circuit substrate to enable the first connecting pad and the third connecting pad to be respectively penetrated through the first opening and electrically connected, and enabling the second connecting pad to be exposed to the second opening and the through hole; arranging an electronic element in the accommodating groove formed by the second opening and the through hole and electrically connecting with the second connecting pad; and covering the electromagnetic shielding layers on the surfaces of the first circuit substrate and the second circuit substrate to obtain the circuit board with the embedded element. The application also provides a circuit board with embedded elements.
Description
Technical Field
The present disclosure relates to the field of circuit boards, and more particularly, to a method for manufacturing a circuit board with embedded components and a circuit board with embedded components.
Background
With the increasing demands of people for various electronic products such as computers, consumer electronics, communications, etc., the functions of electronic products are diversified, and the packaging structures in electronic products are more and more centralized, for example, the components are embedded in a multilayer circuit board.
The existing manufacturing method of the circuit board with the embedded element generally uses a subtractive method for manufacturing a circuit layer, and electroplating hole manufacturing procedures are adopted for interlayer conduction, so that the manufacturing procedures are all wet, the manufacturing procedure is complex, and the pollution problem is serious; when the electronic element and the signal wire are embedded in the circuit board at the same time, the circuit board is not favorable for thinning, and the signal quality of the manufactured circuit board is poor.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method for manufacturing a circuit board with embedded components, which has a simplified manufacturing process and good signal quality.
In addition, it is also necessary to provide a circuit board with embedded components.
A manufacturing method of a circuit board with embedded elements comprises the following steps:
providing a first circuit substrate, wherein the first circuit substrate comprises a first connecting pad and a second connecting pad;
providing a second circuit substrate, wherein the second circuit substrate comprises a third connecting pad, the third connecting pad corresponds to the first connecting pad, and the second circuit substrate further comprises a through hole;
providing an insulating layer, wherein the insulating layer comprises a first opening and a second opening, the first opening corresponds to the first connecting pad and the third connecting pad, and the second opening corresponds to the second connecting pad and the through hole;
sequentially pressing the first circuit substrate, the insulating layer and the second circuit substrate to enable the first connecting pad and the third connecting pad to be respectively penetrated in the first opening and electrically connected, and enabling the second connecting pad to be exposed to the second opening and the through hole;
arranging an electronic element in the accommodating groove formed by the second opening and the through hole and electrically connecting with the second connecting pad; and
And covering electromagnetic shielding layers on the surfaces of the first circuit substrate and the second circuit substrate, which are away from the insulating layer, so as to obtain the circuit board with the embedded element.
Further, metal conductive paste is disposed on the surfaces of the first connection pad and the third connection pad, and after the first circuit substrate, the insulating layer and the second circuit substrate are pressed together, the conductive paste is located in the first opening and between the first connection pad and the third connection pad.
Further, the insulating layer further comprises a metal conductive paste, and the metal conductive paste is accommodated in the first opening.
Further, the manufacturing steps of the insulating layer include:
providing a glue layer;
forming the first opening and the second opening in the adhesive layer; and
and filling metal conductive paste in the first opening.
Further, before the step of forming the electromagnetic shielding layer, the method further comprises the steps of:
and dispensing in a gap between the accommodating groove and the electronic element.
Further, the first circuit substrate further comprises a ground wire, and after the first circuit substrate, the insulating layer and the second circuit substrate are pressed, the ground wire is arranged towards the second circuit substrate, and the part of the first circuit substrate with the ground wire protrudes from the second circuit substrate.
Further, the electromagnetic shielding layer also covers the ground wire.
A circuit board with embedded components, comprising:
a first circuit board including a first connection pad and a second connection pad;
the second circuit substrate comprises a third connecting pad, the third connecting pad corresponds to the first connecting pad, and the second circuit substrate further comprises a through hole;
the insulation layer is positioned between the first circuit substrate and the second circuit substrate, the insulation layer comprises a first opening and a second opening, the first connection pad and the third connection pad are accommodated in the first opening and are electrically connected, the second opening is communicated with the through hole to form a containing groove, and the second connection pad is exposed to the containing groove;
the electronic element is accommodated in the accommodating groove and is electrically connected with the second connecting pad; and
and the electromagnetic shielding layer covers the surfaces of the first circuit substrate and the second circuit substrate, which are away from the insulating layer.
Further, the first circuit substrate further comprises a ground wire, a portion of the first circuit substrate including the ground wire protrudes from the second circuit substrate, and the electromagnetic shielding layer further wraps the ground wire.
Further, the circuit board further comprises a metal conductive paste, wherein the metal conductive paste is located between the first connection pad and the third connection pad and is used for electrically connecting the first circuit substrate and the second circuit substrate.
According to the manufacturing method of the circuit board with the embedded element, the first circuit substrate, the insulating layer and the second circuit substrate are sequentially pressed to form the accommodating groove for accommodating the electronic element, the electronic element is arranged in the accommodating groove, the electromagnetic shielding layers are respectively covered on the surfaces of the first circuit substrate and the second circuit substrate, which are away from the insulating layer, so that the circuit board is manufactured, and the manufacturing process flow is simplified and pollution-free; in addition, the electromagnetic shielding layer wraps the first signal line layer, the second signal line layer and the electronic element in the electromagnetic shielding layer, so that external signals can be shielded to interfere signals of the first signal line layer, the second signal line layer and the electronic element 60 in the circuit board, and the signals in the circuit board can be prevented from leaking, and the signal quality in the circuit board is ensured.
Drawings
Fig. 1 is a schematic cross-sectional view of a first circuit substrate according to an embodiment of the present disclosure.
Fig. 2 is a schematic cross-sectional view of an insulating layer according to an embodiment of the present disclosure.
Fig. 3 is a schematic cross-sectional view of a second circuit substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic cross-sectional view of a first circuit substrate according to another embodiment of the present disclosure.
Fig. 5 is a schematic cross-sectional view of an insulating layer according to another embodiment of the present disclosure.
Fig. 6 is a schematic cross-sectional view of a second circuit substrate according to another embodiment of the present disclosure.
Fig. 7 is a schematic cross-sectional view of a first circuit substrate, an insulating layer, and a second circuit substrate after being sequentially laminated to form a receiving groove.
Fig. 8 is a schematic cross-sectional view of the accommodating groove shown in fig. 7 after an electronic component is disposed therein.
Fig. 9 is a schematic cross-sectional view of the encapsulant between the accommodating recess and the electronic component shown in fig. 8.
Fig. 10 is a schematic cross-sectional view of the first circuit substrate and the second circuit substrate shown in fig. 9 after the electromagnetic shielding layer is covered on the surface of the first circuit substrate and the second circuit substrate facing away from the insulating layer.
Description of the main reference signs
The following detailed description will further illustrate the application in conjunction with the above-described figures.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. In addition, embodiments of the present application and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes all and any combination of one or more of the associated listed items.
In various embodiments of the present application, for ease of description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical coupling, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which change accordingly when the absolute position of the object to be described changes.
Referring to fig. 1 to 10, an embodiment of the present application provides a method for manufacturing a circuit board 100 with embedded components, which includes the following steps:
step S1: referring to fig. 1 and 4, a first circuit substrate 10 is provided, and the first circuit substrate 10 includes a first connection pad 13 and a second connection pad 14.
The first circuit board 10 includes a first substrate layer 11, a first signal line layer 12 disposed on a surface of the first substrate layer 11, and the first connection pad 13 and the second connection pad 14 electrically connected to the first signal line layer 12, where the first signal line layer 12, the first connection pad 13 and the second connection pad 14 are all disposed on a same surface of the first substrate layer 11. The first connection pad 13 is used for electrically connecting with a second circuit substrate 20 formed later, and the second connection pad 14 is used for electrically connecting with an electronic component 60 formed later (refer to fig. 10).
The first circuit substrate 10 further includes a ground line 122, where the ground line 122 is electrically connected to the first signal line layer 12, and the ground line 122 is used for grounding, grounding a housing, or grounding a line with zero reference potential.
In some embodiments, the surface of the first connection pad 13 is further provided with a metal conductive paste 40a, such as solder paste, copper paste, etc., for performing an electrical connection in the circuit board 100 to be formed later. In other embodiments, the surface of the first connection pad 13 may not be provided with the metal conductive paste 40a.
The material of the first substrate layer 11 may be one of flexible materials such as Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP), and modified polyimide (modified polyimide, MPI).
Step S2: referring to fig. 3 and 6, a second circuit substrate 20 is provided, the second circuit substrate 20 includes a third connection pad 23, the third connection pad 23 corresponds to the first connection pad 13, and the second circuit substrate 20 further includes a through hole 24.
The second circuit substrate 20 includes a second base material layer 21, a second signal line layer 22 disposed on a surface of the second base material layer 21, and the third connection pad 23 electrically connected to the second signal line layer 22. The second signal line layer 22 and the third connection pad 23 are both located on the same surface of the second substrate layer 21. The positions and the number of the third connection pads 23 correspond to those of the first connection pads 13.
The second signal line layer 22 is used for transmitting sensing information and control information in the circuit board 100.
In some embodiments, the surface of the second connection pad 14 is further provided with a metal conductive paste 40b, such as solder paste, copper paste, etc., for electrically connecting with the first connection pad 13. In other embodiments, the surface of the second connection pad 14 may not be provided with the metal conductive paste 40b.
The through hole 24 penetrates the second substrate layer 21 and the second signal line layer 22. The number of the through holes 24 may be set according to the need, for example, according to the number of the electronic components 60 to be connected, wherein one through hole 24 may accommodate one electronic component 60.
The material of the second substrate layer 21 may be one of flexible materials such as Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP), and modified polyimide (modified polyimide, MPI). In the same embodiment, the materials of the first substrate layer 11 and the second substrate layer 21 may be the same or different.
Step S3: referring to fig. 2 and 5, an insulating layer 30 is provided, the insulating layer 30 includes a first opening 32 and a second opening 34, the first opening 32 corresponds to the first connection pad 13 and the third connection pad 23, and the second opening 34 corresponds to the second connection pad 14 and the through hole 24.
The insulating layer 30 may be made of one of insulating materials such as epoxy resin, polytetrafluoroethylene (Poly tetra fluoroethylene, PTFE), and industrialized Liquid Crystal Polymer (LCP).
In some embodiments, the insulating layer 30 has a thickness of 10 μm to 25 μm.
The first openings 32 and the second openings 34 penetrate through the insulating layer 30, the positions and the number of the first openings 32 are consistent with those of the first connection pads 13 or the third connection pads 23, and the positions and the number of the second openings 34 are corresponding to those of the second connection pads 14.
Referring to fig. 5, in some embodiments, a metal conductive paste 40c is further contained in the first opening 32, and is used for electrically connecting the first circuit substrate 10 and the second circuit substrate.
In some embodiments, the step of forming the insulating layer 30 having the metal conductive paste 40c includes: providing a glue layer; forming a first opening 32 and a second opening 34 penetrating the adhesive layer through laser perforation; and filling the metal conductive paste 40c in the first opening 32 to obtain the adhesive layer. It should be understood that the steps for forming the insulating layer 30 are only exemplary, and are not limited thereto.
Step S4: referring to fig. 7, the first circuit substrate 10, the insulating layer 30, and the second circuit substrate 20 are sequentially pressed, so that the first connection pad 13 and the third connection pad 23 are respectively disposed through the first opening 32 and electrically connected, and the second connection pad 14 is exposed to the second opening 34 and the through hole 24.
Specifically, the insulating layer 30 is located between the first circuit substrate 10 and the second circuit substrate 20, the surfaces of the first circuit substrate 10 having the first signal line layer 12 and the second circuit substrate 20 having the second signal line layer 22 face the insulating layer 30, and the first connection pad 13 and the third connection pad 23 are disposed in the first opening 32 and electrically connected by the metal conductive paste 40 located between the first connection pad 13 and the third connection pad 23; the second opening 34 and the through hole 24 are mutually communicated to form a containing groove 50, and the second connection pad 14 is exposed to the containing groove 50.
The portion of the first circuit substrate 10 having the ground line 122 protrudes from the second circuit substrate 20.
Step S5: referring to fig. 8, an electronic component 60 is disposed in the accommodating groove 50 formed by the second opening 34 and the through hole 24 and electrically connected to the second connection pad 14.
It will be appreciated that the number of the receiving grooves 50 is set according to the number of the electronic components 60 to be mounted.
Further, in some embodiments, a connection pad (not shown) exposed to another receiving groove (not shown) may also be disposed on the second circuit substrate 20 at the same time, and the electronic component 60 directly connected to the second circuit substrate 20 is received in the corresponding receiving groove. It can be appreciated that the positions of the connection pads for connecting different electronic components 60 need to be staggered along the stacking direction of the first circuit substrate 10 and the second circuit substrate 20, which is beneficial to reducing the thickness of the manufactured circuit board 100 on the basis of meeting the requirements of the number of electronic components 60.
Step S6: referring to fig. 9, the dispensing process is performed in the gap between the accommodating groove 50 and the electronic component 60.
The gap between the accommodating groove 50 and the electronic component 60 is filled with the glue 70 to further fix the electronic component 60.
Step S7: referring to fig. 10, the electromagnetic shielding layer 80 is covered on the surfaces of the first circuit substrate 10 and the second circuit substrate 20 facing away from the insulating layer 30, so as to obtain the circuit board 100 with the embedded component.
The electromagnetic shielding layer 80 may be made of a metal such as copper or aluminum.
The electromagnetic shielding layer 80 covers the surface of the first substrate layer 11 facing away from the first signal line layer 12 and the surface of the second substrate layer 21 facing away from the second signal line layer 22, the electromagnetic shielding layer 80 also covers the surface of the electronic component 60 exposed to the second circuit substrate 20, and the electromagnetic shielding layer 80 also covers the surface of the first circuit substrate 10 protruding from the ground line 122 of the second circuit substrate 20. The electromagnetic shielding layer 80 can be used for shielding external signals, preventing the external signals from interfering the signals of the first signal line layer 12, the second signal line layer 22 and the electronic component 60 in the circuit board 100, and preventing the signals in the circuit board 100 from leaking out, thereby ensuring the signal quality in the circuit board 100.
Further, before the electromagnetic shielding layer 80 is disposed, the first substrate layer 11 and the second substrate layer 21 are located on the outer layer, and an additional ink layer or other substrate layer may not be disposed.
The application also provides a circuit board 100 with embedded components, which comprises a first circuit substrate 10, an insulating layer 30, a second circuit substrate 20 and an electromagnetic shielding layer 80, wherein the first circuit substrate 10, the insulating layer 30, the second circuit substrate 20 and the electromagnetic shielding layer 80 are sequentially stacked, and the electromagnetic shielding layer 80 is positioned on the first circuit substrate 10 and the second circuit substrate 20 and is away from the insulating layer 30.
The first circuit board 10 includes a first substrate layer 11, a first signal line layer 12 on a surface of the first substrate layer 11, the first connection pad 13, and the second connection pad 14.
The second circuit substrate 20 includes a second base material layer 21, a second signal line layer 22 located on the surface of the second base material layer 21, and the third connection pad 23.
The insulating layer 30 is located between the first circuit substrate 10 and the second circuit substrate 20, the insulating layer 30 includes a first opening 32 and a second opening 34, the first connection pad 13 and the third connection pad 23 are accommodated in the first opening 32 and electrically connected, and the second opening 34 corresponds to the second connection pad 14 and the through hole 24.
The first signal line layer 12 and the second signal line layer 22 are disposed towards the insulating layer 30, the first connection pad 13 and the third connection pad 23 are accommodated in the first opening 32, the metal conductive paste 40 is accommodated in the first opening 32 and is located between the first connection pad 13 and the third connection pad 23, and the metal conductive paste 40 is used for electrically connecting the first circuit substrate 10 and the second circuit substrate 20.
The second opening 34 is connected with the through hole 24 to form a receiving groove 50, the second connection pad 14 is exposed in the receiving groove 50, the electronic component 60 is received in the receiving groove 50 and electrically connected with the second connection pad 14, and a gap between the receiving groove 50 and the electronic component 60 is filled with a glue 70.
The electromagnetic shielding layer 80 covers the surface of the first substrate layer 11 facing away from the first signal line layer 12 and the surface of the second substrate layer 21 facing away from the second signal line layer 22, and the electromagnetic shielding layer 80 also covers the surface of the electronic component 60 exposed to the second circuit substrate 20.
Further, the first circuit board 10 further includes a ground line 122, and a portion of the first circuit board 10 having the ground line 122 protrudes from the second circuit board 20. The electromagnetic shielding layer 80 also covers the surface of the first circuit substrate 10 protruding from the ground line 122 of the second circuit substrate 20.
The material of the first substrate layer 11 and the second substrate layer 21 may be one selected from flexible materials such as Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP), and modified polyimide (modified polyimide, MPI).
The insulating layer 30 may be made of one of insulating materials such as epoxy resin, polytetrafluoroethylene (Poly tetra fluoroethylene, PTFE), and industrialized Liquid Crystal Polymer (LCP). The insulating layer 30 is located between the first circuit substrate 10 and the second circuit substrate 20, and has insulation and adhesion effects, and also has the function of buffering stress applied to the first circuit substrate 10 and the second circuit substrate 20, so as to improve the fatigue resistance of the circuit board 100.
Further, the thickness of the circuit board 100 of the embedded component may be set according to the requirement, in a specific embodiment, the thickness of the electromagnetic shielding layer 80 is 10 μm, the thicknesses of the first substrate layer 11 and the second substrate layer 21 are both 12 μm, the thicknesses of the first signal line layer 12 and the second signal line layer 22 are both 12 μm, the thickness of the insulating layer 30 without the first signal line layer 12 and the second signal line layer 22 is 10 μm, and the total thickness of the circuit board is 78 μm, which belongs to the ultra-thin circuit board 100. In addition, the first substrate layer 11, the second substrate layer 21 and the insulating layer 30 may be made of flexible materials, and the circuit board 100 may have flexibility.
According to the manufacturing method of the circuit board 100 with the embedded element, the first circuit substrate 10, the insulating layer 30 and the second circuit substrate 20 are sequentially pressed together to form the accommodating groove 50 for accommodating the electronic element 60, the electronic element 60 is arranged in the accommodating groove 50, the electromagnetic shielding layers 80 are respectively covered on the surfaces of the first circuit substrate 10 and the second circuit substrate 20, which deviate from the insulating layer 30, so that the circuit board 100 is manufactured, and the manufacturing process flow is simplified and pollution-free; in addition, the electromagnetic shielding layer 80 wraps the first signal line layer 12, the second signal line layer 22 and the electronic component in the electromagnetic shielding layer 80, so that the signals of the first signal line layer 12, the second signal line layer 22 and the electronic component 60 in the circuit board 100 can be shielded from being interfered by external signals, and the signals in the circuit board 100 can be prevented from leaking out, thereby ensuring the signal quality in the circuit board 100.
The above embodiments are only for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.
Claims (10)
1. The manufacturing method of the circuit board with the embedded element is characterized by comprising the following steps:
providing a first circuit substrate, wherein the first circuit substrate comprises a first connecting pad and a second connecting pad;
providing a second circuit substrate, wherein the second circuit substrate comprises a third connecting pad, the third connecting pad corresponds to the first connecting pad, and the second circuit substrate further comprises a through hole;
providing an insulating layer, wherein the insulating layer comprises a first opening and a second opening, the first opening corresponds to the first connecting pad and the third connecting pad, and the second opening corresponds to the second connecting pad and the through hole;
sequentially pressing the first circuit substrate, the insulating layer and the second circuit substrate to enable the first connecting pad and the third connecting pad to be respectively penetrated in the first opening and electrically connected, and enabling the second connecting pad to be exposed to the second opening and the through hole;
arranging an electronic element in the accommodating groove formed by the second opening and the through hole and electrically connecting with the second connecting pad; and
And covering electromagnetic shielding layers on the surfaces of the first circuit substrate and the second circuit substrate, which are away from the insulating layer, so as to obtain the circuit board of the embedded element.
2. The method of claim 1, wherein metal conductive paste is disposed on surfaces of the first connection pad and the third connection pad, and after the first circuit substrate, the insulating layer and the second circuit substrate are pressed together, the conductive paste is disposed in the first opening and between the first connection pad and the third connection pad.
3. The method of claim 1, wherein the insulating layer further comprises a metal conductive paste, and wherein the metal conductive paste is accommodated in the first opening.
4. A method of manufacturing a circuit board with embedded components according to claim 3, wherein the insulating layer manufacturing step comprises:
providing a glue layer;
forming the first opening and the second opening in the adhesive layer; and
and filling metal conductive paste in the first opening.
5. The method of manufacturing a circuit board with embedded components according to claim 1, further comprising the steps of, before the step of forming the electromagnetic shielding layer:
and dispensing in a gap between the accommodating groove and the electronic element.
6. The method of claim 1, wherein the first circuit substrate further comprises a ground wire, the ground wire is disposed toward the second circuit substrate after the first circuit substrate, the insulating layer and the second circuit substrate are laminated, and a portion of the first circuit substrate having the ground wire protrudes from the second circuit substrate.
7. The method of claim 6, wherein the electromagnetic shielding layer further encapsulates the ground line.
8. A circuit board with embedded components, comprising:
a first circuit board including a first connection pad and a second connection pad;
the second circuit substrate comprises a third connecting pad, the third connecting pad corresponds to the first connecting pad, and the second circuit substrate further comprises a through hole;
the insulation layer is positioned between the first circuit substrate and the second circuit substrate, the insulation layer comprises a first opening and a second opening, the first connection pad and the third connection pad are accommodated in the first opening and are electrically connected, the second opening is communicated with the through hole to form a containing groove, and the second connection pad is exposed to the containing groove;
the electronic element is accommodated in the accommodating groove and is electrically connected with the second connecting pad; and
and the electromagnetic shielding layer covers the surfaces of the first circuit substrate and the second circuit substrate, which are away from the insulating layer.
9. The circuit board of claim 8, wherein the first circuit substrate further comprises a ground wire, a portion of the first circuit substrate including the ground wire protrudes from the second circuit substrate, and the electromagnetic shield further encapsulates the ground wire.
10. The circuit board of claim 8, further comprising a metallic conductive paste between the first and third connection pads for electrically connecting the first and second circuit substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011166218.6A CN114501854B (en) | 2020-10-27 | 2020-10-27 | Method for manufacturing circuit board with embedded element and circuit board with embedded element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011166218.6A CN114501854B (en) | 2020-10-27 | 2020-10-27 | Method for manufacturing circuit board with embedded element and circuit board with embedded element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114501854A CN114501854A (en) | 2022-05-13 |
| CN114501854B true CN114501854B (en) | 2024-03-29 |
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| CN202011166218.6A Active CN114501854B (en) | 2020-10-27 | 2020-10-27 | Method for manufacturing circuit board with embedded element and circuit board with embedded element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078573A (en) * | 2006-09-25 | 2008-04-03 | Cmk Corp | Multi-layer printed wiring board having built-in parts |
| TW200841443A (en) * | 2007-04-09 | 2008-10-16 | Phoenix Prec Technology Corp | Circuit board structure capable of embedding semiconductor chip therein and manufacturing method thereof |
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| JP5649490B2 (en) * | 2011-03-16 | 2015-01-07 | 新光電気工業株式会社 | Wiring board and manufacturing method thereof |
| JP2019121763A (en) * | 2018-01-11 | 2019-07-22 | イビデン株式会社 | Printed wiring board and manufacturing method thereof |
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| JP2008078573A (en) * | 2006-09-25 | 2008-04-03 | Cmk Corp | Multi-layer printed wiring board having built-in parts |
| TW200843068A (en) * | 2006-12-18 | 2008-11-01 | Texas Instruments Inc | Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate |
| TW200841443A (en) * | 2007-04-09 | 2008-10-16 | Phoenix Prec Technology Corp | Circuit board structure capable of embedding semiconductor chip therein and manufacturing method thereof |
| JP2008288298A (en) * | 2007-05-16 | 2008-11-27 | Toppan Printing Co Ltd | Method for manufacturing printed-wiring board with built-in electronic part |
| CN103906371A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN103906372A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
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